Novel chip substrate loading mechanism and semiconductor packaging equipment

Abstract

The utility model provides a novel chip substrate loading mechanism and semiconductor packaging equipment, which mainly comprises a first base which does reciprocating linear movement, a second moving layer which moves relative to the first base, and a first sucking disc assembly, a first substrate clamping assembly, a second sucking disc assembly and a second tray clamping assembly which are arranged on the second moving layer, the first suction cup assembly and the first substrate clamping assembly are arranged on the same side, the second suction cup assembly and the second tray clamping assembly are arranged on the same side, the first suction cup assembly corresponds to the second suction cup assembly in position, the first substrate clamping assembly corresponds to the second tray clamping assembly in position, and a packaged chip substrate is adsorbed and fixed through the first suction cup assembly. The second suction cup assembly adsorbs a waste film, meanwhile, the first substrate clamping assembly provides an unpackaged chip substrate, the second tray clamping assembly conveys resin, the resin and the chip substrate can be conveyed to the position between a lower mold and an upper mold of the press unit at the same time through secondary stretching of a second moving layer, and the packaging efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor chip substrate packaging, in particular to a novel chip substrate loading mechanism and conductor packaging equipment. Background Art

[0002] Over time, semiconductor technology has continued to advance, gradually developing more complex semiconductor devices such as integrated circuits and large-scale integrated circuits. These technological developments have greatly promoted progress in fields such as computers, communications, and medicine, making our lives more convenient and efficient.

[0003] Compression packaging of chip substrates is an essential step. Traditional chip substrate compression packaging equipment requires manual loading, resulting in low precision and increased risk. Furthermore, resin transfer in traditional equipment requires two separate conveyor mechanisms, operating on the same plane as the chip substrate. The first loading mechanism loads the substrate into the press and then exits the press area. The second loading mechanism then loads the resin into the press and exits, allowing the press to close the mold and pressurize the chip. This loading method wastes time, requiring the chip substrate transport mechanism to fully exit the press before resin transfer can begin. This results in a complex process and low production efficiency. Utility Model Content

[0004] The utility model provides a novel chip substrate loading mechanism, which solves the problem in the above technical background that the resin and the chip substrate of the traditional packaging equipment cannot be fed into the press unit at the same time, resulting in low packaging efficiency.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A novel chip substrate loading mechanism, comprising:

[0007] The first base is capable of reciprocating linear movement;

[0008] a second movable layer, movably arranged relative to the first base, the second movable layer comprising a second movable substrate, and the second movable layer is movably arranged on the first base via the second movable substrate;

[0009] A first suction cup assembly is liftably disposed on the upper side of the second moving substrate, wherein the first suction cup assembly includes a plurality of first suction cups for fixing the chip substrate;

[0010] a first substrate clamping assembly, which is movable and disposed on the upper side of the second movable substrate, the first substrate clamping assembly being spaced apart from the first suction cup assembly, and the first substrate clamping assembly being used as a first substrate clamping claw for transporting unpackaged chip substrates;

[0011] A second suction cup assembly is provided on the lower side of the second movable substrate, corresponding to the position of the first suction cup assembly, and the second suction cup assembly is provided with a plurality of second suction cups for sucking the packaged waste film;

[0012] The second tray clamping assembly is arranged on the lower side of the second movable substrate and corresponds to the position of the first substrate clamping assembly.

[0013] In some embodiments, a first moving layer is further included, the first moving layer includes the first translation substrate, the first translation substrate is movably set on the first base, the second moving layer is provided with a second translation substrate, and the second moving layer is movably set on the first moving layer through the second translation substrate, wherein the moving directions of the first moving layer and the second moving layer are consistent, and the moving direction of the first moving layer is perpendicular to the moving direction of the first base.

[0014] In some embodiments, it also includes a first driving component arranged on the first substrate, the first driving component includes a first substrate translation motor, a first transmission component, a first substrate translation guide rail and a first substrate translation slider, the first substrate translation motor is arranged on the first base, the first substrate translation guide rail is arranged on the first base, the first substrate translation slider is arranged on the first substrate translation guide rail, and the first translation substrate is arranged on the first substrate translation slider, wherein the output end of the first substrate translation motor is connected to the first translation substrate through the first transmission component.

[0015] In some embodiments, the first transmission assembly includes a first substrate translation screw and a first substrate translation nut, the first substrate translation screw is rotatably set on the first base, the first substrate translation nut is movably sleeved on the first substrate translation screw, the first substrate translation screw is connected to the output end of the first substrate translation motor, and the first substrate translation nut is fixedly connected to the first translation substrate, wherein the first substrate translation wire is arranged parallel to the first substrate translation guide rail.

[0016] In some embodiments, it further includes a second driving component arranged on the first translation substrate, the second driving component includes a second substrate translation motor, a second transmission component, a second substrate translation guide rail and a second substrate translation slider, the second substrate translation motor is arranged on the first translation substrate, the second substrate translation guide rail is arranged on the first translation substrate, the second substrate translation slider is arranged on the second substrate translation guide rail, the second translation substrate is arranged on the second substrate translation slider, and the second translation substrate is connected to the output end of the second substrate translation motor through the second transmission component.

[0017] In some embodiments, there are two second-substrate translation guide rails, which are parallel and symmetrically arranged on the first translation substrate. The second transmission assembly includes a first moving shaft, a first translation synchronous pulley, a second translation synchronous pulley, a first translation synchronous belt and a second fixed clamp. The first translation synchronous pulley is fixedly arranged on the first transmission shaft, and the second translation synchronous pulley is rotatably arranged on the first translation substrate. The first translation synchronous belt is wound around the first translation synchronous pulley and the second translation synchronous pulley. The second fixed clamp is fixedly arranged on the first translation synchronous belt, and the second fixed clamp is fixedly connected to the second translation substrate.

[0018] In some embodiments, the first suction cup assembly also includes a first main lifting cylinder, a first lifting base, a first auxiliary lifting cylinder and a first adsorption support, the first main lifting cylinder is arranged on the second translation substrate, the first lifting base is arranged on the free end of the first main lifting cylinder, the first auxiliary lifting cylinder is arranged on the first lifting base, the first adsorption support is arranged on the free end of the first auxiliary lifting cylinder, and a plurality of first suction cups are distributed at intervals on the first adsorption support, wherein the lifting directions of the first lifting base and the first adsorption support are consistent.

[0019] In some embodiments, the first substrate clamping assembly further includes a second main lifting cylinder, a second lifting base, and a second auxiliary lifting cylinder, the second main lifting cylinder being disposed on the second translational substrate, the second lifting base being disposed on a free end of the second main lifting cylinder, the second auxiliary lifting cylinder being disposed on the second lifting base, and the first substrate clamping claw being disposed on the free end of the second auxiliary lifting cylinder;

[0020] The first substrate clamp comprises a first substrate base provided on the second auxiliary lifting cylinder, two first substrate rotating shafts rotatable and symmetrically arranged relative to the first substrate base, a plurality of first substrate supporting claws provided on the two first substrate rotating shafts, and two first substrate connecting rods provided on the first substrate rotating shafts, one end of the two first substrate connecting rods being fixedly connected to the corresponding first substrate rotating shafts, and the other ends of the two first substrate connecting rods being movably connected, thereby realizing synchronous opening and closing of the first substrate supporting claws on the two first substrate rotating shafts;

[0021] The first substrate clamp further includes a first rocker and a first claw cylinder movably connected to one end of the first rocker, and the other end of the first rocker is fixedly connected to the first substrate rotating shaft.

[0022] In some embodiments, the second tray clamping assembly includes a second upper base and a second lower base connected to each other from top to bottom, the second upper base is connected to the lower side of the second translation base plate, and the second lower base is provided with a second main clamping mechanism and a second auxiliary clamping mechanism;

[0023] The second main clamping mechanism includes two second main clamping links arranged parallel to each other, the second main clamping links are movably arranged on the second lower base, and both ends of the second main clamping links are provided with second main clamping claws that can be opened and closed;

[0024] The second secondary clamping mechanism includes two secondary movable seats arranged relative to the second lower base, and the secondary movable seats are provided with a first main clamping block that can be raised and lowered and a first secondary clamping block that is fixedly arranged;

[0025] The first main clamping block can be lifted and lowered relative to the first auxiliary clamping block, thereby realizing the opening and closing of the first main clamping block and the first auxiliary clamping block.

[0026] The two auxiliary movable seats can move away from or towards each other, thereby driving the first auxiliary clamping block to open and close.

[0027] In some embodiments, the present invention further provides a novel semiconductor packaging device, comprising:

[0028] The novel chip substrate loading mechanism as described in the aforementioned embodiment;

[0029] a first mounting platform, wherein a first transport guide rail is provided on the first mounting platform, a first transport slider is provided on the first transport guide rail, and a first base of the novel chip substrate loading mechanism is provided on the first transport slider; and

[0030] The base drive assembly is used to drive the novel chip substrate loading mechanism to perform reciprocating linear motion along the first transport guide rail.

[0031] Compared with the prior art, the beneficial effects brought by the present invention are:

[0032] The utility model arranges a movable first moving layer and a second moving layer on the chip substrate, and can maximize the extension length of the second moving layer on the limited size of the chip substrate loading mechanism. At the same time, a first suction cup assembly, a first substrate clamping assembly, a second suction cup assembly and a second tray clamping assembly are respectively arranged on the second moving layer, and the positions of the first suction cup assembly and the second suction cup assembly correspond to each other, and the positions of the first substrate clamping assembly and the second tray clamping assembly correspond to each other. During one extension of the second moving layer, it can first adsorb and fix the packaged chip substrate and adsorb and take away the waste film, and then through the second movement of the second moving layer, drive the unpackaged chip substrate of the resin box to be synchronously delivered to the press unit, thereby improving the packaging efficiency.

[0033] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a three-dimensional diagram of the chip substrate loading mechanism of the present invention in a retracted state;

[0035] Figure 2 This is a first perspective view of the chip substrate loading mechanism of the present invention in an extended state;

[0036] Figure 3 This is a second perspective view of the chip substrate loading mechanism of the present invention in an extended state;

[0037] Figure 4 It is a top view of the chip substrate loading mechanism of the present invention;

[0038] Figure 5 for Figure 4 Cross-sectional view at GG in the middle;

[0039] Figure 6 for Figure 4 Cross-sectional view at EE;

[0040] Figure 7 for Figure 4 Cross-sectional view at FF;

[0041] Figure 8 This is an exploded view of the first substrate clamping assembly of the chip substrate loading mechanism of the present invention;

[0042] Figure 9 A perspective view of the second tray clamping assembly of the chip substrate loading mechanism of the present invention;

[0043] Figure 10 A partial perspective view of the semiconductor packaging device of the present invention;

[0044] Figure 11 This is an exploded view of the second tray clamping assembly of the chip substrate loading mechanism of the present invention;

[0045] Figure 12 This is an exploded view of the first substrate clamping assembly of the present invention;

[0046] Figure 13 This is a second perspective view of the first substrate clamping assembly of the present invention. DETAILED DESCRIPTION

[0047] The present application is further described in detail below with reference to the accompanying drawings. In the description of this embodiment, unless otherwise specified, the terms "left" and "right" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present application and simplify the description. They do not indicate or imply that the present application must have a specific direction, be constructed, or operate in a specific direction. Therefore, they should not be construed as limiting the present application.

[0048] like Figure 1-3 as well as Figure 10 As shown, the chip substrate loading mechanism 400 and the semiconductor packaging equipment provided by the present invention are provided. The chip substrate loading mechanism 400 is movably arranged on the first mounting platform 101 and is used for transporting unpackaged chip substrates and packaged chip substrates. The chip substrate loading mechanism 400 can move back and forth linearly on the first mounting platform 101. Specifically, in this embodiment, as shown in FIG. Figure 10 As shown, two parallel first transport guide rails 1015 are provided on the first mounting platform 101, and a first straight rack 1016 is provided between the two parallel first transport guide rails 1015. The first straight rack 1016 is parallel to the first transport guide rail 1015. Figure 1 As shown, a base drive assembly is provided on the chip substrate loading mechanism 400, and the base drive assembly includes a first transport motor 4011. A first driving gear 4011 is provided at the output end of the first transport motor 4011, and the first driving gear 40111 is engaged with the first straight rack 1016. At least two first transport sliders 4012 are provided on the chip substrate loading mechanism 400, and the two first transport sliders 4012 are located on different first transport guide rails 1015. The chip substrate loading mechanism 400 is slidably provided on the first mounting platform 101 through the first transport sliders 4012. The forward and reverse rotation of the first transport motor 4011 drives the forward and reverse rotation of the first driving gear 40111. Combined with the first transport guide rail 1015 and the first transport slider 4012, the chip substrate transport mechanism 400 can achieve reciprocating linear movement on the first mounting platform 102. Optionally, the transmission structure of the first driving gear 40111 and the first straight rack 1016 can also be replaced by a combination structure of synchronous wheels and synchronous belts, or a screw slider structure for transmission. It can be known that the driving structure and power type of the chip substrate loading mechanism 400 are not limited by the present invention, and the purpose is to drive the chip substrate loading mechanism 400 to perform reciprocating linear movement on the first mounting platform 101.

[0049] Specifically, if Figure 10As shown, the chip substrate loading mechanism 400 includes a structure that can move back and forth linearly along the first mounting platform 101. The first transport motor 4011 is disposed on the first base 401, and the first transport slider 4012 is fixedly connected to the first base 401. The specific details are not described in detail here.

[0050] like Figure 2 As shown, the first moving layer includes the first translation substrate 402 and two first moving side plates 4024. The two first moving side plates 4024 are arranged in parallel and opposite to each other and are both arranged vertically on the first translation substrate 402. Two parallel first substrate translation guide rails 4015 are arranged on the first base 401. A first substrate translation slider 40151 is arranged on the first substrate translation guide rail 4015. The first translation substrate 402 of the first moving layer is arranged on the first substrate translation slider 40151. A first driving assembly and a first transmission assembly are also arranged on the first base 401. The first driving assembly includes a first substrate translation motor 4013 and a first transmission assembly. The first substrate translation screw 4014, which is rotatably mounted on the first base 401 via a bearing, and the first substrate translation nut 40141, which is mounted on the first substrate translation screw 4014, are connected to the first movable layer 402. The axis of the first substrate translation screw 4014 aligns with the axis of the first substrate translation guide rail 4015. The output end of the first substrate translation motor 4013 is connected to the first substrate translation screw 4014 in a transmission connection. In this embodiment, the power connection is achieved via a synchronous wheel and a synchronous belt. Alternatively, a direct connection can be achieved via a coupling or gear meshing. Alternatively, the first driving element can be a push rod cylinder that directly drives the movement of the first movable layer.

[0051] Second substrate translation guide rails 4023 parallel to each other are provided on the two first movable side plates 4024, a second substrate translation slider 40231 is provided on the second substrate translation guide rails 4023, the second movable substrate 403 is fixedly connected to the second substrate translation slider 40231, a second driving assembly and a second transmission assembly are provided on the first translation substrate 402, the second driving assembly includes a second substrate translation motor 4021, the second transmission assembly includes a first movable shaft 4022 rotatably mounted through a bearing provided on the two first movable side plates 4024, and a first translation synchronous pulley is provided on the first movable shaft 4022. A second translation synchronous pulley 40223 and a first translation synchronous belt 40222 are provided on the first movable side plate 4024, and are arranged parallel to the second baseplate translation guide rail 4023. The first translation synchronous belt 40222 is wound around the first translation synchronous pulley 40221 and the second translation synchronous pulley 40223. A second fixing clamp 40224 is provided on the second movable baseplate 402 and is fixedly connected to the first translation synchronous belt 40222. The second baseplate translation motor 4021 is driven by the synchronous belt and synchronous pulley assembly, thereby driving the first transmission shaft 4022 to rotate. In this embodiment, to facilitate faster response of the second movable layer and prevent power jams, the second fixing clamp 40224, the first translation synchronous belt 40222, the first translation synchronous pulley 40221, and the second translation synchronous pulley 40223 are symmetrically arranged about a radial plane located at the center of the first movable shaft 4022.

[0052] The first moving layer and the second moving layer move in the same direction, and the moving direction of the first moving layer is perpendicular to the moving direction of the first base 401.

[0053] Optionally, the second substrate translation motor 4021 and the first movable shaft 4022 may be connected to each other through gear meshing, or the output shaft of the second substrate translation motor 4021 may be directly connected to the first movable shaft 4022 through a coupling.

[0054] Optionally, the second driving assembly may also be a push rod cylinder to directly push the second movable layer to move.

[0055] Furthermore, the second movable layer includes a first suction cup assembly 4031 and a first substrate clamping assembly 4032 which are arranged above the second movable layer and can be raised and lowered. The first suction cup assembly 4031 is arranged close to the press unit 500, and the first substrate clamping assembly 4032 is arranged away from the press unit 500.

[0056] Specifically, if Figure 1-2As shown, the first suction cup assembly 4031 includes a first lifting base 40313, four first guide shafts 40314 are provided on the first lifting base 40313, and four matching first guide sleeves are provided on the second movable base. The first guide shaft 40314 is movably inserted into the first guide sleeve. At the same time, a first main lifting cylinder 40314 is provided on the second movable base 402, and the fixed end of the first main lifting cylinder 40314 is fixed on the second movable base 403, and the free end of the first main lifting cylinder 40314 is fixed under the first lifting base 40313 to drive the first lifting base 40313 to rise and fall. The first suction cup assembly 4031 also includes a plurality of first suction cups 40312 distributed at intervals, and the first suction cups 40312 are connected to the negative pressure mechanism, so as to grab and adsorb and fix the plastic-sealed finished chip substrate. Furthermore, the first suction cup assembly 4031 further includes a first adsorption support 40311, and a plurality of first suction cups 40312 are disposed on the first adsorption support 40311. Figure 4-6 As shown, the first suction support 40311 is movable relative to the first elevating base 40313, wherein the first suction support 40311 and the first elevating base 40313 move in the same direction. Specifically, the first suction support 40311 is connected to two first secondary guide shafts 403152 and a first secondary guide sleeve 403151 disposed on the first elevating base 40313. The first secondary guide shafts 403152 are movably inserted through the first secondary guide sleeve 403151. A first secondary lifting cylinder 40315 is disposed between the first suction support 40311 and the first elevating base 40313. The first secondary lifting cylinder 40315 is fixed to the first elevating base 40313, and the free end of the first secondary lifting cylinder 40315 is connected to the first suction support 40311. In this embodiment, two first suction cup assemblies 4031 are provided, both disposed on the first elevating base 40313, so as to simultaneously absorb two packaged chip substrates.

[0057] like Figure 5 、 Figure 7 As shown, the first substrate clamping assembly 4032 includes a second lifting base 40322, a first substrate clamping claw 40321 disposed on the second lifting base 40322, the second lifting base 40322 is disposed at the free end of the second main lifting cylinder 40324, the first substrate base 403214 is disposed at the free end of the second auxiliary lifting cylinder 40325, the second auxiliary lifting cylinder 40325 is disposed on the second lifting base 40322, and the second main lifting cylinder 40324 is disposed on the second translation substrate 403. In this application, the first substrate clamping claw 40321 is divided into two groups and can grasp two chip substrates at the same time. In order to reduce the number of driving devices, such as Figure 13As shown, a power link 403210 is provided between the two first rocking arms 30233 of the two first substrate clamps 40321 , and the power link 403210 is connected to the free end of the cylinder to synchronize the opening and closing of the two first substrate clamps 40321 . Optionally, the first transport clamps 3023 may be driven by an independent drive cylinder.

[0058] Specifically, if Figure 8 、 Figure 12 and Figure 13 As shown, the first substrate clamping jaw 40321 also includes a first substrate base 403214 and two first substrate rotating shafts 403213 rotatably arranged relative to the first substrate base 403214. When a chip substrate is clamped on the first substrate clamping jaw, the positions of the two first substrate rotating shafts 403212 are symmetrically arranged with respect to the chip substrate. One of the first substrate rotating shafts 403212 is segmented to form a clearance space to facilitate the installation of the positioning assembly. Both ends of the first substrate rotating shaft 403212 are movably connected by two first substrate connecting rods 403213, thereby realizing the synchronous opening and closing of the first substrate supporting claws 403211 on the two first substrate rotating shafts 403212. In this embodiment, the two first substrate rotating shafts 403212 are both rotatably arranged on the second lifting base 40322. Optionally, the two first substrate rotating shafts 403212 can also be rotatably arranged on the first substrate base 403214.

[0059] Furthermore, the first substrate clamp 40321 also includes a first rocker arm 30233. In this embodiment, the first rocker arm 30233 and one of the above-mentioned first substrate connecting rods 403213 are arranged to form an integrated structure. One end of the first rocker arm 30233 is movably connected to the first claw cylinder, and the other end thereof is fixedly connected to the first substrate rotating shaft 403212. The rotation of the first rocker arm 30233 drives the rotation of the first substrate rotating shaft 403212.

[0060] Furthermore, a plurality of first making way notches 403215 are provided on the first substrate base 403214 to make way for the clamping claws for clamping the chip substrate when the chip substrate is placed.

[0061] like Figure 5 、 Figure 6As shown, a second tray clamping assembly 4034 and a second suction cup assembly 4033 are provided under the second movable substrate 403. The second suction cup assembly 4033 is arranged close to the side of the press unit 500, and the second tray clamping assembly 4034 is arranged away from the side of the press unit 500. In this embodiment, the second suction cup assembly 4033 corresponds to the position of the first suction cup assembly 4031, and the second tray clamping assembly 4034 corresponds to the position of the first substrate clamping assembly 4032, that is, when the first suction cup 40312 can adsorb and fix the finished chip substrate, the second suction cup 40331 can adsorb the waste film without horizontal movement. When the first substrate clamping claw 40321 can transport the unpackaged chip substrate to the upper mold 503 of the press unit 500 by lifting, at this time, the second tray clamping assembly 4034 can place the resin tray 40344 carrying resin and film onto the lower mold 502 of the press unit 500 for resin transportation.

[0062] Specifically, the second suction cup assembly 4033 includes a plurality of second suction cups 40331 . The structure, distribution, and principle of the plurality of second suction cups 40331 are the same as those of the first suction cup 40312 , as described above, and will not be further elaborated here.

[0063] like Figure 9 、 Figure 11 As shown, the second tray clamping assembly 4034 includes a second clamping base, which includes a second upper base 40341 ​​and a second lower base 40342 fixedly connected to each other from top to bottom, with a preset distance between the second upper base 40341 ​​and the second lower base 40342. The second upper base 40341 ​​is fixedly connected to the second movable base 403. The second tray clamping assembly 4034 also includes a second main clamping mechanism and a second auxiliary clamping mechanism, the specific mechanisms of which are as follows;

[0064] like Figure 11As shown, the second main clamping mechanism includes four second main clamping jaws 403424, two second main clamping connecting rods 403423 arranged in parallel with each other, a main clamping cylinder 403433 with two opening and closing free ends, and the two free ends can move back or towards each other at the same time to realize the opening and closing of the second main clamping jaws 303424; two main clamping push rods 403422, wherein the four second main clamping jaws 403424 are divided into two groups, each group is fixedly arranged at the two ends of the second main clamping connecting rod 403423, and the second main clamping jaws 403424 are connected to the resin The main clamping cylinder 403433 is fixed on the second lower base 40342, and the two main clamping push rods 403422 are respectively fixed on the two opening and closing free ends of the main clamping cylinder 403433. The two free ends of the main clamping cylinder 403433 move toward or away from each other, driving the four second main clamping jaws 403424 to open and close, thereby grabbing or putting down the resin tray 40344. In this embodiment, the second main clamping jaw 403424 is an L-shaped hook.

[0065] Furthermore, four second main guide rails 403426 are arranged on the second lower base 40342, and four corresponding second main sliders 403425 are arranged on the four second main guide rails 403426. The axial direction of the second main guide rails 403426 is consistent with the opening and closing direction of the free end of the main clamping cylinder 403433. The four second main sliders 403425 are respectively fixed at the two ends of the corresponding two main clamping connecting rods 403423, thereby supporting the second main clamping connecting rods 403423.

[0066] Alternatively, as Figure 9As shown, the second main clamping jaw 403424 can also be set as a rotating structure, and two parallel second main clamping connecting rods 403434 are rotatably set on the second lower base 40342. Specifically, four rotating brackets 403435 are set on the second lower base 40342, and the second main clamping connecting rod 403434 is rotatably set on the four rotating brackets 403425 through bearings. A second main clamping rocker 403436 is set between the two free ends of the main clamping cylinder 403433 and the corresponding two second main clamping connecting rods 403434, and one end of the second main clamping rocker 403436 is fixedly connected to the second main clamping connecting rod 40344. The other end of the clamping rocker 403436 is movably connected to a free end of the main clamping cylinder 403433. For example, a first connecting rod having a first connecting notch in an elongated structure is provided. One end of the first connecting rod is movably connected to a free end of the main clamping cylinder 403433. The end of the first connecting rod with the first connecting notch is positioned away from the second lower base 40342, so that the first connecting notch compensates for vertical movement of the first connecting rod to avoid motion interference. The first connecting notch can be a rectangular or U-shaped structure, so that the openable free end of the main clamping cylinder 403433 drives the second main clamping jaw 403424 to rotate. For example, when the two free ends of the main clamping cylinder 403433 are open and separated, the second main clamping jaw 403424 is not engaged with the resin tray 40344. When the two free ends of the main clamping cylinder 403433 are closed and brought closer together, the second main clamping jaw 403424 engages and abuts the clamping groove 403441 of the resin tray.

[0067] like Figure 11As shown, the second secondary clamping mechanism includes a secondary clamping cylinder 403421, which is provided with two free ends that can move toward or away from each other, a secondary moving seat 403428 provided at the free end of the secondary clamping cylinder 403421, and a first secondary clamping block 403431 provided on the secondary moving seat 403428. The first secondary clamping block 403431 can clamp and cover one side of the resin tray 40344, and a first main clamping block 403430 that can be raised and lowered is provided on the secondary moving seat 403428. Specifically, A second lifting cylinder 403429 is provided on the movable base 403428. The free end of the second lifting cylinder 403429 is connected to the first main clamping block 403430. By raising and lowering the first main clamping block 403430, the first auxiliary clamping block 403431 is closed and opened, thereby clamping and securing the film. The auxiliary clamping cylinder 403421 is then used to move the auxiliary movable base 403428 closer together, thereby securing the edge of the film loaded with resin, thereby securing the film relative to the resin tray 40344. In this embodiment, the auxiliary movable base 403428, the first auxiliary clamping block 40341, the first main clamping block 40340, and the second lifting cylinder 403429 are each provided in two groups, symmetrically arranged about the second upper base 40341, thereby clamping and securing the film at the edge of the resin tray 40344, ensuring that the resin tray 40344 and the film move synchronously.

[0068] Furthermore, a second secondary guide rail 403411 is provided on the second upper base 40341, and a second secondary slider 403432 is provided on the second secondary guide rail 403411. The second secondary slider 403432 is connected to the secondary movable seat 403428, thereby providing support for the secondary movable seat 403428. The axial direction of the second secondary guide rail 403411 is consistent with the opening and closing movement direction of the free end of the secondary clamp cylinder 403421.

[0069] In this embodiment, Figure 11 As shown, the first auxiliary clamping block 403431 and the first main clamping block 403430 are located on two opposite sides of the resin tray 40344 , and the second main clamping jaw 403424 is located on the other two opposite sides of the resin tray 40344 .

[0070] The above is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention. Such improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A novel chip substrate loading mechanism, characterized in that: include: The first base is capable of reciprocating linear movement; a second movable layer, movably arranged relative to the first base, the second movable layer comprising a second movable substrate, and the second movable layer is movably arranged on the first base via the second movable substrate; A first suction cup assembly is liftably disposed on the upper side of the second moving substrate, wherein the first suction cup assembly includes a plurality of first suction cups for fixing the chip substrate; a first substrate clamping assembly, which is movable and disposed on the upper side of the second movable substrate, the first substrate clamping assembly being spaced apart from the first suction cup assembly, and the first substrate clamping assembly being used as a first substrate clamping claw for transporting unpackaged chip substrates; A second suction cup assembly is provided on the lower side of the second movable substrate, corresponding to the position of the first suction cup assembly, and the second suction cup assembly is provided with a plurality of second suction cups for sucking the packaged waste film; The second tray clamping assembly is arranged on the lower side of the second movable substrate and corresponds to the position of the first substrate clamping assembly.

2. A novel chip substrate loading mechanism according to claim 1, characterized in that: It also includes a first moving layer, the first moving layer includes a first translation substrate, the first translation substrate is movably set on the first base, the second moving layer is provided with a second translation substrate, the second moving layer is movably set on the first moving layer through the second translation substrate, wherein the moving directions of the first moving layer and the second moving layer are consistent, and the moving direction of the first moving layer is perpendicular to the moving direction of the first base.

3. A novel chip substrate loading mechanism according to claim 2, characterized in that: It also includes a first driving component arranged on the first substrate, the first driving component includes a first substrate translation motor, a first transmission component, a first substrate translation guide rail and a first substrate translation slider, the first substrate translation motor is arranged on the first base, the first substrate translation guide rail is arranged on the first base, the first substrate translation slider is arranged on the first substrate translation guide rail, and the first translation substrate is arranged on the first substrate translation slider, wherein the output end of the first substrate translation motor is connected to the first translation substrate through the first transmission component.

4. A novel chip substrate loading mechanism according to claim 3, characterized in that: The first transmission assembly includes a first substrate translation screw and a first substrate translation nut. The first substrate translation screw is rotatably set on the first base. The first substrate translation nut is movably sleeved on the first substrate translation screw. The first substrate translation screw is connected to the output end of the first substrate translation motor. The first substrate translation nut is fixedly connected to the first translation substrate, wherein the first substrate translation wire is arranged parallel to the first substrate translation guide rail.

5. A novel chip substrate loading mechanism according to claim 2, characterized in that: It also includes a second driving component arranged on the first translation substrate, the second driving component includes a second substrate translation motor, a second transmission component, a second substrate translation guide rail and a second substrate translation slider, the second substrate translation motor is arranged on the first translation substrate, the second substrate translation guide rail is arranged on the first translation substrate, the second substrate translation slider is arranged on the second substrate translation guide rail, the second translation substrate is arranged on the second substrate translation slider, and the second translation substrate is connected to the output end of the second substrate translation motor through the second transmission component.

6. A novel chip substrate loading mechanism according to claim 5, characterized in that: There are two second-base translation guide rails, which are parallel and symmetrically arranged on the first translation base. The second transmission assembly includes a first moving shaft, a first translation synchronous pulley, a second translation synchronous pulley, a first translation synchronous belt and a second fixed clamp. The first translation synchronous pulley is fixedly arranged on the first transmission shaft, and the second translation synchronous pulley is rotatably arranged on the first translation base. The first translation synchronous belt is wound around the first translation synchronous pulley and the second translation synchronous pulley. The second fixed clamp is fixedly arranged on the first translation synchronous belt, and the second fixed clamp is fixedly connected to the second translation base.

7. A novel chip substrate loading mechanism according to claim 2, characterized in that: The first suction cup assembly also includes a first main lifting cylinder, a first lifting base, a first auxiliary lifting cylinder and a first adsorption support. The first main lifting cylinder is arranged on the second translation substrate, the first lifting base is arranged on the free end of the first main lifting cylinder, the first auxiliary lifting cylinder is arranged on the first lifting base, and the first adsorption support is arranged on the free end of the first auxiliary lifting cylinder. A plurality of first suction cups are distributed on the first adsorption support at intervals, wherein the lifting directions of the first lifting base and the first adsorption support are consistent.

8. The novel chip substrate loading mechanism according to claim 2, characterized in that: The first substrate clamping assembly further includes a second main lifting cylinder, a second lifting base, and a second auxiliary lifting cylinder, the second main lifting cylinder being disposed on the second translational substrate, the second lifting base being disposed on a free end of the second main lifting cylinder, the second auxiliary lifting cylinder being disposed on the second lifting base, and the first substrate clamping claw being disposed on the free end of the second auxiliary lifting cylinder; The first substrate clamp comprises a first substrate base provided on the second auxiliary lifting cylinder, two first substrate rotating shafts rotatable and symmetrically arranged relative to the first substrate base, a plurality of first substrate supporting claws provided on the two first substrate rotating shafts, and two first substrate connecting rods provided on the first substrate rotating shafts, one end of the two first substrate connecting rods being fixedly connected to the corresponding first substrate rotating shafts, and the other ends of the two first substrate connecting rods being movably connected, thereby realizing synchronous opening and closing of the first substrate supporting claws on the two first substrate rotating shafts; The first substrate clamp further includes a first rocker and a first claw cylinder movably connected to one end of the first rocker, and the other end of the first rocker is fixedly connected to the first substrate rotating shaft.

9. The novel chip substrate loading mechanism according to claim 2, characterized in that: The second tray clamping assembly includes a second upper base and a second lower base connected to each other from top to bottom, the second upper base is connected to the lower side of the second translation base plate, and the second lower base is provided with a second main clamping mechanism and a second auxiliary clamping mechanism; The second main clamping mechanism includes two second main clamping links arranged parallel to each other, the second main clamping links are movably arranged on the second lower base, and both ends of the second main clamping links are provided with second main clamping claws that can be opened and closed; The second secondary clamping mechanism includes two secondary movable seats arranged relative to the second lower base, and the secondary movable seats are provided with a first main clamping block that can be raised and lowered and a first secondary clamping block that is fixedly arranged; The first main clamping block can be lifted and lowered relative to the first auxiliary clamping block, thereby realizing the opening and closing of the first main clamping block and the first auxiliary clamping block. The two auxiliary movable seats can move away from or towards each other, thereby driving the first auxiliary clamping block to open and close.

10. A novel semiconductor packaging device, characterized in that: include: The novel chip substrate loading mechanism according to any one of claims 1 to 9; a first mounting platform, wherein a first transport guide rail is provided on the first mounting platform, a first transport slider is provided on the first transport guide rail, and a first base of the novel chip substrate loading mechanism is provided on the first transport slider; as well as The base drive assembly is used to drive the novel chip substrate loading mechanism to perform reciprocating linear motion along the first transport guide rail.

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