Device for detecting edge gap of wafer

Abstract

A device for detecting a notch in the edge of a wafer comprises a lighting assembly and a photo taking assembly, and the lighting assembly comprises an annular base, an annular sliding rail, a backlight module, a wafer table and a luminous body. According to the device for detecting the side notch of the wafer, the backlight module is arranged, the annular sliding rail is arranged, and the luminous body is arranged on the annular sliding rail in a sliding manner, so that the optimal irradiation angle and height of the luminous body can be adjusted according to different wafers, multiple groups of luminous bodies do not need to be used, and the detection efficiency is improved. The cost is reduced, the occupied space is reduced, the backlight module can reflect the light rays of the light-emitting bodies, and the requirement for the number of the light-emitting bodies is further reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafers, in particular to a device for detecting wafer edge notches. Background Art

[0002] In the semiconductor packaging process, glass wafers or glass panels are used as substrates or underlay materials. After the molding process, the composite material will overflow to the edge of the glass, thereby affecting the subsequent packaging process. Therefore, the product needs to be trimmed. The trimming process includes chemical material cleaning, laser cleaning and wiping cleaning. A notch is generally provided on the glass part for subsequent processing. Since the composite material easily overflows and covers the notch, the area near the notch and the edge is covered, and the notch feature is not easy to see. Therefore, in order to obtain the notch feature, the operator will introduce light into the glass, and use the algorithm to obtain the notch feature through the imaging of the light at the notch. Since the composite material overflows, it will cover and block the edge of the wafer to varying degrees, and one side of the wafer is opaque after being covered by the composite material. In order to ensure that there is enough light to enter the wafer without being blocked, the operator will use multiple light sources and illuminate both sides of the wafer from different angles to ensure sufficient light.

[0003] However, using multiple sets of light-emitting diodes with different angles not only takes up space, but also results in high costs and serious waste because the light provided by some light-emitting diodes is ineffective and the light intensity provided by all light-emitting diodes far exceeds the required light intensity. The illumination angles of all light-emitting diodes also need to be calculated to ensure that most angles are covered after different light-emitting diode combinations. This requires operators to adjust the illumination angles of the light-emitting diodes one by one, and places high demands on the stability of the light-emitting diode angles. Utility Model Content

[0004] In view of this, the present invention provides a device for detecting wafer edge notches to solve the above-mentioned problem.

[0005] A device for detecting wafer edge notches, comprising a lighting assembly and a camera assembly arranged on one side of the lighting assembly. The lighting assembly comprises an annular base, an annular slide rail arranged on the top of the annular base, a backlight module arranged in the middle of the annular base, a wafer table arranged on the top of the backlight module, and a light-emitting body slidably arranged on the annular slide rail. The annular slide rail and the annular base are concentric. The camera assembly comprises an arc rod, an arc slide rail arranged on one side of the arc rod, and a camera assembly slidably arranged on the arc slide rail. The shooting direction of the camera assembly is toward the center of the arc slide rail. A wafer is placed on the top of the wafer table, and the shooting range of the camera assembly is at the edge of the wafer.

[0006] Furthermore, the light beam of the light emitting body is directed toward the center of the annular slide rail.

[0007] Furthermore, the light-emitting body is a spotlight, and the illumination angle and height of the light-emitting body are adjustable.

[0008] Furthermore, when the height of the light-emitting body is at the lowest point and the light beam of the light-emitting body is emitted horizontally, the center line of the light beam of the light-emitting body is flush with the top surface of the wafer table.

[0009] Furthermore, the central angles of the arc rod and the arc slide are both 90°, and when the camera assembly is located at the end of the arc slide, the shooting direction of the camera assembly is perpendicular to the top surface of the wafer table.

[0010] Furthermore, the center heights of the arc-shaped rod and the arc-shaped slide rail are the same as or close to the top surface height of the wafer table.

[0011] Furthermore, the bottom of the arc-shaped rod is connected to the annular base, and the arc-shaped rod and the annular slide rail are an integrated structure.

[0012] Furthermore, the annular slide rail and the arc-shaped slide rail are respectively electric slide rails.

[0013] Compared with the prior art, the device for detecting the side notch of the wafer provided by the present invention is provided with the backlight module and an annular slide rail, a light-emitting body is slidably provided on the annular slide rail, the light-emitting body moves freely on the annular slide rail and the angle is adjustable, so that the optimal irradiation angle and height of the light-emitting body can be adjusted according to different wafers, without the need to use multiple groups of light-emitting bodies, reducing costs and reducing occupied space, the backlight module can reflect the light of the light-emitting body, further saving the demand for the number of light-emitting bodies, the camera assembly is slidably provided on an arc slide rail, and by selecting a wafer of appropriate size circle, so that the edge of the wafer is located within the shooting range of the camera assembly, and the shooting direction of the camera assembly is toward the center of the arc-shaped slide rail, so that when the camera assembly moves on the arc-shaped slide rail, it can continuously shoot the side image of the wafer at the center of the circle, and by adjusting the position of the camera assembly, images of the wafer notch at different angles can be obtained, which is convenient for selecting the angle with the best imaging effect, and the precise notch feature can be calculated through the algorithm. The edge of the wafer will glow due to the internal light, which is also convenient for the camera assembly to form precise edge features of the glass substrate after shooting, which is convenient for fast and precise trimming in the subsequent trimming process. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic structural diagram of a device for detecting wafer edge notches provided by the present invention.

[0015] Figure 2 for Figure 1 A top view of a device for detecting wafer edge notches.

[0016] Figure 3 for Figure 1 A front view of a device for detecting wafer edge notches. DETAILED DESCRIPTION

[0017] The following is a further detailed description of specific embodiments of the present invention. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the scope of protection of the present invention.

[0018] like Figures 1 to 3 As shown, it is a schematic diagram of the structure of the device for detecting wafer edge notches provided by the present invention. The device for detecting wafer edge notches includes a lighting component 10 and a phase-taking component 20 arranged on one side of the lighting component 10. It is conceivable that the device for detecting wafer edge notches also includes other functional modules, such as a controller and a power distributor connected to the lighting component 10 and the orientation component 20, etc., which are technologies well known to those skilled in the art and will not be described in detail here.

[0019] The lighting assembly 10 includes an annular base 11, an annular slide rail 12 arranged on the top of the annular base 11, a backlight module 13 arranged in the middle of the annular base 11, a wafer table 14 arranged on the top of the backlight module 13, and a light-emitting body 15 slidably arranged on the annular slide rail 12.

[0020] The annular base 11 supports and stabilizes the entire device. The annular slide 12 is concentric with the annular base 11. The annular slide 12 is an electric slide, meaning that the position of the slider on the annular slide 12 is electrically controlled and can switch between a moving state and a stationary state. Since electric slides are well known to those skilled in the art, their structure and principles are prior art and will not be described in detail here.

[0021] The backlight module 13 is used to reflect light toward the bottom of the wafer, allowing the light to enter the wafer. The backlight module 13 is a plate with a reflective surface on its top that can reflect light. The backlight module 13 is arranged inside the ring body of the annular base 11. The backlight module 13 is spaced apart from the inner wall of the annular base 11. The area of ​​the backlight module 13 is larger than the projected area of ​​the wafer, so that the projection of the wafer on the backlight module 13 completely falls into the top surface of the backlight module 13, thereby ensuring that the backlight module 13 can provide sufficient reflected light.

[0022] The wafer table 14 is used to support the wafer. The wafer table 14 and the backlight module 13 are designed to be separated. The wafer table 14 is cylindrical, and the top radius of the wafer table 14 is smaller than the radius of the wafer, so that the bottom of the wafer has an annular exposed portion to facilitate light entry. The wafer table 14 and the backlight module 13 are designed to be detachable. Depending on the size of the wafer, the wafer table 14 or backlight module can be replaced with a suitable size, so that the wafer radius is larger than the top radius of the wafer table 14, and the wafer projection falls completely on the top of the backlight module 13.

[0023] The light-emitting body 15 can emit a beam of light and can be a spotlight. The light-emitting body 15 is fixedly arranged on the top of the slider of the annular slide 12 and moves on the annular slide 12 as the slider moves. When the light-emitting body 15 is a spotlight, the height and illumination angle of the light-emitting body are adjustable, so that more light can be irradiated on the top or bottom surface of the wafer by adjusting the direction of the spotlight, and the illumination direction of the spotlight is toward the center of the annular base 11, so that the spotlight can illuminate most positions on the wafer by adjusting the illumination angle and the position on the annular slide 12. The wafer only needs to have one exposed glass area for light to enter from the exposed area. The angle and height of the light-emitting body 15 are adjustable by hingedly connecting the light-emitting body 15 to a bracket, setting a linear cylinder between the bracket and the slider of the annular slide rail 12, and setting another linear cylinder between the housing of the light-emitting body 15 and the slider. The height and angle of the light-emitting body 15 can be automatically adjusted by controlling the extension and contraction of the linear cylinder. The height and angle can also be adjusted manually, such as by adding a pad to the bottom of the light-emitting body 15 and hingedly connecting the light-emitting body 15 to the bracket. Since the principle and structure of adjusting the height and beam angle of the light-emitting body are prior art and well known to those skilled in the art, they will not be described here and will not be shown in the figure. When the light-emitting body 15 is at the lowest point and the light beam is horizontal, the center line of the light beam emitted by the light-emitting body 15 is flush with the top surface of the wafer table 14. At this time, the spotlight can provide as much light as possible when irradiating the side of the wafer, so that the light is brighter at the notch, which facilitates the phase formation of the light at the notch.

[0024] The lighting assembly 20 includes an arc-shaped rod 21 , an arc-shaped slide rail 22 arranged on one side of the arc-shaped rod 21 , and a camera assembly 23 slidably arranged on the arc-shaped slide rail 22 .

[0025] The curved rod 21 has a 90° arc shape. One end of the curved rod 21 is fixedly connected to the slide rail 13, thereby forming a single unit with the annular base 11. The curved rod 21 and the annular base 11 can be made of hard plastic or iron alloy, providing good support and stability. The other end of the curved rod 21 extends above the annular slide rail 12.

[0026] The curved rail 22 is fixedly mounted on one side of the curved rod 21, with the central angle of the curved rail 22 located at the edge of the wafer. It should be noted that a slider is slidably mounted on the curved rail 22, and the camera assembly 23 is fixedly mounted on the slider. The slider on the curved rail 22 can be locked, allowing the position of the slider to be adjusted as needed to capture accurate images. The curved rail 22 is an electric rail. The center of the curved rail 22 and the curved rod 21 are the same or similar.

[0027] The shooting direction of the camera assembly 23 is toward the center of the arc-shaped slide 22, which enables the camera assembly 23 to stably capture images at the center of the circle when it moves on the arc-shaped slide 22. The top surface height of the wafer table 14 is the same as or close to the center height of the arc-shaped slide 22, thereby ensuring that the camera assembly 23 can capture images of the edge of the wafer. It should be noted that the camera assembly 23 is only used to capture images. An image processing system is connected to one side of the camera assembly 23, which can process and calculate the captured images to obtain the shape of the gap. The principle is: when external light enters the interior of the wafer, since the wafer is made of glass, it will emit light at the edge due to refraction and reflection of the internal light. The shape and luminous characteristics of the luminous area in the captured image are processed by the image processing system, and the position and shape of the gap can be calculated by existing algorithm analysis. This algorithm and image processing system are prior art. The required equipment and the connection method and structure of the equipment to the camera assembly 23 are well known to those skilled in the art and will not be described in detail here. They are not shown in the figure.

[0028] When in use, the positions of the wafer table 14 and the wafer are adjusted, and the edge of the wafer is set within the illumination range of the camera assembly 23. Then, the position of the light-emitting body 15 on the annular slide rail 12 is adjusted so that as much light as possible emitted by the light-emitting body 15 enters the wafer to facilitate imaging. The camera assembly 23 continuously shoots and transmits the captured images to the image processing system, and the precise notch features are calculated after processing.

[0029] Compared with the prior art, the device for detecting the side notch of the wafer provided by the present invention is provided with the backlight module 12 and an annular slide rail 22, a light emitting body 14 is slidably provided on the annular slide rail 22, the light emitting body 14 is freely movable on the annular slide rail 22 and the angle is adjustable, so that the optimal irradiation angle and height of the light emitting body 14 can be adjusted according to different wafers, without the need to use multiple groups of light emitting bodies, reducing costs and reducing occupied space, the backlight module 12 can reflect the light of the light emitting body 14, further saving the demand for the number of light emitting bodies 14, the camera assembly 23 is slidably provided on an arc slide rail 22, and by selecting the appropriate The wafer is of appropriate size so that the edge of the wafer is within the shooting range of the camera assembly 23. The shooting direction of the camera assembly 23 is toward the center of the arc-shaped slide 22, so that when the camera assembly 23 moves on the arc-shaped slide 22, it can continuously shoot the side image of the wafer at the center of the circle. By adjusting the position of the camera assembly 23, images of the wafer notch at different angles can be obtained, which is convenient for selecting the angle with the best imaging effect and calculating the precise notch features through the algorithm. The edges of the wafer will glow due to the internal light, which is also convenient for the camera assembly 23 to form precise glass substrate edge features after shooting, so that quick and precise trimming can be achieved in the subsequent trimming process.

[0030] The above are only preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent replacements or improvements within the spirit of the present invention are included in the scope of the claims of the present invention.

Claims

1. A device for detecting wafer edge notches, characterized in that: The device for detecting wafer edge notches includes a lighting component and a camera component arranged on one side of the lighting component, the lighting component includes an annular base, an annular slide rail arranged on the top of the annular base, a backlight module arranged in the middle of the annular base, a wafer table arranged on the top of the backlight module, and a light-emitting body slidably arranged on the annular slide rail, the annular slide rail and the annular base are concentric, the camera component includes an arc rod, an arc slide rail arranged on one side of the arc rod, and a camera component slidably arranged on the arc slide rail, the shooting direction of the camera component is toward the center of the arc slide rail, a wafer is placed on the top of the wafer table, and the shooting range of the camera component is at the edge of the wafer.

2. The device for detecting wafer edge notches according to claim 1, wherein: The light beam of the light emitting body is directed toward the center of the annular slide rail.

3. The device for detecting wafer edge notches according to claim 2, wherein: The light-emitting body is a spotlight, and the irradiation angle and height of the light-emitting body are adjustable.

4. The device for detecting wafer edge notches according to claim 3, wherein: When the height of the light emitting body is at the lowest point and the light beam of the light emitting body is emitted horizontally, the center line of the light beam of the light emitting body is flush with the top surface of the wafer table.

5. The device for detecting wafer edge notches according to claim 1, wherein: The central angles of the arc rod and the arc slide rail are both 90°. When the camera assembly is located at the end of the arc slide rail, the shooting direction of the camera assembly is perpendicular to the top surface of the wafer table.

6. The device for detecting wafer edge notches according to claim 5, wherein: The center heights of the arc rod and the arc slide rail are the same as or close to the top surface height of the wafer table.

7. The device for detecting wafer edge notches according to claim 1, wherein: The bottom of the arc-shaped rod is connected to the annular base, and the arc-shaped rod and the annular slide rail are an integrated structure.

8. The device for detecting wafer edge notches according to claim 1, wherein: The annular slide rail and the arc-shaped slide rail are respectively electric slide rails.

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