Reliability enhancement test equipment for semiconductor laser

Abstract

The utility model discloses reliability strengthening test equipment for a semiconductor laser, which relates to the technical field of semiconductor lasers, is used for positioning the semiconductor laser during a damp-heat aging test and comprises a clamp body. And the jacking column is movably arranged in a movable groove formed in the clamp body. The adjusting assembly can drive the top column to extend out of the movable groove so as to replace a clamp body to support the bottom of the semiconductor laser, the top column is in point contact with the bottom of the semiconductor laser, and the limiting column is in line contact with the side face of the semiconductor laser, so that shielding of the clamp body to the semiconductor laser can be reduced; therefore, each part of the semiconductor laser can be in good contact with a test environment simulated by heating and humidifying elements, the consistency of test conditions borne by each part of the semiconductor device is ensured, and the working state of the semiconductor laser in a severe environment can be accurately simulated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor lasers, in particular to reliability enhancement test equipment for semiconductor lasers. Background Art

[0002] With the development of semiconductor lasers in my country, the reliability requirements for semiconductor lasers are getting higher and higher. Therefore, it is necessary to establish a fault database for semiconductor lasers and analyze the statistical distribution of faults during the production process, and then study the aging fault evolution mechanism of semiconductor lasers and establish a corresponding aging fault life model. At present, the wet heat detection of semiconductor lasers has always been carried out using high and low temperature wet heat test chambers. When in use, in order to ensure that the semiconductor laser remains stable during the detection process and does not move or fall off due to changes in temperature and humidity, it is necessary to use a fixture to clamp the semiconductor laser in the box, and then operate the chip under high temperature and high humidity conditions simulated by the heating and humidification elements inside the box to observe its performance changes.

[0003] Current technical problems: Due to the need to stably confine the semiconductor laser, existing fixtures are usually designed to contact a large area of ​​the semiconductor laser surface. As a result, during the test, the part of the semiconductor laser clamped by the fixture is isolated from the test environment. This part cannot have good contact with the experimental environment simulated by the heating and humidification elements in the test chamber. This results in different test conditions between the part clamped by the fixture and the part not clamped by the fixture in the semiconductor laser, making it impossible to ensure the consistency of the experimental conditions of various parts of the semiconductor device during the test. Therefore, it is necessary to design a new fixture to improve this problem. Utility Model Content

[0004] The purpose of the present utility model is to provide a reliability enhancement test device for semiconductor lasers, so as to solve the technical problem raised in the above-mentioned background art that the semiconductor laser is clamped by a fixture during testing, resulting in the clamped part of the semiconductor laser being unable to make good contact with the test environment.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a reliability enhancement test device for semiconductor lasers, used for positioning semiconductor lasers during a wet heat aging test, comprising:

[0006] Clamp body;

[0007] A top post is movably disposed in a movable groove provided in the clamp body, wherein the top end of the top post passes through the through groove and forms a point contact with the bottom of the semiconductor laser, and the top post has a plurality of supporting areas for forming the semiconductor laser;

[0008] An adjusting assembly for adjusting the position of the top column relative to the through slot;

[0009] A limiting structure for limiting the side of the semiconductor laser.

[0010] As a preferred technical solution of the present utility model, the adjustment component includes:

[0011] A movable plate is slidably arranged in the movable groove, and the bottom end of the top column is arranged at the upper end of the movable plate;

[0012] A lifting component is used to drive the movable plate to move up and down along the movable groove.

[0013] As a preferred technical solution of the present utility model, the lifting component includes:

[0014] One end of the rotating shaft is rotatably arranged on the clamping body;

[0015] a curved disc connected to the other end of the rotating shaft;

[0016] A crankshaft having one end rotatably connected to the crank plate, the other end of the crankshaft being connected to a hinge seat, and the hinge seat being connected to the bottom end of the movable plate;

[0017] A motor is provided on the clamp body, and an output shaft of the motor is connected to the rotating shaft.

[0018] As an optimal technical solution of the present invention, the test equipment also includes: the test equipment also includes: a support plate for placing the semiconductor laser, the support plate is arranged on the clamp body, the top end of the top column passes through a through groove opened on the surface of the support plate, and the support plate is detachably connected to the clamp body.

[0019] As a preferred technical solution of the present utility model, the test equipment further includes:

[0020] Sliders provided at both ends of the support plate;

[0021] A positioning plate is arranged on the upper end of the clamp body, and a sliding groove matched with the sliding block is opened on the inner side of the positioning plate.

[0022] As a preferred technical solution of the present invention, a knob is provided at the end of the clamp body, and the knob is used to prevent the support plate from detaching from the positioning plate.

[0023] As a preferred technical solution of the present invention, the limiting structure is a limiting column arranged on the upper end of the support plate, and the limiting column is in linear contact with the semiconductor laser and there are multiple limiting columns to form an enclosed space for the semiconductor laser.

[0024] As a preferred technical solution of the present invention, there are multiple support plates, and the support plate array is arranged on the upper end of the clamp body.

[0025] As a preferred technical solution of the present invention, a belt pulley is provided at one end of the rotating shaft away from the motor, and a belt is provided between adjacent belt pulleys.

[0026] As a preferred technical solution of the present invention, a mounting hole is provided at the bottom end of the clamp body.

[0027] Compared with the prior art, the beneficial effects of the present invention are:

[0028] The utility model can drive the top column to extend out of the movable groove through the adjustment component, thereby replacing the clamp body to form a support for the bottom of the semiconductor laser. Since the top column is in point contact with the bottom of the semiconductor laser, and the limit column is in line contact with the side of the semiconductor laser, the obstruction of the clamp itself to the semiconductor laser can be reduced, so that all parts of the semiconductor laser can be in good contact with the test environment simulated by the heating and humidifying elements, ensuring the consistency of the experimental conditions to which various parts of the semiconductor device are subjected, and helping to accurately simulate the working state of the semiconductor laser in a harsh environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of the external three-dimensional structure of the utility model;

[0030] Figure 2 This is a schematic diagram of the three-dimensional structure of the clamp body of the present utility model;

[0031] Figure 3 This is a schematic diagram of the three-dimensional structure of the clamp body of the present invention;

[0032] Figure 4 This is a schematic diagram of the three-dimensional structure of the movable plate, crankshaft and crank plate of the utility model;

[0033] Figure 5 This is a schematic diagram of the three-dimensional structure of the support plate and support column of the utility model.

[0034] In the figure: 1. Clamp body; 2. Mounting hole; 3. Positioning plate; 4. Support plate; 5. Slider; 6. Limiting column; 7. Semiconductor laser; 8. Knob; 9. Movable plate; 10. Top column; 11. Through slot; 12. Movable slot; 13. Motor; 14. Rotating shaft; 15. Crank plate; 16. Crankshaft; 17. Hinge seat; 18. Belt pulley; 19. Belt. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0036] See also Figure 1-5The present invention provides a technical solution: a reliability enhancement test device for semiconductor lasers, used for positioning the semiconductor laser 7 during a damp heat aging test, comprising: a clamp body 1, wherein a mounting hole 2 is provided at the bottom end of the clamp body 1; a top column 10, which is movably arranged in a movable groove 12 provided in the clamp body 1, wherein the top end of the top column 10 is a spherical structure, the top end of the top column 10 passes through a through groove 11 and forms a point contact with the bottom of the semiconductor laser 7, and the top column 10 has a plurality of support areas for forming the semiconductor laser 7; an adjustment component for adjusting the position of the top column 10 relative to the through groove 11; and a limiting structure for limiting the side of the semiconductor laser 7;

[0037] The above technical solution can minimize the coverage of the semiconductor laser 7 by the clamp. When in use, open the door of the high and low temperature humidity test chamber, place the clamp body 1 in the high and low temperature humidity test chamber, use bolts to match the mounting holes 2 to fix the clamp body 1, and then match the limiting structure to place the semiconductor laser 7 to be positioned on the upper end of the clamp body 1, so that the semiconductor laser 7 is located directly above the active groove 12. In order to prevent the bottom end of the semiconductor laser 7 from being blocked and unevenly heated, the height of the top column 10 is adjusted by adjusting the assembly to ensure that the top column 10 is The movable groove 12 rises out, so that the top column 10 replaces the clamp body 1 to support the bottom of the semiconductor laser 7. Since the top end of the top column 10 is a spherical structure, it is in point contact with the bottom of the semiconductor laser 7, thereby reducing the obstruction of the bottom of the semiconductor laser 7, so that the bottom of the semiconductor laser 7 can also be exposed to the test environment. Due to the provision of a limiting structure, the semiconductor laser 7 can be prevented from deflecting during the test or when moving upward. The door of the high and low temperature humidity test chamber is closed, and the heating element and the humidifying element are started to simulate a harsh environment in the high and low temperature humidity test chamber.

[0038] like Figure 3 and Figure 4 As shown, in this embodiment, the adjustment assembly includes: a movable plate 9 slidably arranged in a movable groove 12, the bottom end of the top column 10 is arranged at the upper end of the movable plate 9; a lifting component for driving the movable plate 9 to rise and fall along the movable groove 12; specifically, the lifting component includes: a rotating shaft 14 rotatably arranged on the clamp body 1 at one end; a curved plate 15 connected to the other end of the rotating shaft 14; a crankshaft 16 rotatably connected to the curved plate 15 at one end, the other end of the crankshaft 16 is connected to a hinge seat 17, and the hinge seat 17 is connected to the bottom end of the movable plate 9; a motor 13 provided on the clamp body 1, and the output shaft of the motor 13 is connected to the rotating shaft 14;

[0039] The above technical solution can automatically adjust the extension height of the limit column 6, thereby adjusting the gap between the semiconductor laser 7 and the upper end of the clamp body 1. When in use, the motor 13 is started to drive the rotating shaft 14 to rotate, and the rotating shaft 14 drives the curved plate 15 to rotate. The curved plate 15 cooperates with the crankshaft 16 and the hinge seat 17 to drive the movable plate 9 to rise, and the movable plate 9 drives the top column 10 to rise, and the top column 10 drives the semiconductor laser 7 to rise.

[0040] like Figure 2 and Figure 3 As shown, in this embodiment, the test equipment further includes: a support plate 4 for placing the semiconductor laser 7, the support plate 4 is arranged on the clamp body 1, the top end of the top column 10 passes through the through groove 11 opened on the surface of the support plate 4, and the support plate 4 and the clamp body 1 are detachably connected; specifically, the test equipment further includes: sliders 5 provided at both ends of the support plate 4; a positioning plate 3 provided at the upper end of the clamp body 1, the inner side of the positioning plate 3 is provided with a slide groove that matches the slider 5; a knob 8 is provided at the end of the clamp body 1, and the knob 8 is used to prevent the support plate 4 from detaching from the positioning plate 3;

[0041] like Figure 5 As shown, in this embodiment, the limiting structure is a limiting column 6 provided at the upper end of the support plate 4. The cross section of the limiting column 6 is a circular structure. The limiting column 6 is in line contact with the semiconductor laser 7 and is provided in plurality to form an enclosed space for the semiconductor laser 7. Specifically, eight limiting columns 6 form a group, and every two limiting columns 6 limit one corner of the semiconductor laser 7, thereby ensuring that the four corners of the semiconductor laser 7 are fully limited. Multiple groups of limiting columns 6 are provided on each support plate 4.

[0042] The above technical solution can facilitate the disassembly of the support plate 4. During disassembly, the knob 8 is turned to release the movement limit of the support plate 4, so that the support plate 4 together with the sliders 5 on both sides thereof can be pulled out from the sliding groove of the positioning plate 3.

[0043] like Figure 1 and Figure 2 As shown, in this embodiment, there are two support plates 4, and the support plates 4 are arranged in an array on the upper end of the clamp body 1; a belt pulley 18 is provided at one end of the rotating shaft 14 away from the motor 13, and a belt 19 is provided between adjacent belt pulleys 18;

[0044] The above technical solution can limit the semiconductor lasers 7 in batches. When it is necessary to adjust the distance between all semiconductor lasers 7 and the upper end of the support plate 4, the motor 13 is started to drive the rotating shaft 14 to rotate. The rotating shaft 14 cooperates with the belt pulley 18 and the belt 19 to drive multiple curved disks 15 to rotate, thereby adjusting the height of multiple semiconductor lasers 7, and the test efficiency is high.

[0045] Working principle: When in use, first open the door of the high and low temperature humidity test chamber, place the clamp body 1 in the high and low temperature humidity test chamber, use bolts to match the mounting holes 2 to fix the clamp body 1, then place the semiconductor laser 7 to be positioned on the upper end of the support plate 4, and ensure that the semiconductor laser 7 is located in the enclosed space between the limit columns 6, start the motor 13 to drive the rotating shaft 14 to rotate, the rotating shaft 14 drives the curved disk 15 to rotate, the curved disk 15 cooperates with the crankshaft 16 and the hinge seat 17 to drive the movable plate 9 to rise, the movable plate 9 drives the top column 10 to rise, the top column 10 drives the semiconductor laser 7 to rise, and the top column 10 rises from the movable groove 12, so that the top column 10 replaces the clamp body 1 to form a support for the bottom of the semiconductor laser 7. Since the top of the top column 10 is a spherical structure, it is in point contact with the bottom of the semiconductor laser 7, thereby reducing the obstruction of the bottom of the semiconductor laser 7, so that the bottom of the semiconductor laser 7 can also be exposed to the test environment.

[0046] Thereby completing a series of tasks, the contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0047] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A reliability enhancement test device for a semiconductor laser, used for positioning a semiconductor laser (7) during a wet heat aging test, comprising: Clamp body (1); Characterized in that, the test equipment also includes: A top column (10) is movably arranged in a movable groove (12) provided in the clamp body (1); the top end of the top column (10) passes through the through groove (11) and forms a point contact with the bottom of the semiconductor laser (7); the top column (10) has a plurality of support areas for forming the semiconductor laser (7); An adjustment component for adjusting the position of the top column (10) relative to the through slot (11); A limiting structure for limiting the side of the semiconductor laser (7).

2. The reliability enhancement test equipment for semiconductor lasers according to claim 1, characterized in that: The adjustment component includes: A movable plate (9) is slidably arranged in the movable groove (12), and the bottom end of the top column (10) is arranged at the upper end of the movable plate (9); A lifting component for driving the movable plate (9) to move up and down along the movable groove (12).

3. The reliability enhancement test equipment for semiconductor lasers according to claim 2, characterized in that: The lifting component includes: One end of the rotating shaft (14) is rotated on the clamp body (1); a curved disc (15) connected to the other end of the rotating shaft (14); A crankshaft (16) having one end rotatably connected to the crank plate (15), the other end of the crankshaft (16) being connected to a hinge seat (17), and the hinge seat (17) being connected to the bottom end of the movable plate (9); A motor (13) is provided on the clamp body (1), and an output shaft of the motor (13) is connected to a rotating shaft (14).

4. The reliability enhancement test equipment for semiconductor lasers according to claim 3, characterized in that: The test equipment further comprises: a support plate (4) for placing the semiconductor laser (7); the support plate (4) is arranged on the clamp body (1); the top end of the top column (10) passes through a through groove (11) provided on the surface of the support plate (4); and the support plate (4) and the clamp body (1) are detachably connected.

5. The reliability enhancement test equipment for semiconductor lasers according to claim 4, characterized in that: The test equipment also includes: Slide blocks (5) provided at both ends of the support plate (4); A positioning plate (3) is provided at the upper end of the clamp body (1), and a sliding groove that matches the slider (5) is provided on the inner side of the positioning plate (3).

6. The reliability enhancement test equipment for semiconductor lasers according to claim 5, characterized in that: A knob (8) is provided at the end of the clamp body (1), and the knob (8) is used to prevent the support plate (4) from detaching from the positioning plate (3).

7. The reliability enhancement test equipment for semiconductor lasers according to any one of claims 4 to 6, characterized in that: The limiting structure is a limiting column (6) arranged at the upper end of the support plate (4); the limiting column (6) is in linear contact with the semiconductor laser (7) and has a plurality of limiting columns to form an enclosed space for the semiconductor laser (7).

8. The reliability enhancement test equipment for semiconductor lasers according to claim 7, characterized in that: There are a plurality of support plates (4), and the support plates (4) are arranged in an array on the upper end of the clamp body (1).

9. The reliability enhancement test equipment for semiconductor lasers according to claim 8, characterized in that: A belt pulley (18) is provided at one end of the rotating shaft (14) away from the motor (13), and a belt (19) is provided between adjacent belt pulleys (18).

10. The reliability enhancement test equipment for semiconductor lasers according to claim 1, characterized in that: A mounting hole (2) is provided at the bottom end of the clamp body (1).

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