Spray cooling device configured with spray liquid film distribution characteristic reinforced surface

Abstract

The utility model discloses a spray cooling device for configuring a spray liquid film distribution characteristic reinforced surface. The spray cooling device comprises four parts, namely a spray cooling loop, a data acquisition and processing system, a spray system and a micro-structure surface chip simulation system, a cooling working medium is atomized and then sprayed to the surface of the chip, heat exchange is carried out through the phase change process, and the cooling effect on the micro-structure surface chip is achieved. A heat exchange surface with a smooth center and dispersed columnar structures distributed on the periphery is machined on the surface of the chip, surface distribution of a liquid film is promoted, an annular liquid film sprayed by a hollow conical nozzle is matched, heat resistance is reduced, a gasification core is increased, and the heat exchange efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic chip cooling boiling enhanced heat exchange, in particular to a spray cooling device configured with a spray liquid film distribution characteristic enhanced surface. Background Art

[0002] With the continuous advancement of technology, electronic chips and other components are constantly moving towards integration and modularization, resulting in the continuous increase in equipment heat generation power and energy consumption, which has become a problem that cannot be ignored. Among the many cooling methods, air cooling is the most common, but its heat exchange capacity is poor, reaching only 1W / cm 2 Single-phase cooling in liquid cooling relies on the sensible heat transfer of the cooling medium. Although its heat transfer capacity is higher than that of air cooling, it is only suitable for heat fluxes below 100W / cm 2 The following target components. As the heat dissipation requirements of devices increase, the above traditional cooling methods are obviously unable to meet the growing heat dissipation needs. The spray cooling method based on phase change heat transfer has attracted widespread attention due to its advantages such as small liquid flow rate, uniform temperature distribution of the cooled object, and low stress.

[0003] The vaporization of liquids during spray cooling can be divided into two modes: evaporation and boiling. Both phase-change heat transfer modes can effectively improve the heat transfer capacity of the heat sink surface during spray cooling. Although boiling heat transfer has a higher heat transfer efficiency, the liquid film will only boil when the heat sink surface temperature exceeds the boiling point of the liquid coolant. In spray cooling applications in the low-temperature region, the liquid film is the main medium directly involved in cooling. It grows, breaks, and migrates on the hot surface and is strongly coupled with heat transfer. In addition, the liquid film is thin and has a low thermal resistance during spray cooling, allowing a large amount of heat to be quickly transferred from the heat sink surface to the liquid film surface. Therefore, research on spray cooling methods based on liquid film evaporation heat transfer is very necessary.

[0004] Changing the geometry of heat transfer surfaces is an economical and effective method for increasing the heat flux density of spray cooling. The influence of microstructured surfaces on the heat transfer characteristics of spray cooling primarily involves two aspects: surface geometry and surface roughness. Current research focuses on which microstructured surfaces enhance spray cooling, the heat transfer performance of microstructured surfaces in vacuum environments, and the precise mechanisms by which microstructures enhance spray cooling. Summary of the Invention

[0005] In order to solve the problems existing in the above-mentioned prior art, the purpose of the present utility model is to provide a spray cooling device with a spray liquid film distribution characteristic enhanced surface.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A spray cooling device configured with a spray liquid film distribution characteristic enhanced surface includes a spray cooling circuit, a data acquisition and processing system, a spray system, and a microstructured surface chip simulation system;

[0008] The microstructure surface chip simulation system includes a simulation heat source 10 and a microstructure surface chip 13 located on top of the simulation heat source;

[0009] The spray system includes a spray chamber 8, a nozzle 7 extending into the spray chamber 8, and a lifting platform connected to the nozzle 7; the nozzle 7 moves up and down above the microstructure surface chip 13 with the help of the lifting platform;

[0010] The spray cooling circuit includes: a liquid storage tank 1, the liquid outlet of the liquid storage tank 1 is connected to the inlet of the filter 2, the outlet of the filter 2 is connected to the gear pump 3, the gear pump 3 is connected to the hot side inlet of the plate heat exchanger 4, the cold side inlet and the hot side outlet of the plate heat exchanger 4 are connected to the refrigerator for heat exchange, the cold side outlet of the plate heat exchanger 4 is connected to the inlet of the flow meter 5, and a flow regulating valve 6 and a nozzle 7 are installed downstream of the flow meter. The flow regulating valve 6 is used to adjust the spray flow rate. The liquid is atomized and sprayed through the nozzle 7. After being sprayed, it exchanges heat with the microstructure surface chip 13, and the excess liquid flows into the liquid storage tank 1 to complete the closed circulation loop;

[0011] The data acquisition and processing system includes a thermocouple, a data collector 11 connected to the thermocouple, and a computer 12 connected to the data collector 11, which is used to collect and record key parameters in the spray cooling process. The thermocouples are set at the liquid storage tank 1, the nozzle 7, the simulated heat source 10 and the microstructure surface chip 13 to monitor the temperature of these parts and transmit the signals to the computer for analysis of the cooling situation.

[0012] The microstructure surface chip 13 is simulated by a copper sheet with a smooth center and dispersed columnar surface microstructures around the periphery. The simulated heat source 10 is generated by inserting an electric heating rod into the microstructure surface chip 13 to generate heat through heat conduction.

[0013] The nozzle 7 is a hollow cone nozzle, and the cooling medium is sprayed in an annular shape, so that the spray field forms an annular liquid film along the center line with the mainstream droplets concentrated on the outer edge and the inner core being hollow.

[0014] The spray chamber 8 is made of organic glass, and a transparent super-hydrophobic coating is sprayed on the inner surface of the chamber.

[0015] A pressure gauge is installed downstream of the plate heat exchanger 4 and upstream of the nozzle 7 to monitor the pressure in the pipeline before the spray is sprayed out.

[0016] The experimental platform 9 adopts a hollow design, and the simulated heat source 10 is placed in the hollow cavity, so that the microstructure surface chip 13, the upper surface of the experimental platform 9 and the bottom of the spray cavity 8 are flush, which facilitates the flow of excess cooling medium out of the spray cavity.

[0017] Heat insulation cotton is placed between the bottom of the experimental table 9 and the simulated heat source 10.

[0018] The refrigerant in the liquid storage tank 1 is HFE-7100, which has a boiling point of 61° C. at normal pressure. The low boiling point makes it less likely to damage electronic chips.

[0019] The spray chamber 8 is a hollow cube structure and is connected to the experimental table 9 by means of studs; the experimental table 9 includes a laboratory table base 9-1 and a laboratory table body 9-2; the laboratory table base 9-1 and the laboratory table body 9-2, and the laboratory table body 9-2 and the spray chamber 8 are fixed by bolts and studs.

[0020] A rubber sealing ring is placed on the top of the experimental table body 9-2 to prevent leakage of the cooling medium.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. Efficient Cooling and Precise Temperature Control: The device utilizes a meticulously designed spray cooling circuit, filtering, pumping, and heat exchange processes to ensure stable and efficient cooling. Furthermore, the device's flow meter and flow control valve precisely control the spray volume, optimizing the liquid film distribution within the spray field and improving heat exchange efficiency, making the system adaptable to a variety of operating scenarios.

[0023] 2. Accurate Data Collection and High-Safety Design: The device's data acquisition and processing system accurately collects temperature data from key components, including the liquid storage tank, nozzle, simulated heat source, and microstructured surface chips, enabling real-time analysis of cooling conditions and timely adjustments. The use of low-boiling-point refrigerant HFE-7100 as the cooling medium ensures no damage to electronic chips at normal temperature and pressure, enhancing system safety.

[0024] 3. Optimizing Spray Distribution and Enhancing the Heat Exchange Surface: This device utilizes a hollow cone nozzle. Compared to traditional nozzles that require an external pressure device, this nozzle boasts a simpler structure, resulting in smaller and more uniform atomized droplets, allowing the cooling medium to be ejected in a circular pattern. To prevent dry-burning in the center, the device utilizes a microstructured surface chip. Its smooth center and dispersed columnar surface around the periphery promote uniform distribution of the spray film, further enhancing heat exchange efficiency between the cooling medium and the hot surface.

[0025] 4. Visualization and analysis of the spray cooling system: The spray chamber is made of organic glass, and the inner surface of the chamber is sprayed with a transparent super-hydrophobic coating to prevent spray droplets from adhering to the spray chamber wall and affecting observation. The spray heat transfer process is visualized to facilitate observation of spray morphology, distribution, and dynamic changes, and timely adjustment of experimental parameters to improve the accuracy and reliability of heat transfer data. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of a spray cooling device with a spray liquid film distribution characteristic enhanced surface according to the present invention.

[0027] The thick solid line represents the cooling medium and cooling water flow path, and the dotted line represents the detection signal and electrical signal transmission path.

[0028] Figure 2 This is a three-dimensional diagram of the experimental platform.

[0029] Figure 3 A three-dimensional diagram of the spray chamber.

[0030] Figure 4 This is a three-dimensional image of the copper block simulating the heat source.

[0031] Figure 5 Schematic diagram of the microstructured surface chip.

[0032] Figure 6 Schematic diagram of annular liquid film. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of this device clearer and more specific, the experimental device is further described below in combination with a specific implementation plan and with reference to the accompanying drawings.

[0034] like Figure 1As shown, the utility model is a spray cooling device configured with a spray liquid film distribution characteristic enhanced surface, including a spray cooling circuit, a data acquisition and processing system, a spray system and a microstructured surface chip simulation system; the microstructured surface chip simulation system includes a simulated heat source 10 and a microstructured surface chip 13 located on the top of the simulated heat source; the spray system includes a spray chamber 8, a nozzle 7 extending into the spray chamber 8, and a lifting platform connected to the nozzle 7; the nozzle 7 moves up and down above the microstructured surface chip 13 with the help of the lifting platform; the spray cooling circuit includes: a liquid storage tank 1, the liquid outlet of the liquid storage tank 1 is connected to the inlet of the filter 2, the outlet of the filter 2 is connected to the gear pump 3, the gear pump 3 is connected to the hot side inlet of the plate heat exchanger 4, and the cold side inlet of the plate heat exchanger 4 The hot side outlet is connected to the refrigerator for heat exchange, and the cold side outlet of the plate heat exchanger 4 is connected to the inlet of the flow meter 5. A flow regulating valve 6 and a nozzle 7 are installed downstream of the flow meter. The flow regulating valve 6 is used to adjust the spray flow rate. The liquid is atomized and sprayed out through the nozzle 7. After spraying, it exchanges heat with the microstructure surface chip 13, and the excess liquid flows into the liquid storage tank 1 to complete the closed circulation loop; the data acquisition and processing system includes a thermocouple, a data collector 11 connected to the thermocouple, and a computer 12 connected to the data collector 11, which is used to collect and record key parameters in the spray cooling process, wherein the thermocouple is set at the liquid storage tank 1, the nozzle 7, the simulated heat source 10 and the microstructure surface chip 13, for monitoring the temperature of these parts and transmitting the signal to the computer for analysis of the cooling situation.

[0035] like Figure 2 As shown, as a preferred embodiment of the present invention, the experimental table 9 adopts a hollow design, and the simulated heat source 10 is placed in the hollow cavity, so that the microstructure surface chip 13, the upper surface of the experimental table 9 and the bottom of the spray chamber 8 are flush, so that the excess cooling medium can flow out of the spray chamber. The experimental table 9 includes an experimental table base 9-1 and an experimental table body 9-2; the experimental table base 9-1 and the experimental table body 9-2, and the experimental table body 9-2 and the spray chamber 8 are fixed by bolts and studs, and the studs are screwed into the preset threaded holes to make them tightly connected. A rubber sealing ring is placed on the top of the experimental table body 9-2 to prevent leakage of the cooling medium. Insulation cotton is placed between the bottom of the experimental table 9 and the simulated heat source 10 to prevent high temperature from damaging the experimental table. When the copper block is installed, the five larger circular holes should correspond one-to-one to the through holes of the experimental table body to facilitate the insertion of the heating rod.

[0036] like Figure 3 As shown in the figure, as a preferred embodiment of the present invention, the spray chamber 8 is a hollow cube structure, connected to the experimental table 9 by studs. The spray chamber 8 is made of organic glass, which visualizes the spray heat exchange process and facilitates observation of the spray morphology, distribution, and dynamic changes. The inner surface of the spray chamber is sprayed with a transparent super-hydrophobic coating to prevent spray droplets from adhering to the spray chamber wall and affecting observation.

[0037] like Figure 5 As shown in FIG. 1 , as a preferred embodiment of the present invention, the microstructure surface chip 13 is simulated by a copper sheet having a smooth center and a dispersed columnar surface microstructure around the periphery. Figure 5 The small and medium rectangles are columnar surface microstructures.

[0038] As a preferred embodiment of the present invention, the simulated heat source 10 is inserted into the microstructure surface chip 13 by heat conduction. Figure 4 As shown, in this example, the simulated heat source 10 is a copper block, the large hole is used to place the heating rod, and the small hole is used to place the thermocouple.

[0039] As a preferred embodiment of the present invention, the nozzle 7 is a hollow cone nozzle, and the cooling medium is sprayed in an annular shape, so that the spray field forms an annular liquid film along the center line with the mainstream droplets concentrated on the outer edge and the inner hollow core to cover the microstructure surface chip 13, such as Figure 6 As shown, the shaded part is the part covered by the annular liquid film.

[0040] As a preferred embodiment of the present invention, a pressure gauge is installed downstream of the plate heat exchanger 4 and upstream of the nozzle 7 to monitor the pressure in the pipeline before the spray is ejected.

[0041] As a preferred embodiment of the present invention, the refrigerant in the liquid storage tank 1 is selected as HFE-7100, which has a boiling point of 61° C. at normal pressure. The low boiling point makes it less likely to damage electronic chips.

[0042] The working process of the utility model device is as follows: Figure 1 The coolant flows from tank 1, is pressurized by gear pump 3, flows through filter 2 to plate heat exchanger 4, and then flows through flowmeter 5 to nozzle 7 for discharge. Excess coolant is collected and flows back to tank 1, forming a circulation loop. Plate heat exchanger 4 exchanges heat with the coolant through an external refrigerator, keeping the coolant at a low temperature.

[0043] The nozzle 7 adopts a hollow cone nozzle, and the cooling medium is ejected from the orifice in an annular shape, so that the spray field forms an annular liquid film along the center line with the mainstream droplets concentrated on the outer edge and the inner core hollow ( Figure 6 The surface structure of the chip is processed by micro-machining to construct a heat transfer surface with a smooth center and a dispersed columnar structure around the periphery ( Figure 5 ), a vaporization core is added to make the liquid film diffuse quickly and evenly distribute on the surface of the microstructure surface chip, thereby performing heat exchange and cooling the microstructure surface chip.

[0044] The above-described implementation scheme further explains in detail the purpose, technical solutions and beneficial effects of the device. The device can fully improve the heat exchange efficiency and further explain the heat exchange mechanism of spray cooling. It can be widely used in electronic device cooling, chemical refrigeration and other fields, and has broad prospects.

Claims

1. A spray cooling device with a spray film distribution characteristic enhanced surface, characterized in that: It includes a spray cooling circuit, a data acquisition and processing system, a spray system, and a microstructured surface chip simulation system; The microstructure surface chip simulation system includes a simulated heat source (10) and a microstructure surface chip (13) located on top of the simulated heat source; The spray system comprises a spray chamber (8), a nozzle (7) extending into the spray chamber (8), and a lifting platform connected to the nozzle (7); The nozzle (7) moves up and down above the microstructure surface chip (13) by means of a lifting platform; The spray cooling circuit comprises: a liquid storage tank (1), a liquid outlet of the liquid storage tank (1) being connected to an inlet of a filter (2), an outlet of the filter (2) being connected to a gear pump (3), the gear pump (3) being connected to a hot side inlet of a plate heat exchanger (4), a cold side inlet and a hot side outlet of the plate heat exchanger (4) being connected to a refrigerator for heat exchange, the cold side outlet of the plate heat exchanger (4) being connected to an inlet of a flow meter (5), a flow regulating valve (6) and a nozzle (7) being installed downstream of the flow meter, the flow regulating valve (6) being used to regulate the spray flow, the liquid being atomized and sprayed out through the nozzle (7), and exchanging heat with the microstructure surface chip (13) after being sprayed out, and the excess liquid flowing into the liquid storage tank (1) to complete a closed circulation circuit; The data acquisition and processing system includes a thermocouple, a data collector (11) connected to the thermocouple, and a computer (12) connected to the data collector (11), and is used to collect and record key parameters in the spray cooling process. The thermocouples are arranged at the liquid storage tank (1), the nozzle (7), the simulated heat source (10), and the microstructure surface chip (13) to monitor the temperature of these parts and transmit the signals to the computer for analyzing the cooling situation.

2. The spray cooling device with a spray film distribution enhancement surface according to claim 1, characterized in that: The microstructure surface chip (13) is simulated by a copper sheet with a smooth center and dispersed columnar surface microstructures distributed around the periphery. The simulated heat source (10) is inserted into the microstructure surface chip (13) by heat conduction to generate heat through an electric heating rod.

3. The spray cooling device with a spray film distribution enhancement surface according to claim 1, characterized in that: The nozzle (7) is a hollow cone nozzle, and the sprayed droplets have small and uniform particle sizes. The cooling medium is sprayed in an annular shape, so that the spray field forms an annular liquid film along the center line with the mainstream droplets concentrated on the outer edge and the inner core hollow.

4. The spray cooling device with a spray film distribution enhancement surface according to claim 1, characterized in that: The spray chamber (8) is made of organic glass, and a transparent super-hydrophobic coating is sprayed on the inner surface of the chamber.

5. The spray cooling device with a spray film distribution enhancement surface according to claim 1, characterized in that: A pressure gauge is installed downstream of the plate heat exchanger (4) and upstream of the nozzle (7) to monitor the pressure in the pipeline before the spray is ejected.

6. The spray cooling device with a spray film distribution enhancement surface according to claim 1, characterized in that: The experimental platform (9) adopts a hollow design, and the simulated heat source (10) is placed in the hollow cavity, so that the microstructure surface chip (13), the upper surface of the experimental platform (9) and the bottom of the spray cavity (8) are flush, which facilitates the flow of excess cooling medium out of the spray cavity.

7. The spray cooling device with a spray film distribution enhancement surface according to claim 1, characterized in that: Heat insulation cotton is placed between the bottom of the experimental table (9) and the simulated heat source (10).

8. The spray cooling device with a spray film distribution enhancement surface according to claim 1, characterized in that: The refrigeration medium in the liquid storage tank (1) is selected as the refrigerant HFE-7100 with a boiling point of 61° C. under normal pressure. The low boiling point is not easy to damage the electronic chip.

9. The spray cooling device with a spray film distribution enhancement surface according to claim 1, characterized in that: The spray chamber (8) is a hollow cubic structure and is connected to the experimental table (9) by means of studs; the experimental table (9) comprises an experimental table base (9-1) and an experimental table body (9-2); the experimental table base (9-1) and the experimental table body (9-2), as well as the experimental table body (9-2) and the spray chamber (8), are fixed by means of bolts and studs.

10. The spray cooling device with a surface having enhanced spray film distribution characteristics according to claim 9, characterized in that: A rubber sealing ring is placed on the top of the experimental platform body (9-2) to prevent leakage of the cooling medium.

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