Air-liquid mixed heat dissipation device and server with same

Abstract

The utility model discloses an air-liquid mixed heat dissipation device and a server with the air-liquid mixed heat dissipation device, and relates to the technical field of servers, the air-liquid mixed heat dissipation device comprises an air-cooling heat dissipation part, the air-cooling heat dissipation part comprises a heat pipe assembly and an expansion heat dissipation assembly which are connected, the heat pipe assembly is filled with a first refrigerant, the heat pipe assembly is in contact with a first part of a to-be-cooled part, and the expansion heat dissipation assembly is in contact with a second part of the to-be-cooled part; heat of the to-be-cooled part is dissipated; the liquid cooling heat dissipation part is used for introducing a second refrigerant, and the liquid cooling heat dissipation part is in contact with the second part of the component to be subjected to heat dissipation so as to dissipate heat of the component to be subjected to heat dissipation; wherein the heat pipe assembly is arranged on the liquid cooling heat dissipation part so as to dissipate heat of the heat pipe assembly through the liquid cooling heat dissipation part, the problem that an air-liquid mixing radiator in the related technology cannot guarantee continuous heat dissipation of air of the air cooling part in the maintenance period of the liquid cooling equipment is solved, and the effect that the heat pipe assembly cannot dissipate heat even if the liquid cooling heat dissipation part does not participate is achieved. And the temperature of the to-be-cooled part can be ensured to be within a safe range, so that the usability and the stability of the server are greatly improved.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to an air-liquid hybrid heat dissipation device and a server having the same. Background Art

[0002] In the field of electronic devices, as computing performance rapidly increases, the heat generated by their internal heat-generating components is also increasing. For example, server clusters in data centers release a large amount of heat during operation. If heat is not dissipated in a timely and effective manner, it will lead to reduced device performance, shortened lifespan, and even cause failure.

[0003] Air-cooled radiators mainly rely on thermally conductive materials and fans for heat dissipation, and have the advantages of simple structure and low cost. However, in high-performance electronic equipment, their heat dissipation efficiency is limited and it is difficult to meet the heat dissipation needs of high-power chips (such as high-end CPUs / GPUs). Liquid-cooled radiators can provide higher heat dissipation efficiency and more stable temperature control than air-cooled radiators, and are especially suitable for scenarios with high heat flux density. However, the maintenance cost of liquid-cooled cold plates is high, and the coolant needs to be replaced in a timely manner. Therefore, the heat-generating components cannot be effectively cooled in time during maintenance. The current air-liquid hybrid radiators, although they combine the advantages of air-cooled radiators and liquid-cooled radiators to a certain extent, have deficiencies in structural design and functional implementation. They cannot ensure continuous and effective heat dissipation of air-cooled components during liquid-cooled equipment maintenance, and it is difficult to quickly restore the efficient operation of liquid-cooled heat dissipation after maintenance. Utility Model Content

[0004] The present application provides an air-liquid hybrid heat dissipation device and a server having the same, to at least solve the problem in the related art that the air-liquid hybrid radiator cannot ensure continuous heat dissipation of the air cooling part during maintenance of the liquid cooling equipment.

[0005] The present application provides an air-liquid hybrid heat dissipation device, comprising: an air-cooled heat dissipation portion, the air-cooled heat dissipation portion comprising a heat pipe assembly and an extended heat dissipation assembly connected thereto, the extended heat dissipation assembly being used to dissipate heat from the heat pipe assembly, the heat pipe assembly being filled with a first refrigerant, and the heat pipe assembly being in contact with a first portion of a component to be dissipated to dissipate heat from the component to be dissipated; a liquid-cooled heat dissipation portion, the liquid-cooled heat dissipation portion being used to allow a second refrigerant to flow therein, the liquid-cooled heat dissipation portion being in contact with a second portion of the component to be dissipated to dissipate heat from the component to be dissipated; wherein the heat pipe assembly is arranged in the liquid-cooled heat dissipation portion to dissipate heat from the heat pipe assembly through the liquid-cooled heat dissipation portion.

[0006] Furthermore, the liquid cooling assembly also includes: a heat conducting plate, the heat conducting plate contacts the second part of the component to be cooled, the heat pipe assembly is inserted into the heat conducting plate and is located on the side of the heat conducting plate close to the component to be cooled; a liquid cooling plate and a liquid inlet pipe and a liquid outlet pipe connected to the liquid cooling plate, the liquid cooling plate is arranged on the side of the heat conducting plate away from the component to be cooled and contacts the heat conducting plate, and one end of the liquid inlet pipe away from the liquid cooling plate and one end of the liquid outlet pipe away from the liquid cooling plate are both connected to an external refrigerant supply device.

[0007] Furthermore, the liquid inlet pipe and the liquid outlet pipe are arranged at intervals along the second direction on the liquid cooling plate. The liquid cooling plate includes a accommodating cavity and a plurality of partitions arranged in the accommodating cavity. The plurality of partitions are arranged at intervals along the second direction to divide the accommodating cavity into a plurality of refrigerant channels so that the second refrigerant flows through each refrigerant channel.

[0008] Furthermore, the heat pipe assembly includes a plurality of heat pipes, which are spaced apart along the first direction on the liquid cooling portion, and each heat pipe is in contact with the component to be cooled to conduct the heat of the component to be cooled to the first refrigerant.

[0009] Furthermore, at least a portion of the extended heat dissipation assembly is located above the liquid-cooled heat dissipation portion, and at least a portion of the heat pipe assembly is located below the liquid-cooled heat dissipation portion; the extended heat dissipation assembly includes a plurality of gas circulation gaps, the first end of the heat pipe assembly contacts the component to be cooled, and the second end of the heat pipe assembly extends into the extended heat dissipation assembly to dissipate heat to the first refrigerant moving into the second end of the heat pipe assembly through the airflow flowing through the plurality of gas circulation gaps.

[0010] Furthermore, the extended heat dissipation assembly includes multiple extended heat dissipation parts, which are arranged at intervals along the third direction, and a gas circulation gap is formed between any two adjacent extended heat dissipation parts, and each gas circulation gap is used to connect at least part of the second end of the heat pipe assembly.

[0011] Furthermore, each extended heat dissipation portion includes a plurality of heat dissipation fins spaced apart along the first direction.

[0012] Furthermore, the heat pipe assembly includes a plurality of heat pipes, the plurality of heat pipes include a first heat pipe and a second heat pipe, the plurality of gas circulation gaps include a first gas circulation gap and a second gas circulation gap, the second end of the first heat pipe is inserted into the first gas circulation gap, and the second end of the second heat pipe is inserted into the second gas circulation gap.

[0013] Furthermore, the heat pipe includes an evaporation section and a condensation section. The evaporation section is located below the condensation section and contacts the component to be cooled. The condensation section is connected to the extended cooling assembly to transfer the heat of the component to be cooled to the extended cooling assembly.

[0014] The present application also provides a server, comprising a component to be cooled and the above-mentioned air-liquid hybrid cooling device.

[0015] The air-liquid hybrid heat dissipation device of the present application includes: an air-cooled heat dissipation part, the air-cooled heat dissipation part includes a heat pipe assembly and an extended heat dissipation assembly connected to each other, the extended heat dissipation assembly is used to dissipate heat from the heat pipe assembly, the heat pipe assembly is filled with a first refrigerant, and the heat pipe assembly is in contact with a first part of the component to be dissipated to dissipate heat from the component to be dissipated; a liquid-cooled heat dissipation part, the liquid-cooled heat dissipation part is used to pass a second refrigerant, the liquid-cooled heat dissipation part is in contact with a second part of the component to be dissipated to dissipate heat from the component to be dissipated; wherein the heat pipe assembly is arranged in the liquid-cooled heat dissipation part to dissipate heat from the heat pipe assembly through the liquid-cooled heat dissipation part. In this way, since the present application utilizes the efficient heat conduction performance of the heat pipe assembly, by contacting the heat pipe assembly with the first part of the component to be dissipated, the heat of the component to be dissipated is quickly transferred to the first refrigerant in the heat pipe assembly, and then by contacting the liquid cooling heat sink with the second part of the component to be dissipated, the heat of the component to be dissipated is quickly transferred to the second refrigerant in the liquid cooling heat sink, thereby reducing the temperature of the component to be dissipated. The heat pipe assembly and the liquid cooling heat sink achieve efficient heat dissipation of the component to be dissipated, and the heat pipe assembly is arranged in the liquid cooling heat sink. The heat pipe assembly is jointly dissipated by the extended heat sink assembly and the liquid cooling heat sink, significantly improving the heat dissipation efficiency of the heat pipe assembly and extending the service life of the server. Moreover, during the maintenance of the liquid cooling heat sink, the heat pipe assembly and the extended heat sink assembly can operate independently, achieving the goal of ensuring that the temperature of the component to be dissipated is within a safe range even without the participation of the liquid cooling heat sink, avoiding server downtime caused by liquid cooling heat sink maintenance, greatly improving the availability and stability of the server, and effectively solving the problem in the related art that the air-liquid hybrid radiator cannot ensure continuous heat dissipation of the air cooling unit during liquid cooling equipment maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 A schematic diagram of the structure of the air-liquid hybrid heat dissipation device provided in an embodiment of the present application in one direction;

[0018] Figure 2 A schematic diagram of the structure of the air-liquid hybrid heat dissipation device provided in an embodiment of the present application in another direction;

[0019] Figure 3 for Figure 2 A partial enlarged view of point A shown;

[0020] Figure 4A schematic structural diagram of the bottom portion of the air-liquid hybrid heat dissipation device provided in an embodiment of the present application.

[0021] The above drawings include the following reference numerals:

[0022] 10. Air cooling heat dissipation unit; 20. Liquid cooling heat dissipation unit;

[0023] 110. Heat pipe assembly; 120. Extended heat dissipation assembly;

[0024] 210, heat conduction plate; 220, liquid cooling plate; 230, liquid inlet pipe; 240, liquid outlet pipe;

[0025] 211, accommodating chamber; 212, separator; 213, refrigerant channel;

[0026] 111, heat conducting pipe; 112, first heat conducting pipe; 113, second heat conducting pipe;

[0027] 121. Gas circulation gap; 122. Extended heat dissipation portion; 123. First gas circulation gap; 124. Second gas circulation gap. DETAILED DESCRIPTION

[0028] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0029] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended only to facilitate the description of the present application and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be understood broadly, for example, to mean fixed, removable, or integral; mechanical or electrical; direct or indirect through an intermediary; or internal communication between two components. The terms "parallel," "perpendicular," and "equal" include the conditions described and conditions similar to the conditions described, provided that the range of the similar conditions is within an acceptable range of deviation, where the acceptable range of deviation is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity, i.e., the limitations of the measurement system. For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0030] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0031] like Figures 1 to 4 As shown, an embodiment of the present application provides an air-liquid hybrid heat dissipation device, including: an air-cooled heat dissipation part 10, the air-cooled heat dissipation part 10 includes a connected heat pipe assembly 110 and an extended heat dissipation assembly 120, the extended heat dissipation assembly 120 is used to dissipate heat from the heat pipe assembly 110, the heat pipe assembly 110 is filled with a first refrigerant, and the heat pipe assembly 110 is in contact with a first part of the component to be dissipated to dissipate heat from the component to be dissipated; a liquid-cooled heat dissipation part 20, the liquid-cooled heat dissipation part 20 is used to pass a second refrigerant, the liquid-cooled heat dissipation part 20 is in contact with a second part of the component to be dissipated to dissipate heat from the component to be dissipated; wherein, the heat pipe assembly 110 is arranged in the liquid-cooled heat dissipation part 20 to dissipate heat from the heat pipe assembly 110 through the liquid-cooled heat dissipation part 20.

[0032] It can be seen that since the present application utilizes the efficient thermal conductivity performance of the heat pipe assembly 110, by contacting the heat pipe assembly 110 with the first part of the component to be cooled, the heat of the component to be cooled is quickly transferred to the first refrigerant in the heat pipe assembly 110, and then by contacting the liquid-cooled heat dissipation part 20 with the second part of the component to be cooled, the heat of the component to be cooled is quickly transferred to the second refrigerant in the liquid-cooled heat dissipation part 20, thereby reducing the temperature of the component to be cooled. The heat pipe assembly 110 and the liquid-cooled heat dissipation part 20 achieve efficient heat dissipation of the component to be cooled, and the heat pipe assembly 110 is arranged in the liquid-cooled heat dissipation part 20, and the heat pipe assembly 110 is jointly cooled by the extended heat dissipation assembly 120 and the liquid-cooled heat dissipation part 20, thereby significantly improving the heat dissipation efficiency of the heat pipe assembly 110 and extending the service life of the server. Moreover, during the maintenance of the liquid-cooled heat dissipation unit 20, the heat pipe assembly 110 and the extended heat dissipation assembly 120 can operate independently. Even without the participation of the liquid-cooled heat dissipation unit 20, the temperature of the components to be cooled can be ensured to be within a safe range, thereby avoiding server downtime due to maintenance of the liquid-cooled heat dissipation unit, greatly improving the availability and stability of the server, and effectively solving the problem in the related art that the air-liquid hybrid radiator cannot ensure continuous heat dissipation of the air from the air-cooled unit during maintenance of the liquid cooling equipment.

[0033] like Figure 1 As shown, the liquid cooling heat dissipation part 20 also includes: a heat conducting plate 210, the heat conducting plate 210 contacts the second part of the component to be cooled, the heat pipe assembly 110 is inserted on the heat conducting plate 210 and is located on the side of the heat conducting plate 210 close to the component to be cooled, ensuring that the heat conduction path from the component to be cooled to the heat pipe assembly 110 is the shortest, reducing heat loss during heat conduction and improving heat conduction efficiency; a liquid cooling plate 220 and a liquid inlet pipe 230 and a liquid outlet pipe 240 connected to the liquid cooling plate 220, the liquid cooling plate 220 is arranged on the side of the heat conducting plate 210 away from the component to be cooled. And it is in contact with the heat conducting plate 210, which can make full use of the heat conduction capacity of the heat conducting plate 210, so that the heat of the components to be cooled can be efficiently heat-exchanged with the second refrigerant through the liquid cooling channel in the liquid cooling plate 220; the end of the liquid inlet pipe 230 away from the liquid cooling plate 220 and the end of the liquid outlet pipe 240 away from the liquid cooling plate 220 are both connected to the external refrigerant supply device, forming a closed liquid cooling circulation system. The refrigerant supply device can adjust the flow and temperature of the coolant according to the actual temperature of the components to be cooled, thereby achieving more precise and effective heat dissipation control.

[0034] By integrating the heat conducting plate 210, heat pipe assembly 110, and liquid cooling plate 220, not only is heat conduction efficiency enhanced between the components being dissipated, but installation and maintenance of the heat sink are also simplified. During maintenance, even if the liquid cooling unit 20 temporarily fails, the heat pipe assembly 110 can continue dissipating heat through the air cooling unit, reducing the risk of heat sink failure and improving the continuity and stability of its operation.

[0035] The design of the liquid-cooled heat dissipation unit 20 of the present application allows it to be independent of changes in the external ambient temperature. By adjusting the temperature and flow of the coolant, the influence of a high temperature environment on the air-cooled heat dissipation capacity can be overcome, ensuring that the best heat dissipation effect can be achieved under various environmental conditions. In this way, when liquid cooling and air cooling work together, the heat dissipation tasks can be more reasonably allocated, which not only ensures heat dissipation efficiency but also reduces the excessive use of fans and pumps in the server, thereby effectively reducing the energy consumption of the server. In addition, the connection design of the liquid inlet pipe 230 and the liquid outlet pipe 240 to the external refrigerant supply device enables the air-liquid hybrid heat dissipation device to be easily connected to the existing liquid cooling system, enhancing the compatibility of the heat dissipation device.

[0036] like Figure 2 and Figure 3 As shown, the liquid inlet pipe 230 and the liquid outlet pipe 240 are arranged on the liquid cooling plate 220 at intervals along the second direction, which not only optimizes the flow path of the second refrigerant, but also can adjust the position and number of the pipes according to the needs of different application scenarios, thereby enhancing the applicability and flexibility of the heat dissipation device in different equipment and environments; the liquid cooling plate 220 includes a accommodating cavity 211 and a plurality of partitions 212 arranged in the accommodating cavity 211, and the plurality of partitions 212 are arranged at intervals along the second direction, dividing the accommodating cavity 211 into a plurality of refrigerant channels 213, so that the second refrigerant flows through each refrigerant channel 213, which can make the second refrigerant more evenly distributed inside the liquid cooling plate 220, ensuring that the components to be dissipated can be fully cooled, avoiding local overheating, and improving the uniformity and efficiency of heat dissipation.

[0037] Specifically, the first direction is the width direction of the liquid cooling plate 220 , the second direction is the length direction of the liquid cooling plate 220 , and the third direction is the height direction of the liquid cooling plate 220 .

[0038] Preferably, the design of multiple refrigerant channels 213 in the present application increases the contact area between the second refrigerant and the liquid cooling plate 220, and also increases the length of the liquid flow path of the second refrigerant, thereby extending the heat exchange time and improving the heat exchange performance of the liquid cooling plate 220. Compared with the single-channel design, this multi-channel structure can significantly improve the heat absorption and dissipation rate, and the presence of the partition 212 enables the coolant to more effectively utilize the space of the liquid cooling plate 220, avoiding the ineffective circulation of the second refrigerant inside the liquid cooling plate 220, ensuring that every drop of the second refrigerant is fully utilized to absorb and take away heat, reducing the waste of the second refrigerant, and also reducing the operating cost of the server's cooling system.

[0039] The multi-channel structure design of the present application helps to maintain the long-term stability and heat dissipation performance of the liquid-cooled heat dissipation part 20, and by rationally arranging the partitions 212, it can reduce the resistance of the coolant flowing between the channels, reduce the pressure loss of the second refrigerant, thereby reducing the power consumption required to pump the second refrigerant, and indirectly improve the overall energy efficiency of the server's heat dissipation system.

[0040] Specifically, the heat pipe assembly 110 includes a plurality of heat pipes 111, which are arranged on the liquid-cooled heat dissipation part 20 at intervals along a first direction, and each heat pipe 111 is in contact with the component to be cooled, thereby ensuring uniform heat conduction from the component to be cooled to the heat pipe assembly 110 and from the heat pipe assembly 110 to the liquid-cooled heat dissipation part 20, thereby avoiding the common hot spot concentration problem in some radiators. This uniform heat flow distribution helps to improve the heat dissipation efficiency of the heat pipe assembly 110, and is also beneficial to extending the service life of the component to be cooled. It can sense and respond to temperature changes in a timely manner, which is crucial for keeping the equipment operating within the optimal temperature range, especially in scenarios with high loads or dynamic load changes.

[0041] The provision of multiple heat pipes 111 significantly increases the contact area with the components to be cooled, thereby accelerating the heat transfer rate. The efficient heat conduction characteristics of heat pipes 111 make them play an important role in the heat dissipation process, especially for high-power, high-heat-density electronic components. They can quickly respond to temperature changes and transfer heat in a timely manner. As modular components, heat pipes 111 can be independently maintained or replaced without interfering with other parts of the liquid-cooled heat dissipation unit 20. This design not only simplifies the maintenance process, but also facilitates modification according to different heat dissipation requirements.

[0042] The design of multiple heat pipes 111 in this application enables efficient heat transfer within a relatively small space, helping to reduce the overall size of the heat sink. This is particularly important in space-constrained applications, such as portable devices and high-density server racks. Even if individual heat pipes 111 fail, the remaining heat pipes 111 will continue to function normally, dispersing heat and ensuring that overall heat dissipation performance is not significantly affected, thereby improving the heat dissipation reliability and fault tolerance of the heat sink.

[0043] Specifically, at least part of the extended heat dissipation assembly 120 is located above the liquid-cooled heat dissipation portion 20, and at least part of the heat pipe assembly 110 is extended and located on the lower side of the liquid-cooled heat dissipation portion 20. The extended heat dissipation assembly 120 includes multiple gas circulation gaps 121. The first end of the heat pipe assembly 110 contacts the component to be dissipated, and the second end of the heat pipe assembly 110 extends into the extended heat dissipation assembly 120 to dissipate heat to the first refrigerant moving into the second end of the heat pipe assembly 110 through the airflow flowing through the multiple gas circulation gaps 121. The multiple gas circulation gaps 121 can guide the airflow to flow through the end of the heat pipe assembly 110 more effectively, thereby enhancing the heat dissipation effect of the heat pipe assembly 110, not only improving the heat dissipation capacity of the heat pipe 111, but also ensuring that the heat of the first refrigerant inside the heat pipe 111 can be quickly dissipated into the air environment, thereby avoiding heat accumulation inside the heat pipe 111.

[0044] The second end of the heat pipe assembly 110 extends into the extended heat dissipation assembly 120 and fits tightly with the gas circulation gap 121 to form an efficient air-cooling channel, which significantly increases the contact area between the extended heat dissipation assembly 120 and the air, thereby improving the air-cooling efficiency of the heat dissipation device. In particular, when the liquid-cooled heat dissipation unit 20 is temporarily unable to work or its efficiency decreases, the air-cooled heat dissipation unit 10 can continue to intervene to ensure that the server's components to be cooled will not be damaged due to overheating.

[0045] Specifically, the combination of the extended heat dissipation assembly 120 and the heat pipe assembly 110 constructs a heat dissipation architecture. Even if the liquid cooling system of the server fails or requires maintenance, the liquid cooling heat dissipation part 20 of the heat dissipation device of the present application is temporarily unable to work, and its air cooling heat dissipation part 10 can still ensure that the temperature of the key components to be cooled is controlled within a safe range, thereby improving the reliability and operational stability of the entire cooling system of the server.

[0046] The design of the gas circulation gap 121 of the present application takes into account the principles of aerodynamics, so that the airflow can flow smoothly and avoid blockage or stagnation of the airflow. This is extremely important for optimizing the heat dissipation space layout of compact servers, and can maximize the heat dissipation efficiency within a limited space. Through the precise design of the gas circulation gap 121 and the matching of the heat pipe assembly 110, the airflow can flow more smoothly through the heat pipe assembly 110 of the heat dissipation device, reducing turbulence and friction, thereby reducing the noise generated by the air flow. In this way, the first refrigerant at the first end of the heat pipe assembly 110 directly absorbs the heat of the component to be dissipated, and the first refrigerant at the second end dissipates heat through the airflow at the extended heat dissipation assembly 120. This air-liquid mixed heat dissipation mode can give full play to the advantages of the two heat dissipation methods and improve the overall heat dissipation performance of the server.

[0047] Specifically, the extended heat dissipation assembly 120 includes a plurality of extended heat dissipation portions 122, and the plurality of extended heat dissipation portions 122 are spaced apart along a third direction, and a gas circulation gap 121 is formed between any two adjacent extended heat dissipation portions 122, and each gas circulation gap 121 is used to connect at least a portion of the second end of the heat pipe assembly 110. By forming the gas circulation gap 121 between the extended heat dissipation portions 122, the second end of the heat pipe assembly 110 is able to form direct contact with the airflow, thereby accelerating the heat transfer process from the heat pipe assembly 110 to the air, thereby maximizing the heat dissipation efficiency. The presence of the plurality of extended heat dissipation portions 122 increases the heat dissipation surface area of ​​the air-cooled heat dissipation portion 10, and improves the heat dissipation capacity of the air-cooled heat dissipation portion 10 through forced convection of the airflow in the gas circulation gap 121, thereby ensuring the heat dissipation requirements even during maintenance or failure of the liquid-cooled heat dissipation portion 20.

[0048] Preferably, each extended heat sink 122 includes a plurality of heat dissipation fins spaced apart along the first direction, significantly increasing the surface area in contact with air, thereby improving the ability to exchange heat through natural convection or forced convection such as fan-driven heat. A larger surface area means more efficient heat dissipation, which is one of the key factors in improving heat dissipation efficiency.

[0049] The spacing of the cooling fins helps guide air flow, reducing air stagnation and turbulence, allowing air to flow more smoothly and evenly across the heat dissipation area, improving the efficiency and uniformity of airflow. Good aerodynamic design also reduces fan noise, creating a quieter working environment. By adjusting the number and spacing of the cooling fins, the radiator can be customized to meet different heat load requirements, maintaining excellent cooling performance across a wide range of server power outputs, enhancing the adaptability and flexibility of the cooling system.

[0050] The use of the heat sink fins in this application, especially those corresponding to the second end of the heat pipe assembly 110, can accelerate the conduction of heat from the heat pipe assembly 110 to the air, ensuring that the heat in the first refrigerant can be quickly carried away by the airflow, and preventing heat accumulation inside the radiator. In the air-liquid hybrid heat dissipation mode, even if the liquid cooling part fails or during maintenance, the air cooling function of the heat sink fins can still operate independently and continue to dissipate heat for the heat pipe assembly 110, ensuring that the components to be cooled can be maintained within a safe operating temperature range under any circumstances, thereby enhancing the continuous operation capability of the server.

[0051] Optionally, by adjusting the number and spacing of the heat sink fins, the heat sink can be customized to suit different heat load requirements, so that it can maintain good heat dissipation within a wide power output range of the server, thereby enhancing the adaptability and flexibility of the heat dissipation system. Compared with a heat sink made of a single material or structure, the use of multiple heat sink fins can reduce the need for expensive materials. At the same time, by improving the heat dissipation efficiency, it reduces the need for a larger heat sink size or higher fan power for the server, thereby achieving overall cost-effectiveness optimization.

[0052] like Figure 2 and Figure 4 As shown, the heat pipe assembly 110 includes a plurality of heat pipes 111, wherein the plurality of heat pipes 111 include a first heat pipe 112 and a second heat pipe 113, and the plurality of gas circulation gaps 121 include a first gas circulation gap 123 and a second gas circulation gap 124. The second end of the first heat pipe 112 is inserted into the first gas circulation gap 123, and the second end of the second heat pipe 113 is inserted into the second gas circulation gap 124. By dividing the heat pipe assembly 110 into two parts and inserting them into different gas circulation gaps respectively, the distribution and dissipation of heat can be more accurately controlled, ensuring that the temperature of key parts is effectively controlled and local overheating is avoided, while improving the efficiency of the entire heat dissipation system of the server. The matching of the first heat pipe 112 with the first gas circulation gap 123, and the matching of the second heat pipe 113 with the second gas circulation gap 124, achieves targeted heat dissipation for different heat pipes 111. More efficient heat transfer can be achieved by increasing the number of heat pipes 111 and optimizing the layout of the gas circulation gaps 121.

[0053] The differentiated design of the first and second air circulation gaps 123, 124 in this application allows for more rational distribution of airflow across the entire extended heat dissipation assembly 120, optimizing the airflow path and reducing airflow resistance and turbulence, thereby improving the efficiency of the air-cooled heat dissipation system and reducing fan noise. This design allows for adjustment of the length and diameter of the first and second heat pipes 112, 113, and their matching relationship with the first and second air circulation gaps 123, 124 to accommodate varying heat dissipation requirements and server configurations, providing greater flexibility and adjustability for diverse application scenarios.

[0054] Optionally, the clear classification and corresponding design of the first heat pipe 112, the second heat pipe 113, and the first gas circulation gap 123 and the second gas circulation gap 124 facilitate maintenance personnel to quickly locate the problem and perform targeted maintenance or replacement, thereby reducing the difficulty and cost of maintenance, and also reducing the downtime during server maintenance. By more efficiently controlling the temperature inside the server, performance degradation and shortened life of key components due to overheating are avoided, thereby extending the service life of the entire server. The independent operation of the first heat pipe 112 and the second heat pipe 113, and the efficient heat dissipation of the first gas circulation gap 123 and the second gas circulation gap 124 enable the server's heat dissipation system to respond more quickly to changes in the equipment's heat load, especially when the server suddenly increases its load or a thermal shock occurs, and the heat dissipation strategy can be quickly adjusted to protect the server from damage.

[0055] Optionally, the heat pipe 111 includes an evaporation section and a condensation section. The evaporation section is located below the condensation section. The evaporation section is in contact with the component to be dissipated. The first refrigerant quickly absorbs the heat from the component to be dissipated and converts it from liquid to vapor. The vapor rises to the condensation section to cool and releases heat to the air flow flowing through the extended heat dissipation assembly 120. Then the vapor is converted into liquid and returns to the evaporation section. This process greatly improves the speed and efficiency of heat conduction, ensuring temperature control during server operation. The condensation section is connected to the extended heat dissipation assembly 120 to transfer the heat of the component to be dissipated to the extended heat dissipation assembly 120. The connection between the condensation section and the extended heat dissipation assembly 120 can evenly disperse the heat to different positions of the entire extended heat dissipation assembly 120, avoiding the heat concentration effect, making the temperature distribution of the entire heat dissipation device more uniform, which is beneficial to improving the overall heat dissipation performance of the heat dissipation device.

[0056] Among them, the evaporation section is usually made of high thermal conductivity material, which can significantly reduce thermal resistance and accelerate the transfer of heat from the components to be dissipated to the heat pipe 111, thereby improving the thermal response speed of the entire heat dissipation device. By fixing the condensation section on the extended heat dissipation assembly 120, the overall structural stability of the heat dissipation device can be enhanced, avoiding the loosening or falling off of the heat pipe 111 when the server vibrates or moves, thereby ensuring the long-term and reliable operation of the heat dissipation device.

[0057] Optionally, the liquid cooling heat sink 20 may be made of copper, which has extremely high thermal conductivity and can more effectively absorb and conduct heat. The use of copper, particularly in the liquid cooling plate cavity, can significantly improve the efficiency of liquid cooling, reduce coolant temperature fluctuations, and ensure the stability and efficiency of the cooling system.

[0058] Optionally, the extended heat sink assembly 120 may be made of aluminum alloy, which is selected due to its light weight, high strength, and good thermal conductivity. This not only reduces the overall weight of the heat sink and the burden on the device structure, but also ensures sufficient heat dissipation efficiency, especially when the air cooling portion plays a major role.

[0059] Preferably, the combination of copper and aluminum alloy takes into account the matching of material properties under different heat dissipation modes, which not only takes advantage of the high thermal conductivity of copper, but also utilizes the lightness and high strength of aluminum alloy, while finding a balance between cost and performance. It is a material choice that takes into account heat dissipation efficiency, durability and economy.

[0060] The present application also provides a server comprising components to be cooled and the aforementioned air-liquid hybrid cooling device. The air-liquid hybrid cooling device effectively controls the temperature of the components within the server to be cooled, preventing overheating. The air-cooled heat sink 10 and the liquid-cooled heat sink 20 provide efficient heat absorption and transfer during normal operation. The air-cooled heat sink 10 also ensures basic heat dissipation requirements during liquid cooling system maintenance or failure, providing a dual-security thermal management solution.

[0061] By maintaining internal heat-dissipating components within an appropriate operating temperature range, the server can continuously and stably provide high-performance computing and data processing capabilities without performance degradation or calculation errors caused by temperature fluctuations, thereby ensuring business continuity and service quality. Effective thermal management can also reduce aging and failure of internal hardware due to overheating, extend the service life of the server, reduce the cost of frequent hardware replacement, and improve the return on investment.

[0062] Since the liquid cooling heat dissipation unit 20 can take on part of the heat dissipation work, the air volume requirement for the server fan is significantly reduced, which means that the fan can run at a lower speed, thereby reducing noise generation and providing a quieter operating environment for the server, which is suitable for noise-sensitive occasions such as data centers.

[0063] Under normal operating conditions, the air-cooled heat dissipation unit 10 and the liquid-cooled heat dissipation unit 20 of the present application are closely integrated and work in tandem to ensure that the temperature of the components to be cooled inside the server is within an ideal range. During the maintenance period of the liquid-cooled heat dissipation unit 20, the air-cooled heat dissipation unit 10 demonstrates its unique advantages, ensuring the continuous and stable operation of equipment such as the server. Specifically:

[0064] Each heat pipe 111 in the heat pipe assembly 110, including a first heat pipe 112 and a second heat pipe 113, rapidly transfers heat from high-power components such as the CPU and GPU to the airflow flowing through the extended heat dissipation assembly 120. The evaporation section is in close contact with the components to be cooled, rapidly absorbing heat and converting the first refrigerant into vapor. The vapor rises to the condensation section of the heat pipe 111 and ultimately transfers the heat to the heat sink fins, achieving efficient heat dissipation. This allows the air-cooled heat sink 10 to independently assume heat dissipation responsibility during maintenance of the liquid-cooled heat sink 20, ensuring that the temperature of the electronic components waiting for heat dissipation does not exceed a safe range.

[0065] The liquid cooling plate cavity of the liquid-cooled heat sink 20 is made of pure copper with high thermal conductivity and is internally provided with multiple refrigerant channels 213. A second refrigerant (such as water or ethylene glycol solution) circulates within these channels, absorbing heat through convection. This design enables the liquid-cooled heat sink 20 to directly and quickly absorb heat from the heat pipe assembly 110 while also receiving heat directly from the components being dissipated, significantly improving heat absorption and conduction efficiency.

[0066] The heat sink fins on the extended heat sink assembly 120 of the present application form an optimized heat dissipation network. The carefully calculated spacing between the fins, combined with their comb-like arrangement, allows for optimal air flow and enhances convective heat dissipation. Even when the liquid cooling unit 20 is closed, the heat sink fins can still effectively remove heat transferred from the heat pipe assembly 110 through natural convection or forced convection driven by a fan (part of the system's air cooling module).

[0067] Preferably, the first refrigerant is one or more of water, Freon-based refrigerant and ethylene glycol aqueous solution.

[0068] In the air-liquid hybrid heat dissipation device of the present application, the heat pipe 111 plays a key role in heat transfer, wherein the liquefaction and vaporization process experienced by the first refrigerant is the core of the heat dissipation mechanism of the entire heat pipe assembly 110 .

[0069] When servers and other equipment are operating, heat generated by the components to be cooled is first absorbed by the first refrigerant in heat pipe assembly 110. In the evaporation section of first heat pipe 112, due to contact with the components to be cooled, the first refrigerant is heated and transforms from liquid to gas, a process known as vaporization. During vaporization, the refrigerant absorbs a large amount of heat, thereby cooling the components to be cooled.

[0070] In the condensation section of the first heat pipe 112, the gaseous first refrigerant begins to cool and re-liquefy. This is where the heat pipe assembly 110 interacts with the external heat sink fins. The gaseous first refrigerant releases heat in the condensation section and converts back into liquid form. This process occurs in the condensation section because air convection through the heat sink fins dissipates heat to the outside world, thereby lowering the temperature of the environment surrounding the first refrigerant and causing it to release heat and liquefy.

[0071] The liquid first refrigerant then returns to the evaporation section along the return path of the first heat pipe 112, ready to absorb heat and vaporize again. This cycle is continuously carried out inside the heat pipe, ensuring effective heat transfer and heat dissipation.

[0072] In the air-liquid hybrid heat dissipation device of the present application, the liquefaction and vaporization processes of the first refrigerant within the heat pipe 111 work in conjunction with the liquid-cooled heat dissipation unit 20. When the liquid-cooled heat dissipation unit 20 is operating normally, the heat of the first refrigerant, after vaporization, can be partially removed by the second refrigerant in the accommodating cavity 211, resulting in more efficient heat transfer. During liquid-cooled maintenance, heat is primarily dissipated through forced convection from the heat pipe assembly 110 and the air flowing through the heat dissipation fins, ensuring stable heat dissipation even without the support of the liquid-cooled heat dissipation unit 20.

[0073] The above is a detailed introduction to the air-liquid hybrid heat dissipation device and the server provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. An air-liquid mixed heat dissipation device, characterized in that: include: An air-cooled heat dissipation portion (10), the air-cooled heat dissipation portion (10) comprising a heat pipe assembly (110) and an extended heat dissipation assembly (120) connected to each other, the extended heat dissipation assembly (120) being used to dissipate heat from the heat pipe assembly (110), the heat pipe assembly (110) being filled with a first refrigerant, and the heat pipe assembly (110) being in contact with a first portion of a component to be dissipated, so as to dissipate heat from the component to be dissipated; a liquid cooling heat dissipation portion (20), wherein a second refrigerant is introduced into the liquid cooling heat dissipation portion (20), and the liquid cooling heat dissipation portion (20) contacts the second portion of the component to be cooled to dissipate heat, so as to dissipate heat from the component to be cooled; The heat pipe assembly (110) is arranged on the liquid cooling heat dissipation portion (20) so as to dissipate heat from the heat pipe assembly (110) through the liquid cooling heat dissipation portion (20).

2. The air-liquid hybrid heat dissipation device according to claim 1, characterized in that: The liquid cooling heat dissipation unit (20) further includes: a heat conducting plate (210), the heat conducting plate (210) being in contact with the second portion of the component to be cooled, the heat pipe assembly (110) being inserted into the heat conducting plate (210) and being located on a side of the heat conducting plate (210) close to the component to be cooled; A liquid cooling plate (220) and a liquid inlet pipe (230) and a liquid outlet pipe (240) in communication with the liquid cooling plate (220); the liquid cooling plate (220) is arranged on a side of the heat conducting plate (210) away from the component to be cooled and in contact with the heat conducting plate (210); an end of the liquid inlet pipe (230) away from the liquid cooling plate (220) and an end of the liquid outlet pipe (240) away from the liquid cooling plate (220) are both connected to an external refrigerant supply device.

3. The air-liquid hybrid heat dissipation device according to claim 2, characterized in that: The liquid inlet pipe (230) and the liquid outlet pipe (240) are arranged on the liquid cooling plate (220) at intervals along the second direction. The liquid cooling plate (220) includes a receiving cavity (211) and a plurality of partitions (212) arranged in the receiving cavity (211). The plurality of partitions (212) are arranged at intervals along the second direction to divide the receiving cavity (211) into a plurality of refrigerant channels (213), so that the second refrigerant flows through each of the refrigerant channels (213).

4. The air-liquid hybrid heat dissipation device according to claim 1, characterized in that: The heat pipe assembly (110) comprises a plurality of heat-conducting pipes (111), the plurality of heat-conducting pipes (111) being arranged on the liquid-cooled heat dissipation portion (20) at intervals along a first direction, and each of the heat-conducting pipes (111) is in contact with the component to be cooled, so as to conduct heat from the component to be cooled to the first refrigerant.

5. The air-liquid hybrid heat dissipation device according to claim 1, characterized in that: At least a portion of the extended heat dissipation assembly (120) is located above the liquid-cooled heat dissipation portion (20), and at least a portion of the heat pipe assembly (110) is located below the liquid-cooled heat dissipation portion (20); the extended heat dissipation assembly (120) includes a plurality of gas circulation gaps (121), a first end of the heat pipe assembly (110) contacts the component to be cooled, and a second end of the heat pipe assembly (110) extends into the extended heat dissipation assembly (120) to dissipate heat from the first refrigerant moving into the second end of the heat pipe assembly (110) through an airflow flowing through the plurality of gas circulation gaps (121).

6. The air-liquid hybrid heat dissipation device according to claim 5, characterized in that: The extended heat dissipation assembly (120) comprises a plurality of extended heat dissipation portions (122), wherein the plurality of extended heat dissipation portions (122) are spaced apart along a third direction, and a gas circulation gap (121) is formed between any two adjacent extended heat dissipation portions (122), and each gas circulation gap (121) is used to connect at least a portion of the second end of the heat pipe assembly (110).

7. The air-liquid hybrid heat dissipation device according to claim 6, characterized in that: Each of the extended heat dissipation portions (122) comprises a plurality of heat dissipation fins spaced apart along a first direction.

8. The air-liquid hybrid heat dissipation device according to claim 6, characterized in that: The heat pipe assembly (110) includes a plurality of heat-conducting pipes (111), the plurality of heat-conducting pipes (111) include a first heat-conducting pipe (112) and a second heat-conducting pipe (113), the plurality of gas circulation gaps (121) include a first gas circulation gap (123) and a second gas circulation gap (124), the second end of the first heat-conducting pipe (112) is inserted into the first gas circulation gap (123), and the second end of the second heat-conducting pipe (113) is inserted into the second gas circulation gap (124).

9. The air-liquid hybrid heat dissipation device according to claim 4, characterized in that: The heat pipe (111) comprises an evaporation section and a condensation section, the evaporation section is located below the condensation section, the evaporation section is in contact with the component to be cooled, and the condensation section is connected to the extended cooling assembly (120) to transfer heat from the component to be cooled to the extended cooling assembly (120).

10. A server, characterized in that: The invention comprises a component to be cooled and an air-liquid mixed cooling device according to any one of claims 1 to 9.

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