Semiconductor packaging jig

Abstract

The utility model discloses a semiconductor packaging jig which comprises a semiconductor packaging jig seat body, and a left half end circulation adjusting seat and a right half end circulation adjusting seat are arranged on the two sides of the upper portion of the semiconductor packaging jig seat body respectively. A front packaging moving frame and a rear packaging moving frame are arranged at the two ends of the middle position above the semiconductor packaging jig seat body respectively, a first semiconductor positioning groove is formed in the top of the front packaging moving frame, and a second semiconductor positioning groove is formed in the top of the rear packaging moving frame. Supporting plates are arranged on the two sides of the rear end of the semiconductor packaging jig seat body. The front packaging moving frame and the rear packaging moving frame achieve the front-back moving effect through the circulating conveying belt, the positions of the front packaging moving frame and the rear packaging moving frame are made to be alternated back and forth, the feeding and discharging steps can be carried out at the same time, and therefore the feeding and discharging time is shortened, and the feeding and discharging efficiency is improved. Sufficient discharging time can be reserved in the operation steps.

Description

Technical Field

[0001] The utility model relates to the field related to semiconductor packaging, in particular to a semiconductor packaging fixture. Background Art

[0002] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. The packaging process is as follows: the wafers from the front-end wafer process are cut into small chips through a dicing process, and then the cut chips are glued to the corresponding islands on the substrate frame. Ultra-fine metal wires or conductive resins are used to connect the bonding pads of the chips to the corresponding pins of the substrate to form the required circuit. The independent chips are then encapsulated and protected with a plastic shell. A series of operations are performed after the plastic sealing, and the finished product is tested after the packaging is completed.

[0003] There are still certain deficiencies in the use of semiconductor packaging jigs in the existing technology. During the loading and unloading process, traditional semiconductor packaging jigs usually have to wait until the previous semiconductor is unloaded before loading the unpackaged semiconductor. This requires multiple operation steps, delaying the semiconductor packaging time and reducing the packaging efficiency. Utility Model Content

[0004] The purpose of the present invention is to provide a semiconductor packaging jig to solve the problem raised in the above background technology that in the process of loading and unloading, the traditional semiconductor packaging jig usually has to wait until the previous semiconductor is unloaded before loading the unpackaged semiconductor, which requires multiple operation steps, delays the semiconductor packaging time, and reduces the packaging efficiency.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a semiconductor packaging jig, comprising a semiconductor packaging jig base, wherein a left half-end circulating adjustment base and a right half-end circulating adjustment base are respectively provided on both sides of the upper side of the semiconductor packaging jig base, a front packaging movable frame and a rear packaging movable frame are respectively provided at both ends of the middle position above the semiconductor packaging jig base, a first semiconductor positioning groove is provided on the top of the front packaging movable frame, and a second semiconductor positioning groove is provided on the top of the rear packaging movable frame, support plates are provided on both sides of the rear end of the semiconductor packaging jig base, a lifting plate is provided above the support plate, a packaging template is provided inside the lifting plate, a limit baffle is provided at the middle position of the rear end of the semiconductor packaging jig base, a cross partition is provided in the middle position inside the left half-end circulating adjustment base, guard plates are provided at both ends above the cross partition, a circulating conveyor belt is provided above the cross partition, drive rollers are provided at both ends of the circulating conveyor belt, and the drive rollers are connected to the forward and reverse drive motors, and a vertical partition is provided in the middle position inside the right half-end circulating adjustment base.

[0006] In a further embodiment, one side of the rear packaging movable frame is fixedly connected to the outer side surface of the circulating conveyor belt by bolts, and the other side of the rear packaging movable frame is slidingly connected to the right half-end circulating adjustment seat through a second guide slider and a second slide groove, and a second pulley is provided at the bottom of the second guide slider, and the second pulley is fixedly connected to the second guide slider by threads.

[0007] In a further embodiment, one side of the front packaging movable frame is fixedly connected to the inner side surface of the circulating conveyor belt by bolts, and the other side of the front packaging movable frame is slidingly connected to the right half-end circulating adjustment seat through a first guide slider and a first slide groove, and a first pulley is provided at the bottom of the first slide groove, and the first pulley is fixedly connected to the first slide groove by threads.

[0008] In a further embodiment, the limiting baffle is fixedly connected to the semiconductor packaging fixture seat through a fixing bracket, and the limiting baffle is fixedly connected to the fixing bracket through bolts.

[0009] In a further embodiment, the height of the rear packaging moving frame is twice the height of the front packaging moving frame, and the front packaging moving frame and the rear packaging moving frame are connected by sliding.

[0010] In a further embodiment, both sides of the lifting plate are fixedly connected to the support plate via return springs, and the middle position of the lifting plate is slidably connected to the support plate via guide pillars.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] 1. The front packaging mobile rack and the rear packaging mobile rack in the utility model are moved forward and backward by a circulating conveyor belt, so that the positions of the front packaging mobile rack and the rear packaging mobile rack are alternated back and forth, and the loading and unloading steps can be performed simultaneously, thereby shortening the loading and unloading time and improving the loading and unloading efficiency. This operation step can also reserve sufficient discharge time and is easier to operate. The front packaging mobile rack and the rear packaging mobile rack can be driven to move at the same time by the circulating conveyor belt, and only one driving mechanism is needed, which saves cost expenditure. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic structural diagram of a semiconductor packaging fixture of the present invention;

[0014] Figure 2 This is a rear view of a semiconductor packaging jig according to the present invention;

[0015] Figure 3 This is a detailed structural diagram of Part A of the present utility model;

[0016] Figure 4 This is a side view of a semiconductor packaging jig of the present invention;

[0017] Figure 5 It is a top view of the left half-end circulating adjustment seat and the right half-end circulating adjustment seat of the utility model.

[0018] In the figure: 1. Semiconductor packaging fixture seat; 2. Left half-end circulating adjustment seat; 3. Horizontal partition; 4. Circular conveyor belt; 5. Front packaging movable frame; 6. First semiconductor positioning groove; 7. Rear packaging movable frame; 8. Second semiconductor positioning groove; 9. Lifting plate; 10. Guide column; 11. Return spring; 12. Limit baffle; 13. Fixed bracket; 14. Forward and reverse drive motor; 15. Guard plate; 16. Drive roller; 17. Support plate; 18. Packaging template; 19. Right half-end circulating adjustment seat; 20. Vertical partition; 21. First guide slider; 22. First pulley; 23. Second guide slider; 24. Second pulley; 25. Second slide; 26. First slide. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0020] See also Figure 1-5, the utility model provides an embodiment: a semiconductor packaging jig, including a semiconductor packaging jig seat body 1, a left half-end circulation adjustment seat 2 and a right half-end circulation adjustment seat 19 are respectively provided on both sides of the upper side of the semiconductor packaging jig seat body 1, a front packaging movable frame 5 and a rear packaging movable frame 7 are respectively provided at both ends of the middle position above the semiconductor packaging jig seat body 1, the top of the front packaging movable frame 5 is provided with a first semiconductor positioning groove 6, and the top of the rear packaging movable frame 7 is provided with a second semiconductor positioning groove 8, support plates 17 are provided on both sides of the rear end of the semiconductor packaging jig seat body 1, a lifting plate 9 is provided above the support plate 17, and a packaging template 18 is provided inside the lifting plate 9, a limiting baffle 12 is provided in the middle position of the rear end of the semiconductor packaging jig seat body 1, a cross partition 3 is provided in the middle position inside the left half-end circulation adjustment seat 2, guard plates 15 are provided at both ends above the cross partition 3, and a circulating conveyor belt 4 is provided above the cross partition 3. , transmission rollers 16 are provided at both ends of the circulating conveyor belt 4, and the transmission rollers 16 are connected to the forward and reverse drive motors 14. A vertical partition 20 is provided in the middle position of the right half-end circulating adjustment seat 19; the left half-end circulating adjustment seat 2 and the right half-end circulating adjustment seat 19 are used to install the front packaging mobile rack 5 and the rear packaging mobile rack 7, and the front packaging mobile rack 5 is used to install and fix the first semiconductor positioning groove 6 and move the position of the first semiconductor positioning groove 6 back and forth, and the rear packaging mobile rack 7 is used to install and fix the second semiconductor positioning groove 8 and move the position of the second semiconductor positioning groove 8 back and forth, and the support plate 17 is used to install and fix the lifting plate 9, and the lifting plate 9 is used to lift and adjust the position of the packaging template 18, and the packaging template 18 is used to position the packaging, and the circulating conveyor belt 4 is used to move and adjust the position of the front packaging mobile rack 5 and the rear packaging mobile rack 7.

[0021] One side of the rear packaging movable frame 7 is fixedly connected to the outer side surface of the circulating conveyor belt 4 by bolts, and the other side of the rear packaging movable frame 7 is slidingly connected to the right half-end circulating adjustment seat 19 through the second guide slider 23 and the second slide groove 25. A second pulley 24 is provided at the bottom of the second guide slider 23, and the second pulley 24 is fixedly connected to the second guide slider 23 by threads. Bolts are used to install and fix one side of the rear packaging movable frame 7 to the circulating conveyor belt 4, and the second guide slider 23 is connected to the second slide groove 25 to assist in the balance of the movement of the rear packaging movable frame 7.

[0022] One side of the front packaging mobile frame 5 is fixedly connected to the inner side surface of the circulating conveyor belt 4 by bolts, and the other side of the front packaging mobile frame 5 is slidingly connected to the right half-end circulating adjustment seat 19 through the first guide slider 21 and the first slide groove 26. A first pulley 22 is provided at the bottom of the first slide groove 26, and the first pulley 22 and the first slide groove 26 are fixedly connected by threads. Bolts are used to install and fix one side of the front packaging mobile frame 5 to the circulating conveyor belt 4, and the first guide slider 21 is connected to the first slide groove 26 to assist the balance of the movement of the front packaging mobile frame 5.

[0023] The limit baffle 12 is fixedly connected to the semiconductor packaging fixture base 1 through a fixed bracket 13, and the limit baffle 12 is fixedly connected to the fixed bracket 13 by bolts. The fixed bracket 13 is used to install and fix the limit baffle 12, and the limit baffle 12 is used to limit and position the movement of the front packaging movable frame 5 and the rear packaging movable frame 7; the height of the rear packaging movable frame 7 is twice the height of the front packaging movable frame 5, and the front packaging movable frame 5 and the rear packaging movable frame 7 are connected by sliding. The difference in height can make the rear packaging movable frame 7 and the front packaging movable frame 5 coordinate and alternate; the two sides of the lifting plate 9 are fixedly connected to the support plate 17 by a reset spring 11, and the middle position of the lifting plate 9 is slidably connected to the support plate 17 by a guide column 10, and the reset spring 11 is used to reset and adjust the position of the lifting plate 9.

[0024] Working principle: When in use, the unpackaged semiconductors are placed inside the first semiconductor positioning groove 6 and the second semiconductor positioning groove 8 respectively, and the packaging template 18 is pressed downward by the pressing mechanism to contract the reset spring 11, so that the packaging template 18 is embedded and merged with the second semiconductor positioning groove 8, and the packaging position is positioned. The semiconductor is packaged and processed using packaging equipment. After the packaging is completed, the packaging template 18 returns to its original position, and the circulating conveyor belt 4 is driven to rotate in the opposite direction by the forward and reverse drive motor 14, so that the front packaging movable frame 5 moves backward and the rear packaging movable frame 7 moves forward, and the positions of the first semiconductor positioning groove 6 and the second semiconductor positioning groove 8 are alternated. After the loading is completed, the packaged semiconductor in the second semiconductor positioning groove 8 can be taken out.

[0025] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A semiconductor packaging fixture, comprising a semiconductor packaging fixture base (1), characterized in that: A left half-end circulation adjustment seat (2) and a right half-end circulation adjustment seat (19) are respectively provided on both sides above the semiconductor packaging fixture seat (1); a front packaging movable frame (5) and a rear packaging movable frame (7) are respectively provided on both ends of the middle position above the semiconductor packaging fixture seat (1); a first semiconductor positioning groove (6) is provided on the top of the front packaging movable frame (5); a second semiconductor positioning groove (8) is provided on the top of the rear packaging movable frame (7); support plates (17) are provided on both sides of the rear end of the semiconductor packaging fixture seat (1); a lifting plate (9) is provided above the support plate (17); and the lifting plate (9) is provided on the top of the lifting plate (7). A packaging template (18) is provided inside the descending plate (9), a limit baffle (12) is provided at the middle position of the rear end of the semiconductor packaging fixture seat (1), a transverse partition (3) is provided at the middle position inside the left half-end circulation adjustment seat (2), guard plates (15) are provided at both ends above the transverse partition (3), a circulating conveyor belt (4) is provided above the transverse partition (3), transmission rollers (16) are provided at both ends inside the circulating conveyor belt (4), and the transmission rollers (16) are connected to the forward and reverse driving motors (14), and a vertical partition (20) is provided at the middle position inside the right half-end circulation adjustment seat (19).

2. The semiconductor packaging jig according to claim 1, wherein: One side of the rear packaging movable frame (7) is fixedly connected to the outer side surface of the circulating conveyor belt (4) by means of bolts, and the other side of the rear packaging movable frame (7) is slidably connected to the right half-end circulating adjustment seat (19) by means of a second guide slider (23) and a second slide groove (25), a second pulley (24) is provided at the bottom of the second guide slider (23), and the second pulley (24) is fixedly connected to the second guide slider (23) by means of threads.

3. The semiconductor packaging jig according to claim 1, wherein: One side of the front packaging movable frame (5) is fixedly connected to the inner side surface of the circulating conveyor belt (4) by means of bolts, and the other side of the front packaging movable frame (5) is slidably connected to the right half-end circulating adjustment seat (19) through a first guide slider (21) and a first slide groove (26), a first pulley (22) is provided at the bottom of the first slide groove (26), and the first pulley (22) is fixedly connected to the first slide groove (26) by means of threads.

4. The semiconductor packaging jig according to claim 1, wherein: The limiting baffle (12) is fixedly connected to the semiconductor packaging fixture seat (1) via a fixing bracket (13), and the limiting baffle (12) and the fixing bracket (13) are fixedly connected via bolts.

5. The semiconductor packaging jig according to claim 1, wherein: The height of the rear packaging movable frame (7) is twice the height of the front packaging movable frame (5), and the front packaging movable frame (5) and the rear packaging movable frame (7) are connected by sliding.

6. The semiconductor packaging jig according to claim 1, wherein: Both sides of the lifting plate (9) are fixedly connected to the support plate (17) via return springs (11), and the middle position of the lifting plate (9) is slidably connected to the support plate (17) via guide pillars (10).

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