Storage tank monitoring device

Abstract

The utility model relates to the field of material storage, in particular to a material storage tank monitoring device, which comprises a material storage tank, a first pressure acquisition module, a second pressure acquisition module, a gravity acquisition module, a temperature and humidity acquisition module, a material level acquisition module and a main control module, the gravity acquisition module is arranged at the bottom of the storage tank; the first pressure acquisition module, the temperature and humidity acquisition module and the material level acquisition module are arranged at the top of the material storage tank; the second pressure acquisition module is arranged on a feeding pipe of the storage tank; the first pressure acquisition module, the second pressure acquisition module, the gravity acquisition module, the temperature and humidity acquisition module and the material level acquisition module are respectively connected with the main control module, and are used for improving the monitoring precision and the monitoring function richness of the storage tank.

Description

Technical Field

[0001] The utility model relates to the field of material storage, in particular to a material storage tank monitoring device. Background Art

[0002] During the operation of the incinerator, pollutant gas sources will be generated and emitted. In order to make the pollutant gases emitted by the incinerator meet the emission standards, various materials are needed to regulate the pollutant gas sources generated by the incinerator. The aforementioned various materials need to be protected from moisture and thermal decomposition. Usually, the materials are stored in sealed storage tanks. When they need to participate in the adjustment link, the storage tanks are used to unload the materials to achieve the regulation of the pollutant gas sources of the incinerator. Therefore, in order to ensure the smooth implementation of the material adjustment action, it is necessary to monitor the storage tanks. However, the existing technology usually adopts the method of dedicated personnel on duty to monitor the storage tanks, and this monitoring method has the problems of low monitoring accuracy and single monitoring function. Utility Model Content

[0003] The embodiment of the utility model discloses a storage tank monitoring device, which is used to improve the monitoring accuracy and richness of the monitoring functions of the storage tank.

[0004] The embodiment of the utility model provides a storage tank monitoring device, comprising: a storage tank, a first pressure acquisition module, a second pressure acquisition module, a gravity acquisition module, a temperature and humidity acquisition module, a material level acquisition module, and a main control module;

[0005] The gravity collection module is arranged at the bottom of the storage tank;

[0006] The first pressure acquisition module, the temperature and humidity acquisition module, and the material level acquisition module are arranged on the top of the storage tank;

[0007] The second pressure acquisition module is provided on the feed pipe of the storage tank;

[0008] The first pressure acquisition module, the second pressure acquisition module, the gravity acquisition module, the temperature and humidity acquisition module, and the material level acquisition module are respectively connected to the main control module.

[0009] Optionally, support bodies are respectively provided on both sides of the storage tank;

[0010] The storage tank is fixed on the mounting platform through the support body;

[0011] The gravity collection module is fixedly arranged between the support body and the installation platform.

[0012] Optionally, the storage tank includes a tank body;

[0013] A support ring is fixedly connected to the outer surface of the upper end of the tank body;

[0014] The upper portion of the support ring is fixedly connected to the top cover;

[0015] A conical bin is provided at the bottom of the tank;

[0016] A discharge valve is provided at the lower end of the conical bin;

[0017] The upper end of the tank body is provided with the feeding pipe.

[0018] Optionally, a connecting pipe is provided on one side of the tank body, and the connecting pipe is used to be connected to a temperature and humidity regulating device.

[0019] Optionally, a round cover is provided on the top cover;

[0020] One end of the circular cover is embedded in the top cover;

[0021] A first connecting pipe communicating with the circular cover is installed on the upper surface of the circular cover;

[0022] The other end of the first connecting pipe is communicated with the air inlet end of the air pump.

[0023] Optionally, a filter is provided at the lower portion of the interior of the circular cover.

[0024] Optionally, a second connecting pipe communicating with the circular cover is further installed on the upper surface of the circular cover; the other end of the second connecting pipe is used to communicate with a compressed gas storage device; and a second solenoid valve is provided on the second connecting pipe.

[0025] Optionally, the second connecting pipe is connected to a third connecting pipe;

[0026] The other end of the third connecting pipe is connected to the feed pipe;

[0027] A first solenoid valve is provided in the pipe connecting the third connecting pipe and the feeding pipe;

[0028] The second solenoid valve is specifically arranged at a side of the connection between the second connecting pipe and the third connecting pipe that is closer to the circular cover.

[0029] Optionally, an electric feeding door is provided at one end of the feeding pipe away from the tank body;

[0030] The feeding electric door is connected to the main control module.

[0031] Optionally, the main control module includes a single chip microcomputer and an operating platform; the operating platform is connected to the single chip microcomputer;

[0032] The single chip microcomputer is connected to the first pressure acquisition module, the second pressure acquisition module, the gravity acquisition module, the temperature and humidity acquisition module, the material level acquisition module, and the feed electric door. From the above technical solution, it can be seen that the embodiment of the utility model has the following advantages:

[0033] An embodiment of the present utility model provides a storage tank monitoring device including: a storage tank, a first pressure acquisition module, a second pressure acquisition module, a gravity acquisition module, a temperature and humidity acquisition module, a material level acquisition module, and a main control module; the gravity acquisition module is arranged at the bottom of the storage tank; the first pressure acquisition module, the temperature and humidity acquisition module, and the material level acquisition module are arranged at the top of the storage tank; the second pressure acquisition module is arranged on the feed pipe of the storage tank; the first pressure acquisition module, the second pressure acquisition module, the gravity acquisition module, the temperature and humidity acquisition module, and the material level acquisition module are respectively connected to the main control module.

[0034] In the present utility model, the gravity acquisition module is used to collect the weighing value of the storage tank to realize weight monitoring of the storage tank; the first pressure acquisition module is used to collect the air pressure in the storage tank, obtain first pressure data, and realize air pressure monitoring inside the storage tank; the second pressure acquisition module is used to output second pressure data when it is squeezed by the material in the feed pipe, so that the staff can observe the feeding situation of the feed pipe based on the second pressure data, so as to promptly discover and deal with the blockage of the feed pipe; the material level acquisition module is used to measure the material level data in the storage tank to realize material level monitoring of the storage tank; the temperature and humidity acquisition module is used to collect temperature data and humidity data in the storage tank; the main control module is connected to the first pressure acquisition module, the second pressure acquisition module, the gravity acquisition module, the temperature and humidity acquisition module, and the material level acquisition module, and is used to receive and display the first pressure data, the second pressure data, the weighing value, the material level data, the temperature data and the humidity data. Therefore, the device provided by the utility model provides a variety of monitoring data for storage tank monitoring, realizes more comprehensive, richer and more accurate monitoring, improves monitoring accuracy, and provides effective data support for staff to carry out storage tank monitoring work, so that staff can have a more comprehensive understanding of the status of the storage tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0036] Figure 1This is a structural diagram of a storage tank monitoring device provided in an embodiment of the present utility model;

[0037] Figure 2 for Figure 1 Schematic diagram of the structure of area A;

[0038] Figure 3 for Figure 2 Schematic diagram of the cross-section structure;

[0039] Figure 4 for Figure 1 Schematic diagram of the interface of area B in the middle;

[0040] Figure 5 This is a schematic diagram of the principle of a storage tank monitoring device provided in an embodiment of the present utility model;

[0041] Figure 6 A schematic structural diagram of a single chip microcomputer provided in an embodiment of the present utility model;

[0042] Figure 7 Another structural diagram of the single chip microcomputer provided in an embodiment of the present utility model;

[0043] Figure 8 A schematic diagram of the structure of a reset circuit provided in an embodiment of the present utility model;

[0044] Figure 9 This is a schematic diagram of the circuit structure of the buzzer provided in an embodiment of the utility model;

[0045] Figure 10 A schematic diagram of the circuit structure of the temperature and humidity sensor provided in an embodiment of the present utility model;

[0046] Figure 11 A schematic diagram of the circuit structure of the memory provided in an embodiment of the present utility model;

[0047] Figure 12 This is a schematic diagram of the circuit structure of the first solenoid valve provided in an embodiment of the present utility model;

[0048] Figure 13 This is a schematic diagram of the circuit structure of the second solenoid valve provided in an embodiment of the present utility model;

[0049] Figure 14 A schematic diagram of the circuit structure of the dust removal fan provided in an embodiment of the present utility model;

[0050] Figure 15 This is a schematic diagram of the circuit structure of the valve controller provided in an embodiment of the present utility model;

[0051] Figure 16 This is a schematic diagram of the circuit structure of a touch display screen provided in an embodiment of the present utility model;

[0052] Figure 17 This is a schematic diagram of the circuit structure of the first gravity transmitter provided in an embodiment of the present utility model;

[0053] Figure 18 This is a schematic diagram of the circuit structure of the second gravity transmitter provided in an embodiment of the present utility model;

[0054] Figure 19 This is a schematic diagram of the circuit structure of the pressure sensor A provided in an embodiment of the present utility model;

[0055] Figure 20 This is a schematic diagram of the circuit structure of the pressure sensor B provided in an embodiment of the present utility model;

[0056] Figure 21 This is a schematic diagram of the circuit structure of the material level sensor provided in an embodiment of the present utility model;

[0057] Figure 22 This is a schematic diagram of the circuit structure of the SPI to four-way serial port converter provided in an embodiment of the present utility model;

[0058] Figure 23 A schematic structural diagram of a crystal oscillator circuit provided in an embodiment of the present invention;

[0059] Figure 24 This is a schematic diagram of the structure of the key circuit provided in an embodiment of the present utility model;

[0060] Figure 25 A schematic diagram of the structure of a download circuit provided in an embodiment of the present utility model;

[0061] Figure 26 This is a schematic diagram of the structure of the power module provided in an embodiment of the present utility model;

[0062] Figure 27 This is a schematic diagram of the interface structure of the gravity transmitter A, gravity transmitter B, pressure sensor A, pressure sensor B, and material level sensor provided in the embodiment of the present utility model;

[0063] Figure 28 This is a schematic diagram of the circuit structure of the LCD display screen provided in an embodiment of the present utility model;

[0064] Figure 29 A schematic diagram of a fixing port of an LCD display screen provided in an embodiment of the present utility model;

[0065] Figure 30 This is another circuit structure diagram of the LCD display screen provided in an embodiment of the present utility model;

[0066] In the figure: 1. Tank body; 2. Conical bin; 3. Discharge valve; 4. Connecting pipe; 5. Support ring; 6. Round cover; 7. First connecting pipe; 8. Vacuum pump; 9. Top cover; 10. Electric feed door; 11. Flange; 12. Pipe joint; 13. Feed pipe; 14. Left support body; 15. Connecting flange; 16. Right support body; 17. First pressure acquisition module; 18. Temperature and humidity acquisition module; 19. Material level acquisition module; 20. First gravity transmitter; 21. Mounting platform; 22. Third connecting pipe; 23. First solenoid valve; 24. Second pressure acquisition module; 25. Second solenoid valve; 26. Second gravity transmitter; 27. Second connecting pipe; 28. Sealing nut; 29. ​​Touch screen; 30. Mode switch button; 31. Emergency interrupt button; 32. REST reset button; 33. Buzzer; 34. Filter. DETAILED DESCRIPTION

[0067] The utility model provides a storage tank monitoring device, which is used to improve the monitoring accuracy and richness of the monitoring functions of the storage tank.

[0068] The following is a clear and complete description of the technical solution of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0069] In the description of the present invention, it should be noted that the terms "front," "back," "upper," "lower," "both ends," "center," "horizontal," "inner," and "outer" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Relational terms such as "first" and "second" are used solely to distinguish one entity from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities.

[0070] Unless otherwise expressly specified or limited, the terms "installed," "connected," "connect," "fixed," and "disposed" should be understood broadly. For example, they may refer to fixed, detachable, or integral connections; they may refer to mechanical connections, direct connections, indirect connections through an intermediary, or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0071] See also Figure 1An embodiment of a storage tank monitoring device provided in an embodiment of the present invention includes a storage tank, a first pressure acquisition module 17, a second pressure acquisition module 24, a gravity acquisition module, a temperature and humidity acquisition module 18, a material level acquisition module 19, and a main control module; the gravity acquisition module is arranged at the bottom of the storage tank; the second pressure acquisition module 24 is arranged on the feed pipe 13 of the storage tank; the first pressure acquisition module 17 is arranged at the top of the storage tank; the temperature and humidity acquisition module 18 and the material level acquisition module 19 are arranged at the top of the storage tank; the first pressure acquisition module 17, the second pressure acquisition module 24, the gravity acquisition module, the temperature and humidity acquisition module 18, and the material level acquisition module 19 are respectively connected to the main control module.

[0072] It should be noted that the gravity collection module is used to collect the weighing value of the storage tank to realize weight monitoring of the storage tank.

[0073] The feed pipe 13 can be arranged on one side of the upper part of the storage tank and be connected to the inside of the storage tank to provide a feed channel. In actual use, the material can be poured into the storage tank through the feed pipe 13 to complete the feeding. Among them, the second pressure acquisition module 24 is arranged in the feed pipe 13, and is used to collect the second pressure data generated by the material squeezing the second pressure acquisition module 24 during the feeding process. In actual applications, the pressure exerted on the second pressure acquisition module 24 can be fed back according to the size of the second pressure data. When the pressure is greater, the more serious the blockage of the feed pipe 13 is. Therefore, based on the size of the second pressure data, the feeding situation of the feed pipe 13 can be observed, so that when a slight blockage or a serious blockage occurs, it is convenient for the staff to discover and intervene in time to improve the smoothness of the feeding, and avoid the situation where it is difficult to observe the feeding process due to the storage tank being a non-transparent enclosed space, which makes it difficult to find the feeding blockage and reduces the feeding efficiency.

[0074] The first pressure acquisition module 17, the material level acquisition module 19, and the temperature and humidity acquisition module 18 are all connected to the interior of the storage tank. The first pressure acquisition module 17 is used to acquire air pressure data within the storage tank to obtain first pressure data, thereby enabling air pressure monitoring within the storage tank; the material level acquisition module 19 is used to measure material level data within the storage tank to enable material level monitoring; and the temperature and humidity acquisition module 18 is used to acquire temperature and humidity data within the storage tank.

[0075] The main control module is connected to the first pressure acquisition module 17, the second pressure acquisition module 24, the gravity acquisition module, the temperature and humidity acquisition module 18, and the material level acquisition module 19, and is used to receive and display the first pressure data, the second pressure data, the weighing value, the material level data, the temperature data and the humidity data.

[0076] Therefore, the device provided by the utility model provides a variety of monitoring data for storage tank monitoring, realizes more comprehensive, richer and more accurate monitoring, improves monitoring accuracy, and provides effective data support for staff to carry out storage tank monitoring work, so that staff can have a more comprehensive understanding of the status of the storage tank.

[0077] In a specific embodiment, supporting bodies are respectively provided on both sides of the storage tank; the storage tank is fixed on the mounting platform 21 through the supporting bodies; and the gravity collection module is fixedly provided between the supporting bodies and the mounting platform 21.

[0078] like Figure 1 As shown, a left support body 14 and a right support body 16 are respectively provided on the left and right sides of the storage tank, and are fixed to the mounting platform 21 through the support bodies, which can improve the stability of the storage tank and enable the storage tank to be firmly fixed on the mounting platform 21.

[0079] Among them, a gravity collection module is installed under each support body to detect the weight of the storage tank and obtain the weighing value of the storage tank. Therefore, in actual application, the staff can determine the weight of the material discharged from the storage tank based on the weighing value, thereby achieving accurate material discharge.

[0080] Therefore, this embodiment improves the weighing accuracy by arranging gravity collection modules under the support bodies on the left and right sides of the storage tank, thereby further improving the monitoring accuracy.

[0081] In a specific embodiment, the gravity collection module may adopt a gravity transmitter with a sensor.

[0082] In this embodiment, a gravity transmitter is provided under each of the left and right support bodies 16. Figure 1 As shown, the left support body 14 is provided with a second gravity transmitter 26 , and the right support body 16 is provided with a first gravity transmitter 20 .

[0083] In a specific embodiment, the material level acquisition module 19 may be a weight-type material level meter.

[0084] In a specific embodiment, the storage tank includes a tank body 1; the outer surface of the upper end of the tank body 1 is fixedly connected to a support ring 5; the upper part of the support ring 5 is fixedly connected to a top cover 9; a conical bin 2 is provided at the bottom of the tank body 1; a discharge valve 3 is provided at the lower end of the conical bin 2; and the feed pipe 13 is provided at the upper end of the tank body 1.

[0085] like Figure 1As shown, the tank body 1, the top cover 9 and the conical bin 2 at the bottom of the tank body 1 constitute a closed storage tank body for sealing and storing materials. Among them, a discharge valve is installed at the lower end of the conical bin 2 to provide a material discharge channel. A temperature and humidity acquisition module 18, a material level acquisition module 19, and a first pressure acquisition module 17 are installed above the top cover 9, wherein the temperature and humidity acquisition module 18, the material level acquisition module 19, and the first pressure acquisition module 17 are all connected to the inside of the tank body 1 through the top cover 9, and are respectively used to collect temperature data, humidity data, material level data and air pressure data inside the tank body 1. A feed pipe 13 is provided on one side of the upper end of the tank body 1, and a second pressure acquisition module 24 can be provided on the side of the feed pipe 13 close to the tank body 1. Among them, the discharge valve 3 is a manual plug-in type discharge valve.

[0086] In a specific embodiment, the top cover 9 is connected to the support ring 5 by a plurality of bolts.

[0087] In this embodiment, the storage tank body is composed of a tank body 1, a top cover 9, and a conical bottom chamber 2, forming a sealed container. A support ring 5 is fixedly connected to the outer surface of the upper end of the tank body 1, and the top cover 9 is fixedly connected to the support ring 5 by multiple bolts, which improves the sealing of the storage tank as a whole and better realizes material storage.

[0088] In a specific embodiment, a connecting pipe 4 is provided on one side of the tank body 1 , and the connecting pipe 4 is used to connect to a temperature and humidity regulating device.

[0089] In actual application, by setting a connecting pipe 4 to connect with the temperature and humidity regulating device, the temperature and humidity regulating device can adjust the temperature and humidity in the storage tank through the connecting pipe 4, so that the storage tank is maintained at a suitable temperature and humidity, thereby effectively avoiding the material from being decomposed by heat and getting damp, thereby extending the storage time of the material.

[0090] In a specific embodiment, the temperature and humidity regulating device may be a device capable of regulating temperature and humidity, such as a constant temperature and humidity machine.

[0091] In a specific embodiment, a round cover 6 is provided on the top cover 9; one end of the round cover 6 is embedded in the top cover 9; a first connecting pipe 7 connected to the round cover 6 is installed on the upper surface of the round cover 6; the other end of the first connecting pipe 7 is connected to the air inlet end of the vacuum pump 8.

[0092] like Figures 1 to 3 As shown, the upper portion of the dome 6 is closed and hollow, while the lower portion is embedded in the top cover 9 and flush with the inner edge of the top cover 9. Therefore, the interior of the dome 6 is connected to the interior of the tank body 1. A first connecting pipe 7 is mounted on the outer surface of the upper portion of the dome 6, communicating with the dome 6. One end of the first connecting pipe 7 is inserted into the interior of the dome 6. The other end of the first connecting pipe 7 is connected to the air inlet of the air pump 8.

[0093] The working principle of this embodiment is as follows: when adding material to the tank body 1, the air pump 8 is started and put into operation, and the air inside the tank body 1 is pumped out of the tank body 1, so that a slightly negative pressure state is formed inside the tank body 1, thereby further improving the smoothness of feeding and preventing the air pressure inside the tank body 1 from increasing as the material increases, resulting in poor feeding. When the material is stopped, the air pump 8 is stopped.

[0094] In a specific embodiment, a filter screen 34 is provided at the lower portion of the inner portion of the circular cover 6 .

[0095] like Figure 3 As shown, the filter screen 34 is fixed in the ring edge at the lower position of the circular cover 6, wherein the filter screen 34 is arranged below one end of the first connecting pipe 7, and is used to prevent the material from being sucked into the first connecting pipe 7 when the vacuum pump 8 is running, thereby avoiding the material from entering the main body of the vacuum pump 8, causing pressure buildup in the pump body or damage to the pump impeller.

[0096] It can be understood that the material in this embodiment is powdery. By setting a filter screen 34 at the edge of the circle at the lower position of the circular cover 6, the material is filtered to prevent the air flow of the material from being discharged, and to prevent the material from being sucked into the vacuum pump 8 and damaging the vacuum pump 8. At the same time, it also prevents the material from contaminating the air inlet end of the vacuum pump 8, thereby improving the cleanliness of the vacuum pump 8.

[0097] In a specific embodiment, a second connecting pipe 27 connected to the circular cover 6 is also installed on the upper surface of the circular cover 6; the other end of the second connecting pipe 27 is used to connect to the compressed gas storage device; and a second solenoid valve 25 is provided on the second connecting pipe 27.

[0098] like Figure 3 As shown, one end of the second connecting pipe 27 is inserted into the circular cover 6 and is arranged above the filter screen 34. The other end of the second connecting pipe 27 is provided with a connecting flange 15 and is connected to the compressed gas storage device through the connecting flange 15. The second solenoid valve 25 is provided on the second connecting pipe 27 and is used to open or close the communication state between the compressed gas device and the internal space of the circular cover 6.

[0099] The other end of the second connecting pipe 27 is provided with a connecting flange 15 for firmly connecting to the compressed gas storage equipment.

[0100] In actual application, the compressed gas storage device is connected to the connecting flange 15 at the other end of the second connecting pipe 27. When the vacuum pump 8 is running, the second solenoid valve 25 is started to connect the compressed gas device and the internal space of the circular cover 6, so that the compressed gas device can spray the stored compressed gas onto the filter 34 through the second connecting pipe 27, thereby blowing the material attached to the filter 34 to the bottom of the tank body 1, thereby cleaning the filter 34, and further preventing the material from entering the vacuum pump 8 and damaging the vacuum pump 8.

[0101] It should be noted that the gas discharge volume of the compressed gas storage device and the suction volume of the suction pump 8 can be set so that the suction volume is greater than the gas discharge volume, so that the tank body 1 can be kept in a slightly negative pressure state even during the injection process to improve the smoothness of the feeding.

[0102] In another application example, the negative pressure state inside the tank body 1 can be observed in real time based on the first pressure data, and when a non-negative pressure state occurs, the gas discharge volume of the compressed gas storage device and the gas extraction volume of the vacuum pump 8 can be adjusted in time to keep the air pressure state inside the tank body 1 in a slightly negative pressure state.

[0103] In a specific embodiment, the compressed gas storage device may be a compressed air tank.

[0104] In a specific embodiment, a sealing nut 28 is further included; the second connecting pipe 27 is sealed and fixedly connected to the outer surface of the circular cover 6 through the sealing nut 28.

[0105] like Figures 2 to 3 As shown, a sealing nut 28 is provided at the connection between the second connecting pipe 27 and the outer surface of the upper portion of the circular cover 6 , so that the second connecting pipe 27 can form a sealed connection with the circular cover 6 , thereby improving the airtightness of the circular cover 6 .

[0106] In a specific embodiment, the second connecting pipe 27 is connected to the third connecting pipe 22; the other end of the third connecting pipe 22 is connected to the feed pipe 13; a first solenoid valve 23 is provided in the pipe connecting the third connecting pipe 22 and the feed pipe 13; the second solenoid valve 25 is specifically provided on the side of the connection between the second connecting pipe 27 and the third connecting pipe 22 that is closer to the round cover 6.

[0107] like Figure 1As shown, one end of the third connecting pipe 22 is disposed between the communication flange 15 and the second solenoid valve 25 and communicates with the second connecting pipe 27, thereby connecting to the compressed gas storage device through the second connecting pipe 27. The other end of the third connecting pipe 22 communicates with the feed pipe 13. A first solenoid valve 23 is disposed on the pipe between the two ends of the third connecting pipe 22. The first solenoid valve 23 is used to open or close the pipe passage between the third connecting pipe 22 and the feed pipe 13.

[0108] The working principle of this embodiment is: when it is determined that the feed pipe 13 is blocked based on the second pressure data, the first solenoid valve 23 is started to make the pipeline between the third connecting pipe 22 and the feed pipe 13 conductive, so that the compressed gas storage device can spray the compressed gas stored inside it into the feed pipe 13 through the third connecting pipe 22, and blow the material in the feed pipe 13 to alleviate the blockage in the feed pipe 13 and improve the smoothness, efficiency and safety and reliability of the feed; and when the feed pipe 13 is not blocked, the first solenoid valve 23 can be turned off to stop blowing.

[0109] In another specific embodiment, the first solenoid valve 23 and the second solenoid valve 25 are respectively connected to the single chip microcomputer of the main control module. In this embodiment, the first solenoid valve 23 and the second solenoid valve 25 can be driven to be turned on and off by the main control module.

[0110] In a specific embodiment, an electric feeding door 10 is provided at one end of the feeding pipe 13 away from the tank body 1 ; the electric feeding door 10 is connected to the main control module.

[0111] It should be noted that one end of the electric feed door 10 is provided with a pipe joint 12 for connecting to the feed pipe 13. One end of the pipe joint 12 is connected to the feed pipe 13, and the other end of the pipe joint 12 is provided with a flange 11, which is used to connect to the unloading equipment. The unloading equipment is used to provide a source of materials. In actual use, staff connect the unloading equipment to the flange 11 of the pipe joint 12, so that the material in the unloading equipment can flow through the pipe joint 12 to the feed pipe 13, and then flow from the feed pipe 13 into the interior of the tank body 1.

[0112] The feed electric door 10 can be an intelligent electric valve with a built-in valve controller. A main control module can be installed on the intelligent electric valve and connected to the valve controller. In practical applications, the main control module can be used to control the valve controller, which can adjust the valve opening, thereby starting or stopping the feed and adjusting the feed amount.

[0113] In a specific embodiment, the main control module includes a single chip microcomputer and an operating platform; the operating platform is connected to the single chip microcomputer;

[0114] The single chip microcomputer is connected to the first pressure acquisition module 17 , the second pressure acquisition module 24 , the gravity acquisition module, the temperature and humidity acquisition module 18 , and the material level acquisition module 19 respectively.

[0115] It should be noted that the main control module can be the main control module included with existing commercially available intelligent electric valves. The main control module includes a single-chip microcomputer and an operating platform. The operating platform is connected to the single-chip microcomputer via a 485 communication interface, and the single-chip microcomputer is connected to the valve controller of the feed electric door 10 via the 485 communication interface. The data output terminals of the second pressure acquisition module 24, the first pressure acquisition module 17, the gravity acquisition module, the temperature and humidity acquisition module 18, and the material level acquisition module 19 are respectively connected to the ADC and DAC acquisition I / O ports of the single-chip microcomputer.

[0116] Therefore, in actual applications, the second pressure acquisition module 24, the first pressure acquisition module 17, the gravity acquisition module, the temperature and humidity acquisition module 18, and the material level acquisition module 19 can transmit the collected data to the single-chip microcomputer through the I / O port, and the single-chip microcomputer can transmit the received data to the operating platform through the 485 communication interface. The operating platform can display the second pressure data for feedback on the blockage condition of the feed pipe 13, the first pressure data for feedback on the internal pressure of the tank body 1, the temperature, humidity, material weight, and material level inside the tank body 1, so that the staff can understand the status inside the tank in real time.

[0117] On the other hand, when valve opening adjustment is required, the staff can use the operating platform to input the valve adjustment signal to the single-chip microcomputer, and the single-chip microcomputer forwards the signal to the valve controller through the 485 communication interface, thereby realizing valve opening adjustment.

[0118] In a specific embodiment, Figure 4 As shown, the operating platform also includes peripheral auxiliary components such as a touch screen display 29, an automatic / manual switching button, an emergency interrupt button 31, a REST reset button 32, a memory, and a buzzer 33; among them, the touch screen display 29, the mode switching button 30, the emergency interrupt button 31, the REST reset button 32, and the buzzer 33 are arranged on the operating platform.

[0119] It should be noted that peripheral auxiliary components such as the mode switch button 30, emergency interrupt button 31, REST reset button 32, memory, buzzer 33 are connected to the corresponding I / O ports of the microcontroller, and the touch screen 29 is connected to the microcontroller through the 485 communication interface.

[0120] It should be noted that the REST reset button 32 is used to prevent the intelligent valve controller from freezing and restarting it. The emergency stop button 31 is used to prevent the intelligent valve controller from failing and to shut down the feed electric door 10 in an emergency, and has the highest priority. The memory is used to store data and record valve operation and fault information. The mode switch button 30 is used to switch between automatic mode and manual mode. Automatic mode automatically adjusts the opening of the feed electric door 10, while manual mode allows manual adjustment of the opening of the feed electric door 10.

[0121] The buzzer 33 is used for alarming. For example, when the state of the storage tank is abnormal, the buzzer 33 can be used to alarm. For example, when the feed pipe is blocked, an alarm is issued to remind the staff, and the alarm stops after the feed pipe returns to normal. In an application example, based on the hardware structure provided by this embodiment, the alarm activity can be performed by setting the corresponding temperature and humidity thresholds, material level thresholds, gravity thresholds and pressure thresholds. Taking the material level threshold as an example, when the actual material level is higher than 85% of the material level threshold, a high material level "H" alarm is issued; when the actual material level is higher than 95% of the material level threshold, a high material level "HH" alarm is issued, prompting to stop feeding; when the actual material level is lower than 20% of the material level threshold, a low material level "L" alarm is issued; when the actual material level is lower than 10% of the material level threshold, a low material level "LL" alarm is issued, prompting that feeding is required.

[0122] In one application example, when switching to manual mode, a worker can use the touchscreen display 29 to set and adjust the opening of the electric feed door 10. Manual adjustment works as follows: the touchscreen display 29 receives the opening value set by the worker and forwards it to the microcontroller via the 485 communication interface. The microcontroller then forwards the value to the valve controller of the electric feed door 10, which then adjusts the valve opening. It is understood that existing intelligent valve controllers have this valve opening adjustment function, and the opening can be adjusted according to the product specifications.

[0123] In another application example, it is also possible to switch to automatic mode and use the single chip microcomputer for automatic adjustment. For example: the I / O ports of the ADC and DAC of the single chip microcomputer can be used to obtain the data collected by each acquisition module (such as material level data, weight data), and the amount of material filled in the tank body and the material level height can be determined based on the collected data, and the opening of the feed electric door can be controlled based on the material amount and the material level height to realize the automatic feeding function. For example, when it is found that the material level height is about to reach the height of the inner edge of the top cover, the opening of the feed electric door is adjusted to the lowest, the feed electric door is closed, and the feeding is stopped. It can be understood that based on the hardware connection structure of the device provided in this embodiment, those skilled in the art can set the corresponding automatic mode according to actual needs to automatically adjust the valve, realize the automation of material feeding, and further improve the accuracy, efficiency and safety and reliability of feeding, without being limited to this application example.

[0124] In one application example, based on the hardware structure provided by this device, a buzzer can be used to alarm for various abnormal conditions of the tank to prompt the staff to deal with them in time. For example, when the monitored temperature and humidity data are abnormal or the second pressure data or the first pressure data or the material level data or the weighing value is abnormal, the buzzer will alarm to remind the staff to check. When the abnormal data returns to normal, the buzzer will automatically reset and stop the alarm.

[0125] In one possible implementation, the overall hardware structure of the storage tank monitoring device provided by the present invention is as follows: Figure 5 As shown, the STM32F103VET6 is a single-chip microcomputer, and pressure transmitters A and B are the first and second pressure transmitters, respectively, in the aforementioned embodiment. Gravity transmitters A and B are the first and second gravity transmitters installed on the support body in the aforementioned embodiment. The level gauge transmitter is the level acquisition module in the aforementioned embodiment. Solenoid valves A and B are the first and second solenoid valves in the aforementioned embodiment. The dust removal fan is the air extraction pump in the aforementioned embodiment.

[0126] Pressure transmitter A, pressure transmitter B, gravity transmitter A, gravity transmitter B, and level meter transmitter are each connected to the microcontroller's AD / DA module. Each AD / DA module is connected to the microcontroller via the RS485 communication interface. The temperature and humidity sensors are connected to the microcontroller via the IC bus. A power module is connected to the microcontroller to provide 12V, 5V, and 3V power supplies. The emergency interrupt button KEY1, mode switch button KEY2, and buzzer are connected to the microcontroller via the GPIO port. Solenoid valves A and B are each connected to a driver module composed of MOS transistors, each of which is connected to the microcontroller via the GPIO port. The electric valve is connected to the valve controller, which is connected to the microcontroller via the RS485 interface. The memory is connected to the microcontroller via the IC bus. The microcontroller is connected to the thyristor via the GPIO port. The thyristor is connected to the AC contactor, which is connected to the dust removal fan. The touch screen is connected to the microcontroller via the RS485 communication interface.

[0127] In a possible implementation, the connection relationship between the pins of the microcontroller is as follows: Figure 6As shown, pin PA0 is connected to the emergency interrupt button KEY1. Pins PA4 to PA7 are connected to the SPI_CS, SPI_SCK, SPI_MISO, and SPIMOSI ports of the SPI to 4-way serial port, respectively. Pin PA8 is connected to the buzzer. Pins PA9 and PA10 are connected to the RXE_485 and TXE_485, respectively, and are connected to the material level transmitter through the RXE_485 and TXE_485. Pin PA11 is connected to the dust removal fan. Pin PB0 is connected to solenoid valve A. Pin PB1 is connected to solenoid valve B. Pins PB6 to PB8 are connected to the I2C1_SCL and I2C1_SDA of the temperature and humidity sensor, as well as LED1, respectively. Pin PB9 is connected to LED2. Pins PC6 and PC7 are connected to the I2C2_SCL and I2C2_SDA of the memory, respectively. Pins PC10 and PC11 are connected to RXF_485 and TXF_485, respectively, and are connected to the touch screen through RXF_485 and TXF_485. Pin PC13 is connected to the mode switch button KEY2. Pins PD4 to PD7 are connected to the valve controller.

[0128] In one possible implementation, Figure 7 As shown, the microcontroller is also provided with pins VBAT, VDD power supply pin, VSS pin, ADC (analog-to-digital converter) reference voltage positive pin VREF+, ADC (analog-to-digital converter) reference voltage negative pin VREF-, VSS ground pin, NRST reset pin, startup pins (BOOT0 and PB2), OSC_IN crystal oscillator circuit reverse input pin, OSC_OUT crystal oscillator circuit reverse output pin, and JTAG or SWD download pins (PB3 to PB4 pins, PA13 to PA15 pins), PC14 to PC15 pins. The connection relationship of the above pins can be referred to. Figure 7 .

[0129] In a possible implementation, a reset circuit is further provided for resetting the single chip microcomputer, wherein the circuit diagram of the reset circuit is as shown in FIG. Figure 8 As shown, the power supply VCC is connected to the voltage R34, and is respectively connected to the reset button SW1 and the reset pin NRST of the microcontroller, wherein both ends of the reset button SW1 are connected to the capacitor C13 and to the ground GND.

[0130] In a possible implementation, the circuit connection relationship between the buzzer and the single chip microcomputer is as follows: Figure 9 As shown, the PA8 pin of the microcontroller is connected to the resistor R2 and the transistor Q1 respectively. The transistor Q1 and the resistor R2 are grounded. The transistor Q1 is connected to the diode D1 and the buzzer BZ1 respectively. The buzzer BZ1 is connected to the resistor R1. The resistor R1 is connected to the power supply VCC.

[0131] In a possible implementation, the temperature and humidity acquisition module may use a SHT31-DIS-F temperature and humidity sensor U1, wherein the connection relationship between the temperature and humidity sensor and the single chip microcomputer is as follows: Figure 10 As shown in the figure, the power supply VCC is connected to capacitor C1 and temperature and humidity sensor U1 respectively. Capacitor C1 is grounded. Among pins 1 to 7 of the temperature and humidity sensor, pin 1 and pin 4 are connected to the microcontroller through I2C1_SCL and I2C1_SDA respectively, while pins 2, 7, 8, and 9 are grounded, and pins 3 and 6 are left unconnected.

[0132] In a possible implementation, the memory may be an EEPROM non-volatile memory, and its specific connection relationship with the single chip microcomputer is as follows: Figure 11 In this embodiment, U2 is used to represent a memory. Pins 1 to 3 of the memory are connected to resistors R5, R6, and R7, respectively. Pins 4 and 7 are grounded. Pins 6 and 5 are connected to the microcontroller via I2C1_SCL and I2C1_SDA, respectively. Pin 8 is connected to the power supply VCC. Pin 6 is also connected to resistor R3, and pin 5 is connected to resistor R4. R3, R4, and capacitor C2 are connected to the power supply VCC, and capacitor C2 is grounded.

[0133] In a possible implementation, the specific connection between the first solenoid valve (ie, solenoid valve A) and the single chip microcomputer is as follows: Figure 12 As shown. Interface 1 and interface 2 of coil interface group J1 of the first solenoid valve are each connected to diode D2. One end of diode D2 is grounded, and the other end is connected to transistor Q2. Transistor Q2 is connected to resistor R8 and power supply VCC. Resistor R8 is connected to resistor R9. Resistor R9 is connected to transistor Q3. The B and E terminals of transistor Q3 are connected to resistor R11, respectively. Resistor R11 is connected to resistor R10 and ground, respectively. Resistor R10 is connected to pin PB0 of the microcontroller.

[0134] In a possible implementation, the specific connection between the second solenoid valve (ie, solenoid valve B) and the single chip microcomputer is as follows: Figure 13 As shown. Interface 1 and interface 2 of coil interface group J2 of the second solenoid valve are each connected to diode D3. One end of diode D3 is grounded, and the other end is connected to transistor Q4. Transistor Q4 is connected to resistor R12 and power supply VCC. Resistor R12 is connected to resistor R13, which is connected to transistor Q5. The B and E terminals of transistor Q5 are connected to resistor R15, respectively. Resistor R15 is connected to resistor R14 and ground, respectively. Resistor R14 is connected to pin PB1 of the microcontroller.

[0135] In a possible implementation, the control circuit of the dust removal fan is as follows: Figure 14As shown in the figure, power supply VCC is connected to resistors R21 and R22. Resistor R22 is connected to pin PA11 of the microcontroller. Resistor R21 is connected to the optocoupler MOC3041, which is connected to resistor R20, dual diode D5, and resistor R24. Resistor R20 is connected to dual diode D5, a 10nF capacitor, and pin 1 of the AC contactor control coil J4. Resistor R24 ​​is connected to dual diode D5, resistor R25, and resistor R23. Resistor R23 is connected to the 10nF capacitor and pin 2 of the AC contactor J4. Resistor R25 is connected to pin 3 of the AC contactor J4.

[0136] In a possible implementation, the specific connection relationship between the valve controller and the single chip microcomputer is as follows: Figure 15 As shown in the figure, J12 represents the valve controller's interface group, where interfaces 1 through 3 are connected to 485B_7EXT, 485A_7EXT, and ground GND, respectively. 485B_7EXT is connected to small-profile diode D23, capacitor C53, resistor R116, and resistor R113, respectively. Small-profile diode D23 and capacitor C53 are connected to ground. 485A_7EXT is connected to small-profile diode D22, capacitor C54, resistor R115, and resistor R112, respectively. Resistor R116 is connected to 485A_7EXT and resistor R114, respectively. Resistors R112 through R115 are connected to pins 6, 7, 5, and 8 of half-duplex transceiver U17, respectively. Resistor R114 is connected to ground, while resistor R115 is connected to power supply VCC and capacitor C55. Capacitor C55 is grounded. Pins 2 and 3 of the half-duplex transceiver U17 are connected to resistor R117, which is then connected to power supply VCC, resistor R120, and resistor R119. Resistor R119 is connected to pin 1 of optocoupler ISO15, and pin 2 of optocoupler ISO15 is connected to pin 1 of half-duplex transceiver U17. Resistor R120 is connected to pin 4 of half-duplex transceiver U17 and pin 4 of optocoupler ISO14. Pin 3 of optocoupler ISO14 is connected to ground. Pin 3 of optocoupler ISO15 is connected to GND. Pin 4 of optocoupler ISO15 is connected to RXG_485, resistor R118, and then to the microcontroller through RXG_485. It is also connected to power supply VCC through resistor R118. Pin 2 of optocoupler ISO14 is connected to TXG_485, which in turn is connected to the microcontroller through TXG_485. Pin 1 of the photocoupler ISO14 is connected to a resistor R121 and is connected to a power supply VDD through the resistor R121.

[0137] In a possible implementation, the specific connection relationship between the touch screen and the single chip microcomputer is as follows: Figure 16As shown. Interfaces 1 to 3 of the touch screen interface group J11 are connected to 485B_6EXT, 485A_6EXT, and ground GND, respectively. 485B_6EXT is connected to a small-profile diode D21, capacitor C50, resistor R106, and resistor R103, respectively. Small-profile diode D21 and capacitor C50 are connected to ground. 485A_6EXT is connected to a small-profile diode D20, capacitor C51, resistor R105, and resistor R102, respectively. Resistor R106 is connected to 485A_6EXT and resistor R104, respectively. Resistors R102 through R105 are connected to pins 6, 7, 5, and 8 of the half-duplex transceiver U16, respectively. Resistor R104 is connected to ground, while resistor R105 is connected to power supply VCC and capacitor C52. Capacitor C52 is grounded. Pins 2 and 3 of the half-duplex transceiver U16 are connected to resistor R107, which is then connected to power supply VCC, resistor R110, and resistor R109. Resistor R109 is connected to pin 1 of optocoupler ISO13, and pin 2 of optocoupler ISO13 is connected to pin 1 of half-duplex transceiver U16. Resistor R110 is connected to pin 4 of half-duplex transceiver U16 and pin 4 of optocoupler ISO12. Pin 3 of optocoupler ISO12 is grounded. Pin 3 of optocoupler ISO13 is connected to GND. Pin 4 of optocoupler ISO13 is connected to RXF_485, resistor R108, and then to the microcontroller through RXF_485. It is also connected to power supply VCC through resistor R108. Pin 2 of optocoupler ISO12 is connected to TXF_485, which in turn is connected to the microcontroller through TXF_485. Pin 1 of the photocoupler ISO12 is connected to the resistor R111 and is connected to the power supply VDD through the resistor R111.

[0138] In a possible implementation, the specific connection relationship between the first gravity transmitter (ie, gravity transmitter A) and the single chip microcomputer is as follows: Figure 17As shown. The first gravity transmitter is connected to 485B_1EXT and 485A_1EXT. 485B_1EXT is connected to a small-profile diode D11, capacitor C36, resistor R56, and resistor R57, respectively. Small-profile diode D11 and capacitor C36 are grounded. 485A_1EXT is connected to a small-profile diode D10, capacitor C37, resistor R58, and resistor R61, respectively. Resistor R56 is connected to 485A_1EXT and resistor R60, respectively. Resistors R57, R58, R60, and R61 are connected to pins 7, 8, 5, and 6 of half-duplex transceiver U11, respectively. Resistor R60 is connected to ground, while resistor R58 is connected to power supply VCC and capacitor C35. Capacitor C35 is grounded. Pins 2 and 3 of half-duplex transceiver U11 are connected, as well as resistor R55. Resistor R55 is connected to power supply VCC, resistor R54, and resistor R53. Resistor R53 is connected to pin 1 of optocoupler ISO2, and pin 2 of optocoupler ISO2 is connected to pin 1 of half-duplex transceiver U11. Resistor R54 is connected to pin 4 of half-duplex transceiver U11 and pin 4 of optocoupler ISO3. Pin 3 of optocoupler ISO3 is grounded. Pin 3 of optocoupler ISO2 is connected to GND. Pin 4 of optocoupler ISO2 is connected to RXA_485, resistor R52, and then to the microcontroller through RXA_485. It is also connected to power supply VCC through resistor R52. Pin 2 of optocoupler ISO3 is connected to TXA_485 and then to the microcontroller through TXA_485. Pin 1 of optocoupler ISO3 is connected to resistor R59, which is then connected to power supply VDD through resistor R59.

[0139] In a possible implementation, the specific connection relationship between the second gravity transmitter (ie, gravity transmitter B) and the single chip microcomputer is as follows: Figure 18As shown. The second gravity transmitter is connected to 485B_2EXT and 485A_2EXT. 485B_2EXT is connected to a small-profile diode D13, capacitor C39, resistor R66, and resistor R67, respectively. Small-profile diode D13 and capacitor C39 are grounded. 485A_2EXT is connected to a small-profile diode D12, capacitor C40, resistor R68, and resistor R71, respectively. Resistor R66 is connected to 485A_2EXT and resistor R70, respectively. Resistors R67, R68, R70, and R71 are connected to pins 7, 8, 5, and 6 of half-duplex transceiver U12, respectively. Resistor R70 is connected to ground, while resistor R68 is connected to power supply VCC and capacitor C38. Capacitor C38 is also connected to ground. Pins 2 and 3 of half-duplex transceiver U12 are connected, as well as resistor R65. Resistor R65 is connected to power supply VCC, resistor R64, and resistor R63. Resistor R63 is connected to pin 1 of optocoupler ISO4, and pin 2 of optocoupler ISO4 is connected to pin 1 of half-duplex transceiver U12. Resistor R64 is connected to pin 4 of half-duplex transceiver U12 and pin 4 of optocoupler ISO5. Pin 3 of optocoupler ISO5 is grounded. Pin 3 of optocoupler ISO4 is connected to GND. Pin 4 of optocoupler ISO4 is connected to RXB_485, resistor R62, and then to the microcontroller through RXB_485. It is also connected to power supply VCC through resistor R62. Pin 2 of optocoupler ISO5 is connected to TXB_485 and then to the microcontroller through TXB_485. Pin 1 of optocoupler ISO5 is connected to resistor R69, which is then connected to power supply VDD through resistor R69.

[0140] In a possible implementation, the first pressure acquisition module may use a pressure sensor A. The specific connection relationship between the pressure sensor A and the single chip microcomputer is as follows: Figure 19As shown. Pressure sensor A is connected to 485B_3EXT and 485A_3EXT. 485B_3EXT is connected to small-profile diode D15, capacitor C42, resistor R76, and resistor R78, respectively. Small-profile diode D15 and capacitor C42 are grounded. 485A_3EXT is connected to small-profile diode D14, capacitor C43, resistor R77, and resistor R81, respectively. Resistor R76 is connected to 485A_3EXT and resistor R80, respectively. Resistor R78, resistor R77, resistor R80, and resistor R81 are connected to pins 7, 8, 5, and 6 of half-duplex transceiver U13, respectively. Resistor R80 is connected to ground, while resistor R77 is connected to power supply VCC and capacitor C41. Capacitor C41 is grounded. Pins 2 and 3 of half-duplex transceiver U13 are connected, as well as resistor R75. Resistor R75 is connected to power supply VCC, resistor R74, and resistor R73. Resistor R73 is connected to pin 1 of optocoupler ISO6, and pin 2 of optocoupler ISO6 is connected to pin 1 of half-duplex transceiver U13. Resistor R74 is connected to pin 4 of half-duplex transceiver U13 and pin 4 of optocoupler ISO7. Pin 3 of optocoupler ISO7 is grounded. Pin 3 of optocoupler ISO6 is connected to GND. Pin 4 of optocoupler ISO6 is connected to RXC_485, resistor R72, and then to the microcontroller through RXC_485. It is also connected to power supply VCC through resistor R72. Pin 2 of optocoupler ISO7 is connected to TXC_485 and then to the microcontroller through TXC_485. Pin 1 of optocoupler ISO7 is connected to resistor R79, which is then connected to power supply VDD through resistor R79.

[0141] In a possible implementation, the second pressure acquisition module may use a pressure sensor B. The specific connection relationship between the pressure sensor B and the single chip microcomputer is as follows: Figure 20As shown. Pressure sensor B is connected to 485B_4EXT and 485A_4EXT. 485B_4EXT is connected to small-profile diode D17, capacitor C45, resistor R86, and resistor R88, respectively. Small-profile diode D17 and capacitor C45 are grounded. 485A_4EXT is connected to small-profile diode D16, capacitor C46, ​​resistor R87, and resistor R91, respectively. Resistor R86 is connected to 485A_4EXT and resistor R90, respectively. Resistor R88, resistor R87, resistor R90, and resistor R91 are connected to pins 7, 8, 5, and 6 of half-duplex transceiver U14, respectively. Resistor R90 is connected to ground, while resistor R87 is connected to power supply VCC and capacitor C44. Capacitor C44 is grounded. Pins 2 and 3 of half-duplex transceiver U14 are connected, as well as resistor R85. Resistor R85 is connected to power supply VCC, resistor R84, and resistor R83. Resistor R83 is connected to pin 1 of optocoupler ISO8, and pin 2 of optocoupler ISO8 is connected to pin 1 of half-duplex transceiver U14. Resistor R84 is connected to pin 4 of half-duplex transceiver U14 and pin 4 of optocoupler ISO9. Pin 3 of optocoupler ISO9 is grounded. Pin 3 of optocoupler ISO8 is connected to GND. Pin 4 of optocoupler ISO8 is connected to RXD_485, resistor R82, and then to the microcontroller through RXD_485, and then to power supply VCC through resistor R82. Pin 2 of optocoupler ISO9 is connected to TXD_485 and then to the microcontroller through TXD_485. Pin 1 of optocoupler ISO9 is connected to resistor R89, and then to power supply VDD through resistor R89.

[0142] In a possible embodiment, the material level detection module can use a material level sensor. The specific connection relationship between the material level sensor and the single chip microcomputer is as follows: Figure 21As shown. The material level sensor is connected to 485B_5EXT and 485A_5EXT. 485B_5EXT is connected to small-profile diode D19, capacitor C48, resistor R96, and resistor R98, respectively. Small-profile diode D19 and capacitor C48 are grounded. 485A_5EXT is connected to small-profile diode D18, capacitor C49, resistor R97, and resistor R101, respectively. Resistor R96 is connected to 485A_5EXT and resistor R100, respectively. Resistors R98, R97, R100, and R101 are connected to pins 7, 8, 5, and 6 of half-duplex transceiver U15, respectively. Resistor R100 is connected to ground, while resistor R97 is connected to power supply VCC and capacitor C47. Capacitor C47 is grounded. Pins 2 and 3 of the half-duplex transceiver U15 are connected to resistor R95, which is then connected to power supply VCC, resistor R94, and resistor R93. Resistor R93 is connected to pin 1 of optocoupler ISO10, and pin 2 of optocoupler ISO10 is connected to pin 1 of half-duplex transceiver U15. Resistor R94 is connected to pin 4 of half-duplex transceiver U15 and pin 4 of optocoupler ISO11. Pin 3 of optocoupler ISO11 is grounded. Pin 3 of optocoupler ISO10 is connected to GND. Pin 4 of optocoupler ISO10 is connected to RXE_485, resistor R92, and then to the microcontroller through RXE_485. Pin 2 of optocoupler ISO11 is connected to TXE_485, which in turn is connected to the microcontroller through TXE_485. Pin 1 of optocoupler ISO11 is connected to resistor R99, which is then connected to power supply VDD through resistor R99.

[0143] In a possible implementation, the structure of SPI to four-way serial port is as follows: Figure 22 As shown, it includes the main chip WK2124-ISSG for SPI to four-channel serial port, resistor R49, resistor R50, capacitor C30, capacitor C31, capacitor C34, among which the connection relationship between the main chip WK2124-ISSG, resistor R49, resistor R50, capacitor C30, capacitor C31, capacitor C34 and the pins of the microcontroller can be referred to Figures and Figures.

[0144] In addition, the baud rate of the SPI to four-way serial port in this embodiment is set to 9600, which can be achieved by connecting an external 11.05926MHz crystal oscillator frequency circuit to the single-chip microcomputer. The circuit structure of the 11.05926MHz crystal oscillator frequency circuit is as follows: Figure 22 As shown on the right, it includes resistor R51, crystal oscillator X3, capacitor C32, and capacitor C33.

[0145] In one possible implementation, Figure 23As shown, the single chip microcomputer is further provided with a crystal oscillator circuit, which includes capacitor C16, capacitor C18, capacitor C19, capacitor C21, crystal oscillator X1, and crystal oscillator X2.

[0146] In one possible implementation, the MCU can be connected to an external crystal oscillator with a frequency of 11.05926 MHz.

[0147] In a possible implementation, the emergency interrupt button KEY1 and the mode switch button KEY2 may constitute a key circuit, the structure of which is as follows: Figure 24 As shown on the left, it includes resistors R35, R36, R39, R40, capacitors C17, C20, push button switch SW2, and push button switch SW3. Among them, push button switch SW2 is used to realize the function of emergency interrupt button KEY1, and push button SW3 is used to realize the function of mode switching button KEY2.

[0148] In a possible implementation, LED1 and LED2 can be used for light alarm, and the circuit structure is as follows: Figure 24 As shown on the right, it includes a light-emitting diode D6, a light-emitting diode D7, a resistor R37, and a resistor R38. Among them, the light-emitting diode D6 is LED1, and the light-emitting diode D7 is LED2.

[0149] Based on the light alarm circuit provided in this embodiment, in actual applications, when an abnormality is detected in the state of the tank (such as temperature and humidity or material level or pressure data or weighing value), a corresponding light alarm can be issued by turning on the circuit of LED1 or LED2.

[0150] In a possible implementation, the single-chip microcomputer is also equipped with a JTAG download circuit. In actual applications, the staff can use the download circuit to test and debug the internal chip of the single-chip microcomputer. Figure 25 As shown, the download circuit includes a JTAG interface, resistors R41 to R44, a pin connector J7 and a BOOT setting circuit.

[0151] In a possible implementation manner, a power supply module is further included, and the power supply module is used to provide electrical energy.

[0152] It should be noted that the power module is used to provide the required power to the monitoring device. In this embodiment, the power module includes a first conversion circuit and a second conversion circuit. The first conversion circuit is used to convert a 12V voltage to a 5V voltage, and the second conversion circuit is used to convert a 5V voltage to a 3V voltage.

[0153] The structure of the first conversion circuit is as follows Figure 26As shown, the 12V power supply VCC_12 is connected to resistor R48 and pin 1 of connector J9, respectively. Pin 2 of connector J9 is connected to pin 3 and ground. Resistor R48 is connected to diode D8, which is connected to voltage regulator D9, capacitor C22, capacitor C23, and pin 3 of converter U8, respectively. Voltage regulator D9, capacitor C22, capacitor C23, and pin 1 of converter U8 are all grounded. Pin 4 of converter U8 is connected to capacitor C24 and capacitor C25, respectively. Capacitors C24 and C25 are all grounded. The other end of capacitor C25 is the 5V power output terminal.

[0154] The structure of the second conversion circuit is as follows Figure 26 As shown, the 5V power supply is connected to capacitor C26, capacitor C27, and pin 1 of converter U9 respectively, capacitor C26, capacitor C27, and pin 2 of converter U9 are grounded, pin 3 of converter U9 is connected to capacitor C28 and capacitor C29 respectively, capacitor C28 and capacitor C29 are grounded, and the other end of capacitor C29 is the output end of the 3V power supply VCC_3V3.

[0155] In a possible implementation, gravity transmitter A, gravity transmitter B, pressure sensor A, pressure sensor B, and material level sensor can be connected to the single chip through a connector, and the connection diagram is as follows: Figure 27 As shown, J10 represents a connector, the pins on the left side of J10 are used to connect gravity transmitter A, gravity transmitter B, pressure sensor A, pressure sensor B, and material level sensor, and the pins on the right side are used to connect pins of the microcontroller.

[0156] In a possible implementation, an LCD display screen is further included. The LCD display screen is connected to the single-chip microcomputer and can be used to display data output by the single-chip microcomputer.

[0157] The structure of LCD display is as follows Figure 28 As shown in the figure. LCD display pins DB00 to DB15 are connected to the microcontroller's PD14, PD15, PD0, PD1, PE7 to PE15, and PD8 to PD10, respectively. LCD_RESET, LCD_BL, LCD_CS, RD, WE, RS, DCLK, DOUT, DIN, CS#, and PENIRQ pins are connected to the microcontroller's PE1, PD12, PD7, PD4, PD3, PD11, PE0, PE3, PE2, PD13, and PE4, respectively. The LCD display's power pins 3V3 and 5V are connected to the power supply VCC_3V3 and power supply VCC_5V, respectively.

[0158] The LCD is further provided with fixing ports MH5 to MH10.

[0159] In a possible implementation, the LCD display screen may also be connected to an external TFT-LCD screen, wherein the connection relationship between the pins of the TFT-LCD screen is as follows: Figure 29 As shown. Among them, the TFT-LCD screen can adopt a capacitive screen or a resistive screen, wherein the circuit structure of the capacitive screen and the resistive screen is as follows Figure 29 As shown, when a capacitive screen is used, there is no need to weld the circuit of the resistive screen. 3M fixing holes MH1 to MH4 are also provided.

[0160] The above is a detailed introduction to a storage tank monitoring device provided by the present invention. For those skilled in the art, according to the ideas of the embodiments of the present invention, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A storage tank monitoring device, characterized in that: include: Storage tank, first pressure acquisition module, second pressure acquisition module, gravity acquisition module, temperature and humidity acquisition module, material level acquisition module, main control module; The gravity collection module is arranged at the bottom of the storage tank; The first pressure acquisition module, the temperature and humidity acquisition module, and the material level acquisition module are arranged on the top of the storage tank; The second pressure acquisition module is provided on the feed pipe of the storage tank; The first pressure acquisition module, the second pressure acquisition module, the gravity acquisition module, the temperature and humidity acquisition module, and the material level acquisition module are respectively connected to the main control module.

2. The device according to claim 1, characterized in that Support bodies are respectively provided on both sides of the storage tank; The storage tank is fixed on the mounting platform through the support body; The gravity collection module is fixedly arranged between the support body and the installation platform.

3. The device according to claim 1, characterized in that The storage tank includes a tank body; A support ring is fixedly connected to the outer surface of the upper end of the tank body; The upper portion of the support ring is fixedly connected to the top cover; A conical bin is provided at the bottom of the tank; A discharge valve is provided at the lower end of the conical bin; The upper end of the tank body is provided with the feeding pipe.

4. The device according to claim 3, characterized in that A connecting pipe is provided on one side of the tank body, and the connecting pipe is used to be connected to the temperature and humidity regulating equipment.

5. The device according to claim 3, characterized in that The top cover is provided with a round cover; One end of the circular cover is embedded in the top cover; A first connecting pipe communicating with the circular cover is installed on the upper surface of the circular cover; The other end of the first connecting pipe is communicated with the air inlet end of the air pump.

6. The device according to claim 5, characterized in that A filter screen is provided at the lower portion of the interior of the circular cover.

7. The device according to claim 6, characterized in that A second connecting pipe communicating with the circular cover is also installed on the upper surface of the circular cover; the other end of the second connecting pipe is used to communicate with the compressed gas storage device; and a second solenoid valve is provided on the second connecting pipe.

8. The device according to claim 7, characterized in that The second connecting pipe is connected to the third connecting pipe; The other end of the third connecting pipe is connected to the feed pipe; A first solenoid valve is provided in the pipe connecting the third connecting pipe and the feeding pipe; The second solenoid valve is specifically arranged at a side of the connection between the second connecting pipe and the third connecting pipe that is closer to the circular cover.

9. The device according to claim 3, characterized in that An electric feeding door is provided at one end of the feeding pipe away from the tank body; The feeding electric door is connected to the main control module.

10. The device according to claim 9, characterized in that The main control module includes a single chip microcomputer and an operating platform; the operating platform is connected to the single chip microcomputer; The single chip microcomputer is respectively connected to the first pressure acquisition module, the second pressure acquisition module, the gravity acquisition module, the temperature and humidity acquisition module, the material level acquisition module, and the feed electric door.

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