Pressing ring assembly, bearing device and ion beam equipment

Abstract

The utility model discloses a compression ring subassembly, bearing device and ion beam equipment, including compression ring main part and compression ring guide pillar, the compression ring main part has the guide pillar fixed hole, the first end of compression ring guide pillar is connected with the guide pillar fixed hole through the sliding piece, the guide pillar fixed hole is strip-shaped hole, the sliding piece is in the guide pillar fixed hole, and the sliding piece is connected with the guide pillar fixed hole through the guide pillar fixed hole. And a deformation redundant gap is formed between the guide pillar fixing hole and the guide pillar fixing hole. According to the compression ring assembly provided by the utility model, the first end of the compression ring guide column is connected into the guide column fixing hole through the sliding piece, and the guide column fixing hole is a strip-shaped hole, so that the sliding piece can move in the strip-shaped hole when the compression ring main body and the compression ring guide column are heated to deform and the deformation amounts of the compression ring main body and the compression ring guide column are different; therefore, the deformation difference between the compression ring main body and the compression ring guide pillar is counteracted, and the fracture problem caused by stress is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of ion beam equipment, and more specifically, to a pressure ring assembly, a supporting device and ion beam equipment. Background Art

[0002] Ion beam equipment can be divided into etching equipment and coating equipment. Both types of ion beam etching and coating equipment have a support device. This support device is mainly used to receive and secure the wafer, and can adjust the wafer's rotation speed, orbital angle, and other spatial positions to facilitate the wafer etching or coating process. Due to increasingly stringent process requirements, new challenges are posing to the high-temperature stability of the wafer carrier structure.

[0003] The support devices commonly used in ion beam equipment are currently only suitable for processes operating at temperatures below 100°C. Support devices that can meet high-temperature requirements (≥300°C) are rare. Support devices typically consist of a stage assembly and a pressure ring assembly. The stage assembly supports workpieces such as wafers, while the pressure ring assembly holds the wafers against the stage assembly.

[0004] When the pressure ring assembly of the supporting device presses the wafer, the temperature will be transferred to the pressure ring assembly. The high temperature environment will cause the pressure ring assembly to deform. Since the pressure ring body and the pressure ring guide pin of the pressure ring assembly have different contact areas with the supporting device, the temperatures of the two are different, resulting in different deformation amounts of the two, causing stress to be generated at the connection between the pressure ring body and the pressure ring guide pin, which is prone to breakage.

[0005] Therefore, how to avoid the fracture at the connection between the pressure ring body and the pressure ring guide pin due to different deformation variables has become a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0006] In view of this, the purpose of the present invention is to provide a pressure ring assembly to avoid the fracture of the connection between the pressure ring body and the pressure ring guide pin due to different deformation amounts;

[0007] Another object of the present invention is to provide a supporting device and an ion beam device having the pressure ring assembly.

[0008] To achieve the above objectives, the present invention provides the following technical solutions:

[0009] A pressure ring assembly includes a pressure ring body and a pressure ring guide column. The pressure ring body has a guide column fixing hole. The first end of the pressure ring guide column is connected to the guide column fixing hole through a sliding member. The guide column fixing hole is a strip-shaped hole. The sliding member is in the guide column fixing hole and has a deformation redundant gap between the sliding member and the guide column fixing hole.

[0010] Optionally, in the above-mentioned pressure ring assembly, the guide column fixing hole has a limiting step, and along the extension direction of the pressure ring guide column, the sliding member is limitedly engaged with the limiting step.

[0011] Optionally, in the above-mentioned pressure ring assembly, the first end of the pressure ring guide post is inserted into the guide post fixing hole from the first surface of the pressure ring body, and is limitedly engaged with the first side of the limiting step;

[0012] The sliding member includes a pressure ring pad, which is fixed to the first end of the pressure ring guide column and is limitedly matched with the second side of the limiting step.

[0013] Optionally, in the above-mentioned pressure ring assembly, the pressure ring pad is fixed to the first end of the pressure ring guide column by a fixing member;

[0014] The fixing member has a limiting portion, the pressure ring pad is arranged between the limiting portion and the pressure ring guide column, and a gap is formed between the limiting portion and the second surface of the pressure ring body.

[0015] Optionally, in the above-mentioned pressure ring assembly, the pressure ring assembly further includes a chassis, the second end of the pressure ring guide pin is fixed on the chassis, and a pin for lifting the wafer is provided on the chassis.

[0016] Optionally, in the above-mentioned pressure ring assembly, the length direction of the guide column fixing hole points to the center of the pressure ring body.

[0017] The utility model provides a pressure ring assembly, in which the first end of the pressure ring guide post is connected to the guide post fixing hole through a sliding member, and the guide post fixing hole is a strip hole, so that when the pressure ring body and the pressure ring guide post are deformed by heat and the deformation amounts of the two are different, the sliding member can move in the strip hole to offset the difference in deformation amounts of the pressure ring body and the pressure ring guide post, thereby avoiding the problem of fracture caused by stress.

[0018] A supporting device, comprising:

[0019] stage device;

[0020] A pressure ring assembly, wherein the pressure ring assembly is a pressure ring assembly as described in any one of the above items, wherein the pressure ring body is located on the upper side of the carrier device, and the carrier device has a guide sliding hole that slides with the pressure ring guide column.

[0021] Optionally, in the above-mentioned supporting device, a guide sleeve is provided in the guide sliding hole, and the guide sleeve has a guide hole that slides with the pressure ring guide column, and the guide hole is a strip-shaped hole with its length direction pointing to the center of the carrier device.

[0022] Optionally, in the above-mentioned supporting device, a notch is provided on at least one side wall of the guide hole along the length direction.

[0023] Optionally, in the above-mentioned supporting device, the carrier device includes a carrying heat platform and a heat platform connecting boss, the heat platform connecting boss is arranged on a side of the carrying heat platform facing away from the pressure ring body, and the guide sliding hole is arranged on the carrying heat platform;

[0024] The heat-bearing platform is provided with a heating portion, and the heat-platform connecting boss is provided with a cooling portion.

[0025] Optionally, in the above-mentioned supporting device, the heating portion includes an electric heating element provided on the heat-bearing platform, and the cooling portion includes a cooling medium channel provided on the heat-platform connecting boss.

[0026] Optionally, in the above-mentioned supporting device, the heating platform connecting boss is a hollow structure, and the wiring harness of the electric heating element extends out from the hollow structure of the heating platform connecting boss.

[0027] Optionally, the supporting device further comprises a rotating assembly, wherein the rotating assembly comprises a first rotating body and a second rotating body that rotate relative to each other, and the heating platform connecting boss is connected to one of the first rotating body and the second rotating body.

[0028] Optionally, in the above-mentioned supporting device, the end surface where the heating platform connecting boss is connected to the rotating assembly is a heating platform docking end surface, and the end surface where the rotating assembly is connected to the heating platform connecting boss is a rotating docking end surface;

[0029] The rotating assembly is provided with a medium inlet and outlet channel communicating with the cooling medium channel, and the medium inlet and outlet channel extends to the rotating docking end face;

[0030] A first sealing member is provided between the heating platform butt joint end surface and the rotating butt joint end surface, and the first sealing member is arranged around the outer sides of the cooling medium channel and the medium inlet and outlet channel.

[0031] Optionally, in the above-mentioned supporting device, the heat platform connecting boss is connected to one of the first rotating body and the second rotating body, and the other of the first rotating body and the second rotating body is provided with a lifting drive device, and the lifting drive device is used to drive the pressure ring assembly to rise.

[0032] Optionally, in the above-mentioned supporting device, the pressure ring assembly further comprises a chassis, and the second end of the pressure ring guide column is fixed to the chassis;

[0033] The stage device is provided with an elastic pressing device, and the elastic pressing device includes:

[0034] a reset guide post, wherein a first end of the reset guide post is fixed to the stage device, and a second end of the reset guide post passes through the chassis and is slidably engaged with the chassis;

[0035] A first elastic reset member is sleeved on the reset guide column, with one end abutting against the chassis and the other end abutting against the platform device. The first elastic reset member is used to drive the pressure ring assembly to descend.

[0036] Optionally, in the above-mentioned supporting device, the pressure ring assembly further comprises a chassis, and the second end of the pressure ring guide column is fixed to the chassis;

[0037] A second elastic reset member is sleeved on the pressure ring guide column, one end of the second elastic reset member abuts against the chassis, and the other end abuts against the stage device.

[0038] Optionally, the supporting device further includes an electric slip ring assembly, the electric slip ring assembly includes an electric slip ring, the electric slip ring and the heating platform connecting boss are connected to the same one of the first rotating body and the second rotating body, and the electric slip ring is connected to the electric heating element through a wiring harness.

[0039] The supporting device provided by the present invention has all the technical effects of the above-mentioned pressure ring assembly due to its inclusion, and will not be described in detail herein.

[0040] An ion beam device comprises the supporting device as described in any one of the above items.

[0041] The ion beam device provided by the present invention has all the technical effects of the above-mentioned supporting device, and will not be described in detail herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0043] Figure 1 This is a structural schematic diagram of the supporting device disclosed in an embodiment of the present utility model when it is in a compressed position;

[0044] Figure 2 This is a structural schematic diagram of the supporting device disclosed in an embodiment of the present utility model when it is in a raised position;

[0045] Figure 3 This is a schematic structural diagram of the pressure ring assembly disclosed in an embodiment of the present utility model;

[0046] Figure 4 This is a structural schematic diagram of the pressure ring body and the pressure ring guide pillar at the connection position along the longitudinal direction disclosed in an embodiment of the present utility model;

[0047] Figure 5 This is a structural schematic diagram of the pressure ring body and the pressure ring guide pillar at the connection position along the horizontal direction disclosed in an embodiment of the present utility model;

[0048] Figure 6 A cross-sectional view of a compression ring gasket disclosed in an embodiment of the present utility model;

[0049] Figure 7 A cross-sectional view of a compression ring gasket disclosed in another embodiment of the present utility model;

[0050] Figure 8 A cross-sectional view of a compression ring gasket disclosed in yet another embodiment of the present utility model;

[0051] Figure 9 This is a structural diagram of a platform device provided with an elastic pressing device disclosed in an embodiment of the present utility model;

[0052] Figure 10 A cross-sectional view of the connection position between the pressure ring guide pin and the guide sleeve disclosed in an embodiment of the present utility model;

[0053] Figure 11 This is a cross-sectional view of the connection position between the pressure ring guide pin and the guide sleeve disclosed in another embodiment of the present utility model;

[0054] Figure 12 This is a cross-sectional view of the connection position between the pressure ring guide pin and the guide sleeve disclosed in yet another embodiment of the present utility model;

[0055] Figure 13 This is a schematic structural diagram of a rotating assembly and an electric slip ring assembly disclosed in an embodiment of the present utility model;

[0056] Figure 14 This is a schematic structural diagram of the pressure ring assembly and the carrier device disclosed in an embodiment of the present utility model.

[0057] The meanings of the reference numerals in the figures are as follows:

[0058] 100-pressing ring assembly; 110-pressing ring body; 120-pressing ring guide pin; 130-thimble; 140-chassis; 150-fixing member; 160-pressing ring pad; 170-second elastic reset member;

[0059] 200-carrying platform device; 210-carrying hot plate; 220-guide sleeve; 221-notch; 230-guide sliding hole; 240-thimble sliding hole; 250-hot plate connecting boss; 260-cooling medium channel; 270-wiring harness;

[0060] 300-elastic pressing device; 310-first elastic reset member; 320-reset guide column;

[0061] 400 - Rotating assembly; 410 - First sealing member; 420 - Second rotating member; 430 - Lifting top plate; 440 - Lifting drive device; 450 - First rotating member; 460 - Medium inlet channel; 470 - Medium outlet channel; 480 - Second sealing member;

[0062] 500-electric slip ring assembly; 510-input wiring harness; 520-electric slip ring;

[0063] 600-wafer. DETAILED DESCRIPTION

[0064] The core of the utility model is to provide a pressure ring assembly to avoid the fracture of the connection between the pressure ring body and the pressure ring guide pin due to different deformation variables;

[0065] Another core of the present invention is to provide a supporting device and an ion beam device having the pressure ring assembly.

[0066] The following embodiments are described with reference to the accompanying drawings. The embodiments described below do not limit the scope of the utility model as set forth in the claims. Furthermore, the entire contents of the components described in the following embodiments are not necessarily required to provide the solutions described in the claims. It should be noted that, for ease of description, only the portions relevant to the utility model are shown in the accompanying drawings. The embodiments and features of the embodiments of the present utility model may be combined with one another unless there is a conflict.

[0067] like Figure 1 The pressure ring assembly 100 disclosed in the embodiment of the present invention is used to clamp a workpiece (such as wafer 600, which will be described below as an example) during a drop, thereby maintaining the stability of wafer 600 in the processing position. After processing of wafer 600 is completed, the pressure ring assembly 100 rises to release the pressure on wafer 600, allowing wafer 600 to be removed from the stage assembly 200.

[0068] Because the wafer 600 needs to be heated by the stage device 200 of the supporting device during some process steps, and in some processes, the stage device 200 even needs to output a high temperature of over 300°C, when the pressure ring assembly 100 presses the wafer 600, the temperature will be transferred to the pressure ring assembly 100, and the high temperature environment will cause the pressure ring assembly 100 to deform. In order to avoid the connection between the pressure ring body 110 and the pressure ring guide pillar 120 of the pressure ring assembly 100 from breaking due to the different deformation amounts of the pressure ring body 110 and the pressure ring guide pillar 120, this embodiment discloses a new structure of the pressure ring assembly 100.

[0069] like Figure 3-Figure 5 As shown, the pressure ring assembly 100 disclosed in the embodiment of the present invention includes a pressure ring body 110 and a pressure ring guide post 120. The pressure ring guide post 120 can be arranged perpendicular to the pressure ring body 110. Those skilled in the art can also set the angle between the pressure ring guide post 120 and the pressure ring body 110 according to needs. Among them, the pressure ring body 110 has a guide post fixing hole. The first end of the pressure ring guide post 120 is connected to the guide post fixing hole through a sliding member. The guide post fixing hole is a bar-shaped hole. The sliding member is in the guide post fixing hole and has a deformation redundant gap between the sliding member and the guide post fixing hole. The redundant gap can provide movement space for the sliding member to prevent different deformation amounts from causing excessive stress and fracture at the connection between the pressure ring body 110 and the pressure ring guide post 120.

[0070] The pressure ring guide pins 120 are used to slide with the stage assembly 200, allowing the pressure ring body 110 to move up and down in a set direction. When the pressure ring assembly 100 falls, the pressure ring body 110 not only presses the wafer 600 but also conducts heat from the stage assembly 200, causing the pressure ring body 110 to heat up. Due to the large contact area between the pressure ring body 110 and the stage assembly 200 and its plate-like structure, the pressure ring body 110 deforms more than the pressure ring guide pins 120. This difference in deformation between the two can easily cause stress at the connection point, leading to fracture.

[0071] In this embodiment, the first end of the pressure ring guide column 120 is connected to the guide column fixing hole through a sliding member, and the guide column fixing hole is a strip hole, so that when the pressure ring body 110 and the pressure ring guide column 120 are deformed by heat and the deformation amounts of the two are different, the sliding member can move in the strip hole to offset the difference in deformation amounts between the pressure ring body 110 and the pressure ring guide column 120, thereby avoiding the problem of fracture caused by stress.

[0072] The heat-induced deformation of the pressure ring body 110 is an outward expansion deformation. In this embodiment, the length direction of the guide post fixing hole is designed to point toward the center of the pressure ring body 110. This setting of the extension direction of the guide post fixing hole allows the size of the guide post fixing hole to be shortened while maintaining the same amount of deformation. It should be noted that the length direction of the guide post fixing hole can also be designed in other directions to offset the difference in deformation between the pressure ring body 110 and the pressure ring guide post 120. This only requires increasing the length of the guide post fixing hole.

[0073] In this embodiment, the guide post fixing hole has a limiting step, and the sliding member cooperates with the limiting step along the extension direction of the pressure ring guide post 120. By providing the limiting step in the guide post fixing hole, the sliding member can be limited in the extension direction of the pressure ring guide post 120 to prevent the sliding member from falling out of the guide post fixing hole. It should be noted that the limiting step only limits the sliding member along the extension direction of the pressure ring guide post 120, and does not limit the sliding member along the length of the guide post fixing hole to prevent it from being unable to move due to thermal deformation.

[0074] Furthermore, the first end of the pressure ring guide post 120 is inserted into the guide post fixing hole from the first surface (such as the lower surface) of the pressure ring body 110 and is limitedly engaged with the first side (such as the lower side) of the limiting step. The sliding member includes a pressure ring pad 160, which is fixed to the first end of the pressure ring guide post 120 and is limitedly engaged with the second side (such as the upper side) of the limiting step. In this embodiment, the sliding member is fixed to the pressure ring guide post 120, and the pressure ring guide post 120 is limitedly engaged with the first side of the limiting step, and the pressure ring pad 160 is limitedly engaged with the second side of the limiting step. As a result, the assembly formed by the pressure ring guide post 120 and the pressure ring pad 160 cannot move along the extension direction of the pressure ring guide post 120 after being connected to the guide post fixing hole. Taking the extension direction of the pressure ring guide post 120 as the vertical direction as an example, the above-mentioned limiting structure can prevent the pressure ring guide post 120 from moving upward and downward.

[0075] In this embodiment, the compression ring pad 160 is fixed to the first end of the compression ring guide pillar 120 by the fixing member 150. The fixing member 150 has a limiting portion. For example, if the fixing member 150 is a fastener, the limiting portion is the nut of the fastener.

[0076] During installation, the first end of the pressure ring guide column 120 is inserted into the guide column fixing hole from the first surface of the pressure ring body 110, and the pressure ring pad 160 is inserted into the guide column fixing hole from the second surface of the pressure ring body 110, and then the threaded part of the fixing member 150 is passed through the fastening hole on the pressure ring pad 160, and tightened into the threaded hole at the first end of the pressure ring guide column 120 until the limiting part of the fixing member 150 is pressed on the pressure ring pad 160.

[0077] The compression ring block 160 is located between the retaining portion and the compression ring guide post 120. Through dimensional design, the upper surface of the compression ring block 160 is higher than the upper surface (i.e., the second surface) of the compression ring body 110, creating a gap between the retaining portion and the second surface of the compression ring body 110. This arrangement ensures that when the compression ring block 160, the fixing member 150, and the compression ring guide post 120 deform and move within the guide post fixing hole, the retaining portion of the fixing member 150 will not press against the compression ring body 110, causing excessive friction and hindering movement. To prevent the retaining portion of the fixing member 150 from protruding too far from the upper surface of the compression ring body 110, a flat-head screw can be used for the fixing member 150.

[0078] In this embodiment, the specific shape of the pressure ring pad 160 is not limited. Figure 6-Figure 8 The three specific shapes shown are all acceptable as long as they can accomplish the above functions. Figure 8 In the illustrated solution, in order to achieve assembly, a detachable limiting member for fixing needs to be provided on the upper side or the lower side of the pressure ring body 110 .

[0079] Furthermore, the pressure ring assembly includes a chassis 140, to which the second ends of the pressure ring guide pins 120 are fixed. The chassis 140 is provided with ejector pins 130 for lifting the wafer 600. When the pressure ring assembly 100 rises, the ejector pins 130 rise with it, thereby lifting the wafer 600 on the stage assembly 200, thereby facilitating removal of the wafer 600 from the stage assembly 200.

[0080] In order to smoothly lift the wafer 600, multiple ejector pins 130 can be provided, for example, more than three; the pressure ring guide pillar 120 is vertically fixed on the base 140 and is closer to the outer edge of the base 140 than the ejector pins 130. It should be noted that in order not to affect the pressure of the pressure ring body 110 on the wafer 600, the ejector pins 130 should be lower than the pressure ring body 110.

[0081] like Figure 1 and Figure 2 As shown, an embodiment of the present utility model further discloses a supporting device, which includes a platform device 200 and a pressure ring assembly 100.

[0082] The pressure ring assembly 100 is the pressure ring assembly 100 disclosed in the above embodiment, and the pressure ring body 110 is located on the upper side of the stage device 200. Figure 9 As shown, the stage device 200 has a guide sliding hole 230 that slides with the pressure ring guide column 120. It should be noted that when the pressure ring assembly 100 includes the ejector pin 130, the stage device 200 has an ejector sliding hole 240 that slides with the ejector pin 130.

[0083] The supporting device disclosed in the embodiment of the present invention has all the technical effects of the above-mentioned pressure ring assembly 100, and thus will not be described in detail herein.

[0084] Since the pressure ring guide column 120 also has a certain size, its deformation cannot be ignored. When it slides with the guide sliding hole 230, if the deformation is large, there may be a risk of causing sliding jamming.

[0085] Based on this, in this embodiment, a guide sleeve 220 is provided in the guide slide 230. The guide sleeve 220 has a guide hole that slides with the pressure ring guide column 120. The guide hole is a bar-shaped hole with its length direction pointing to the center of the stage device 200. After the stage device 200 is heated and deformed, the stage device 200 will expand outward, and the guide slide 230 thereon will follow and expand outward. Since the guide sleeve 220 is provided in the guide slide 230, and the guide hole of the guide sleeve 220 is a bar-shaped hole with its length direction pointing to the center of the stage device 200, when the guide sleeve 220 moves outward with the guide slide 230, the guide hole of the guide sleeve 220 does not interfere with the pressure ring guide column 120, that is, the pressure ring guide column 120 can slide in the guide hole of the guide sleeve 330 to offset each other, thereby avoiding the problem of the pressure ring guide column 120 being stuck in contact with the guide hole.

[0086] like Figure 10 As shown, the guide hole of the guide sleeve 220 may not have a notch on the side wall along the length direction, or may have notches 221 on both side walls along the length direction as shown in FIG11, or may have notches 222 on both side walls as shown in FIG12. Figure 12 As shown, a notch 221 is provided on one side wall along the length direction. It will be understood by those skilled in the art that providing the notch 221 on the side wall of the guide hole along the length direction can reduce the contact area between the pressure ring guide post 120 and the side wall of the guide hole, thereby reducing friction and improving the smoothness of the relative movement between the pressure ring guide post 120 and the guide hole.

[0087] like Figure 9 As shown, in a specific embodiment of the present invention, the carrier device 200 includes a carrying heat platform 210 and a heat platform connecting boss 250, the heat platform connecting boss 250 is arranged on the side of the carrying heat platform 210 facing away from the pressure ring body 110, and the guide sliding hole 230 and the ejector pin sliding hole 240 are arranged on the carrying heat platform 210.

[0088] The heat-carrying platform 210 is provided with a heating portion, and the heat-carrying platform connecting boss 250 is provided with a cooling portion. The heating portion may include an electric heating element provided on the heat-carrying platform 210 , and the cooling portion may include a cooling medium channel 260 provided on the heat-carrying platform connecting boss 250 .

[0089] The heating platform 210 can be heated quickly by electric heating. By introducing cooling medium into the cooling medium channel 260 , the heat of the heating platform connecting boss 250 can be taken away to reduce the temperature of the heating platform connecting boss 250 .

[0090] To facilitate connection between the wiring harness 270 of the electric heater and an external power source, in this embodiment, the heat plate connecting boss 250 is a hollow structure, that is, the heat plate connecting boss 250 has corresponding holes, so that the wiring harness 270 of the electric heater can extend through the hollow structure of the heat plate connecting boss 250. It should be noted that the wiring harness 270 is not limited to the wiring harness of the electric heater. The wiring harnesses of other electronic devices can also extend through the hollow structure of the heat plate connecting boss 250. For example, the signal line of the temperature sensor used to detect the temperature of the support heat plate 210 can also extend through the hollow structure of the heat plate connecting boss 250.

[0091] In certain semiconductor processing techniques, wafer 600 is required to rotate. To enable this rotation, the support device disclosed in this embodiment further includes a rotation assembly 400. The rotation assembly 400 serves as a supporting body for the other components of the support device and is connected and fixed within the chamber of the ion beam device, allowing the support device to support the wafer and complete the corresponding process within the chamber of the corresponding ion beam device.

[0092] like Figure 13 As shown, the rotating assembly 400 includes a first rotating body 450 and a second rotating body 420 that rotate relative to each other, and the heat stage connecting boss 250 is connected to one of the first rotating body 450 and the second rotating body 420 .

[0093] The driving device needs to drive whichever of the first rotating body 450 and the second rotating body 420 the stage device 200 is connected to to rotate, thereby driving the stage device 200 to rotate, and the other of the first rotating body 450 and the second rotating body 420 is fixed in the chamber of the ion beam device.

[0094] For example, the stage assembly 200 can be connected to the second rotator 420, and the first rotator 450 can be fixed in the chamber of the ion beam apparatus. To facilitate the connection between the stage assembly 200 and the second rotator 420, the second rotator 420 can be rotatably disposed within the first rotator 450, that is, the first rotator 450 is disposed around the second rotator 420. After the first rotator 450 is fixed, the second rotator 420 can rotate relative to the first rotator 450. The first rotator 450 serves as the stator of the rotator, and the second rotator 420 serves as the mover of the rotator.

[0095] like Figure 9 and Figure 13 As shown, for ease of understanding, the end surface where the heating platform connecting boss 250 is connected to the rotating assembly 400 is defined as the heating platform docking end surface, and the end surface where the rotating assembly 400 is connected to the heating platform connecting boss 250 is defined as the rotating docking end surface.

[0096] Rotating assembly 400 is provided with medium inlet and outlet channels (e.g., medium inlet channel 460 and medium outlet channel 470) that communicate with cooling medium channel 260. The medium inlet and outlet channels extend to the end face of the rotating assembly 400, that is, the medium inlet and outlet channels are connected to the end face of the rotating assembly 400, thereby connecting to an external cooling medium circulation device (e.g., a chiller) through the medium inlet and outlet channels on rotating assembly 400. Through the external cooling medium circulation device, the cooling medium can circulate within the cooling medium channel 260 of the stage assembly 200 through the medium inlet and outlet channels, thereby removing heat from the stage assembly 200 and reducing the temperature of the stage assembly 200.

[0097] It should be noted that both the medium inlet channel 460 and the medium outlet channel 470 consist of two parts: one part is provided on the second rotating body 420 located on the inner ring, and the other part is provided on the first rotating body 450 located on the outer ring. Since the second rotating body 420 rotates relative to the first rotating body 450, to ensure that the two parts remain continuously connected, the channel portion on the second rotating body 420 located on the inner ring should include an annular channel, and the channel portion on the first rotating body 450 should be connected to the annular channel. This ensures that when the second rotating body 420 rotates, it can always maintain communication with the channel on the first rotating body 450. In other words, the two parts of the medium inlet channel 460 and the two parts of the medium outlet channel 470 are always connected, regardless of the rotation of the second rotating body 420.

[0098] A first seal 410 is installed between the hot plate docking end face and the rotating docking end face, surrounding the cooling medium channel 260 and the outside of the medium inlet and outlet channels. Cooling medium channel 260 can be placed close to the hot plate docking end face to reduce the temperature of the hot plate docking end face, preventing the first seal 410 from being heated due to excessive temperatures and affecting its sealing effect and service life.

[0099] like Figure 13 As shown, in this embodiment, the support device may further include an electric slip ring assembly 500, which includes an electric slip ring 520. The electric slip ring 520 and the heat stage connection boss 250 are connected to the same one of the first rotating body 450 and the second rotating body 420. The electric slip ring 520 is connected to the electric heating element via an input wiring harness 510. The input wiring harness 510 of the electric slip ring 520 is electrically connected to the wiring harness 270 of the electric heating element, and the output wiring harness of the electric slip ring 520 can be connected to a corresponding power supply, controller, or other device as required. The second rotating body 420 has a hollow structure, and the input wiring harness 510 of the electric slip ring 520 is electrically connected to the corresponding wiring harness of the stage device 200 through the hollow structure of the second rotating body 420.

[0100] In this embodiment, the electric slip ring assembly 500 is connected to the electrical devices (such as electric heaters, temperature sensors, etc.) on the stage device 200, which can avoid the risk of wire harnesses getting entangled and being torn apart when the stage device 200 rotates.

[0101] Further, such as Figure 13 As shown, the heat plate connection boss 250 is connected to one of the first rotating body 450 and the second rotating body 420, and the other of the first rotating body 450 and the second rotating body 420 is provided with a lifting drive device 440, which is used to drive the pressure ring assembly 100 to rise. For example, the heat plate connection boss 250 can be connected to the second rotating body 420, the first rotating body 450 is arranged around the second rotating body 420, and the lifting drive device 440 is arranged on the first rotating body 450. The first rotating body 450 has a support step, which is used to support the position to be installed, and a second sealing member 480 is provided between the support step and the position to be installed.

[0102] It should be noted that the installation environment of the supporting device in the ion beam equipment is a vacuum environment. In particular, the stage device 200 must be in a vacuum environment because it needs to support the wafer 600. Since components such as the electric slip ring assembly 500 need to be connected to the outside, the electric slip ring assembly 500 is set in the atmospheric environment, which makes it easier to ensure the isolation of the vacuum environment from the external atmospheric environment.

[0103] In this embodiment, the second seal 480 arranged between the first rotating body 450 and the installation position can isolate the vacuum environment from the external atmospheric environment, that is, the carrier device 200 and the pressure ring assembly 100 above the second seal 480 are in a vacuum environment, while the main part of the first rotating body 450 and the electric slip ring assembly 500 are in the external atmospheric environment.

[0104] To ensure that the electrical slip ring assembly 500 can route the wiring harness within the vacuum environment to the external atmosphere, the corresponding wiring harness is connected through the hollow structure of the heat plate connecting boss 250 and the hollow structure of the second rotating body 420. Because the path through which the wiring harness passes is difficult to seal, the hollow structures of the heat plate connecting boss 250 and the second rotating body 420 are connected to the external atmosphere. The hollow structures of the heat plate connecting boss 250 and the second rotating body 420 are isolated from the vacuum environment by the first seal 410.

[0105] The lifting drive device 440 can be a piston-cylinder device (such as a pneumatic cylinder), a linear motor, or the like, as long as it can drive the pressure ring assembly 100 upward. In order to smoothly apply the lifting drive force to the pressure ring assembly 100, a lifting top plate 430 can be provided at the output end of the lifting drive device 440, and the lifting top plate 430 can be used to push the pressure ring assembly 100 upward. The lifting top plate 430 has a larger contact area with the pressure ring assembly 100, which can more smoothly apply force to the pressure ring assembly 100. When pushing the pressure ring assembly 100, the lifting top plate 430 can contact the bottom plate 140 of the pressure ring assembly 100.

[0106] like Figure 9 As shown, the stage assembly 200 is provided with an elastic clamping device 300, which includes a reset guide post 320 and a first elastic reset member 310. The first end of the reset guide post 320 is fixed to the stage assembly 200, while the second end of the reset guide post 320 passes through the chassis 140 and slidably engages with the chassis 140. Specifically, a guide hole is provided on the chassis 140 for sliding engagement with the reset guide post 320. The reset guide post 320 serves the same function as the pressure ring guide post 120, both providing guidance for the lifting and lowering of the pressure ring assembly 100.

[0107] The first elastic reset member 310 is sleeved on the reset guide column 320, and one end thereof abuts against the chassis 140 and the other end abuts against the stage device 200. The first elastic reset member 310 is used to drive the pressure ring assembly 100 to descend. Figure 2 As shown, when the pressure ring assembly 100 is driven upward by the lifting drive 440, the distance between the chassis 140 and the heat-bearing platform 210 of the stage assembly 200 gradually decreases, and the first elastic return member 310 is gradually compressed and stores energy. When the driving end of the lifting drive 440 descends, the pressure ring assembly 100 loses the thrust of the lifting drive 440, and the first elastic return member 310 pushes the pressure ring assembly 100 downward.

[0108] In addition, in addition to the solution disclosed in the above embodiment, the elastic reset member used to drive the pressure ring assembly 100 to descend can also be provided on the pressure ring guide column 120. Figure 14 As shown, a second elastic return member 170 is sleeved on the pressure ring guide column 120. One end of the second elastic return member 170 abuts against the chassis 140, and the other end abuts against the carrier device 200. When the pressure ring assembly 100 is driven by the lifting drive device 440 to rise, the distance between the chassis 140 and the heat-bearing platform 210 of the carrier device 200 gradually decreases, and the second elastic return member 170 is gradually compressed to store energy. When the driving end of the lifting drive device 440 descends, the pressure ring assembly 100 loses the thrust of the lifting drive device 440, and the second elastic return member 170 pushes the pressure ring assembly 100 to descend.

[0109] The present invention also discloses an ion beam device including the supporting device disclosed in the above embodiment. Due to the supporting device, the device has all the technical effects of the supporting device, which will not be described in detail herein.

[0110] As used in this application and the claims, unless the context clearly indicates an exception, the terms "a," "an," "an," and / or "the" are not intended to refer to the singular and may include the plural, unless the context clearly indicates otherwise. Generally speaking, the terms "comprises" and "include" only indicate the inclusion of the steps and elements specifically identified, and these steps and elements do not constitute an exclusive list. A method or apparatus may also include other steps or elements. The phrase "comprises a..." does not preclude the presence of additional identical elements in the process, method, product, or apparatus that includes the elements.

[0111] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0112] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0113] This document uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A pressure ring assembly, characterized in that: The invention comprises a pressure ring body (110) and a pressure ring guide column (120), wherein the pressure ring body (110) has a guide column fixing hole, and the first end of the pressure ring guide column (120) is connected to the guide column fixing hole through a sliding member, and the guide column fixing hole is a strip-shaped hole, and the sliding member is in the guide column fixing hole and has a deformation redundant gap between the sliding member and the guide column fixing hole.

2. The pressure ring assembly according to claim 1, wherein: The guide post fixing hole has a limiting step, and along the extension direction of the pressure ring guide post (120), the sliding member is in limiting cooperation with the limiting step.

3. The pressure ring assembly according to claim 2, wherein: The first end of the pressure ring guide column (120) is inserted into the guide column fixing hole from the first surface of the pressure ring body (110) and is limitedly engaged with the first side of the limiting step; The sliding member comprises a pressure ring pad (160), the pressure ring pad (160) being fixed to the first end of the pressure ring guide column (120) and being limitedly matched with the second side of the limiting step.

4. The pressure ring assembly according to claim 3, wherein: The pressure ring pad (160) is fixed to the first end of the pressure ring guide column (120) via a fixing member (150); The fixing member (150) has a limiting portion, the pressure ring pad (160) is arranged between the limiting portion and the pressure ring guide column (120), and a gap is provided between the limiting portion and the second surface of the pressure ring body (110).

5. The pressure ring assembly according to any one of claims 1 to 4, characterized in that: The pressure ring assembly further comprises a chassis (140), the second end of the pressure ring guide column (120) is fixed on the chassis (140), and a top pin (130) for lifting the wafer (600) is provided on the chassis (140); and / or, The length direction of the guide column fixing hole points to the center of the pressure ring body (110).

6. A supporting device, characterized in that: include: a stage device (200); A pressure ring assembly (100), wherein the pressure ring assembly (100) is the pressure ring assembly (100) according to any one of claims 1 to 5, wherein the pressure ring body (110) is located on the upper side of the carrier device (200), and the carrier device (200) has a guide sliding hole (230) that is slidably matched with the pressure ring guide column (120); A guide sleeve (220) is provided in the guide sliding hole (230), and the guide sleeve (220) has a guide hole that slides with the pressure ring guide column (120), and the guide hole is a strip-shaped hole with its length direction pointing to the center of the carrier device (200).

7. The supporting device according to claim 6, wherein: A notch (221) is provided on at least one side wall of the guide hole along the length direction.

8. The supporting device according to claim 6, wherein: The platform device (200) comprises a heat-bearing platform (210) and a heat-bearing platform connecting boss (250), wherein the heat-bearing platform connecting boss (250) is arranged on a side of the heat-bearing platform (210) facing away from the pressure ring body (110), and the guide sliding hole (230) is arranged on the heat-bearing platform (210); The bearing heat platform (210) is provided with a heating portion, and the heat platform connecting boss (250) is provided with a cooling portion, wherein the cooling portion comprises a cooling medium channel (260) provided on the heat platform connecting boss (250).

9. The supporting device according to claim 8, wherein: The device further comprises a rotating assembly (400), wherein the rotating assembly (400) comprises a first rotating body (450) and a second rotating body (420) that rotate relative to each other, and the hot stage connecting boss (250) is connected to one of the first rotating body (450) and the second rotating body (420); The end surface where the hot table connection boss (250) is connected to the rotating assembly (400) is a hot table docking end surface, and the end surface where the rotating assembly (400) is connected to the hot table connection boss (250) is a rotating docking end surface; The rotating assembly (400) is provided with a medium inlet and outlet channel communicating with the cooling medium channel (260), and the medium inlet and outlet channel extends to the rotating docking end face; A first sealing member (410) is provided between the hot platform butt joint end face and the rotating butt joint end face, and the first sealing member (410) is arranged around the outside of the cooling medium channel (260) and the medium inlet and outlet channel.

10. An ion beam device, characterized in that Comprising the supporting device according to any one of claims 6 to 9.

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