Resin loading mechanism and semiconductor packaging equipment
By designing the resin loading mechanism and pallet handling mechanism, automated resin transmission and pallet recycling of chip substrate packaging equipment are realized, solving the safety and accuracy problems caused by manual loading in traditional equipment, and improving production efficiency.
Patent Information
- Application Number
- CN202422445230.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-10-09
AI Technical Summary
Compressed packaging equipment of traditional chip substrates requires manual loading, resulting in low resin laying accuracy, poor safety and low production efficiency, and the inability to achieve automatic transmission of resin.
A resin loading mechanism is designed, including a third base, a fourth moving layer and a pallet handling mechanism. The second main clamping mechanism and the second secondary clamping mechanism on the pallet handling mechanism are used to realize the automatic transmission of the resin pallet and the fixation of the film, and the third driving component is combined to realize the reciprocating linear movement to avoid resin sprinkling.
The automatic transmission of resin and the recycling of pallets are realized, the production efficiency is improved, the stable transmission and safety of resin are ensured, and the danger and accuracy of manual operation are avoided.
Smart Images

Figure CN223273237U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor chip substrate packaging, in particular to a resin loading mechanism and semiconductor packaging equipment. Background Art
[0002] Over time, semiconductor technology has continued to advance, gradually developing more complex semiconductor devices such as integrated circuits and large-scale integrated circuits. These technological developments have greatly promoted progress in fields such as computers, communications, and medicine, making our lives more convenient and efficient.
[0003] Compression packaging of chip substrates is an indispensable step. Traditional compression packaging equipment for chip substrates requires manual resin loading. Manual loading has low resin laying accuracy and increased risk factors in manual operation. At the same time, production efficiency is low. Therefore, how to realize the automatic transmission of resin is an urgent problem that people in this field need to solve. Utility Model Content
[0004] The present invention provides a resin loading mechanism to solve the safety problems, precision problems, low packaging efficiency and the problem of how to realize the automatic transmission of resin caused by the need for manual loading assistance of traditional packaging equipment in the above technical background. Another aspect of the present invention is to provide a semiconductor packaging device.
[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:
[0006] A resin loading mechanism, comprising:
[0007] The third base is capable of reciprocating linear movement;
[0008] a fourth movable layer, provided with a fourth movable substrate, wherein the fourth movable layer is movably arranged relative to the third base via the fourth movable substrate;
[0009] a tray transport mechanism, disposed on the fourth movable base plate, the tray transport mechanism being used for transporting resin and recovering empty resin trays;
[0010] The pallet transport mechanism includes a second upper base and a second lower base connected to each other from top to bottom, the second upper base is connected to the lower side of the fourth movable substrate, and the second lower base is provided with a second main clamping mechanism that can be opened and closed and a second auxiliary clamping mechanism that can be opened and closed. The second main clamping mechanism is used to fix the resin pallet, and the second auxiliary clamping mechanism is used to fix the film.
[0011] In some embodiments, the second main clamping mechanism includes two second main clamping links arranged parallel to each other, the second main clamping links being movably arranged on the second lower base, and second main clamping jaws that can be opened and closed are arranged at both ends of the second main clamping links;
[0012] The second secondary clamping mechanism includes two secondary movable seats arranged relative to the second lower base, and the secondary movable seats are provided with a first main clamping block that can be raised and lowered and a first secondary clamping block that is fixedly arranged;
[0013] The first main clamping block can be lifted and lowered relative to the first auxiliary clamping block, thereby realizing the opening and closing of the first main clamping block and the first auxiliary clamping block;
[0014] The two auxiliary movable seats can move away from or towards each other, thereby driving the first auxiliary clamping block to open and close.
[0015] In some embodiments, a third moving layer is further included, and a third moving substrate is provided. The third moving substrate is movably set on the third base. The fourth moving layer is movably set on the third moving layer. The moving directions of the fourth moving layer and the third moving layer are consistent and perpendicular to the moving direction of the third base.
[0016] In some embodiments, a fourth guide rail is provided on the third base, a fourth slider is provided on the fourth guide rail, the third movable substrate is disposed on the fourth slider, and the axial direction of the fourth guide rail is consistent with the moving direction of the fourth movable layer.
[0017] In some embodiments, a fifth guide rail is provided on the third movable base plate, a fifth slider is provided on the fifth guide rail, and an axial direction of the fifth guide rail is consistent with an axial direction of the fourth guide rail.
[0018] In some embodiments, there are at least two fourth guide rails, and the at least two fourth guide rails are arranged in parallel and spaced apart, and each of the fourth guide rails is provided with at least one fourth slider;
[0019] There are at least two fifth guide rails, and the at least two fifth guide rails are arranged in parallel and spaced apart. Each of the fifth guide rails is provided with at least one fifth sliding block.
[0020] In some embodiments, the fourth drive assembly is further included, the fourth drive assembly including a fourth drive motor, a fourth driving pulley, a fourth driven pulley, and a fourth synchronous belt, the fourth drive motor is disposed on the third movable base plate, the fourth driving pulley is disposed on the output shaft of the fourth drive motor, the fourth driven pulley is rotatably disposed on the fourth movable base plate, and the fourth synchronous belt is wound around the fourth driving pulley and the fourth driven pulley;
[0021] Among them, a third connecting block is set on the third base, and a fourth connecting block is set on the fourth movable base plate. The third connecting block is fixedly connected to the fourth synchronous belt, and the fourth connecting block is connected to the fourth synchronous belt.
[0022] In some embodiments, in the initial position, the third connecting block is close to the fourth driven pulley, and the fourth connecting block is close to the fourth driving pulley. When the third moving layer and the fourth moving layer are fully extended, the third connecting block is close to the fourth driving pulley, and the fourth connecting block is close to the fourth driven pulley.
[0023] In some embodiments, the present invention further provides a semiconductor packaging device, comprising:
[0024] The resin loading mechanism as described in each of the above embodiments;
[0025] a second mounting platform, on which at least one third guide rail is provided, on which a third slider is provided, and on which the third base is provided;
[0026] The third driving assembly is used to drive the resin loading mechanism to move back and forth linearly along the third guide rail.
[0027] In some embodiments, the third drive assembly includes a third drive motor disposed on the third base, the output end of the third drive motor is provided with a second gear, the second mounting platform is provided with a second spur rack, the second spur rack is arranged parallel to the third guide rail, and the second gear is engaged with the second spur rack.
[0028] Compared with the prior art, the beneficial effects brought by the present invention are:
[0029] The present application sets a reciprocating resin loading mechanism on the second mounting platform, and sets a pallet transporting mechanism on the resin loading mechanism for the transmission of resin and the secondary recycling of the pallet. The entire process does not require manual loading. At the same time, combined with the second main clamping mechanism and the second auxiliary clamping mechanism on the pallet transporting mechanism, the pallet is clamped, transported and fixed by the second main clamping mechanism, and then the film under the resin pallet is fixed in conjunction with the second auxiliary clamping mechanism, thereby ensuring the stable transmission of the resin and avoiding separation between the film and the resin pallet, which causes the resin to spill.
[0030] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] Figure 1 This is a first perspective view of the resin loading mechanism of the present invention;
[0032] Figure 2 It is a top view of the resin loading mechanism of the present invention;
[0033] Figure 3 It is an exploded diagram of the resin state mechanism of the present invention;
[0034] Figure 4 for Figure 3 Another perspective diagram in ;
[0035] Figure 5 This is an exploded view of the pallet handling mechanism of the present invention;
[0036] Figure 6 This is a schematic diagram of another alternative structure of the pallet transport mechanism of the present invention;
[0037] Figure 7 for Figure 2 Cross-sectional view of middle HH;
[0038] Figure 8 This is a structural diagram of the digital loading mechanism of the present invention being arranged on the second mounting platform. DETAILED DESCRIPTION
[0039] The present application is further described in detail below with reference to the accompanying drawings. In the description of this embodiment, unless otherwise specified, the terms "left" and "right" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present application and simplify the description. They do not indicate or imply that the present application must have a specific direction, be constructed, or operate in a specific direction. Therefore, they should not be construed as limiting the present application.
[0040] In one embodiment, Figure 1 As shown, the resin loading mechanism 800 includes a third base 801, a third movable layer and a fourth movable layer, wherein the third base 801 is slidably set on the second mounting platform 102, the third movable layer can extend to one side relative to the third base 801, and the fourth movable layer can extend to one side relative to the third movable layer, and is consistent with the extending direction of the third movable layer. At the same time, the moving directions of the third movable layer and the fourth movable layer are both perpendicular to the moving direction of the third base 801, and the tray transporting mechanism 4034 is set on the fourth movable substrate for transporting the resin tray.
[0041] Furthermore, if Figure 3 and Figure 4As shown, the third moving layer includes a third moving base plate 802, which is slidably arranged on the third base 801, and a fourth driving motor 8021 is provided on the third moving base plate 801. A fourth active pulley 8022 is connected to the output shaft of the fourth driving motor 8021, and a rotating fourth driven pulley 8024 is provided on the third moving base plate 802, and the two are connected by a fourth synchronous belt 8025; two parallel fourth guide rails 8013 are provided on the third base 801, and at least one fourth slider 8023 is provided on each fourth guide rail 8013, and the third moving base plate 802 is fixedly arranged on the fourth slider 8023, wherein a third connecting block 8014 is provided on the third base 801, and the third connecting block 8014 is fixedly connected to the fourth synchronous belt 8025, thereby driving the third moving base plate 802 to move relative to the third base 801;
[0042] Furthermore, the fourth moving layer includes a fourth moving base plate 803, on which a tray transport mechanism 4034 is provided for transporting an empty resin tray 80344 or a resin tray 80344 for transporting a film and resin. Two parallel fifth guide rails 8026 are provided on the third moving base plate 802, on which a fifth slider 8032 is provided, and the fourth moving base plate 803 is fixedly provided on the fifth slider 8032. In this embodiment, in order to reduce the number of drive devices, such as Figure 7 As shown, a fourth connecting block 8033 is provided on the fourth movable substrate 803, and the fourth connecting block 8033 is fixedly connected to the fourth synchronous belt 8025. In the initial position, the third connecting block 8014 is close to the fourth driven pulley 8024, and the fourth connecting block 8033 is close to the fourth active pulley 8022. When the fourth drive motor 8021 rotates, the third movable layer and the fourth movable layer are driven to move relative to the third connecting block 8014 on the third base 801. At the same time, since the fourth connecting block 8033 is fixedly connected to the fourth synchronous belt 8025, and the fourth connecting block 8033 is fixedly connected to the fourth movable substrate 803, the fourth movable substrate 803 and the third movable substrate 802 move synchronously.
[0043] Optionally, the fourth movable base plate 803 may also be driven by a separate driving device, such as a motor-screw-slider structure, a motor combined with a synchronous wheel and synchronous belt structure, or a cylinder structure with a push rod.
[0044] In one embodiment, Figure 5As shown, the pallet transport mechanism 4034 includes a second upper base 40341 and a second lower base 40342 fixedly connected to each other from top to bottom. A preset distance is set between the second upper base 40341 and the second lower base 40342. The second upper base 40341 is fixedly connected to the fourth movable base 803. The second pallet clamping assembly 4034 also includes a second main clamping mechanism and a second auxiliary clamping mechanism. The specific structure is as follows;
[0045] Reference again Figure 5 The second main clamping mechanism includes four second main clamping jaws 403424, two second main clamping connecting rods 403423 arranged in parallel with each other, a main clamping cylinder 403433 with two opening and closing free ends, and the two free ends can move back to back or towards each other at the same time to realize the opening and closing of the second main clamping jaws 303424; two main clamping push rods 403422, wherein the four second main clamping jaws 403424 are divided into two groups, each group is fixedly set at the two ends of the second main clamping connecting rod 403423, and the second main clamping jaws 403424 are connected to the resin support The main clamping cylinder 403433 is fixed on the second lower base 40342, and the two main clamping push rods 403422 are respectively fixed on the two opening and closing free ends of the main clamping cylinder 403433. The two free ends of the main clamping cylinder 403433 move toward or away from each other, driving the four second main clamping jaws 403424 to open and close, thereby grabbing or putting down the resin tray 40344. In this embodiment, the second main clamping jaw 403424 is an L-shaped hook.
[0046] Furthermore, four second main guide rails 403426 are arranged on the second lower base 40342, and four corresponding second main sliders 403425 are arranged on the four second main guide rails 403426. The axial direction of the second main guide rails 403426 is consistent with the opening and closing direction of the free end of the main clamping cylinder 403433. The four second main sliders 403425 are respectively fixed at the two ends of the corresponding two main clamping connecting rods 403423, thereby supporting the second main clamping connecting rods 403423.
[0047] Alternatively, as Figure 6As shown, the second main clamping jaw 403424 can also be set as a rotating structure, and two parallel second main clamping connecting rods 403434 are rotatably set on the second lower base 40342. Specifically, four rotating brackets 403435 are set on the second lower base 40342, and the second main clamping connecting rod 403434 is rotatably set on the four rotating brackets 403425 through bearings. A second main clamping rocker 403436 is set between the two free ends of the main clamping cylinder 403433 and the corresponding two second main clamping connecting rods 403434, and one end of the second main clamping rocker 403436 is fixedly connected to the second main clamping connecting rod 40344. The other end of the clamping rocker 403436 is movably connected to a free end of the main clamping cylinder 403433. For example, a first connecting rod having a first connecting notch in an elongated structure is provided. One end of the first connecting rod is movably connected to a free end of the main clamping cylinder 403433. The end of the first connecting rod with the first connecting notch is positioned away from the second lower base 40342, so that the first connecting notch compensates for vertical movement of the first connecting rod to avoid motion interference. The first connecting notch can be a rectangular or U-shaped structure, so that the openable free end of the main clamping cylinder 403433 drives the second main clamping jaw 403424 to rotate. For example, when the two free ends of the main clamping cylinder 403433 are open and separated, the second main clamping jaw 403424 is not engaged with the resin tray 40344. When the two free ends of the main clamping cylinder 403433 are closed and brought closer together, the second main clamping jaw 403424 engages and abuts the clamping groove 403441 of the resin tray.
[0048] like Figure 5As shown, the second secondary clamping mechanism includes a secondary clamping cylinder 403421, which is provided with two free ends that can move toward or away from each other, a secondary moving seat 403428 provided at the free end of the secondary clamping cylinder 403421, and a first secondary clamping block 403431 provided on the secondary moving seat 403428. The first secondary clamping block 403431 can clamp and cover one side of the resin tray 40344, and a first main clamping block 403430 that can be raised and lowered is provided on the secondary moving seat 403428. Specifically, A second lifting cylinder 403429 is provided on the movable base 403428. The free end of the second lifting cylinder 403429 is connected to the first main clamping block 403430. By raising and lowering the first main clamping block 403430, the first auxiliary clamping block 403431 is closed and opened, thereby clamping and securing the film. The auxiliary clamping cylinder 403421 is then used to move the auxiliary movable base 403428 closer together, thereby securing the edge of the film loaded with resin, thereby securing the film relative to the resin tray 40344. In this embodiment, the auxiliary movable base 403428, the first auxiliary clamping block 40341, the first main clamping block 40340, and the second lifting cylinder 403429 are each provided in two groups, symmetrically arranged about the second upper base 40341, thereby clamping and securing the film at the edge of the resin tray 40344, ensuring that the resin tray 40344 and the film move synchronously.
[0049] Furthermore, a second secondary guide rail 403411 is provided on the second upper base 40341, and a second secondary slider 403432 is provided on the second secondary guide rail 403411. The second secondary slider 403432 is connected to the secondary movable seat 403428, thereby providing support for the secondary movable seat 403428. The axial direction of the second secondary guide rail 403411 is consistent with the opening and closing movement direction of the free end of the secondary clamp cylinder 403421.
[0050] In this embodiment, Figure 5 As shown, the first auxiliary clamping block 403431 and the first main clamping block 403430 are located on two opposite sides of the resin tray 40344 , and the second main clamping jaw 403424 is located on the other two opposite sides of the resin tray 40344 .
[0051] In one embodiment, Figure 8As shown, the present invention further provides a semiconductor packaging device, which mainly includes the resin loading mechanism of each of the above embodiments, a second mounting platform 102, on which is provided at least one third guide rail 1025, a third slider 8013 is disposed on the third guide rail 1025, and a third base 801 is fixedly disposed on the third slider 8013; and a third drive assembly for driving the resin loading mechanism 800 to perform reciprocating linear movement along the third guide rail 8013. Specifically, in this embodiment, the third drive assembly includes a third drive motor 8011 disposed on the third base 801, a second gear 8012 is disposed at the output end of the third drive motor 8011, and a second spur rack 1026 is disposed on the second mounting platform 102. The second spur rack 1026 is disposed parallel to the third guide rail 1025, and the second gear 8012 is engaged with the second spur rack 1026 for transmission.
[0052] Optionally, the transmission method of the second gear 8012 and the second spur rack 1026 can be replaced by a screw slider structure, or a transmission structure of a synchronous belt and synchronous wheel can be adopted. In this case, the third drive motor 8011 needs to be set on the second mounting platform.
[0053] Optionally, the third driving assembly may be directly replaced by a linear push rod cylinder, and the third base may be fixedly connected to the free end of the linear push rod cylinder.
[0054] The above is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention. Such improvements and modifications should also be considered within the scope of protection of the present invention.
Claims
1. A resin loading mechanism, characterized in that: include: The third base is capable of reciprocating linear movement; a fourth movable layer, provided with a fourth movable substrate, wherein the fourth movable layer is movably arranged relative to the third base via the fourth movable substrate; a tray transport mechanism, disposed on the fourth movable base plate, the tray transport mechanism being used for transporting resin and recovering empty resin trays; The pallet transport mechanism includes a second upper base and a second lower base connected to each other from top to bottom, the second upper base is connected to the lower side of the fourth movable substrate, and the second lower base is provided with a second main clamping mechanism that can be opened and closed and a second auxiliary clamping mechanism that can be opened and closed. The second main clamping mechanism is used to fix the resin pallet, and the second auxiliary clamping mechanism is used to fix the film.
2. A resin loading mechanism according to claim 1, characterized in that: include: The second main clamping mechanism includes two second main clamping links arranged parallel to each other, the second main clamping links are movably arranged on the second lower base, and both ends of the second main clamping links are provided with second main clamping claws that can be opened and closed; The second secondary clamping mechanism includes two secondary movable seats arranged relative to the second lower base, and the secondary movable seats are provided with a first main clamping block that can be raised and lowered and a first secondary clamping block that is fixedly arranged; The first main clamping block can be lifted and lowered relative to the first auxiliary clamping block, thereby realizing the opening and closing of the first main clamping block and the first auxiliary clamping block; The two auxiliary movable seats can move away from or towards each other, thereby driving the first auxiliary clamping block to open and close.
3. A resin loading mechanism according to claim 2, characterized in that: It also includes a third moving layer, which is provided with a third moving substrate. The third moving substrate is movably set on the third base. The fourth moving layer is movably set on the third moving layer. The moving directions of the fourth moving layer and the third moving layer are consistent and perpendicular to the moving direction of the third base.
4. A resin loading mechanism according to claim 3, characterized in that: A fourth guide rail is provided on the third base, a fourth slider is provided on the fourth guide rail, the third movable substrate is arranged on the fourth slider, and the axial direction of the fourth guide rail is consistent with the moving direction of the fourth movable layer.
5. A resin loading mechanism according to claim 4, characterized in that: A fifth guide rail is provided on the third movable base plate, a fifth slider is provided on the fifth guide rail, and an axial direction of the fifth guide rail is consistent with an axial direction of the fourth guide rail.
6. A resin loading mechanism according to claim 5, characterized in that: There are at least two fourth guide rails, which are arranged in parallel and spaced apart, and each of the fourth guide rails is provided with at least one fourth slider; There are at least two fifth guide rails, and the at least two fifth guide rails are arranged in parallel and spaced apart. Each of the fifth guide rails is provided with at least one fifth sliding block.
7. The resin loading mechanism according to claim 5, characterized in that: The fourth drive assembly further includes a fourth drive motor, a fourth driving pulley, a fourth driven pulley, and a fourth synchronous belt, wherein the fourth drive motor is disposed on the third movable base plate, the fourth driving pulley is disposed on the output shaft of the fourth drive motor, the fourth driven pulley is rotatably disposed on the fourth movable base plate, and the fourth synchronous belt is wound around the fourth driving pulley and the fourth driven pulley; Among them, a third connecting block is set on the third base, and a fourth connecting block is set on the fourth movable base plate. The third connecting block is fixedly connected to the fourth synchronous belt, and the fourth connecting block is connected to the fourth synchronous belt.
8. The resin loading mechanism according to claim 7, characterized in that: In the initial position, the third connecting block is close to the fourth driven pulley, and the fourth connecting block is close to the fourth driving pulley. When the third moving layer and the fourth moving layer are fully extended, the third connecting block is close to the fourth driving pulley, and the fourth connecting block is close to the fourth driven pulley.
9. A semiconductor packaging device, characterized in that include: The resin loading mechanism according to any one of claims 1 to 8; a second mounting platform, on which at least one third guide rail is provided, on which a third slider is provided, and on which the third base is provided; The third driving assembly is used to drive the resin loading mechanism to move back and forth linearly along the third guide rail.
10. The semiconductor packaging device according to claim 9, wherein: The third drive assembly includes a third drive motor arranged on the third base, the output end of the third drive motor is provided with a second gear, the second mounting platform is provided with a second spur rack, the second spur rack is arranged parallel to the third guide rail, and the second gear is engaged with the second spur rack.