Light portable computer radiator

Abstract

The utility model relates to the technical field of notebook computers, and particularly discloses a light portable computer radiator which comprises a fan, a heat conducting plate, a plurality of heat pipes and radiating fins, the bottom surface of the heat conducting plate is in contact with a heat source module to be radiated, the heat pipes are distributed at intervals in the circumferential direction of the upper portion of the heat conducting plate, and the lower ends of the heat pipes are embedded into the heat conducting plate; a heat dissipation pipe is vertically arranged at the position of an annular center shaft defined by the heat pipes, the heat dissipation pipe is vertically fixed to the upper end of the heat conduction plate, the heat dissipation pipe is in a fence cylinder shape, and airflow blown out by the fan is vertically blown down from the upper end of the heat dissipation pipe; the heat dissipation fins comprise the first fins and the second fins, the first fins are arranged along the circumferential side wall of the heat dissipation pipe at intervals, the second fins are horizontally arranged in multiple layers at intervals from top to bottom along the height of the heat dissipation pipe, the second fins are annular, and the heat pipe is located between the adjacent first fins. According to the scheme, the problem that the heat dissipation efficiency and the heat dissipation effect in a limited space are not high due to the fact that fins of an existing heat dissipation device for the light portable computer are only distributed at intervals in height can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of notebook computers, in particular to a radiator for a lightweight portable computer. Background Art

[0002] As mobile chip technology and performance advance, the operating frequency and power consumption of electronic components also increase. This results in electronic components generating more heat than ever before during operation. The generation and release of heat is crucial to the stability of the entire computer system and the product's lifespan. Heat energy in portable computers primarily comes from the CPU, main graphics card, hard drive, and motherboard chipset, particularly the northbridge chip within the chipset that processes high-speed signals and the graphics card power supply circuit. The CPU is the largest heat source, accounting for one-third of a laptop's heat output. Therefore, high temperatures can have a devastating impact on these components. Heat is the CPU's natural enemy; excessive temperatures can easily burn out the CPU. Therefore, a stable and effective cooling system is crucial in laptops. Many computer hardware failures are caused by electronic component failures due to cooling system issues.

[0003] Existing heat dissipation devices, such as the structure disclosed in Chinese patent publication number CN118012248A, include a fixed base with connecting plates provided at the four corners of the top of the fixed base, a plurality of heat pipes embedded in the bottom surface of the fixed base, and a plurality of heat pipes connected to a heat fin group. By installing an inlet fan and an outlet fan, the heat inside the heat dissipation fin group is further efficiently exchanged, ensuring that the outside air exchanges heat in the heat dissipation fin group through a stable route, thereby improving the heat exchange efficiency. The defect of the above structure is that most radiators on the market are composed of a heat conducting plate, a heat pipe, a fan, and heat dissipation fins, and multiple heat conducting pipes are arranged vertically and at intervals along the circumference of the heat dissipation tube. Multiple layers of horizontal heat dissipation fins are arranged at the height of the outer edges of the multiple heat conducting pipes. Since the heat dissipation fins of different layers are dispersed in height, only part of the outer wall of the heat conducting pipe is in contact with the heat dissipation fins, resulting in uneven heat transfer between the heat conducting pipes in different areas and inefficient heat dissipation. In order to achieve higher heat dissipation efficiency and maximize the heat dissipation effect in a limited space, our company has proposed a new heat dissipation method that complements the active heat dissipation centered on the fan and the passive heat dissipation centered on the heat pipe. Utility Model Content

[0004] The utility model provides a lightweight portable computer radiator to solve the problem that the fins of the existing lightweight portable computer radiator are only distributed at intervals in height, resulting in low heat dissipation efficiency and effect in a limited space.

[0005] In order to solve the above problems, the technical solution adopted by the present invention is as follows: a lightweight radiator for portable computers, including a fan, a heat conducting plate, a heat pipe, and heat dissipation fins. The bottom surface of the heat conducting plate is in contact with the heat source module to be dissipated. There are multiple heat pipes and they are distributed at intervals along the circumference of the upper part of the heat conducting plate. The lower end of the heat pipe is embedded in the heat conducting plate. A heat dissipation pipe is vertically provided at the central axis of the ring formed by the multiple heat pipes. The heat dissipation pipe is vertically fixed to the upper end of the heat conducting plate. The heat dissipation pipe is in the shape of a fence cylinder. The airflow blown out by the fan is blown vertically down from the upper end of the heat dissipation pipe; the heat dissipation fins include first fins and second fins. The first fins are arranged at intervals along the circumferential side wall of the heat dissipation pipe, and the second fins are horizontally arranged in multiple layers from top to bottom along the height of the heat dissipation pipe. The second fins are annular, and the heat pipes are located between adjacent first fins.

[0006] The basic principle of this solution is as follows: a heat-conducting plate absorbs heat from the heat source module through contact. The lower end of the heat pipe is embedded in the heat-conducting plate, absorbing heat and causing the liquid inside the heat pipe to evaporate and vaporize. The airflow blown out by the fan exchanges heat with the upper end of the heat pipe, where the vaporized steam condenses and releases heat, achieving heat dissipation. Simultaneously, the heat pipe is interspersed with the heat dissipation fins. The fan airflow flows along the grid of the heat dissipation pipe to the spaces between the second fins on each layer and flows along the radial first fins. The airflow exchanges heat with the heat on the fins to achieve heat dissipation. At the same time, the first fins act as a guide, allowing air to flow around the side walls of the heat pipe to dissipate heat.

[0007] This solution offers several advantages: Unlike conventional tube bundle heat transfer, the heat fins enhance heat transfer capacity. The primary heat transfer processes occur between the fins and air, and between the heat pipes and the heat conducting plate. The fins' orientation enhances air convection around the heat pipes. The heat pipe's placement affects the radiator's flow resistance and surface heat transfer coefficient, thus affecting the heat transfer effect. This solution employs a cross-shaped first and second fin heat pipe arrangement interlaced with the fins for heat transfer. This optimizes the fin arrangement in both height and radial direction, improving heat dissipation efficiency and effectiveness within a limited space.

[0008] Furthermore, the first fin includes a cross fin and a short fin, and the cross fin and the short fin are alternately arranged along the circumferential side wall of the heat dissipation tube. The cross fin and the short fin pass through the radial direction of the heat dissipation tube respectively. The inner ring side wall of the second fin touches the outer side wall of the short fin, and the outer ring side wall of the second fin is flush with the outer side wall of the cross fin.

[0009] Furthermore, the outer end of each cross wing includes two forks, both of which are curved arc-shaped, and a crescent-shaped gap is formed between the two forks.

[0010] Furthermore, a copper-based porous material layer is provided on the upper portion of the heat conducting plate. The copper-based porous material layer includes a plurality of cross holes, and the cross holes allow airflow to pass through.

[0011] Furthermore, the heat conducting plate is a copper metal plate, and the outer wall of the heat pipe is a copper pipe.

[0012] Furthermore, the fan is a centrifugal fan, which is arranged parallel to the heat source module. The air outlet of the centrifugal fan is connected to an air duct, through which the air flow is directed to the upper end of the heat dissipation pipe. This allows the fan installation position to be optimized without being affected by the thickness of the casing.

[0013] Furthermore, the fan is electrically connected to a speed controller, which enables the fan to have two gears of low wind and high wind through the speed controller.

[0014] Furthermore, the copper-based porous material layer is a foam copper layer. The foam copper has a high specific surface area and a through-porosity rate of more than 98%.

[0015] Furthermore, the upper end of the heat pipe passes through the second fin of the uppermost layer, so that the condensing section at the upper end of the heat pipe can directly exchange heat with the fan airflow. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic top view of an embodiment of the present utility model;

[0017] Figure 2 It is a side sectional view of an embodiment of the present utility model. DETAILED DESCRIPTION

[0018] The following is further described in detail through specific implementation methods:

[0019] The reference numerals in the drawings of the specification include: heat source module 01 , heat conducting plate 1 , cross hole 2 , first fin 3 , short fin 31 , bifurcated fin 32 , second fin 4 , heat pipe 5 , and heat dissipation pipe 6 .

[0020] The embodiment is basically as shown in the attached Figure 1 To the attached Figure 2 As shown:

[0021] A lightweight radiator for portable computers includes a heat conducting plate 1, heat dissipation fins, a heat pipe 5, a fan, and a heat pipe 6. The fan is installed inside the notebook case as a power source for air flow inside the notebook computer. The specific fan can be a centrifugal fan, and the airflow direction of the centrifugal fan is perpendicular to the axial direction of the radiator. The centrifugal fan is characterized by high wind pressure and is suitable for compact spaces and dense component arrangements. It is generally used for heating elements with large resistance. In this embodiment, to ensure that the air inlet of the centrifugal fan has sufficient air volume, 1-2mm of space is reserved above and below the fan. For ultra-thin models, ventilation holes will be reserved in the case directly below the fan. The air volume and air pressure are provided by the fan, and the heat pipe 5 conducts heat from the inside to the outside to dissipate heat on the surface of the case. When using a centrifugal fan, the air duct can be used to adjust the direction of the wind so that the cooling fan can be parallel to the motherboard and is not limited by the thickness of the body.

[0022] The heat conducting plate 1 is parallel to the heat source module 01 and is placed in contact with it. The heat source module 01 is the motherboard chip. A layer of thermal grease is coated between the heat source module 01 and the bottom surface of the heat conducting plate 1. The thermal grease is thermal silicone grease. The purpose is to fill the small gap between the chip and the heat conducting plate 1, and to make the contact surface smoother, thereby increasing the contact area between the heat source and the heat conducting plate 1. The operating temperature is between -50°C and 180°C, and it has good thermal conductivity, waterproofness, high temperature resistance and aging resistance.

[0023] The heat pipe 5 comprises a tube shell, a wick, and an end cap. After negative pressure is applied to the heat pipe 5, an appropriate amount of working fluid is applied. The capillary porous material of the wick, which is in close contact with the inner wall, is then filled with liquid and sealed. The lower end of the heat pipe 5 is a heating section, and the upper end is a cooling section. The heating and cooling sections are separated by an insulating section. When the lower end of the heat pipe 5 is heated, the liquid in the capillary wick absorbs heat and evaporates. When the vaporized vapor flows upward to the condensation section, it releases heat and liquefies. The liquid then flows back to the evaporation section along the porous material due to capillary forces. This cycle transfers heat from one end of the heat pipe 5 to the other. In this embodiment, the lower end of the heat pipe 5 is vertically embedded in the interior of the heat conducting plate 1. A fan is located directly above the upper end of the heat pipe 5. The fan's outlet and airflow direction blow vertically downward toward the upper end of the heat pipe 5.

[0024] In this embodiment, multiple heat pipes 5 are made of copper tubes. The heat pipes 5 are spaced apart circumferentially around the heat conducting plate 1. A heat dissipation pipe 6 is vertically embedded at the center of the circular ring formed by the multiple heat pipes 5. The heat dissipation pipe 6 is in the shape of a cylindrical fence, and the circumferential sidewalls of the heat dissipation pipe 6 are composed of multiple vertical bars spaced apart. This ensures that air from the top fan can flow from the center of the heat dissipation pipe 6 to the gaps between the bars.

[0025] The heat sink fins include first fins 3 and second fins 4. Vertical first fins 3 are spaced apart on the circumferential outer wall of the heat sink. The first fins 3 are distributed radially along the heat sink 6. The first fins 3 include short fins 31 and bifurcated fins 32. The short fins 31 and bifurcated fins 32 are alternately spaced along the circumference of the heat sink. The short fins 31 are shorter in radial direction than the bifurcated fins 32.

[0026] Multiple layers of horizontal second fins 4 are spaced apart from each other along the entire height of the heat dissipation tube, from top to bottom. These second fins 4 are circular thin sheets, with the inner sidewalls of the second fins 4 in contact with the outer walls of the short fins 31, and the outer sidewalls of the second fins 4 flush with the outermost ends of the bifurcated fins 32. The heat pipes 5, heat dissipation pipes 6, and first fins 3 are all perpendicular to the second fins 4. The heat pipes 5 and the bifurcated fins 32 of the first fins 3 vertically penetrate the second fins 4. In this embodiment, the outer ends of the bifurcated fins 32 include two forks, both of which are curved arcs with a crescent-shaped gap between them. The heat dissipation fins of the heat pipe 5 radiator are a dense and thin matrix of fins, and are the primary component for convective heat exchange with the air in this heat dissipation system. Given a certain system air volume and radiator volume, reducing the inter-fin spacing and thickness increases the heat exchange area between the radiator and the air. The arrangement of the heat pipes 5 affects the flow resistance and surface heat transfer coefficient of the radiator, thereby affecting the heat exchange effect. The heat pipe 5 is inserted into the heat sink for heat exchange, which is somewhat different from the general tube bundle heat exchange. The heat sink fins enhance the heat exchange capacity. The main heat exchange process is the heat exchange between the heat sink fins and the air, which is related to the temperature distribution of the heat sink fins and the velocity distribution on the surface of the heat sink fins.

[0027] In this embodiment, the heat conducting plate 1 is a metal plate. To increase airflow above the plate 1, a copper-based porous material layer is formed near the top of the plate 1. The copper-based porous material has a plurality of cross holes 2, i.e., multiple overlapping through holes, which allow airflow to pass through the gaps near the metal plate wall, thereby achieving a more uniform temperature distribution on the condensing surface of the heat pipe 5 on the metal plate. Specifically, copper foam can be used.

[0028] In this solution, in order to control the fan speed, the fan motor is electrically connected to a speed controller, and the speed controller allows the fan to have two gears: low wind and high wind.

[0029] The specific implementation process is as follows: the bottom surface of the metal heat conducting plate 1 absorbs heat energy from the heat source module 01, and the lower end of the heat pipe 5 inside the heat conducting plate 1 absorbs heat through its copper tube wall, causing the liquid inside the heat pipe 5 to absorb heat and evaporate. The vaporized vapor rises to the condensation section of the heat pipe 5. The condensation section is close to the fan and the temperature is low. The vaporized vapor releases heat and liquefies, thus completing the convection heat exchange with the fan airflow. At the same time, the heat pipe 6 set at the center of the multiple heat pipes 5 guides the airflow blowing from above into the multiple layers of second fins 4. The lower end of the first fin 3 contacts the metal plate to absorb heat. A space is formed between the bifurcated fins 32 of two adjacent first fins 3 and the two adjacent second fins 4. When the airflow flows along the side walls of the bifurcated fins 32, it takes away the heat of the bifurcated fins 32. The interlaced design of the fins enhances the heat exchange between the heat sink fins and the air. At the same time, the heat pipe 5 is interlaced with the heat sink fins to exchange heat, splitting the airflow and concentrating it around the heat pipe 5, thereby enhancing heat dissipation.

[0030] The above is only an embodiment of the present invention, and the commonly known specific structures and characteristics of the scheme are not described in detail here. It should be pointed out that for those skilled in the art, several modifications and improvements can be made without departing from the structure of the present invention, and these should also be regarded as the scope of protection of the present invention. These will not affect the effect of the implementation of the present invention and the practicality of the patent. The scope of protection claimed by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A lightweight portable computer radiator comprising a fan, a heat conducting plate, a heat pipe, and heat dissipation fins, wherein the bottom surface of the heat conducting plate is in contact with a heat source module to be dissipated, and characterized in that: There are multiple heat pipes distributed at intervals along the circumference of the upper portion of the heat conducting plate. The lower ends of the heat pipes are embedded in the heat conducting plate. A heat dissipation pipe is vertically provided at the central axis of the ring formed by the multiple heat pipes. The heat dissipation pipe is vertically fixed to the upper end of the heat conducting plate. The heat dissipation pipe is in the shape of a fence cylinder. The airflow blown by the fan is blown vertically downward from the upper end of the heat dissipation pipe. The heat dissipation fins include first fins and second fins. The first fins are arranged at intervals along the circumferential side walls of the heat dissipation pipe. The second fins are horizontally arranged in multiple layers from top to bottom along the height of the heat dissipation pipe. The second fins are annular. The heat pipe is located between adjacent first fins.

2. A lightweight portable computer radiator according to claim 1, characterized in that: The first fins include cross fins and short fins, and the cross fins and short fins are alternately arranged along the circumferential side wall of the heat dissipation tube. The cross fins and short fins pass through the radial direction of the heat dissipation tube respectively. The inner ring side wall of the second fin touches the outer side wall of the short fin, and the outer ring side wall of the second fin is flush with the outer side wall of the cross fin.

3. The lightweight portable computer radiator according to claim 1, characterized in that: The outer end of each cross wing includes two forks, both of which are curved arc-shaped, and a crescent-shaped gap is formed between the two forks.

4. The lightweight portable computer radiator according to claim 1, characterized in that: A copper-based porous material layer is provided on the upper portion of the heat conducting plate. The copper-based porous material layer includes a plurality of cross holes, and the cross holes allow air flow to pass through.

5. The lightweight portable computer radiator according to claim 1, characterized in that: The heat conducting plate is a copper metal plate, and the outer wall of the heat pipe is a copper pipe.

6. The lightweight portable computer radiator according to claim 1, characterized in that: The fan is a centrifugal fan, which is arranged parallel to the heat source module. The air outlet of the centrifugal fan is connected to an air duct, through which the air flow can flow to the upper end of the heat dissipation pipe.

7. The lightweight portable computer radiator according to claim 1, characterized in that: The fan is electrically connected to a speed controller, which enables the fan to have two gears of low wind and high wind through the speed controller.

8. The lightweight portable computer radiator according to claim 4, characterized in that: The copper-based porous material layer is a foam copper layer.

9. The lightweight portable computer radiator according to claim 1, characterized in that: The upper end of the heat pipe passes through the second fin on the uppermost layer.

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