Jig system for testing semiconductor device

Abstract

The utility model discloses a jig system for testing a semiconductor device, which comprises a jig seat (1), a jig (2), driving devices (3), an electrical interface (4) and a jig seat probe (5), the jig seat electrical interface (4) is arranged at the top end of the side surface of the jig seat (1), the driving devices (3) are respectively arranged on an upper panel of the jig seat (1), driving heads of the driving devices (3) are fixedly connected with a lower panel of the jig seat (1), and the jig seat probe (5) is arranged on the jig seat (1). The jig seat probe (5) is fixedly arranged below an upper panel of the jig seat (1), the jig seat probe (5) is electrically connected with the jig seat electrical interface (4), two sliding chutes (12) are respectively and fixedly arranged on two sides above a lower panel of the jig seat (1), the sliding chutes (12) are matched with two side edges of the jig (2), and a hole is formed in the middle of the lower panel of the jig seat (1). According to the utility model, a rapid dismounting and replacing mode of the jig and the tested piece (3) is provided, and the fatigue of the cable caused in the repeated mounting and dismounting process of the tested piece or the jig can be avoided.

Description

Technical Field

[0001] The utility model relates to a semiconductor testing system, in particular to a testing fixture for a power module. Background Art

[0002] With technological advancements, the use of power semiconductor IGBT and MOSFET modules is becoming increasingly widespread. Reliability assessments are necessary during device development, manufacturing, and before application. Before conducting electrical evaluations, the device under test (DUT) must be electrically connected to the test equipment using a quick, non-permanent connection.

[0003] Currently, test equipment for modules with multiple independent or semi-independent functional units within them typically utilizes a dedicated fixture system. This fixture system provides an electrical connection, connecting specific signals on the module to the relevant interfaces on the tester. This allows different test fixtures to be used for power modules of varying shapes and specifications, while maintaining the same tester interface.

[0004] In current fixture systems, cable connections are widely used to connect fixtures to test machines. The installation method is relatively complicated, and the life of the cables will decrease rapidly in a moving environment.

[0005] Chinese patent publication number CN216209637U discloses an IGBT module testing device. A mounting platform is provided with a vertically movable probe mounting plate. Multiple probes are mounted on the lower surface of the probe mounting plate. The mounting platform also features multiple vertically adjustable movable blocks positioned above a printed circuit board (PCB). Reeds are located below the movable blocks. When the probes and reeds make contact with the PCB, the PCB is energized. This solution achieves electrical continuity across the PCB by controlling the contact between the probes and reeds and the PCB via the vertically movable probe mounting plate and movable blocks, eliminating the need for complex power cables. However, the IGBT under test still requires an electrical connection to the PCB via wires, resulting in complex connections, reduced cable life, and low reliability. Furthermore, in this technical solution, the probes above the fixture move downward to contact the fixture. Since the PCB is a load-bearing component, multiple PCBs must be stacked to meet the stress requirements of the probes under high pressure. This places high demands on the PCB design, resulting in complex and costly designs and low design efficiency and success rates. Utility Model Content

[0006] The technical problem to be solved by the utility model is how to improve the usability and reliability of the fixture.

[0007] The utility model solves the above technical problems through the following technical means: a jig system for testing semiconductor devices, comprising a jig seat (1), a jig (2), a driving device (3), an electrical interface (4) and a jig seat probe (5); a jig compartment capable of placing the jig (2) is provided on the jig seat (1); a jig seat electrical interface (4) is provided on the top of the side of the jig seat (1); an upper panel and a lower panel are provided on the upper part of the jig seat (1); the driving device (3) is respectively provided on the upper panel of the jig seat (1), and the driving head of the driving device (3) is fixedly connected to the lower panel of the jig seat (1); the jig seat probe (5) is fixedly provided below the upper panel of the jig seat (1); the jig seat probe (5) is electrically connected to the jig seat electrical interface (4); a slide groove (12) is fixedly provided on both sides of the upper side of the lower panel of the jig seat (1); the slide groove (12) cooperates with the two sides of the jig (2); and a hole is opened in the middle of the lower panel of the jig seat (1).

[0008] Furthermore, the fixture seat probe (5) is distributed in a U shape with the opening facing outwards.

[0009] Furthermore, an elastically retractable top bead (14) for rough positioning is provided on the inner side of at least one side of the slide groove (12), and a positioning groove (28) matching the top bead (14) is provided on the side of the fixture (2).

[0010] Furthermore, the jig (2) comprises a PCB (21), a jig frame (22), and a probe (25); the PCB (21) is fixed on the jig frame (22); and the PCB (21) is provided with at least one set of probes (25) that penetrate the PCB board.

[0011] Furthermore, the jig (2) further includes support columns (23), which are provided on both sides below the jig frame (22). The support columns (23) form a space between the bottom of the jig frame (22) and the table on which the jig (2) is placed.

[0012] Furthermore, the fixture (2) further includes a top column (24), and a top column (24) is provided on both sides of each set of probes (25), and the top of the top column (24) is higher than the top of the probe (25).

[0013] Furthermore, the fixture (2) further comprises a probe pad (26), the probe pad (26) being fixed below the PCB (21), the probe (25) located below the PCB (21) passing through the probe pad (26), and the probe (25) and the probe pad (26) forming a structural connection through a tight fit.

[0014] Furthermore, the probe pad (26) is made of non-metallic insulating material.

[0015] Furthermore, the jig (2) further comprises a positioning hole (27), at least one positioning hole (27) is provided on the jig frame (22), and positioning posts (16) for guiding are provided at positions corresponding to the positioning holes (27) below the upper panel of the jig seat (1), and the positioning posts (16) can enter the positioning holes (27).

[0016] Furthermore, the driving device (3) adopts a motion cylinder or a linear motor or a worm gear.

[0017] The advantages of the present invention are:

[0018] 1. The structure of the utility model provides a quick way to dismantle and replace the jig and the tested part (3);

[0019] 2. The structure of the present invention can avoid fatigue of cables during repeated installation and removal of the test piece or fixture;

[0020] 3. The structure of the present invention can effectively reduce the number of cables connected during fixture installation, reduce working hours, and reduce the risk of potential electrical signal connection errors;

[0021] 4. The structure of the present invention can complete the product design with only one PCB. The number of PCBs is reduced from 3-4 to 1, which reduces the work of developing new fixtures and effectively reduces the cost and manufacturing complexity of the product.

[0022] 5. The structure of the present invention can ensure that the fixture and the fixture seat have a more accurate positioning, avoiding problems such as the probe failing to form a reliable connection or the relative position deviation between the measured part and the fixture due to positioning error.

[0023] 6. The fixture framework uses a standardized design and no longer needs to be revised for the test piece, reducing the workload of fixture development;

[0024] 7. The support point of the probe of the tested part is changed from PCB to top pillar, which reduces the stress strength of PCB, reduces the requirements for PCB, reduces the design complexity and cost, improves the design efficiency and success rate, and also increases the fatigue life of PCB;

[0025] 8. All assemblies are equipped with pin positioning to improve the overall assembly accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a front view of a semiconductor device testing fixture system (without fixtures) according to an embodiment of the present invention;

[0027] Figure 2This is a three-dimensional diagram of a semiconductor device testing fixture system (without fixtures) according to an embodiment of the present invention;

[0028] Figure 3 This is a three-dimensional diagram of a semiconductor device testing fixture system (with fixtures) according to an embodiment of the present utility model;

[0029] Figure 4 This is a side view of a fixture system (with a fixture) for testing semiconductor devices according to an embodiment of the present invention;

[0030] Figure 5 This is a front view of a static fixture for a semiconductor power module according to an embodiment of the present utility model;

[0031] Figure 6 is a three-dimensional diagram of a static fixture for a semiconductor power module in an embodiment of the present utility model;

[0032] Figure 7 This is a three-dimensional diagram of the static fixture and the device under test of the semiconductor power module in the embodiment of the present utility model;

[0033] Figure 8 It is a top perspective view of a static fixture of a semiconductor power module in an embodiment of the present invention. DETAILED DESCRIPTION

[0034] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0035] It should be noted that the following embodiments and features therein may be combined with one another unless they conflict. Furthermore, the diagrams provided in the following embodiments are merely schematic illustrations of the basic concept of the present invention. The diagrams only show components relevant to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be varied arbitrarily, and the component layout may also be more complex.

[0036] See also Figures 1 to 4 The semiconductor device testing fixture system of the embodiment of the present invention includes a fixture base 1, a fixture 2, a driving device 3, an electrical interface 4 and a fixture base probe 5. The fixture base 1 is provided with a fixture compartment capable of placing the fixture 2.

[0037] An upper panel and a lower panel are provided on the upper portion of the fixture base 1 . The driving devices 3 are respectively provided on the upper panels of the fixture base 1 , and the driving heads of the driving devices 3 are fixedly connected to the lower panels of the fixture base 1 .

[0038] A fixture base electrical interface 4 is provided on the top of the side of the fixture base 1 , and the electrical signal of the test machine is connected to the fixture base electrical interface 4 through a cable.

[0039] The fixture base probe 5 is fixedly arranged below the upper panel of the fixture base 1. The fixture base probe 5 is arranged in a U shape with the opening facing outward. The probe on the side of the fixture base probe 5 is electrically connected to the fixture base electrical interface 4.

[0040] A chute 12 is fixedly mounted on each side of the upper surface of the lower panel of the jig base 1. These chute 12 engages with the sides of the jig 2, allowing the jig 2 to be inserted into the jig compartment. A resilient, retractable ball 14 for rough positioning is located on at least one side of the chute 12. A positioning groove 28 is defined on the side of the jig 2 to engage with the ball 14.

[0041] A hole is opened in the middle of the lower panel of the fixture base 1 for the test piece 6 to pass through.

[0042] Continue reading Figures 5 to 8 The fixture 2 of the embodiment of the present invention includes a PCB 21 , a fixture frame 22 , a support column 23 , a top column 24 , a probe 25 , a probe pad 26 , a positioning hole 27 , and a positioning groove 28 .

[0043] The PCB 21 is fixed on the jig frame 22 . In this embodiment, the jig frame 22 and the PCB 21 are positioned using pins through mounting holes on both sides to ensure relative positioning accuracy.

[0044] At least one set of probes 25 that penetrate the PCB board is provided on the PCB21, and the PCB21 and the probes 25 are welded together. At least one top post 24 is provided on the periphery of the probes 25 on the upper part of the PCB21, and the top of the top post 24 is higher than the top of the probes 25. In this embodiment, two sets of probes 25 are respectively arranged on the PCB21 relative to each other, and a top post 24 is provided on both sides of each set of probes 25. A probe pad 26 is fixed below the PCB21, and the probes 25 located below the PCB21 pass through the probe pad 26. The probes 25 and the probe pad 26 are tightly fitted to form a structural connection, and the PCB21 will bear the torsional force generated by the gravity of the probes 25 and the probe pad 26. In this embodiment, the PCB21 and the probe pad 26 are positioned by pins to ensure relative position accuracy. The probe pad 26 is made of non-metallic insulating material, including but not limited to epoxy resin board, polyformaldehyde resin, PEEK, etc.

[0045] As a further optimized technical solution, support columns 23 are provided on both sides of the bottom of the jig frame 22. The support columns 23 form a space between the bottom of the jig frame 22 and the table on which the jig 2 is placed, thereby preventing the probe 25 from contacting the table on which the jig 2 is placed when the jig 2 is stored, thereby reducing the risk of damage to the probe 25.

[0046] The jig frame 22 is provided with at least one positioning hole 27. In this embodiment, one positioning hole 27 is provided on each side of the jig frame 22. The positioning holes 27 provide a high-precision positioning interface on the jig 2, preventing problems such as jig tilt during installation. Positioning posts 16 are provided below the upper panel of the jig base 1 at positions corresponding to the positioning holes 27, and the positioning posts 16 can enter the positioning holes 27.

[0047] Positioning grooves 28 are provided on both sides of the fixture frame 22 at positions corresponding to the top beads 14 on the sides of the fixture 2. In this embodiment, two top beads are provided on one side of the chute 12, so four positioning grooves 28 are also provided.

[0048] The operation process of the semiconductor device test fixture system is as follows:

[0049] 1. Push the jig 2 into the jig seat 1 along the slide groove 12. When the coarse positioning bead 14 slides down to the coarse positioning groove 28, you can feel a clear sense of movement, which means the coarse positioning is completed.

[0050] 2. Use the driving device 3 to lift the fixture 2 upward so that the positioning column 16 enters the positioning hole 27, and further accurately position the fixture 2 through the cooperation of the shaft and the hole;

[0051] 3. After the positioning post 16 is fully inserted into the positioning hole 27, the jig 2 is continuously lifted upward, and the lower panel of the jig base 1 contacts the bottom of the jig frame 22 until the jig base probe 5 is correctly compressed to the upper surface of the PCB 21, forming a reliable electrical connection. The spring pressure of the jig base probe 5 is transmitted downward through the PCB 21 to the jig frame 22, and then to the lower panel of the jig base 1, forming a nearly vertical force direction, preventing the PCB 21 or the jig frame 22 from being subjected to torsional forces, thereby reducing the strength requirements of these two parts;

[0052] 4. Use the device for lifting the test piece 6 (not shown) to lift the test piece 6 upward, so that the probe 25 contacts and compresses the test piece 6 to form a reliable electrical connection. When the test piece 6 is lifted onto the probe 25, the top of the top column 24 contacts the upper panel of the fixture base 1. The force generated by the lifting is transmitted to the upper panel of the fixture base 1 through the probe 25, the probe pad 26, and the top column 24. The pressure generated when the bottom of the probe 25 is compressed is transmitted to the fixture base 1 outside the fixture through the probe pad 26 and the top column 24, thereby preventing the PCB 21 from being subjected to the force generated by the lifting of the test piece 6.

[0053] The electrical connection relationship during measurement is as follows:

[0054] A. The electrical signal of the tester is connected to the fixture base electrical interface 4 through a cable, thereby connecting the fixture base probe 5. The fixture base probe 5 of the fixture base 1 contacts the upper surface of the PCB 21 to form an electrical connection;

[0055] B. The electrical signal of the fixture base 1 is connected to the probe 25 through the fixture base probe 5 and the copper or flying wire on the PCB 21;

[0056] C. The electrical signal on the probe 25 is connected to the device under test 6, forming a complete electrical connection.

[0057] The tester's electrical signals are connected via a cable to the fixture base's electrical interface 4, which then connects to the fixture base's probe 5. The electrical signals are then connected to the probe 25 via the fixture base's probe 5, ultimately connecting to the device under test 6. The fixture 2 is pushed into the fixture compartment via the slide 12, where it is roughly positioned using the top bead 14 and the positioning groove 28. This is confirmed by the user's feedback during the sliding movement. The positioning post 16 and positioning hole 27 then establish a more precise positioning relationship between the fixture 2 and the fixture base 1, ensuring the reliability of the electrical connection.

[0058] In this embodiment, the driving device 3 adopts a motion cylinder, but other methods can also be used to drive the movement of the fixture base 5, such as a linear motor, a worm gear, etc.

[0059] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A fixture system for testing semiconductor devices, comprising a fixture base (1), a fixture (2), a drive device (3), an electrical interface (4), and a fixture base probe (5), wherein the fixture base (1) is provided with a fixture compartment capable of receiving the fixture (2), and a fixture base electrical interface (4) is provided at the top of a side surface of the fixture base (1), characterized in that: The upper portion of the jig seat (1) is provided with an upper panel and a lower panel. The driving device (3) is respectively provided on the upper panel of the jig seat (1), and the driving head of the driving device (3) is fixedly connected to the lower panel of the jig seat (1). The jig seat probe (5) is fixedly provided below the upper panel of the jig seat (1). The jig seat probe (5) is electrically connected to the jig seat electrical interface (4). A slide groove (12) is fixedly provided on both sides of the upper portion of the lower panel of the jig seat (1). The slide groove (12) cooperates with the two sides of the jig (2). The middle portion of the lower panel of the jig seat (1) is opened.

2. A semiconductor device testing fixture system according to claim 1, characterized in that: The fixture seat probe (5) is distributed in a U shape, with the opening facing outwards.

3. The semiconductor device testing fixture system according to claim 1, wherein: An elastically retractable top bead (14) for rough positioning is provided on the inner side of at least one side of the slide groove (12), and a positioning groove (28) matching the top bead (14) is provided on the side of the fixture (2).

4. The semiconductor device testing fixture system according to claim 1, wherein: The jig (2) comprises a PCB (21), a jig frame (22), and probes (25); the PCB (21) is fixed on the jig frame (22); and the PCB (21) is provided with at least one set of probes (25) penetrating the PCB board.

5. The semiconductor device testing fixture system according to claim 1, wherein: The jig (2) further comprises support columns (23), which are arranged on both sides below the jig frame (22). The support columns (23) form a space between the bottom of the jig frame (22) and the table on which the jig (2) is placed.

6. The semiconductor device testing fixture system according to claim 1, wherein: The fixture (2) further comprises a top column (24), and a top column (24) is provided on both sides of each set of probes (25), and the top end of the top column (24) is higher than the top end of the probe (25).

7. The semiconductor device testing fixture system according to claim 1, wherein: The jig (2) further comprises a probe pad (26), the probe pad (26) being fixed below the PCB (21), the probe (25) located below the PCB (21) passing through the probe pad (26), and the probe (25) and the probe pad (26) forming a structural connection through a tight fit.

8. A semiconductor device testing fixture system according to claim 7, characterized in that: The probe pad (26) is made of non-metallic insulating material.

9. The semiconductor device testing fixture system according to claim 1, wherein: The jig (2) further comprises a positioning hole (27). At least one positioning hole (27) is provided on the jig frame (22). Positions corresponding to the positioning holes (27) are provided below the upper panel of the jig seat (1) with positioning posts (16) for guiding. The positioning posts (16) can enter the positioning holes (27).

10. The semiconductor device testing fixture system according to claim 1, wherein: The driving device (3) adopts a motion cylinder, a linear motor or a worm gear.

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