Edge grinding device for semiconductor wafer processing

Abstract

The utility model discloses an edge grinding device for processing a semiconductor wafer, and relates to the technical field of wafer edge grinding. The frame body is arranged in a step shape; a plurality of placing grooves are formed in the surface of the feeding disc; an edge grinding cylinder is fixedly mounted at the top of the second step of the frame body; a notch facilitating installation of the grinding plate is formed in the side wall of the edge grinding cylinder. An annular concave cavity is formed in the inner surface of the edge grinding cylinder of the grinding plate; the grinding plate extends out of the edge grinding cylinder and is connected with a fixing frame arranged on the outer edge of the edge grinding cylinder in a matched mode through a rotating shaft. Connecting rods are arranged at the bottoms of the grinding plates. Every two adjacent connecting rods are connected in a matched mode through a connecting plate. During use, an edged wafer is placed in a placement groove formed in the feeding disc through the mechanical arm, the controller achieves that the stroke belt drives the sliding plate to move, and the vertical air cylinder installed at the end of the horizontal air cylinder is moved to the position above the feeding disc; the distance between the suction cup and the containing groove is adjusted through the vertical air cylinder, and the wafers in the containing groove are effectively adsorbed.

Description

Technical Field

[0001] The utility model specifically relates to the technical field of wafer edge grinding, in particular to an edge grinding device for semiconductor wafer processing. Background Art

[0002] Semiconductor wafers are obtained by cutting semiconductor crystal rods. After cutting, the edges of the wafers need to be polished according to customer requirements to obtain wafers of specific shapes and sizes.

[0003] The wafer is a relatively thin workpiece, so it is easy to damage the wafer when grinding its edge. The traditional edge grinding device grinds the edge of the wafer by rotating the wafer. When the wafer rotates, the wafer is prone to friction with the surface of the placement device, which will damage the quality of the wafer and cannot effectively guarantee the quality of the wafer.

[0004] After searching, Chinese patent publication number CN202011100814.4 discloses a semiconductor wafer edge grinding device; it includes a fixing mechanism, a rotating mechanism, a pressing mechanism, a limiting frame, a propulsion mechanism, a moving mechanism and a grinding mechanism, wherein the rotating mechanism is arranged at the bottom end of the fixing mechanism, the pressing mechanism is arranged at the top end of the fixing mechanism, the rotating mechanism and the pressing mechanism correspond to each other up and down, the limiting frame is arranged on the rotating mechanism and the pressing mechanism, the propulsion mechanism is arranged on one side of the rotating mechanism, the moving mechanism is arranged on the propulsion mechanism, the grinding mechanism is arranged on the moving mechanism, and the working end of the grinding mechanism corresponds to the working end of the rotating mechanism;

[0005] In the structure of the above patent, when grinding the edge of the wafer, the first rotating plate cooperates with the limiting plate to clamp and fix the wafer. The first motor drives the first rotating plate to rotate the lens. At this time, the limiting plate in the above patent achieves the effect of rotation with the cooperation of the first rotating plate. Since the limiting plate rotates passively, when the grinding disc contacts the wafer, the limiting plate will stop rotating, causing friction between the wafer and the fiberboard, resulting in damage to the wafer surface.

[0006] In response to the above situation, we provide an edge grinding device for semiconductor wafer processing. In this device, the wafer is placed on the grinding plate inside the corresponding edge grinding cylinder through a suction cup. The grinding stone set at the edge of the cavity opened on the grinding plate contacts the wafer. The screw is driven by a driving motor to rotate, so that multiple grinding plates inside the edge grinding cylinder can move simultaneously, thereby achieving effective edge grinding of the wafer edge. Utility Model Content

[0007] The purpose of the utility model is to provide an edge grinding device for semiconductor wafer processing. In this device, a grinding stone is provided at the edge of the concave cavity opened on the grinding plate inside the edge grinding cylinder. The screw is driven by a driving motor to rotate, so that the grinding plate is moved inside the edge grinding cylinder. During the movement, the edge of the concave cavity is effectively ground to the wafer; so as to solve the problems of the above-mentioned background technology.

[0008] To achieve the above objectives, the present invention provides the following technical solutions:

[0009] A edging device for semiconductor wafer processing comprises a frame; the frame is arranged in a stepped shape; a loading tray is fixedly mounted on the top of the first step of the frame; a plurality of placement slots are provided on the surface of the loading tray; an edging cylinder having the same number as the placement slots is fixedly mounted on the top of the second step of the frame; a notch is provided on the side wall of the edging cylinder for facilitating the installation of a grinding plate; the grinding plate is located in an annular cavity formed on the inner surface of the edging cylinder;

[0010] The grinding plate extends to the outside of the edging cylinder and is connected to a fixing frame provided on the outer edge of the edging cylinder through a rotating shaft; a connecting rod is provided at the bottom of the plurality of grinding plates; and two adjacent connecting rods are connected through a connecting plate.

[0011] As a further technical solution of the present invention, the grinding plate extends to the edge grinding barrel section and is installed in cooperation with the screw; one end of the screw is fixedly installed with the driving motor.

[0012] As a further technical solution of the present invention, the loading tray is provided with suction cups with the same number as the placement slots away from the top of the frame; multiple suction cups are fixedly installed through a mounting plate; a vertical cylinder is fixedly installed on the mounting plate.

[0013] As a further technical solution of the present invention, one side of the vertical cylinder is fixedly mounted to the horizontal cylinder through an L-shaped support plate; the horizontal cylinder is fixedly mounted on a slide; the bottom of one end of the slide away from the horizontal cylinder is mounted in cooperation with the slide rail.

[0014] As a further technical solution of the present invention, the slide rail extends from the first step of the frame to the second step; the slide rail is fixedly installed on the frame.

[0015] As a further technical solution of the present invention, the slide plate is further installed in conjunction with a travel belt; the travel belt is electrically connected to the controller; and the controller is fixedly installed on the frame.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] When the utility model is in use, the edge-grinded wafer is placed in the placement slot provided on the loading tray by the robotic arm, the travel belt is driven to move the slide by the controller, and the vertical cylinder installed at the end of the horizontal cylinder is moved to the top of the loading tray, and the distance between the suction cup and the placement slot is adjusted by the vertical cylinder to effectively adsorb the wafer in the placement slot;

[0018] The utility model drives the slide plate to move along the slide rail through the travel belt to transfer the wafer on the suction cup to the top of the edging cylinder, and controls the distance between the suction cup and the edging cylinder through the vertical cylinder to place the wafer on the suction cup on the grinding plate inside the edging cylinder.

[0019] In the present invention, during grinding, the wafer is placed in a cavity provided on the grinding plate, and the screw is driven by a motor to rotate, so that the grinding plate rotates in an arc shape inside the grinding cylinder. During the rotation, the edge of the cavity contacts the edge of the wafer, thereby achieving edge grinding of the wafer.

[0020] The utility model, when edge grinding is performed, the connecting rod between two adjacent grinding plates is installed through the connecting plate. In this way, when one of the grinding plates is adjusted during grinding, the cooperation between the connecting rod and the connecting plate effectively ensures that multiple grinding plates move simultaneously during grinding, thereby effectively ensuring the efficiency and quality of grinding. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a three-dimensional structural diagram of the utility model.

[0022] Figure 2 This utility model Figure 1 side view.

[0023] Figure 3 This utility model Figure 1 Schematic diagram of the rear structure.

[0024] Figure 4 This utility model Figure 1 Top view of .

[0025] Figure 5 This utility model Figure 1 Schematic diagram of local structure decomposition.

[0026] Figure 6 This utility model Figure 5 Top view of .

[0027] In the figure: 1-frame, 2-loading tray, 3-placing slot, 4-mounting plate, 5-vertical cylinder, 6-horizontal cylinder, 7-stroke belt, 8-slide rail, 9-working disc, 10-edging cylinder, 11-driving motor, 12-screw, 13-controller, 14-slide plate, 15-suction cup, 16-grinding plate, 160-concave cavity, 17-fixed frame, 18-rotating shaft, 19-connecting rod, 20-connecting plate. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] See also Figure 1-6 In an embodiment of the present invention, a edging device for semiconductor wafer processing includes a frame 1; the frame 1 is arranged in a stepped shape; a loading tray 2 is fixedly mounted on the top of the first step of the frame 1; a plurality of placement slots 3 are opened on the surface of the loading tray 2; an edging cylinder 10 with the same number as the placement slots 3 is fixedly mounted on the top of the second step of the frame 1; a notch is opened on the side wall of the edging cylinder 10 for facilitating the installation of a grinding plate 16; the grinding plate 16 is located on the inner surface of the edging cylinder 10 and an annular concave cavity 160 is opened;

[0030] The grinding plates 16 extend to the outside of the edging cylinder 10 and are connected to the fixing frame 17 provided on the outer edge of the edging cylinder 10 through the rotating shaft 18; a connecting rod 19 is provided at the bottom of the plurality of grinding plates 16; and adjacent two connecting rods 19 are connected by a connecting plate 20.

[0031] More specifically, the grinding plate 16 extends to the edge grinding cylinder 10 and is installed in conjunction with the screw 12 ; one end of the screw 12 is fixedly installed with the driving motor 11 .

[0032] By adopting the above technical solution, when in use, the edge-milled wafer is placed in the placement groove 3 provided on the loading tray 2 by the robotic arm, and the travel belt 7 drives the slide 14 to move by the controller 13, so as to move the vertical cylinder 5 installed at the end of the horizontal cylinder 6 to the top of the loading tray 2, and the vertical cylinder 5 adjusts the distance between the suction cup 15 and the placement groove 3 to effectively achieve the effective adsorption of the wafer in the placement groove 3;

[0033] The loading tray 2 is provided with suction cups 15 with the same number as the placement slots 3 at the top away from the frame 1; the plurality of suction cups 15 are fixedly installed through the mounting plate 4; and a vertical cylinder 5 is fixedly installed on the mounting plate 4.

[0034] In this embodiment, one side of the vertical cylinder 5 is fixedly mounted to the horizontal cylinder 6 via an L-shaped support plate; the horizontal cylinder 6 is fixedly mounted on the slide 14; the bottom of the end of the slide 14 away from the horizontal cylinder 6 is mounted in cooperation with the slide rail 8.

[0035] By adopting the above technical solution, the travel belt 7 drives the slide 14 to move along the slide rail 8, so that the wafer on the suction cup 15 is transferred to the top of the edging cylinder 10, and the vertical cylinder 5 controls the distance between the suction cup 15 and the edging cylinder 10, so that the wafer on the suction cup 15 is placed on the grinding plate 16 inside the edging cylinder 10;

[0036] Furthermore, during grinding, the wafer is placed in the concave cavity 160 opened on the grinding plate 16, and the screw 12 is driven by the driving motor 11 to rotate, so that the grinding plate 16 rotates in an arc inside the grinding cylinder 10. During the rotation, the edge of the concave cavity 160 contacts the edge of the wafer, thereby realizing the edge grinding of the wafer.

[0037] In this embodiment, the slide rail 8 extends from the first step of the frame 1 to the second step; the slide rail 8 is fixedly installed on the frame 1;

[0038] In this embodiment, the slide plate 14 is further installed in conjunction with the travel belt 7 ; the travel belt 7 is electrically connected to the controller 13 ; and the controller 13 is fixedly installed on the frame 1 .

[0039] By adopting the above technical solution, when edge grinding is performed, the connecting rod 19 between two adjacent grinding plates 16 is installed in conjunction with the connecting plate 20. In this way, when grinding, when one of the grinding plates 16 is adjusted, the cooperation between the connecting rod 19 and the connecting plate 20 effectively ensures that multiple grinding plates 16 move simultaneously during grinding, effectively ensuring the efficiency and quality of grinding.

[0040] The working principle of the utility model is as follows: when in use, the edged wafer is placed in the placement groove 3 provided on the loading tray 2 by the robotic arm, the travel belt 7 is driven by the controller 13 to move the slide 14, and the vertical cylinder 5 installed at the end of the horizontal cylinder 6 is moved to the top of the loading tray 2, and the vertical cylinder 5 adjusts the distance between the suction cup 15 and the placement groove 3 to effectively achieve the effective adsorption of the wafer in the placement groove 3;

[0041] The sliding plate 14 is driven by the travel belt 7 to move along the slide rail 8 to transfer the wafer on the suction cup 15 to the top of the edging cylinder 10. The vertical cylinder 5 controls the distance between the suction cup 15 and the edging cylinder 10 to place the wafer on the suction cup 15 on the grinding plate 16 inside the edging cylinder 10.

[0042] During grinding, the wafer is placed in the cavity 160 formed on the grinding plate 16. The motor 11 drives the screw 12 to rotate, so that the grinding plate 16 rotates in an arc shape inside the grinding cylinder 10. During the rotation, the edge of the cavity 160 contacts the edge of the wafer, thereby grinding the wafer.

[0043] When edge grinding is performed, the connecting rod 19 between two adjacent grinding plates 16 is installed in conjunction with the connecting plate 20. In this way, when grinding, when one of the grinding plates 16 is adjusted, the cooperation between the connecting rod 19 and the connecting plate 20 effectively ensures that during grinding, multiple grinding plates 16 move simultaneously, effectively ensuring the efficiency and quality of grinding.

[0044] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0045] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. An edge grinding device for semiconductor wafer processing, characterized in that: The invention comprises a frame (1); the frame (1) is arranged in a stepped shape; a loading plate (2) is fixedly mounted on the top of the first step of the frame (1); a plurality of placement grooves (3) are provided on the surface of the loading plate (2); a grinding cylinder (10) having the same number as the placement grooves (3) is fixedly mounted on the top of the second step of the frame (1); a notch is provided on the side wall of the grinding cylinder (10) for facilitating the installation of a grinding plate (16); an annular concave cavity (160) is provided on the inner surface of the grinding cylinder (10); The grinding plates (16) extend to the outside of the edge grinding cylinder (10) and are connected to a fixing frame (17) provided on the outer edge of the edge grinding cylinder (10) via a rotating shaft (18); a connecting rod (19) is provided at the bottom of the plurality of grinding plates (16); and two adjacent connecting rods (19) are connected via a connecting plate (20).

2. The semiconductor wafer processing edge grinding device according to claim 1, wherein: The grinding plate (16) extends to the edge grinding cylinder (10) section and is installed in conjunction with the screw (12); one end of the screw (12) is fixedly installed with the driving motor (11).

3. The edge grinding device for semiconductor wafer processing according to claim 1, characterized in that: The top of the loading tray (2) away from the frame (1) is provided with suction cups (15) having the same number as the placement slots (3); the plurality of suction cups (15) are fixedly mounted via a mounting plate (4); a vertical cylinder (5) is fixedly mounted on the mounting plate (4).

4. The edge grinding device for semiconductor wafer processing according to claim 3, characterized in that: One side of the vertical cylinder (5) is fixedly mounted on the horizontal cylinder (6) via an L-shaped support plate; the horizontal cylinder (6) is fixedly mounted on the slide plate (14); the bottom of one end of the slide plate (14) away from the horizontal cylinder (6) is mounted in cooperation with the slide rail (8).

5. The edge grinding device for semiconductor wafer processing according to claim 4, characterized in that: The slide rail (8) extends from the first step of the frame (1) to the second step; the slide rail (8) is fixedly mounted on the frame (1).

6. The edge grinding device for semiconductor wafer processing according to claim 4, characterized in that: The slide plate (14) is also installed in conjunction with the travel belt (7); the travel belt (7) is electrically connected to the controller (13); and the controller (13) is fixedly installed on the frame (1).

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