Heat dissipation device for circuit board

Abstract

The utility model discloses a heat dissipation device for a circuit board, and relates to the technical field of heat dissipation for circuit boards. The heat dissipation device for the circuit board comprises a connecting strip, and is characterized in that the bottom of the connecting strip is provided with a bearing seat, the top of the bearing seat is provided with a clamping mechanism which is convenient for clamping the circuit board, and the top of the connecting strip is provided with a heat dissipation mechanism which is convenient for heat dissipation of the circuit board. According to the heat dissipation device for the circuit board, by arranging the heat dissipation fan, when heat dissipation needs to be conducted on the circuit board when the circuit board is welded, the heat dissipation fan is charged through the charging port firstly, the heat dissipation fan can be used conveniently, and an arc-shaped block and a rotating shaft which are convenient for angle adjustment are arranged at the bottom of the heat dissipation fan; a sleeve and a sleeve rod which are convenient to adjust the height of the cooling fan are arranged between the arc-shaped block and the rotating shaft, a second connecting sleeve and a third limiting rod which can adjust the position, on the top of the connecting strip, of the cooling fan are arranged at the bottom of the rotating shaft, and heat dissipation can be conveniently conducted on the circuit board when the circuit board is welded.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation for circuit boards, and particularly relates to a heat dissipation device for circuit boards. Background Art

[0002] A circuit board is composed of an insulating board substrate, a conductive pattern, and pads. It is a component used to carry electronic components and realize electrical connections between electronic components. During the soldering process of circuit board components, an electric soldering iron is required to melt the solder to solder and fix the circuit board and components.

[0003] The prior art does not have a structure for heat dissipation during circuit board welding. As a result, during the heat dissipation process of the prior art circuit board, due to the high temperature of the soldering iron, if multiple soldering of a single component pin is required due to operation or equipment problems, the circuit board and the components are easily damaged due to excessive temperature. Based on the deficiencies of the prior art, the present invention designs a heat dissipation device for a circuit board. Utility Model Content

[0004] In order to solve the above problems existing in the prior art, the utility model provides a heat dissipation device for a circuit board, which has the characteristics of heat dissipation by circuit board welding.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a heat dissipation device for a circuit board, comprising a connecting bar, a bearing seat provided at the bottom of the connecting bar, a clamping mechanism for clamping the circuit board provided at the top of the bearing seat, and a heat dissipation mechanism provided at the top of the connecting bar for dissipating heat from the circuit board;

[0006] The heat dissipation mechanism includes a cooling fan, a charging port, a connecting sleeve 2, a limiting rod 3, a rotating shaft, a sleeve, a sleeve rod and an arc block. The cooling fan is arranged at the top of the connecting strip, and the charging port is provided at the bottom of the cooling fan. The connecting sleeve 2 is slidably sleeved on the outer surface of the connecting strip, and one side of the connecting sleeve 2 is threadedly connected to the limiting rod 3. The top of the connecting sleeve 2 is fixedly connected to the rotating shaft, and one side of the rotating shaft is rotatably connected to the sleeve. The inside of the sleeve is slidably connected to the sleeve rod, and the upper surface of the sleeve rod is fixedly connected to the arc block.

[0007] As an optimal technical solution for a heat dissipation device for a circuit board of the utility model, a limiting groove is provided on one side of the connecting strip, an anti-slip pad is fixedly connected to the lower surface of the supporting seat, a connecting sleeve is fixedly connected to the top of the supporting seat, and a limiting rod is threadedly connected to one side of the connecting sleeve.

[0008] As a preferred technical solution of a heat dissipation device for a circuit board of the present invention, the upper surface of the connecting sleeve is fixedly connected to a support rod, one side of the support rod is provided with a slide groove, and one side of the support rod is provided with a threaded groove.

[0009] As an optimal technical solution for a heat dissipation device for a circuit board of the utility model, the clamping mechanism includes a clamping head, a rotating rod, a limiting ring, a second thread groove, a rotating knob, a threaded rod and a rubber pad. The clamping head is arranged on one side of the support rod, one side of the clamping head is fixedly connected to the rotating rod, one side of the rotating rod is fixedly connected to the limiting ring, one side of the rotating rod is provided with a second thread groove, the internal thread of the second thread groove is connected to the threaded rod, one side of the threaded rod is fixedly connected to the rotating knob, and the outer surface of the rotating knob is movably sleeved with a rubber pad.

[0010] As an optimal technical solution for a heat dissipation device for a circuit board of the utility model, the clamping mechanism also includes a sliding sleeve, a rotation groove, a second limiting groove and a second limiting rod. The sliding sleeve is slidably connected to the inside of the support rod, a rotation groove is provided on one side of the sliding sleeve, a second limiting groove is provided on one side of the sliding sleeve, and a second limiting rod is provided on one side of the second limiting groove.

[0011] As an optimal technical solution for a heat dissipation device for a circuit board of the utility model, the heat dissipation fan is rotatably connected to the top of the arc block, the limiting rod three is arranged on one side of the limiting groove one, and the sleeve is rotatably connected to the top of the connecting sleeve two.

[0012] As a preferred technical solution of a heat dissipation device for a circuit board of the present invention, the clamping head is rotatably connected to one side of the sliding sleeve, and the rotating rod is rotatably connected to the inside of the rotating groove.

[0013] As a preferred technical solution of a heat dissipation device for a circuit board of the present invention, the sliding sleeve is slidably connected to the inside of the first sliding groove, and the second limiting rod is threadedly connected to the inside of the first thread groove.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] 1. When the utility model is in use, by setting a cooling fan, when it is necessary to dissipate heat during circuit board welding, the cooling fan is first charged through the charging port provided on one side of the cooling fan, which is convenient for use of the cooling fan. An arc block and a rotating shaft for facilitating angle adjustment are provided at the bottom of the cooling fan, a sleeve and a sleeve rod for facilitating height adjustment of the cooling fan are provided between the arc block and the rotating shaft, and a connecting sleeve 2 and a limiting rod 3 for adjusting the position of the cooling fan at the top of the connecting strip are provided at the bottom of the rotating shaft, so as to flexibly dissipate heat for the circuit board being welded. The device is convenient for dissipating heat during circuit board welding;

[0016] 2. When the present invention is in use, when it is necessary to clamp the circuit board, first the two clamping heads contact the circuit board, and a sliding sleeve is provided on one side of the clamping head. By loosening the limit rod 2, the sliding sleeve can move on one side of the support rod. After moving to the appropriate position, the limit rod 2 can be tightened. Then, the clamping head is fixed with one hand, and the knob is turned with the other hand, so that the threaded rod rotates inside the thread groove 2 and the knob is away from the side of the sliding sleeve. At this time, the rubber pad does not contact the side of the sliding sleeve. At this time, the clamping head can be rotated and adjusted to a suitable angle, and the knob is turned again to make the rubber pad contact the side of the sliding sleeve, and the rubber pad is squeezed and fixed, so that the clamping head can be fixed. This device is convenient for clamping circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0018] Figure 1 This is a schematic diagram of the connecting strip structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the bearing seat of the utility model;

[0020] Figure 3 This is a schematic diagram of the heat dissipation mechanism structure of the present utility model;

[0021] Figure 4 This is a schematic diagram of the support rod structure of the utility model;

[0022] Figure 5 This is a schematic structural diagram of the clamping mechanism of the present utility model.

[0023] In the figure: 1. Connecting strip; 101. Limiting groove 1; 2. Bearing seat; 201. Anti-slip pad; 202. Connecting sleeve 1; 203. Limiting rod 1; 204. Support rod; 205. Slide groove 1; 206. Threaded groove 1; 3. Clamping mechanism; 301. Clamping head; 302. Rotating rod; 303. Limiting ring; 304. Threaded groove 2; 305. Knob; 306. Threaded rod; 307. Rubber pad; 308. Slide sleeve; 309. Rotating groove; 310. Limiting groove 2; 311. Limiting rod 2; 4. Heat dissipation mechanism; 401. Cooling fan; 402. Charging port; 403. Connecting sleeve 2; 404. Limiting rod 3; 405. Rotating shaft; 406. Sleeve; 407. Sleeve rod; 408. Arc block. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] Example 1

[0026] See also Figure 1-5 The utility model provides the following technical solutions: a heat dissipation device for a circuit board, comprising a connecting bar 1, a bearing seat 2 is provided at the bottom of the connecting bar 1, a clamping mechanism 3 for clamping the circuit board is provided on the top of the bearing seat 2, and a heat dissipation mechanism 4 is provided on the top of the connecting bar 1 for dissipating heat from the circuit board;

[0027] A limiting groove 101 is provided on one side of the connecting strip 1, a non-slip pad 201 is fixedly connected to the lower surface of the supporting seat 2, a connecting sleeve 202 is fixedly connected to the top of the supporting seat 2, and a limiting rod 203 is threadedly connected to one side of the connecting sleeve 202.

[0028] The upper surface of the connecting sleeve 202 is fixedly connected to a support rod 204 , a sliding groove 205 is provided on one side of the support rod 204 , and a threaded groove 206 is provided on one side of the support rod 204 .

[0029] What needs to be further explained is that: two bearing seats 2 are sleeved on the outer surface of the connecting bar 1, and the position of the support rod 204 at the top of the connecting bar 1 is adjusted by cooperating with the limiting rod 203 and the limiting groove 101 set on the top of the supporting rod 204. A clamping mechanism 3 is set on the top of the support rod 204. By setting the clamping mechanism 3, it is convenient to position the circuit board and the fixed angle of the circuit board can also be adjusted. A heat dissipation mechanism 4 is set on the top of the connecting bar 1. By setting the heat dissipation mechanism 4, it is convenient to dissipate heat when the circuit board is soldered, so as to avoid excessive temperature affecting the service life of the circuit board.

[0030] Example 2

[0031] See also Figure 2-3 , the utility model provides the following technical solutions:

[0032] The heat dissipation mechanism 4 includes a cooling fan 401, a charging port 402, a connecting sleeve 2 403, a limiting rod 3 404, a rotating shaft 405, a sleeve 406, a sleeve rod 407 and an arc block 408. The cooling fan 401 is arranged at the top of the connecting strip 1, and the charging port 402 is provided at the bottom of the cooling fan 401. The connecting sleeve 2 403 is slidably sleeved on the outer surface of the connecting strip 1. One side of the connecting sleeve 2 403 is threadedly connected to the limiting rod 3 404. The top of the connecting sleeve 2 403 is fixedly connected to the rotating shaft 405, and one side of the rotating shaft 405 is rotatably connected to the sleeve 406. The inside of the sleeve 406 is slidably connected to the sleeve rod 407, and the upper surface of the sleeve rod 407 is fixedly connected to the arc block 408.

[0033] The cooling fan 401 is rotatably connected to the top of the arc block 408 , the limiting rod 3 404 is set on one side of the limiting groove 101 , and the sleeve 406 is rotatably connected to the top of the connecting sleeve 2 403 .

[0034] What needs to be further explained is that the cooling fan 401 is charged through the charging port 402 set on one side of the cooling fan 401, which facilitates the use of the cooling fan 401. An arc block 408 and a rotating shaft 405 are set at the bottom of the cooling fan 401 for facilitating angle adjustment. A sleeve 406 and a sleeve rod 407 are set between the arc block 408 and the rotating shaft 405 for facilitating height adjustment of the cooling fan 401. A connecting sleeve 2 403 and a limiting rod 3 404 for adjusting the position of the cooling fan 401 at the top of the connecting strip 1 are set at the bottom of the rotating shaft 405 to facilitate flexible heat dissipation of the circuit board being welded.

[0035] Example 3

[0036] See also Figure 2-5 , the utility model provides the following technical solutions:

[0037] The clamping mechanism 3 includes a clamping head 301, a rotating rod 302, a limiting ring 303, a second thread groove 304, a rotating knob 305, a threaded rod 306 and a rubber pad 307. The clamping head 301 is arranged on one side of the support rod 204. One side of the clamping head 301 is fixedly connected to the rotating rod 302. One side of the rotating rod 302 is fixedly connected to the limiting ring 303. One side of the rotating rod 302 is provided with a second thread groove 304. The internal thread of the second thread groove 304 is connected to the threaded rod 306. One side of the threaded rod 306 is fixedly connected to the rotating knob 305. The outer surface of the rotating knob 305 is movably sleeved with a rubber pad 307.

[0038] The clamping mechanism 3 also includes a sliding sleeve 308, a rotating groove 309, a limiting groove 2 310 and a limiting rod 2 311. The sliding sleeve 308 is slidably connected to the inside of the support rod 204. A rotating groove 309 is provided on one side of the sliding sleeve 308, a limiting groove 2 310 is provided on one side of the sliding sleeve 308, and a limiting rod 2 311 is provided on one side of the limiting groove 2 310.

[0039] The clamping head 301 is rotatably connected to one side of the sliding sleeve 308 , and the rotating rod 302 is rotatably connected to the inside of the rotating groove 309 .

[0040] The sliding sleeve 308 is slidably connected to the interior of the sliding groove 1 205 , and the limiting rod 2 311 is threadedly connected to the interior of the thread groove 1 206 .

[0041] What needs to be further explained is that: the two clamping heads 301 are in contact with the circuit board, and a sliding sleeve 308 is provided on one side of the clamping head 301. By loosening the limit rod 211, the sliding sleeve 308 can be moved to one side of the support rod 204. After moving to the appropriate position, tighten the limit rod 211. Then, fix the clamping head 301 with one hand and turn the knob 305 with the other hand to make the threaded rod 306 rotate inside the thread groove 204 and make the knob 305 away from the side of the sliding sleeve 308. At this time, the rubber pad 307 does not contact the side of the sliding sleeve 308. At this time, the clamping head 301 can be rotated and adjusted to the appropriate angle, and then the knob 305 can be turned again to make the rubber pad 307 contact the side of the sliding sleeve 308, and the rubber pad 307 can be squeezed and fixed to fix the clamping head 301.

[0042] Working principle: When a heat dissipation device for a circuit board is used, first, two supporting seats 2 are sleeved on the outer surface of the connecting bar 1. The limiting rod 203 provided on the top of the supporting seat 2 cooperates with the limiting groove 101 to facilitate the adjustment of the position of the support rod 204 on the top of the connecting bar 1. A clamping mechanism 3 is provided on the top of the support rod 204. The clamping mechanism 3 is provided to facilitate the positioning of the circuit board and to adjust the fixed angle of the circuit board. A heat dissipation mechanism 4 is provided on the top of the connecting bar 1. The heat dissipation mechanism 4 is provided to facilitate the heat dissipation of the circuit board during welding, thereby preventing excessive temperature from affecting the service life of the circuit board.

[0043] When it is necessary to dissipate heat during soldering of a circuit board, the cooling fan 401 is first charged through the charging port 402 provided on one side of the cooling fan 401 to facilitate the use of the cooling fan 401. An arc block 408 and a rotating shaft 405 are provided at the bottom of the cooling fan 401 for facilitating angle adjustment. A sleeve 406 and a sleeve rod 407 are provided between the arc block 408 and the rotating shaft 405 for facilitating height adjustment of the cooling fan 401. A connecting sleeve 2 403 and a limiting rod 3 404 for adjusting the position of the cooling fan 401 at the top of the connecting strip 1 are provided at the bottom of the rotating shaft 405 to facilitate flexible heat dissipation of the circuit board being soldered. This device facilitates heat dissipation of the circuit board during soldering.

[0044] When the circuit board needs to be clamped, first the two clamping heads 301 contact the circuit board, and a sliding sleeve 308 is provided on one side of the clamping head 301. By loosening the limit rod 211, the sliding sleeve 308 can be moved to one side of the support rod 204. After moving to the appropriate position, tighten the limit rod 211. Then, fix the clamping head 301 with one hand and turn the knob 305 with the other hand, so that the threaded rod 306 rotates inside the thread groove 204 and the knob 305 is away from the side of the sliding sleeve 308. At this time, the rubber pad 307 does not contact the side of the sliding sleeve 308. At this time, the clamping head 301 can be rotated and adjusted to a suitable angle, and then the knob 305 is turned again so that the rubber pad 307 contacts the side of the sliding sleeve 308, and the rubber pad 307 is squeezed and fixed, so that the clamping head 301 can be fixed. This device is convenient for clamping circuit boards.

[0045] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A heat dissipation device for a circuit board, comprising a connecting strip (1), characterized in that: A bearing seat (2) is provided at the bottom of the connecting bar (1), a clamping mechanism (3) for clamping a circuit board is provided at the top of the bearing seat (2), and a heat dissipation mechanism (4) for dissipating heat from the circuit board is provided at the top of the connecting bar (1); A heat dissipation mechanism (4), the heat dissipation mechanism (4) comprising a heat dissipation fan (401), a charging port (402), a second connecting sleeve (403), a limiting rod (404), a rotating shaft (405), a sleeve (406), a sleeve rod (407) and an arc block (408), wherein the heat dissipation fan (401) is arranged at the top of the connecting strip (1), the bottom of the heat dissipation fan (401) is provided with a charging port (402), the second connecting sleeve (403) is slidably sleeved on the outer surface of the connecting strip (1), one side of the second connecting sleeve (403) is threadedly connected to the limiting rod (404), the top of the second connecting sleeve (403) is fixedly connected to the rotating shaft (405), one side of the rotating shaft (405) is rotatably connected to the sleeve (406), the interior of the sleeve (406) is slidably connected to the sleeve rod (407), and the upper surface of the sleeve rod (407) is fixedly connected to the arc block (408).

2. The heat dissipation device for a circuit board according to claim 1, characterized in that: A limiting groove (101) is provided on one side of the connecting strip (1), a non-slip pad (201) is fixedly connected to the lower surface of the supporting seat (2), a connecting sleeve (202) is fixedly connected to the top of the supporting seat (2), and a limiting rod (203) is threadedly connected to one side of the connecting sleeve (202).

3. The heat dissipation device for a circuit board according to claim 2, characterized in that: The upper surface of the connecting sleeve (202) is fixedly connected to a support rod (204), one side of the support rod (204) is provided with a sliding groove (205), and one side of the support rod (204) is provided with a threaded groove (206).

4. The heat dissipation device for a circuit board according to claim 1, wherein: The clamping mechanism (3) comprises a clamping head (301), a rotating rod (302), a limiting ring (303), a second thread groove (304), a rotating knob (305), a threaded rod (306) and a rubber pad (307); the clamping head (301) is arranged on one side of the support rod (204); one side of the clamping head (301) is fixedly connected to the rotating rod (302); one side of the rotating rod (302) is fixedly connected to the limiting ring (303); one side of the rotating rod (302) is provided with a second thread groove (304); the inner thread of the second thread groove (304) is connected to the threaded rod (306); one side of the threaded rod (306) is fixedly connected to the rotating knob (305); and the outer surface of the rotating knob (305) is movably sleeved with a rubber pad (307).

5. The heat dissipation device for a circuit board according to claim 1, characterized in that: The clamping mechanism (3) further comprises a sliding sleeve (308), a rotating groove (309), a second limiting groove (310) and a second limiting rod (311); the sliding sleeve (308) is slidably connected to the interior of the support rod (204); a rotating groove (309) is provided on one side of the sliding sleeve (308); a second limiting groove (310) is provided on one side of the sliding sleeve (308); and a second limiting rod (311) is provided on one side of the second limiting groove (310).

6. The heat dissipation device for a circuit board according to claim 1, characterized in that: The cooling fan (401) is rotatably connected to the top of the arc block (408), the limiting rod (404) is arranged on one side of the limiting groove (101), and the sleeve (406) is rotatably connected to the top of the connecting sleeve (403).

7. The heat dissipation device for a circuit board according to claim 4, characterized in that: The clamping head (301) is rotatably connected to one side of the sliding sleeve (308), and the rotating rod (302) is rotatably connected to the inside of the rotating groove (309).

8. The heat dissipation device for a circuit board according to claim 5, characterized in that: The sliding sleeve (308) is slidably connected to the inside of the sliding groove (205), and the limiting rod (311) is threadedly connected to the inside of the thread groove (206).

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