Layered chip substrate, resin conveying structure and semiconductor packaging equipment

Abstract

The utility model belongs to the field of semiconductor packaging, and provides a layered chip substrate, a resin conveying structure and semiconductor packaging equipment, comprising a support frame on which a first mounting platform and a second mounting platform are arranged in a layered manner; the chip substrate loading mechanism is movably arranged on the first mounting platform; the resin loading mechanism is movably arranged on the second mounting platform, and the resin loading mechanism is used for carrying a resin tray; and the first lifting mechanism is arranged on the supporting frame, a first lifting platform is arranged on the first lifting mechanism, and the first lifting platform ascends and descends between the first mounting platform and the second mounting platform. According to the invention, the chip substrate loading mechanism and the resin loading mechanism are arranged in a staggered manner, and linkage is carried out through the first lifting mechanism, so that the supply of resin and the chip substrate can be transmitted between the lower mold and the upper mold of the press unit at the same time, and the packaging efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor chip substrate packaging, in particular to a layered chip substrate and resin delivery structure and semiconductor packaging equipment. Background Art

[0002] Over time, semiconductor technology has continued to advance, gradually developing more complex semiconductor devices such as integrated circuits and large-scale integrated circuits. These technological developments have greatly promoted progress in fields such as computers, communications, and medicine, making our lives more convenient and efficient.

[0003] Compression packaging of chip substrates is an essential step. Traditional chip substrate compression packaging equipment requires manual loading, resulting in low precision and increased risk. Furthermore, resin transfer in traditional equipment requires two separate conveyor mechanisms, operating on the same plane as the chip substrate. The first loading mechanism loads the substrate into the press and then exits the press area. The second loading mechanism then loads the resin into the press and exits, allowing the press to close the mold and pressurize the chip. This loading method wastes time, requiring the chip substrate transport mechanism to fully exit the press before resin transfer can begin. This results in a complex process and low production efficiency. Utility Model Content

[0004] The present invention provides a layered chip substrate and resin delivery structure that addresses the safety and precision issues inherent in traditional packaging equipment requiring manual loading, as well as the complex and inefficient process of transferring the chip substrate and resin into the press. Another aspect of the present invention is to provide a semiconductor packaging device.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A layered chip substrate and resin delivery structure comprising:

[0007] A support frame, on which a first mounting platform and a second mounting platform are provided, wherein the first mounting platform is arranged above the second mounting platform;

[0008] a chip substrate loading mechanism, movably disposed on the first mounting platform, for transporting chip substrates to be packaged and packaged, the chip substrate loading mechanism being capable of reciprocating linear movement on the first mounting platform;

[0009] a resin loading mechanism, movably disposed on the second mounting platform, the resin loading mechanism being used for transporting the resin tray and capable of reciprocating linear movement on the second mounting platform;

[0010] The first lifting mechanism is provided on the support frame. The first lifting mechanism is provided with a first lifting platform. The first lifting platform is lifted and moved between the first mounting platform and the second mounting platform.

[0011] In some embodiments, the chip substrate loading mechanism includes:

[0012] a first base capable of reciprocating linear movement along the first mounting platform;

[0013] a second movable layer, movably arranged relative to the first base, the second movable layer comprising a second movable substrate, and the second movable layer is movably arranged on the first base via the second movable substrate;

[0014] A first suction cup assembly is liftably disposed on the upper side of the second moving substrate, wherein the first suction cup assembly includes a plurality of first suction cups for fixing the chip substrate;

[0015] a first substrate clamping assembly, which is liftable and disposed on the upper side of the second movable substrate, the first substrate clamping assembly being spaced apart from the first suction cup assembly, and the first substrate clamping assembly being provided with a first substrate clamping claw for transporting an unpackaged chip substrate;

[0016] A second suction cup assembly is provided on the lower side of the second movable substrate, corresponding to the position of the first suction cup assembly, and the second suction cup assembly is provided with a plurality of second suction cups for sucking the packaged waste film;

[0017] The second tray clamping assembly is arranged on the lower side of the second movable substrate and corresponds to the position of the first substrate clamping assembly.

[0018] In some embodiments, a first moving layer is further included, the first moving layer includes the first translation substrate, the first translation substrate is movably set on the first base, and the second moving layer is movably set on the first moving layer through the second translation substrate, wherein the moving directions of the first moving layer and the second moving layer are consistent, and the moving direction of the first moving layer is perpendicular to the moving direction of the first base.

[0019] In some embodiments, the first substrate clamping assembly includes a second main lifting cylinder, a second lifting base, a second auxiliary lifting cylinder, and a first substrate clamping claw, wherein the second main lifting cylinder is disposed on the second translational substrate, the second lifting base is disposed on a free end of the second main lifting cylinder, the second auxiliary lifting cylinder is disposed on the second lifting base, and the first substrate clamping claw is disposed on a free end of the second auxiliary lifting cylinder;

[0020] The first substrate clamp includes a first substrate base arranged on the second sub-lifting cylinder, two first substrate rotating shafts that rotate relative to the first substrate base and are symmetrically arranged, a plurality of first substrate support claws arranged on the two first substrate rotating shafts, and two first substrate connecting rods arranged on the first substrate rotating shafts, one end of the two first substrate connecting rods is fixedly connected to the corresponding first substrate rotating shaft, and the other ends of the two first substrate connecting rods are movably connected so that the first substrate support claws located on the two first substrate rotating shafts can be opened and closed synchronously.

[0021] In some embodiments, the second tray clamping assembly includes a second upper base and a second lower base connected to each other from top to bottom, the second upper base is connected to the lower side of the second translation base plate, and the second lower base is provided with a second main clamping mechanism and a second auxiliary clamping mechanism;

[0022] The second main clamping mechanism includes two second main clamping links arranged parallel to each other, the second main clamping links are movably arranged on the second lower base, and both ends of the second main clamping links are provided with second main clamping claws that can be opened and closed;

[0023] The second secondary clamping mechanism includes two secondary movable seats arranged relative to the second lower base, and the secondary movable seats are provided with a first main clamping block that can be raised and lowered and a first secondary clamping block that is fixedly arranged;

[0024] The first main clamping block can be lifted and lowered relative to the first auxiliary clamping block, thereby realizing the opening and closing of the first main clamping block and the first auxiliary clamping block.

[0025] The two auxiliary movable seats can move away from or towards each other, thereby driving the first auxiliary clamping block to open and close.

[0026] In some embodiments, the resin loading mechanism comprises:

[0027] a third base capable of reciprocating linear movement on the second mounting platform;

[0028] a fourth movable layer, provided with a fourth movable substrate, wherein the fourth movable layer is movably arranged relative to the third base via the fourth movable substrate;

[0029] The pallet transport mechanism is provided on the fourth movable base plate, and the pallet transport mechanism has the same structure as the second pallet clamping assembly.

[0030] In some embodiments, it also includes a first transport guide rail, a first transport slider, a first spur rack, a first transport motor and a first driving gear, the first transport guide rail and the first spur rack are both arranged on the first mounting platform, the first transport guide rail and the first spur rack are parallel to each other, the first transport slider is arranged on the first transport guide rail, the first transport motor is arranged on the first base, the first base is arranged on the first transport slider, the first spur gear is arranged on the output shaft of the first transport motor, and the first spur gear is meshed with the first spur rack.

[0031] In some embodiments, it also includes a third guide rail, a third slider, a second spur rack, a third drive motor and a second gear, the third guide rail and the second spur rack are both arranged on the second mounting platform, the third guide rail and the second spur rack are parallel to each other, the third slider is arranged on the third guide rail, the third base is arranged on the third slider, the third drive motor is arranged on the third base, the second gear is arranged on the output shaft of the third drive motor, and the second gear is engaged with the second spur rack.

[0032] In some embodiments, the first lifting mechanism further includes a first base, a first lifting motor, a first lifting screw, a first lifting nut, a first lifting guide rail, a first lifting slider, and a first fixing block;

[0033] The first base is fixedly set on the support frame, the first lifting motor is set on the first base, the output end of the first lifting motor is connected to the first lifting screw, the first lifting nut is sleeved on the first lifting screw, the first lifting guide rail is set on the first base, the axial direction of the first lifting guide rail is parallel to the axial direction of the first lifting screw, the first fixed block connects the first lifting slider and the first lifting nut, and the first lifting platform is set on the first fixed block.

[0034] In some embodiments, the present invention further provides a fully automatic semiconductor packaging device, comprising a layered chip substrate and a resin delivery structure as described in any one of the above embodiments.

[0035] Compared with the prior art, the beneficial effects brought by the present invention are:

[0036] The present application arranges the chip substrate loading mechanism and the resin loading mechanism in staggered layers, and combines the first lifting mechanism to transfer the resin tray to the chip substrate loading mechanism, so that the chip substrate and the resin can enter the press unit for packaging at the same time, thereby improving the transmission efficiency of the chip substrate and the resin, eliminating the need to give way and wait, and further improving the chip substrate packaging efficiency.

[0037] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 This is a first stereoscopic view of a layered chip substrate and resin delivery structure of the present invention;

[0039] Figure 2 This is a schematic diagram of a resin loading mechanism of a layered chip substrate and resin delivery structure located at a first lifting mechanism of the present invention;

[0040] Figure 3 This is a second perspective view of a layered chip substrate and resin delivery structure of the present invention;

[0041] Figure 4 A three-dimensional diagram of the chip substrate loading mechanism of the present invention;

[0042] Figure 5 This is a first perspective view of the chip substrate loading mechanism of the present invention in an extended state;

[0043] Figure 6 This is a second perspective view of the chip substrate loading mechanism of the present invention in an extended state;

[0044] Figure 7 It is a top view of the chip substrate loading mechanism of the present invention;

[0045] Figure 8 for Figure 7 Cross-sectional view at GG in the middle;

[0046] Figure 9 for Figure 7 Cross-sectional view at EE;

[0047] Figure 10 for Figure 7 Cross-sectional view at FF;

[0048] Figure 11 This is an exploded view of the first substrate clamping assembly of the chip substrate loading mechanism of the present invention;

[0049] Figure 12 A perspective view of the second tray clamping assembly of the chip substrate loading mechanism of the present invention;

[0050] Figure 13 This is an exploded view of the second tray clamping assembly of the chip substrate loading mechanism of the present invention;

[0051] Figure 14A perspective view of the resin loading mechanism of the present invention;

[0052] Figure 15 It is a top view of the resin loading mechanism of the present invention;

[0053] Figure 16 This is an exploded view of the resin loading mechanism of the present invention;

[0054] Figure 17 This is an exploded view of the first substrate clamp of the present invention;

[0055] Figure 18 for Figure 16 A structural diagram from another perspective;

[0056] Figure 19 for Figure 15 Cross-sectional view of middle HH; DETAILED DESCRIPTION

[0057] The present application is further described in detail below with reference to the accompanying drawings. In the description of this embodiment, unless otherwise specified, the terms "left" and "right" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present application and simplify the description. They do not indicate or imply that the present application must have a specific direction, be constructed, or operate in a specific direction. Therefore, they should not be construed as limiting the present application.

[0058] In one embodiment, Figure 1-3 As shown, a layered chip substrate and resin delivery structure provided by the present invention mainly includes a support frame 100, on which a first mounting platform 101 and a second mounting platform 101 are provided. The first mounting platform 101 and the second mounting platform 102 are staggered, and the first mounting platform 101 is located above the second mounting platform 102;

[0059] The chip substrate loading mechanism 400 is movably arranged on the first mounting platform 101 and is used for transporting unpackaged chip substrates and packaged chip substrates. The chip substrate loading mechanism 400 can move back and forth linearly on the first mounting platform 101. Specifically, in this embodiment, Figure 3 As shown, two parallel first transport guide rails 1015 are provided on the first mounting platform 101, and a first straight rack 1016 is provided between the two parallel first transport guide rails 1015. The first straight rack 1016 is parallel to the first transport guide rail 1015. Figure 4-5As shown, a first transport motor 4011 is provided on the chip substrate loading mechanism 400, and a first driving gear 40111 is provided at the output end of the first transport motor 4011, and the first driving gear 40111 is engaged with the first straight rack 1016. At least two first transport sliders 4012 are provided on the chip substrate loading mechanism 400, and the two first transport sliders 4012 are located on different first transport guide rails 1015. The chip substrate loading mechanism 400 is slidably provided on the first mounting platform 101 through the first transport sliders 4012. The forward and reverse rotation of the first transport motor 4011 drives the forward and reverse rotation of the first driving gear 40111. Combined with the first transport guide rail 1015 and the first transport slider 4012, the chip substrate transport mechanism 400 can achieve reciprocating linear movement on the first mounting platform 102. Optionally, the transmission structure of the first driving gear 40111 and the first straight rack 1016 can also be replaced by a combination structure of synchronous wheels and synchronous belts, or a screw slider structure for transmission. It can be known that the driving structure and power type of the chip substrate loading mechanism 400 are not limited by the present invention, and the purpose is to drive the chip substrate loading mechanism 400 to perform reciprocating linear movement on the first mounting platform 101.

[0060] The resin loading mechanism 800 is movably mounted on the second mounting platform 102 and is capable of reciprocating linear movement on the second mounting platform 102. The resin loading mechanism 800 is primarily used to transport resin trays that have been coated with resin, as well as to transport empty resin trays 40344 after encapsulation. The second mounting platform 102 is positioned below the first mounting platform 101, with a predetermined spacing therebetween, thereby providing space for the resin loading mechanism 800 to move.

[0061] like Figure 3-4 As shown, the first lifting mechanism 700 is arranged on the support frame 100, and part of the resin loading mechanism 800 can be moved to the top of the first lifting mechanism 700, thereby driving the resin tray 40344 to move the resin tray 40344 to the first lifting mechanism 700. Through the lifting of the first lifting mechanism 700, the resin tray 40344 with resin is driven to move to the bottom of the chip substrate loading mechanism 400. The chip substrate loading mechanism 400 grabs the resin tray 40344, and then can be moved between the press units through the partial structure of the chip substrate loading mechanism 400, thereby completing the resin transportation.

[0062] Specifically, as shown in Figure 3, the first lifting mechanism 700 mainly includes a first lifting platform 706, a first base 707, a first lifting motor 701, a first lifting screw rod 703, a first lifting nut, a first lifting guide rail 704, a first lifting slider 705 and a first fixed block 702. The first base 707 is fixedly set on the support frame 100, the first lifting motor 701 is set on the first base 107, the output end of the first lifting motor 701 is connected to the first lifting screw rod 703, driving the first lifting screw rod 703 to rotate forward and reverse, the first lifting nut is sleeved on the first lifting screw rod 703, and the first lifting guide rail 704 is set on the first base 707. The axial direction of the first lifting guide rail 704 is parallel to the axial direction of the first lifting screw rod 703, so that the first lifting platform 706 can perform stable lifting and lowering movements. The first lifting slider 705 is disposed on the first lifting guide rail 704 , the first fixing block 702 connects the first lifting nut and the first lifting slider 705 , and the first lifting platform 706 is fixedly disposed on the first fixing block 706 .

[0063] The first lifting nut is raised and lowered by the forward and reverse rotation of the first lifting screw 703. A loading position for the resin tray 40344 is provided on the first lifting platform 706. Optionally, the transmission structure between the first lifting screw 703 and the first lifting nut can be replaced by a synchronous belt and synchronous pulley structure, that is, the synchronous belt is fixedly connected to the first fixed block 702. Optionally, the transmission structure between the first lifting screw 703 and the first lifting nut can also be a telescopic structure of a cylinder, with the first lifting platform 706 connected to the free end of the cylinder's push rod.

[0064] The present application sets up a first lifting platform 706 to provide a transfer for the resin tray 40344, thereby meeting the layered transportation of the chip substrate loading mechanism 400 and the resin loading mechanism 800, so that the operation of the resin and the chip substrate do not interfere with each other, thereby improving the transportation efficiency of the chip substrate and the resin. At the same time, it can also combine with the chip substrate loading mechanism 400 to transport the unpackaged chip substrate and the resin tray 40344 covered with resin at the same time, without the need to transport the resin and the chip substrate twice, saving time and improving packaging efficiency.

[0065] In one embodiment, Figure 4 、 Figure 5 as well as Figure 6 As shown, the chip substrate loading mechanism 400 includes a first base 401 that can move back and forth linearly along a first mounting platform, a first movable layer that moves relative to the first base 401, and a second movable layer that moves relative to the first movable layer, wherein the moving direction of the first base 401 is perpendicular to the moving direction of the first movable layer, and the moving direction of the second movable layer is parallel to the moving direction of the first movable layer, so that the second movable layer can extend between the upper mold and the lower mold of the press unit.

[0066] Specifically, if Figure 4 As shown, the chip substrate loading mechanism 400 includes a structure that can move back and forth linearly along the first mounting platform 101. The first transport motor 4011 is provided on the first base, and the first transport slider 4012 is fixedly connected to the first base 401. The details are not described in detail here.

[0067] The first moving layer includes a first moving base plate 402 and two first moving side plates 4024. The two first moving side plates 4024 are arranged in parallel and opposite to each other and are both arranged vertically on the first translation base plate 402. Two parallel first substrate translation guide rails 4015 are arranged on the first base 401. A first substrate translation slider 40151 is arranged on the first substrate translation guide rails 4015. The first moving base plate 402 of the first moving layer is arranged on the first substrate translation slider 40151. A first substrate translation motor 4013 is also arranged on the first base 401, which rotates the first substrate translation motor 4013 arranged on the first base 401 through a bearing. A substrate translation screw rod 4014, and a first substrate translation nut 40141 arranged on the first substrate translation screw rod 4014, the first substrate translation nut 40141 is connected to the first moving layer 402, and the axial direction of the first substrate translation screw rod 4014 is consistent with the axial direction of the first substrate translation guide rail 4015, the output end of the first substrate translation motor 4013 and the first substrate translation screw rod 4014 are connected in transmission. In this embodiment, the power connection is achieved through a synchronous wheel and a synchronous belt. Optionally, a direct connection can also be achieved through a coupling; or the power connection can be achieved by gear meshing.

[0068] Second substrate translation guide rails 4023 parallel to each other are provided on the two first movable side plates 4024, a second substrate translation slider 40231 is provided on the second substrate translation guide rails 4023, the second movable substrate 403 is fixedly connected to the second substrate translation slider 40231, a second substrate translation motor 4021 is provided on the first movable substrate 402, a first movable shaft 4022 rotating through a bearing is provided on the two first movable side plates 4024, a first translation synchronous pulley 40221 is provided on the first movable shaft 4022, and a first movable shaft 4022 is provided on the first movable side plate 402. 4, a second translation synchronous pulley 40223 is provided on the second movable base plate 402. The first translation synchronous belt 40222 is arranged parallel to the second base plate translation guide rail 4023. The first translation synchronous belt 40222 is wound around the first translation synchronous pulley 40221 and the second translation synchronous pulley 40223. A second fixing clamp 40224 is provided on the second movable base plate 402 and fixedly connected to the first translation synchronous belt 40222. The second base plate translation motor 4021 is driven by the synchronous belt and synchronous pulley assembly, thereby driving the first transmission shaft 4022 to rotate. In this embodiment, to ensure faster response of the second movable base plate and prevent power jams, the second fixing clamp 40224, the first translation synchronous belt 40222, the first translation synchronous pulley 40221, and the second translation synchronous pulley 40223 are symmetrically arranged about a radial plane located at the center of the first movable shaft 4022.

[0069] Optionally, the second substrate translation motor 4021 and the first movable shaft 4022 may be connected to each other through gear meshing, or the output shaft of the second substrate translation motor 4021 may be directly connected to the first movable shaft 4022 through a coupling.

[0070] Furthermore, the second movable layer includes a first suction cup assembly 4031 and a first substrate clamping assembly 4032 which are arranged above the second movable layer and can be lifted and lowered. The first suction cup assembly 4031 is arranged close to the press unit, and the first substrate clamping assembly 4032 is arranged away from the press unit.

[0071] Specifically, if Figure 7-8As shown, the first suction cup assembly 4031 includes a first lifting base 40313, four first guide shafts 4035 are provided on the first lifting base 40313, and four matching first guide sleeves are provided on the second movable base. The first guide shaft 4035 is movably inserted into the first guide sleeve. At the same time, a first main lifting cylinder 40314 is provided on the second movable base 402. The fixed end of the first main lifting cylinder 40314 is fixed on the second movable base 403, and the free end of the first main lifting cylinder 40314 is fixed under the first lifting base 40313 to drive the first lifting base 40313 to move up and down. The first suction cup assembly 4031 also includes a plurality of first suction cups 40312 distributed at intervals. The first suction cups 40312 are connected to the negative pressure mechanism to grab and adsorb and fix the plastic-sealed finished chip substrate. Furthermore, the first suction cup assembly 4031 also includes a first adsorption support 40311. A plurality of first suction cups 40312 are provided on the first adsorption support 40311. Figure 8-9 As shown, the first suction support 40311 is movable relative to the first lifting base 40313. Specifically, the first suction support 40311 is connected to two first secondary guide shafts 403152 and a first secondary guide sleeve 403151 disposed on the first lifting base 40313. The first secondary guide shafts 403152 are movably inserted through the first secondary guide sleeve 403151. A first secondary lifting cylinder 40315 is disposed between the first suction support 40311 and the first lifting base 40313. The first secondary lifting cylinder 40315 is fixed to the first lifting base 40313, and the free end of the first secondary lifting cylinder 40315 is connected to the first suction support 40311. In this embodiment, two first suction cup assemblies 4031 are provided, both disposed on the first lifting base 40313, so that two packaged chip substrates can be simultaneously sucked.

[0072] like Figure 8 、 Figure 10As shown, the first substrate clamping assembly 4032 includes a second lifting base 40322, a first substrate clamping claw 40321 arranged on the second lifting base 40322, four guide sleeves are arranged on the second movable base 403, four matching second guide shafts 4036 are arranged on the second lifting base 40322, and a second main lifting cylinder 40324 is arranged on the second movable base 403. The free end of the second main lifting cylinder 40324 is connected to the second lifting base 40322, driving the second lifting base 40322 to move up and down. Furthermore, a second auxiliary lifting cylinder 40325 is provided on the second lifting base 40322, and the free end of the second auxiliary lifting cylinder 40325 is connected to the first substrate clamp 40321. At the same time, in order to further stabilize the structure, a second auxiliary guide sleeve 403251 is provided on the second lifting base 40322, and a second auxiliary guide shaft 403252 is provided in the second auxiliary guide sleeve 403251, and one end of the second auxiliary guide shaft 403252 is connected to the first substrate clamp 40321.

[0073] Specifically, if Figure 17 As shown, the first substrate clamping jaw 40321 also includes a first substrate base 403214 and two first substrate rotating shafts 403213 rotatably arranged relative to the first substrate base 403214. When a chip substrate is clamped on the first substrate clamping jaw, the positions of the two first substrate rotating shafts 403212 are symmetrically arranged with respect to the chip substrate. One of the first substrate rotating shafts 403212 is segmented to form a clearance space to facilitate the installation of the positioning assembly. Both ends of the first substrate rotating shaft 403212 are movably connected by two first substrate connecting rods 403213, thereby realizing the synchronous opening and closing of the first substrate supporting claws 403211 on the two first substrate rotating shafts 403212. In this embodiment, the two first substrate rotating shafts 403212 are both rotatably arranged on the second lifting base 40322. Optionally, the two first substrate rotating shafts 403212 can also be rotatably arranged on the first substrate base 403214.

[0074] Furthermore, the first substrate clamp 40321 also includes a first substrate rocker. In this embodiment, the first substrate rocker is arranged into an integrated structure with one of the above-mentioned first substrate connecting rods 403213. One end of the first substrate rocker is movably connected to the first claw cylinder, and the other end is fixedly connected to the first substrate rotating shaft 403212. The rotation of the first substrate rocker drives the rotation of the first substrate rotating shaft 403212.

[0075] Furthermore, a plurality of first making way notches 403215 are provided on the first substrate base 403214 to make way for the clamping claws for clamping the chip substrate when the chip substrate is placed.

[0076] In the present application, the first substrate clamps 40321 are divided into two groups, which can grasp two chip substrates at the same time. In order to reduce the driving device, a power connecting rod is set between the two first rockers 30233 of the two first substrate clamps 40321. The power connecting rod is connected to the free end of the cylinder to synchronize the opening and closing of the two first substrate clamps 40321. Optionally, the first transport clamp 3023 can also be driven by an independent driving cylinder.

[0077] like Figure 8 、 Figure 9 As shown, a second tray clamping assembly 4034 and a second suction cup assembly 4033 are provided under the second movable substrate 403. The second suction cup assembly 4033 is arranged close to one side of the press unit, and the second tray clamping assembly 4034 is arranged away from the one side of the press unit. In this embodiment, the second suction cup assembly 4033 corresponds to the position of the first suction cup assembly 4031, and the second tray clamping assembly 4034 corresponds to the position of the first substrate clamping assembly 4032, that is, when the first suction cup 40312 can adsorb and fix the finished chip substrate, the second suction cup 40331 can adsorb the waste film without horizontal movement. When the first substrate clamping claw 40321 can transport the unpackaged chip substrate to the upper mold of the press unit by lifting, at this time, the second tray clamping assembly 4034 can place the resin tray 40344 carrying resin and film onto the lower mold of the press unit for resin delivery.

[0078] Specifically, the second suction cup assembly 4033 includes a plurality of second suction cups 40331 . The structure, distribution, and principle of the plurality of second suction cups 40331 are the same as those of the first suction cup 40312 , as described above, and will not be further elaborated here.

[0079] like Figure 13 As shown, the second tray clamping assembly 4034 includes a second clamping base, which includes a second upper base 40341 ​​and a second lower base 40342 fixedly connected to each other from top to bottom, with a preset distance between the second upper base 40341 ​​and the second lower base 40342. The second upper base 40341 ​​is fixedly connected to the second movable base 403. The second tray clamping assembly 4034 also includes a second main clamping mechanism and a second auxiliary clamping mechanism, the specific mechanisms of which are as follows;

[0080] like Figure 13As shown, the second main clamping mechanism includes four second main clamping jaws 403424, two second main clamping connecting rods 403423 arranged in parallel with each other, a main clamping cylinder 403433 with two opening and closing free ends, and the two free ends can move back or towards each other at the same time to realize the opening and closing of the second main clamping jaws 303424; two main clamping push rods 403422, wherein the four second main clamping jaws 403424 are divided into two groups, each group is fixedly arranged at the two ends of the second main clamping connecting rod 403423, and the second main clamping jaws 403424 are connected to the resin The main clamping cylinder 403433 is fixed on the second lower base 40342, and the two main clamping push rods 403422 are respectively fixed on the two opening and closing free ends of the main clamping cylinder 403433. The two free ends of the main clamping cylinder 403433 move toward or away from each other, driving the four second main clamping jaws 403424 to open and close, thereby grabbing or putting down the resin tray 40344. In this embodiment, the second main clamping jaw 403424 is an L-shaped hook.

[0081] Furthermore, four second main guide rails 403426 are arranged on the second lower base 40342, and four corresponding second main sliders 403425 are arranged on the four second main guide rails 403426. The axial direction of the second main guide rails 403426 is consistent with the opening and closing direction of the free end of the main clamping cylinder 403433. The four second main sliders 403425 are respectively fixed at the two ends of the corresponding two main clamping connecting rods 403423, thereby supporting the second main clamping connecting rods 403423.

[0082] Alternatively, as Figure 12As shown, the second main clamping jaw 403424 can also be set as a rotating structure, and two parallel second main clamping connecting rods 403434 are rotatably set on the second lower base 40342. Specifically, four rotating brackets 403435 are set on the second lower base 40342, and the second main clamping connecting rod 403434 is rotatably set on the four rotating brackets 403425 through bearings. A second main clamping rocker 403436 is set between the two free ends of the main clamping cylinder 403433 and the corresponding two second main clamping connecting rods 403434, and one end of the second main clamping rocker 403436 is fixedly connected to the second main clamping connecting rod 40344. The other end of the clamping rocker 403436 is movably connected to a free end of the main clamping cylinder 403433. For example, a first connecting rod having a first connecting notch in an elongated structure is provided. One end of the first connecting rod is movably connected to a free end of the main clamping cylinder 403433. The end of the first connecting rod with the first connecting notch is positioned away from the second lower base 40342, so that the first connecting notch compensates for vertical movement of the first connecting rod to avoid motion interference. The first connecting notch can be a rectangular or U-shaped structure, so that the openable free end of the main clamping cylinder 403433 drives the second main clamping jaw 403424 to rotate. For example, when the two free ends of the main clamping cylinder 403433 are open and separated, the second main clamping jaw 403424 is not engaged with the resin tray 40344. When the two free ends of the main clamping cylinder 403433 are closed and brought closer together, the second main clamping jaw 403424 engages and abuts the clamping groove 403441 of the resin tray.

[0083] like Figure 13As shown, the second secondary clamping mechanism includes a secondary clamping cylinder 403421, which is provided with two free ends that can move toward or away from each other, a secondary moving seat 403428 provided at the free end of the secondary clamping cylinder 403421, and a first secondary clamping block 403431 provided on the secondary moving seat 403428. The first secondary clamping block 403431 can clamp and cover one side of the resin tray 40344, and a first main clamping block 403430 that can be lifted and lowered is provided on the secondary moving seat 403428. Specifically, A second lifting cylinder 403429 is provided on the movable base 403428. The free end of the second lifting cylinder 403429 is connected to the first main clamping block 403430. By raising and lowering the first main clamping block 403430, the first auxiliary clamping block 403431 is closed and opened, thereby clamping and securing the film. The auxiliary clamping cylinder 403421 is then used to move the auxiliary movable base 403428 closer together, thereby securing the edge of the film loaded with resin, thereby securing the film relative to the resin tray 40344. In this embodiment, the auxiliary movable base 403428, the first auxiliary clamping block 40341, the first main clamping block 40340, and the second lifting cylinder 403429 are each provided in two groups, symmetrically arranged about the second upper base 40341, thereby clamping and securing the film at the edge of the resin tray 40344, ensuring that the resin tray 40344 and the film move synchronously.

[0084] Furthermore, a second secondary guide rail 403411 is provided on the second upper base 40341, and a second secondary slider 403432 is provided on the second secondary guide rail 403411. The second secondary slider 403432 is connected to the secondary movable seat 403428, thereby providing support for the secondary movable seat 403428. The axial direction of the second secondary guide rail 403411 is consistent with the opening and closing movement direction of the free end of the secondary clamp cylinder 403421.

[0085] In this embodiment, Figure 13 As shown, the first auxiliary clamping block 403431 and the first main clamping block 403430 are located on two opposite sides of the resin tray 40344 , and the second main clamping jaw 403424 is located on the other two opposite sides of the resin tray 40344 .

[0086] In one embodiment, Figure 14 、 Figure 15 As shown, the resin loading mechanism 800 includes a third base 801, a third movable layer and a fourth movable layer, wherein the third base 801 is slidably arranged on the second mounting platform 102, the third movable layer can extend to one side relative to the third base 801, and the fourth movable layer can extend to one side relative to the third movable layer, and is consistent with the extending direction of the third movable layer.

[0087] Specifically, refer again to Figure 1A third guide rail 1025 is provided on the second mounting platform 101, a third slider 8013 is provided on the third guide rail 1025, and the third base 801 is fixedly connected to the third slider 8013. In this embodiment, there are two third guide rails 1025, and they are arranged in parallel. A second straight rack 1026 is provided between the two parallel third guide rails 1025. The second straight rack 1026 is parallel to the third guide rail 1025. Figure 14 As shown, a third drive motor 8011 is provided on the third base 801, and a second gear 8012 is provided on the output shaft of the third drive motor 8011. The second gear 8012 is engaged with the second spur rack 1026. In this embodiment, the second spur rack 1026 and the first spur rack 1016 are installed in the same direction.

[0088] Optionally, the transmission structure of the second spur rack 1026 and the second gear 8012 can also be set as a transmission structure of a screw nut, and the nut is connected to the third slider 8013 for limiting, thereby realizing reciprocating linear movement; optionally, the transmission structure of the second spur rack 1026 and the second gear 8012 can also be a cylinder push rod structure, or a synchronous wheel and synchronous belt structure.

[0089] Furthermore, if Figure 16 and Figure 18 As shown, the third moving layer includes a third moving base plate 802, which is slidably arranged on the third base 801, and a fourth driving motor 8021 is provided on the third moving base plate 801. The output shaft of the fourth driving motor 8021 is connected to a fourth active pulley 8022, and a rotating fourth driven pulley 8024 is provided on the third moving base plate 802, and the two are connected by a fourth synchronous belt 8025; two parallel fourth guide rails 8013 are provided on the third base 801, and a fourth slider 8023 is provided on the fourth guide rail 8013. The third moving base plate 802 is fixedly arranged on the fourth slider 8023, wherein a third connecting block 8014 is provided on the third base 801, and the third connecting block 8014 is fixedly connected to the fourth synchronous belt 8025, thereby driving the third moving base plate 802 to move relative to the third base 801;

[0090] Furthermore, if Figure 19 As shown, the fourth moving layer includes a fourth moving base plate 803, on which a tray transport mechanism 8031 ​​is provided for transporting an empty resin tray 80344 or a resin tray 80344 with a film and resin. Two parallel fifth guide rails 8026 are provided on the third moving base plate 802, on which a fifth slider 8032 is provided. The fourth moving base plate 803 is fixedly provided on the fifth slider 8032. In this embodiment, in order to reduce the number of driving devices, such as Figure 18 and Figure 19 As shown, a fourth connecting block 8033 is provided on the fourth movable base plate 803, and the fourth connecting block 8033 is fixedly connected to the fourth synchronous belt 8025. In the initial position, the third connecting block 8014 is close to the fourth driven pulley 8024, and the fourth connecting block 8033 is close to the fourth driving pulley 8022. When the fourth drive motor 8021 rotates, it drives the third and fourth movable layers to move relative to the third connecting block 8014 on the third base 801. At the same time, since the fourth connecting block 8033 is fixedly connected to the fourth synchronous belt 8025, and the fourth connecting block 8033 is fixedly connected to the fourth movable base plate 803, the fourth movable base plate 803 moves synchronously with the third movable base plate 802. It should be noted that the structure and principle of the pallet transport mechanism 8031 ​​and the second pallet clamping assembly 4034 are the same as mentioned above, and no further details will be given here. Optionally, the fourth movable base plate 803 may also be driven by a separate driving device, such as a motor-screw-slider structure, a motor combined with a synchronous wheel and synchronous belt structure, or a cylinder structure with a push rod.

[0091] In one embodiment, the present invention further provides a semiconductor packaging device, comprising the layered chip substrate and the resin delivery structure in the above embodiments.

[0092] The above is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention. Such improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A layered chip substrate and resin delivery structure, characterized in that, include: A support frame, on which a first mounting platform and a second mounting platform are provided, wherein the first mounting platform is arranged above the second mounting platform; a chip substrate loading mechanism, movably disposed on the first mounting platform, for transporting chip substrates to be packaged and packaged, the chip substrate loading mechanism being capable of reciprocating linear movement on the first mounting platform; a resin loading mechanism, movably disposed on the second mounting platform, the resin loading mechanism being used for transporting the resin tray and capable of reciprocating linear movement on the second mounting platform; The first lifting mechanism is provided on the support frame. The first lifting mechanism is provided with a first lifting platform. The first lifting platform is lifted and moved between the first mounting platform and the second mounting platform.

2. A layered chip substrate and resin delivery structure according to claim 1, characterized in that: The chip substrate loading mechanism comprises: A first base capable of reciprocating linear movement along the first mounting platform; a second movable layer, movably arranged relative to the first base, the second movable layer comprising a second movable substrate, and the second movable layer is movably arranged on the first base via the second movable substrate; A first suction cup assembly is liftably disposed on the upper side of the second moving substrate, wherein the first suction cup assembly includes a plurality of first suction cups for fixing the chip substrate; a first substrate clamping assembly, which is liftable and disposed on the upper side of the second movable substrate, the first substrate clamping assembly being spaced apart from the first suction cup assembly, and the first substrate clamping assembly being provided with a first substrate clamping claw for transporting an unpackaged chip substrate; A second suction cup assembly is provided on the lower side of the second movable substrate, corresponding to the position of the first suction cup assembly, and the second suction cup assembly is provided with a plurality of second suction cups for sucking the packaged waste film; The second tray clamping assembly is arranged on the lower side of the second movable substrate and corresponds to the position of the first substrate clamping assembly.

3. A layered chip substrate and resin delivery structure according to claim 2, characterized in that: It also includes a first moving layer, the first moving layer includes a first translation substrate, the first translation substrate is movably set on the first base, and the second moving layer is movably set on the first moving layer through the second translation substrate, wherein the moving directions of the first moving layer and the second moving layer are consistent, and the moving direction of the first moving layer is perpendicular to the moving direction of the first base.

4. A layered chip substrate and resin delivery structure according to claim 3, characterized in that: The first substrate clamping assembly includes a second main lifting cylinder, a second lifting base, a second auxiliary lifting cylinder, and a first substrate clamping claw, the second main lifting cylinder being arranged on the second translational substrate, the second lifting base being arranged on the free end of the second main lifting cylinder, the second auxiliary lifting cylinder being arranged on the second lifting base, and the first substrate clamping claw being arranged on the free end of the second auxiliary lifting cylinder; The first substrate clamp includes a first substrate base arranged on the second sub-lifting cylinder, two first substrate rotating shafts that rotate relative to the first substrate base and are symmetrically arranged, a plurality of first substrate support claws arranged on the two first substrate rotating shafts, and two first substrate connecting rods arranged on the first substrate rotating shafts, one end of the two first substrate connecting rods is fixedly connected to the corresponding first substrate rotating shaft, and the other ends of the two first substrate connecting rods are movably connected so that the first substrate support claws located on the two first substrate rotating shafts can be opened and closed synchronously.

5. A layered chip substrate and resin delivery structure according to claim 3, characterized in that: The second tray clamping assembly includes a second upper base and a second lower base connected to each other from top to bottom, the second upper base is connected to the lower side of the second translation base plate, and the second lower base is provided with a second main clamping mechanism and a second auxiliary clamping mechanism; The second main clamping mechanism includes two second main clamping links arranged parallel to each other, the second main clamping links are movably arranged on the second lower base, and both ends of the second main clamping links are provided with second main clamping claws that can be opened and closed; The second secondary clamping mechanism includes two secondary movable seats arranged relative to the second lower base, and the secondary movable seats are provided with a first main clamping block that can be raised and lowered and a first secondary clamping block that is fixedly arranged; The first main clamping block can be lifted and lowered relative to the first auxiliary clamping block, thereby realizing the opening and closing of the first main clamping block and the first auxiliary clamping block. The two auxiliary movable seats can move away from or towards each other, thereby driving the first auxiliary clamping block to open and close.

6. A layered chip substrate and resin delivery structure according to claim 5, characterized in that: The resin loading mechanism comprises: a third base capable of reciprocating linear movement on the second mounting platform; a fourth movable layer, provided with a fourth movable substrate, wherein the fourth movable layer is movably arranged relative to the third base via the fourth movable substrate; The pallet transport mechanism is provided on the fourth movable base plate, and the pallet transport mechanism has the same structure as the second pallet clamping assembly.

7. A layered chip substrate and resin delivery structure according to claim 2, characterized in that: It also includes a first transport guide rail, a first transport slider, a first spur rack, a first transport motor and a first driving gear. The first transport guide rail and the first spur rack are both arranged on the first mounting platform. The first transport guide rail and the first spur rack are parallel to each other. The first transport slider is arranged on the first transport guide rail, the first transport motor is arranged on the first base, the first base is arranged on the first transport slider, the first spur gear is arranged on the output shaft of the first transport motor, and the first spur gear is meshed with the first spur rack.

8. The layered chip substrate and resin delivery structure according to claim 6, wherein: It also includes a third guide rail, a third slider, a second spur rack, a third drive motor and a second gear. The third guide rail and the second spur rack are both arranged on the second mounting platform. The third guide rail and the second spur rack are parallel to each other. The third slider is arranged on the third guide rail, the third base is arranged on the third slider, the third drive motor is arranged on the third base, the second gear is arranged on the output shaft of the third drive motor, and the second gear is engaged with the second spur rack.

9. The layered chip substrate and resin delivery structure according to claim 1, wherein: The first lifting mechanism further includes a first base, a first lifting motor, a first lifting screw, a first lifting nut, a first lifting guide rail, a first lifting slider and a first fixing block; The first base is fixedly set on the support frame, the first lifting motor is set on the first base, the output end of the first lifting motor is connected to the first lifting screw, the first lifting nut is sleeved on the first lifting screw, the first lifting guide rail is set on the first base, the axial direction of the first lifting guide rail is parallel to the axial direction of the first lifting screw, the first fixed block connects the first lifting slider and the first lifting nut, and the first lifting platform is set on the first fixed block.

10. A semiconductor packaging device, characterized in that: The invention comprises a layered chip substrate and a resin delivery structure as claimed in any one of claims 1 to 9.

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