Heat dissipation device of vacuum eutectic furnace packaging device

Abstract

The utility model is suitable for the technical field of vacuum packaging, and provides a heat dissipation device of a vacuum eutectic furnace packaging device, which comprises a cooling plate, a plurality of stainless steel interlayers are arranged in the cooling plate to form a plurality of cooling liquid channels; the cooling medium inlets and outlets are located at the two ends of the cooling plate, and a cooling medium enters the cooling plate from the cooling medium inlet and outlet in one side, flows into the multiple cooling liquid channels for flow division and then is combined to flow out through the cooling medium inlet and outlet in the other side; and the hollow channel is arranged on the cooling plate and is used for installing a clamp of an electronic device. According to the utility model, the clamp provided with the hollow channel for installing the electronic device is arranged, so that the bottom surface of the clamp can be directly contacted with the infrared heating device of the vacuum eutectic furnace, the side edge of the clamp can be directly contacted with the cooling liquid channel, and cooling liquid or cooling gas enters the cooling plate from the cooling medium inlet / outlet at one side; and the cooling liquid flows through the plurality of cooling liquid channels and then converges to flow out through the cooling medium inlet and outlet in the other side, so that rapid heat dissipation is realized.

Description

Technical Field

[0001] The utility model belongs to the technical field of vacuum packaging, and in particular relates to a heat dissipation device for a vacuum eutectic furnace packaging device. Background Art

[0002] In the prior art, the solders used in vacuum eutectic welding are mostly two or more alloy solders with low melting points, such as gold-tin alloy and tin-silver alloy. Eutectic welding occurs at a relatively low temperature, and eutectic fusion occurs. Through temperature control, the eutectic alloy directly changes from solid to liquid, and then from liquid to solid, without going through a plastic stage. If the heating or cooling is not well controlled, the solder on the welding surface may overflow or voids may occur, resulting in a decrease in product yield or unsuccessful welding.

[0003] In the prior art, heating devices and heat dissipation cooling devices mostly use heat conducting plates to heat or dissipate heat to cool the fixture containing electronic devices. However, since the heat conducting plates have a certain thermal capacitance, the heat cannot be quickly transferred to the fixture or quickly transferred away from the fixture. Utility Model Content

[0004] The purpose of the embodiments of the present invention is to provide a heat dissipation device for a vacuum eutectic furnace packaged device, aiming to solve the problems raised in the above-mentioned background technology.

[0005] The embodiment of the present utility model is implemented as follows: a heat dissipation device for a vacuum eutectic furnace packaged device, comprising:

[0006] A cooling plate, wherein a plurality of stainless steel interlayers are arranged inside the cooling plate to form a plurality of coolant channels;

[0007] The cooling medium inlet and outlet are located at both ends of the cooling plate. The cooling medium enters the cooling plate from the cooling medium inlet and outlet on one side, flows into several cooling liquid channels, and then merges and flows out through the cooling medium inlet and outlet on the other side.

[0008] The hollow channel is provided on the cooling plate and is used for mounting a fixture for electronic components.

[0009] Preferably, stainless steel pipes are provided at both ends of the cooling plate, and the cooling medium inlet and outlet are located at one end of the stainless steel pipe.

[0010] Preferably, a stainless steel bellows is sleeved on the outside of the stainless steel tube, one end of the stainless steel bellows is welded to a stainless steel disc, the stainless steel disc passes through the stainless steel tube and is welded to the outer edge of the stainless steel tube, and the other end of the stainless steel bellows is provided with a CF knife-edge flange.

[0011] Preferably, the cooling plate is further provided with mounting holes.

[0012] Preferably, the heat dissipation device further includes a bottom plate, and the bottom plate cooperates with the cooling plate.

[0013] A heat dissipation device for packaging components in a vacuum eutectic furnace provided by an embodiment of the present invention can be used for welding electronic components with cavities in a vacuum system through a eutectic process, such as bonding a chip to a substrate, bonding a substrate to a tube shell, sealing a tube shell, and other eutectic welding. During welding, the temperature needs to be quickly raised to the fusion temperature of the alloy solder, and after fusion, it needs to be quickly dissipated and cooled through a heat dissipation device. The cooling plate is made of stainless steel 304, 316, or 321, and its shape can be a square plate or a circular plate. The hollow channels are upper and lower through holes. It is a stainless steel structure, and its shape can be square, rectangular, circular, or irregular. It is convenient for installing a fixture for electronic components, so that the bottom surface of the fixture can directly contact the infrared heating device of the vacuum eutectic furnace, and the side of the fixture can directly contact the coolant channel. The coolant or cooling gas enters the cooling plate from the cooling medium inlet and outlet on one side, flows through a plurality of coolant channels, contacts the hollow channel, and exchanges heat with the fixture in the hollow channel, and then merges and flows out through the cooling medium inlet and outlet on the other side to achieve rapid heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A cross-sectional view of a heat dissipation device for a vacuum eutectic furnace packaged device provided by an embodiment of the present utility model;

[0015] Figure 2 This is an external view of a heat dissipation device for a vacuum eutectic furnace packaged device provided in an embodiment of the present utility model.

[0016] In the attached figure: 1-cooling liquid channel; 2-stainless steel interlayer; 3-hollow channel; 4-cooling plate; 5-mounting and fixing hole; 6-stainless steel disc; 7-stainless steel bellows; 8-CF knife-edge flange; 9-cooling medium inlet and outlet; 10-stainless steel pipe. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0018] The specific implementation of the present invention is described in detail below with reference to specific embodiments.

[0019] like Figures 1 to 2 FIG. 1 is a structural diagram of a heat dissipation device for a vacuum eutectic furnace packaged device provided by an embodiment of the present invention, comprising:

[0020] A cooling plate 4, wherein a plurality of stainless steel interlayers 2 are arranged inside the cooling plate 4, forming a plurality of cooling liquid channels 1;

[0021] The cooling medium inlet and outlet 9 are located at both ends of the cooling plate 4. The cooling medium enters the cooling plate 4 from the cooling medium inlet and outlet 9 on one side, flows into several cooling liquid channels 1, and then merges and flows out through the cooling medium inlet and outlet 9 on the other side.

[0022] The hollow channel 3 is provided on the cooling plate 4 and is used for mounting a fixture of electronic components.

[0023] In one embodiment of the present invention, the heat dissipation device of the vacuum eutectic furnace packaging device can be used to weld electronic devices with cavities through the eutectic process in a vacuum system, such as bonding chips to substrates, bonding substrates to tube shells, tube shell caps, and other eutectic welding. During welding, it is necessary to quickly heat up to the fusion temperature of the alloy solder, and after fusion, it is necessary to quickly dissipate heat and cool down through the heat dissipation device. The cooling plate 4 is made of stainless steel 304, 316, 321, and its shape can be a square plate or a circular plate. The hollow channel 3 is a top and bottom passage. The hole is a stainless steel structure, and its shape can be square, rectangular, circular or irregular, which is convenient for installing the fixture of the electronic device, so that the bottom surface of the fixture can be directly in contact with the infrared heating device of the vacuum eutectic furnace, and the side of the fixture can be directly in contact with the coolant channel 1. The coolant or cooling gas enters the cooling plate 4 from the cooling medium inlet and outlet 9 on one side, flows through several coolant channels 1, contacts the hollow channel 3, and exchanges heat with the fixture in the hollow channel 3, and then merges and flows out through the cooling medium inlet and outlet 9 on the other side to achieve rapid heat dissipation.

[0024] like Figure 1 As shown, as a preferred embodiment of the present invention, a stainless steel pipe 10 is provided at each end of the cooling plate 4, and the cooling medium inlet and outlet 9 is located at one end of the stainless steel pipe 10;

[0025] Specifically, a stainless steel bellows 7 is provided on the outside of the stainless steel tube 10, one end of the stainless steel bellows 7 is welded to the stainless steel disc 6, the stainless steel disc 6 passes through the stainless steel tube 10 and is welded to the outer edge of the stainless steel tube 10, and the other end of the stainless steel bellows 7 is provided with a CF knife-edge flange 8.

[0026] One end of the stainless steel tube 10 is a connecting joint, which is convenient for connecting the input and output interfaces of the coolant equipment. A stainless steel bellows 7 is also provided on the outside of the stainless steel tube 10. The material of the stainless steel bellows 7 can be 304, 316, or 321. The interface of the CF knife-edge flange 8 can be installed on the inside or outside of the vacuum chamber through a pure copper gasket, which can maximize the reduction of the leakage rate of the heat dissipation device.

[0027] like Figure 1 As shown, as a preferred embodiment of the present invention, the cooling plate 4 is further provided with a mounting hole 5 .

[0028] The installation and fixing holes 5 are provided to facilitate the installation and fixing of the heat dissipation device.

[0029] like Figure 1 As shown, as a preferred embodiment of the present invention, the heat dissipation device further includes a bottom plate, which cooperates with the cooling plate 4.

[0030] The bottom plate and the cooling plate 4 can be welded together by vacuum brazing or by argon arc welding. The bottom plate is also a stainless steel structure. During vacuum brazing, the bottom plate is a stainless steel plate with hollow holes, and the upper and lower plates are welded together by existing technology; during argon arc welding, the bottom plate is a plate with hollow holes and corresponding hollow holes for the protruding parts of the stainless steel interlayer 2, and the upper and lower plates are welded together by argon arc shielded welding.

[0031] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A heat dissipation device for a vacuum eutectic furnace packaged device, characterized in that: include: A cooling plate (4), wherein a plurality of stainless steel interlayers (2) are arranged inside the cooling plate (4), forming a plurality of cooling liquid channels (1); The cooling medium inlet and outlet (9) are located at both ends of the cooling plate (4). The cooling medium enters the cooling plate (4) from the cooling medium inlet and outlet (9) on one side, flows into a plurality of cooling liquid channels (1) for split flow, and then merges and flows out through the cooling medium inlet and outlet (9) on the other side. The hollow channel (3) is provided on the cooling plate (4) and is used for mounting a fixture for electronic devices.

2. The heat dissipation device for vacuum eutectic furnace packaging components according to claim 1, characterized in that: Stainless steel pipes (10) are respectively provided at both ends of the cooling plate (4), and the cooling medium inlet and outlet (9) are located at one end of the stainless steel pipe (10).

3. The heat dissipation device for vacuum eutectic furnace packaging components according to claim 2, characterized in that: A stainless steel bellows (7) is sleeved on the outer side of the stainless steel tube (10), one end of the stainless steel bellows (7) is welded to a stainless steel disc (6), the stainless steel disc (6) passes through the stainless steel tube (10) and is welded to the outer edge of the stainless steel tube (10), and the other end of the stainless steel bellows (7) is provided with a CF knife-edge flange (8).

4. The heat dissipation device for vacuum eutectic furnace packaging components according to claim 1, characterized in that: The cooling plate (4) is also provided with a mounting and fixing hole (5).

5. The heat dissipation device for vacuum eutectic furnace packaging components according to claim 1, characterized in that: The heat dissipation device also includes a bottom plate, which cooperates with the cooling plate (4).

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