Package structure

Abstract

The utility model discloses a packaging structure, and the structure comprises a substrate which comprises a groove; the first electronic element is arranged on the substrate and avoids the area of the groove; the first mold sealing layer covers the first electronic element and extends to the side surface of the groove but is exposed out of the bottom surface of the groove; and the inner circuit is positioned in the substrate, extends to the bottom surface of the groove, and electrically connects the substrate with the first electronic element. According to the technical scheme, the mold sealing layer with the expected mold sealing thickness can be obtained at least according to the depth of the groove.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and more specifically, to a packaging structure. Background Art

[0002] Figures 1A to 1C and Figures 2A to 2C The figure is a cross-sectional view of the multiple stages of forming different thickness molding layers in the traditional transfer molding process. The transfer molding of traditional packaging products includes the following processes: Figure 1A and Figure 2A , an electronic component 22 is placed on the substrate 10, and mold chases 30A and 30B are placed over the electronic component 22, wherein the mold chases 30A and 30B are different according to the thickness of the mold seal to define cavities 35A and 35B with different heights h1 and h2; see Figure 1B and Figure 2B , the cavities 35A and 35B are filled with molding materials to form molding layers 40A and 40B; Figure 1C and Figure 2C , the molds 30A and 30B are removed, thereby forming mold layers 40A and 40B of different heights encapsulating the electronic components 22 on the substrate 10. Figure 1C The thicker mold encapsulation layer (eg Figure 2C To achieve this, different molds are required to define a higher space above the substrate 10 for forming the mold layer. As can be seen, in traditional transfer molding of packaged products, the mold determines the thickness of the mold layer. Therefore, products with different mold thicknesses require their own dedicated molds, and each mold set is often very expensive. This increases manufacturing costs and limits flexibility.

[0003] Another current method for forming a mold layer is compression molding. Although compression molding defines the thickness by the amount of adhesive, due to the minimum adhesive requirement, most methods can only produce a thickness of more than 300μm. Utility Model Content

[0004] In response to the above problems, the present application proposes a packaging structure to obtain a molding layer with a desired molding thickness.

[0005] The technical solution of this application is achieved as follows:

[0006] According to one aspect of the present application, a packaging structure is provided, comprising: a substrate including a groove; a first electronic component disposed on the substrate and avoiding an area of ​​the groove; a first molding layer covering the first electronic component and extending to the side of the groove but exposing the bottom of the groove; and an internal circuit located in the substrate and extending to the bottom of the groove, electrically connecting the substrate to the first electronic component.

[0007] In some embodiments, the substrate is separated into a first plane and a second plane by the groove, and the first electronic component is disposed on the first plane, wherein the packaging structure further includes a second electronic component disposed on the second plane.

[0008] In some embodiments, the first plane is higher than the second plane.

[0009] In some embodiments, a top surface of the first electronic component is exposed by the first molding layer.

[0010] In some embodiments, the packaging structure further includes: a second molding layer covering the second electronic component, extending to the other side of the groove, and not contacting the first molding layer.

[0011] In some embodiments, a top surface of the first molding layer is flush with a top surface of the second molding layer.

[0012] In some embodiments, a side surface of the first molding layer is parallel to a side surface of the second molding layer.

[0013] In some embodiments, the first molding layer and the second molding layer are made of different materials.

[0014] In some embodiments, a third electronic component is disposed on the first plane and is covered by the first molding layer.

[0015] In some embodiments, the top surface of the first molding layer has at least two different distances from the substrate in a vertical direction.

[0016] In the above technical solution, by forming a groove in the substrate and extending the molding layer into the groove, at least a molding layer with a lower molding thickness can be formed, and a molding layer with a desired molding thickness can be obtained according to the depth of the groove; in addition, the bottom surface of the groove is provided with internal circuits, which also increases the possibility of electrical connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figures 1A to 1C and Figures 2A to 2C It is a schematic diagram of a method for forming a packaging structure in the prior art.

[0019] Figures 3A to 3C , Figure 4A 、 Figures 4B to 9A 、 Figure 9B as well as Figure 10A 、 Figures 10B to 15A 、 Figure 15B Schematic diagram of various packaging structures and different stages of their formation methods according to embodiments of the present application.

[0020] Figure 16A and Figure 16B It is a cross-sectional schematic diagram at different cross sections according to an embodiment of the present application.

[0021] Figure 17A 、 Figures 17B to 22A 、 Figure 22B Schematic top and cross-sectional views of various stages of forming the packaging structure of an embodiment of the present application.

[0022] Figure 23A and Figure 23B 1 is a schematic cross-sectional view of a packaging structure at different cross sections according to an embodiment of the present application.

[0023] Figures 24 to 27 、 Figure 28A is a schematic cross-sectional view of a packaging structure according to another embodiment of the present application.

[0024] Figure 28B It is a schematic cross-sectional view of a packaging structure in which a molding layer is formed without using a groove. DETAILED DESCRIPTION

[0025] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0026] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. Specific examples of components and arrangements will be described below to simplify the present invention. Of course, these are merely examples and are not intended to limit the present invention. For example, in the following description, forming a first component above or on a second component may include an embodiment in which the first component and the second component are in direct contact, and may also include an embodiment in which an additional component is formed between the first component and the second component so that the first component and the second component may not be in direct contact. Moreover, the present invention may repeatedly refer to numbers and / or letters in various examples. This repetition is merely for simplicity and clarity and does not in itself represent a relationship between the various embodiments and / or configurations discussed.

[0027] In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0028] Embodiments of the present application provide a packaging structure and a method for forming the same. Figures 3A to 3C 1 is a schematic cross-sectional view of multiple stages of forming a package structure according to an embodiment of the present application.

[0029] First reference Figure 3A As shown, a groove 115 is formed on the substrate 110. The groove 115 can be formed on the substrate 110 by a half-cut (or half-etch) process. A first electronic component 121 and a second electronic component 122 are disposed on the substrate 110. The groove 115 avoids the area where the first electronic component 121 and the second electronic component 122 are to be disposed. The first electronic component 121 and the second electronic component 122 can be bonded to the substrate 110 via bump connectors 129, respectively.

[0030] Then, a mold 330 is placed on the substrate 110. The mold 330 may include a vertically extending sidewall 331 and a top wall 332 connected to the sidewall 331. The bottom of the sidewall 331 of the mold 330 is placed in the groove 115, thereby defining a cavity for forming a molding layer between the mold 330 and the substrate 110. There is a gap between the sidewall 331 of the mold 330 and the sidewall of the groove 115.

[0031] Then refer to Figure 3B As shown, a molding material is poured between the mold 330 and the substrate 110 to form a first molding layer 161. Due to the gap between the sidewall 331 of the mold 330 and the sidewall of the groove 115, a portion of the molding material extends into the groove 115. The first molding layer 161 also covers the bump connector 129.

[0032] refer to Figure 3C As shown, the mold 330 is removed to obtain the package structure 100 .

[0033] The package structure 100 may include a substrate 110 and at least one electronic component disposed on the substrate 110. In this embodiment, a first electronic component 121 and a second electronic component 122 are disposed. A first encapsulation layer 161 covers the first electronic component 121 and the second electronic component 122. The substrate 110 includes a groove 115, and the first electronic component 121 and the second electronic component 122 are positioned away from the area of ​​the groove 115. The first encapsulation layer 161 extends to the side of the groove 115 but exposes a portion of the bottom surface of the groove 115. An internal circuit 119 is disposed in the substrate 110, extending to the bottom surface of the groove 115 and electrically connecting the substrate 110 to the first electronic component 121.

[0034] In the above technical solution, by forming a groove 115 in the substrate 110, the bottom of the mold 330 is placed in the groove 115, so that the thickness of the encapsulation layer (such as the first encapsulation layer 161) covering the first electronic component 121 can be adjusted by the depth of the groove, thereby achieving different thicknesses of the encapsulation layer using the same mold 330. Therefore, in the packaging structure, by forming a groove 115 in the substrate 110 and extending the encapsulation layer into the groove 115, a encapsulation layer of the required thickness can be formed in the area where the first electronic component 121 is located while the height from the top surface of the encapsulation layer to the bottom surface of the groove 115 is the same, and the encapsulation layer of the desired thickness can be obtained according to the depth of the groove. Without making a new mold 330, different encapsulation thicknesses can be made using the same mold 330. The adjustable range of the encapsulation thickness can be set to a range of 10μm, for example, 250μm, 260μm, 270μm, etc. Furthermore, the thickness of the mold seal can be made lower than 100 μm (for example, the thickness of the first mold seal layer 161 is less than 300 μm). In addition, the bottom surface of the groove 115 is provided with an inner circuit 119, which increases the possibility of electrical connection.

[0035] Figure 4A 、 Figures 4B to 9A 、 Figure 9B 1 is a schematic top view and cross-sectional view of multiple stages of forming a packaging structure of another embodiment of the present application. Figures 4A to 9A It is a top view schematic diagram.

[0036] Figures 4B to 9B yes Figures 4A to 9A It should be understood that for clarity of illustration, the inner circuits in the substrate are not shown in each top view.

[0037] refer to Figure 4A and Figure 4B As shown, a substrate 110 having an inner circuit 119 is provided.

[0038] refer to Figure 5A and Figure 5B As shown, a groove 115 is formed in the substrate 110, for example, by a half-cutting (or half-etching) process. The bottom surface of the groove 115 exposes the internal circuit 119. In this embodiment, the groove 115 is formed along the edge of the substrate 110, and the groove 115 is a ring with a rectangular shape in a top view.

[0039] refer to Figure 6A and Figure 6B As shown, a plurality of electronic components 120 are bonded in an area avoiding the groove 115. In this embodiment, the groove 115 surrounds the plurality of electronic components 120 in a top view. The plurality of electronic components 120 include a first electronic component 121 and a second electronic component 122 as examples.

[0040] refer to Figure 7A and Figure 7B As shown, a mold 330 is disposed above the substrate 110, and the bottom of the sidewall of the mold 330 is disposed in the groove 115. Then, a molding material is poured between the mold 330 and the substrate 110.

[0041] refer to Figure 8A and Figure 8B As shown, the mold 330 is removed and a molding layer 160 is formed on the substrate 110 .

[0042] Then refer to Figure 9A and Figure 9B As shown, a cutting process is performed along the dotted line La through the encapsulation layer 160 and the substrate 110 to form a singulated package structure 200. In each package structure 200, a single electronic component (such as a corresponding one of the first electronic component 121 and the second electronic component 122) is included, and the first electronic component 121 and the second electronic component 122 are respectively covered by the corresponding first encapsulation layer 161 and the second encapsulation layer 162.

[0043] Figure 10A 、 Figures 10B to 15A 、 Figure 15B 1 is a schematic top view and cross-sectional view of multiple stages of forming a packaging structure of another embodiment of the present application. 10A to 15A It is a top view schematic diagram. Figures 10B to 15B yes 10A to 15A Schematic diagram of the cross section at the section line C2-C2 in.

[0044] refer to Figure 10A and Figure 10B As shown, a substrate 110 having an inner circuit 119 is provided.

[0045] refer to Figure 11A and Figure 11BAs shown, a groove 115 is formed in the substrate 110, for example, by a half-cutting (or half-etching) process. In this embodiment, a groove 115 extending along the length direction (direction X) of the substrate 110 and a groove 115 extending along the width direction (direction Y) of the substrate 110 are also formed. The groove 115 is formed along the edge of the substrate 110. The substrate 110 is separated into a first plane 181 and a second plane 182 by the groove 115.

[0046] refer to Figure 12A and Figure 12B As shown, a plurality of electronic components 120 are joined in an area avoiding the groove 115, and the groove 115 surrounds each of the plurality of electronic components 120, taking the first electronic component 121 and the second electronic component 122 as an example. Each of the first electronic component 121 and the second electronic component 122 is surrounded by the groove 115. The first electronic component 121 and the second electronic component 122 are respectively arranged on the first plane 181 and the second plane 182.

[0047] refer to Figure 13A and Figure 13B As shown, a mold 330 is placed above the substrate 110, and the bottom of the vertically extending sidewall of the mold 330 is placed in the groove 115. Then, a molding material is poured between the mold 330 and the substrate 110. A first molding layer 161 covering the first electronic component 121 and a second molding layer 162 covering the second electronic component 122 are formed.

[0048] refer to Figure 14A and Figure 14B As shown, the mold 330 is removed. A portion of the bottom surface of the groove 115 previously covered by the mold 330 is exposed by the first and second molding layers 161 and 162.

[0049] Then refer to Figure 15A and Figure 15B As shown, a cutting process is performed along the dotted line La through the substrate 110 below the groove 115 to form a singulated package structure 300. In the package structure 300, the groove 115 is set along the edge of each side of the substrate 110. In this embodiment, each electronic component is cut as a unit, so that the package unit 300 after cutting includes one electronic component. In other embodiments, any number of electronic components can also be cut as a group, so that the package unit after cutting includes multiple electronic components. For example, referring to Figure 15A and Figure 15BAs shown, the first electronic component 121, the second electronic component 122, the third electronic component 123 and the fourth electronic component 124 can be cut as a group, so that the packaging unit after cutting includes four electronic components, and the four electronic components are located on the same first plane 181 and are covered by the first molding layer 161.

[0050] Figure 16A and Figure 16B Schematic diagrams of cross sections of the package structure 300 after singulation are shown. Figure 16A and Figure 16B As shown, after singulation, the four lateral dimensions of each side of the substrate 110 are larger than the dimensions of the first encapsulation layer 161, so that the substrate 110 below the groove 115 protrudes laterally beyond the first encapsulation layer 161. Each side of the first encapsulation layer 161 extends downward to cover the side of the groove 115 of the substrate 110. By adjusting the depth of the groove 115, the warpage of the package structure 300 can be improved based on the depth of the first encapsulation layer 161 extending into the groove 115. In some embodiments, the deeper the first encapsulation layer 161 extends into the groove 115, the less the degree of upward warping of the edge of the package structure 300.

[0051] Figure 17A 、 Figures 17B to 22A 、 Figure 22B 1 is a schematic top view and cross-sectional view of multiple stages of forming a packaging structure of another embodiment of the present application. 17A to 22A It is a top view schematic diagram. Figures 17B to 22B yes 17A to 22A Schematic diagram of the cross section at the section line C3-C3 in.

[0052] refer to Figure 17A and Figure 17B As shown, a substrate 110 having an inner circuit 119 is provided.

[0053] refer to Figure 18A and Figure 18B As shown, for example, a groove 115 is formed in the substrate 110 by a half-cutting (or half-etching) process. In this embodiment, the groove 115 is formed along the edge of the substrate 110. In addition, at least one groove 115 extending along the length direction of the substrate 110 is formed to define a first plane 181 and a second plane 182 separated by the groove 115.

[0054] refer to Figure 19A and Figure 19BAs shown, multiple electronic components are bonded in an area avoiding the groove 115, with a first electronic component 121 and a second electronic component 122 being used as an example. In this embodiment, the first electronic component 121 and the second electronic component 122 are respectively arranged on a first plane 181 and a second plane 182. The groove 115 is located between the first electronic component 121 and the second electronic component 122.

[0055] refer to Figure 20A and Figure 20B As shown, a mold 330 is disposed above the substrate 110, and the bottom of the vertically extending sidewall of the mold 330 is disposed in the groove 115. Then, a molding material is poured between the mold 330 and the substrate 110 to form a first molding layer 161 covering the first electronic component 121 and a second molding layer 162 covering the second electronic component 122.

[0056] refer to Figure 21A and Figure 21B As shown, the mold 330 is removed. Part of the surface of the groove 115 is exposed by the first and second molding layers 161 and 162 .

[0057] Then refer to Figure 22A and Figure 22B As shown, a sawing process is performed along the dotted lines through the substrate 110 below the groove 115 to form a singulated package structure 300 .

[0058] Figure 23A and Figure 23B Schematic diagrams of cross sections of the package structure 300 after singulation are shown. Figure 23A and Figure 23B As shown, after singulation, grooves 115 are provided on opposite sides of the substrate 110 in the direction Y. The lateral dimensions of the opposite sides 161a and 161c of the substrate 110 in the direction Y are larger than the dimensions of the first mold sealing layer 161, so that the substrate 110 below the groove 115 protrudes laterally from the first mold sealing layer 161 in the direction Y (see FIG. Figure 23B ). The two opposite sides 161b and 161d of the substrate 110 in the direction X do not have the groove 115, and the side surfaces of the substrate 110 are coplanar with the side surfaces 161b and 161d of the first mold encapsulation layer 161 (see Figure 23A ).

[0059] The top surface of the first encapsulating layer 161 has at least two different distances, d1 and d2, vertically from the substrate 110. For example, the vertical distance between the top surface of the first encapsulating layer 161 and the substrate 110 at the first side 161a is a first dimension d1, and the vertical distance between the top surface of the first encapsulating layer 161 and the substrate 110 at the second side 161b is a second dimension d2, which is different from the first dimension d1. The first side 161a is perpendicular to the second side 161b. The first encapsulating layer 161 has a third side 161c opposite the first side 161a and a fourth side 161d opposite the second side 161b. The vertical distance between the top surface of the first encapsulating layer 161 and the substrate 110 at the third side 161c is the first dimension d1, and the vertical distance between the top surface of the first encapsulating layer 161 and the substrate 110 at the fourth side 161d is the second dimension d2. In this embodiment, d2 is smaller than d1.

[0060] The opposite sides 161a and 161c of the first encapsulation layer 161 in the direction Y extend downward to cover the sides of the groove 115 of the substrate 110. By adjusting the depth of the groove 115, the warping of the package structure can be improved based on the depth to which the first encapsulation layer 161 extends into the groove 115. Specifically, adjusting the depth to which the opposite sides 161a and 161c of the first encapsulation layer 161 in the direction Y extend into the groove 115 can improve the warping inconsistency between the X and Y directions of the package structure. In some embodiments, the deeper the depth to which the opposite sides 161a and 161c of the first encapsulation layer 161 in the direction Y extend into the groove 115, the less the degree to which the opposite edges of the package structure 300 in the direction Y warp upward, thereby reducing the warping of the package structure 300 in the direction Y and improving the warping inconsistency between the X and Y directions of the package structure 300. It should be understood that the first molding layer 161 can be extended to an appropriate depth in the groove 115 on any one side or multiple sides (eg, one side or three sides) according to needs and warpage inconsistency.

[0061] In addition, by providing the groove 115 in the substrate 110 , the flexibility of the package structure design is increased. Figure 24 FIG is a schematic cross-sectional view of a package structure 400 according to another embodiment of the present application. Figure 24 As shown, package structure 400 includes a substrate 110 and a first electronic component 121 disposed on substrate 110. Substrate 110 includes a recess 115, and first electronic component 121 is positioned away from recess 115. A first encapsulation layer 161 covers first electronic component 121. First encapsulation layer 161 extends to the sides of recess 115 surrounding first electronic component 121, but exposes a portion of the bottom surface of recess 115.

[0062] Furthermore, the internal circuit 119 is located in the substrate 110 and extends to the bottom surface of the groove 115, and can electrically connect the substrate 110 to the first electronic component 121. The groove 115 can be located in the edge region of the substrate 110, and the bottom surface of the groove 115 is connected to the sidewall 110s at the edge region of the substrate 110.

[0063] The substrate 110 is separated into a first plane 181 and a second plane 182 by a groove 115. The first electronic component 121 is disposed on the first plane 181. The package structure 400 also includes a second electronic component 122 disposed on the second plane 182. In this embodiment, the first plane 181 and the second plane 182 can be flush, and the top surface of the first electronic component 121 can be flush with the top surface of the second electronic component 122. The second electronic component 122 does not need to be covered by the molding layer.

[0064] Figure 25 FIG is a schematic cross-sectional view of a package structure 500 according to another embodiment of the present application. Figure 25 As shown, Figure 24 The difference in the illustrated embodiment is that the second encapsulation layer 162 covers the second electronic component 122. At the groove 115 between the first electronic component 121 and the second electronic component 122, the first encapsulation layer 161 extends to one side of the groove 115, and the second encapsulation layer 162 extends to the other side of the groove 115. The second encapsulation layer 162 does not contact the first encapsulation layer 161. A portion of the bottom surface of the groove 115 is exposed between the second encapsulation layer 162 and the first encapsulation layer 161. In this embodiment, the first encapsulation layer 161 and the second encapsulation layer 162 are made of different materials.

[0065] Figure 26 FIG is a schematic cross-sectional view of a package structure 600 according to another embodiment of the present application. Figure 26 As shown, the substrate 110 is separated into a first plane 181 and a second plane 182 by a groove 115. The first electronic component 121 is arranged on the first plane 181. The second electronic component 122 is arranged on the second plane 182. The first plane 181 is higher than the second plane 182, so that the bottom surface and the top surface of the first electronic component 121 can be higher than the bottom surface and the top surface of the second electronic component 122, respectively. In this embodiment, the top surface of the first electronic component 121 is exposed by the first mold sealing layer 161. The top surface of the second electronic component 122 is covered by the second mold sealing layer 162. The top surface of the first mold sealing layer 161, the top surface of the first electronic component 121, and the top surface of the second mold sealing layer 162 can be flush. The side surface of the first mold sealing layer 161 is parallel to the side surface of the second mold sealing layer 162.

[0066] The present application also provides a packaging structure having a lead frame structure. Figure 27 FIG is a schematic cross-sectional view of a package structure 700 according to another embodiment of the present application. Figure 27 As shown, package structure 700 includes a lead frame 710 and a first electronic component 121 attached to lead frame 710. Lead frame 710 may include a groove 115. First electronic component 121 is electrically connected to lead frame 710 via wire bonding 718. First electronic component 121 avoids an area of ​​groove 115. First mold layer 161 covers first electronic component 121 and extends to the side of groove 115 but exposes a portion of the bottom surface of groove 115.

[0067] Figure 28A FIG is a schematic cross-sectional view of a package structure 800 according to another embodiment of the present application. Figure 28A As shown, the package structure 800 includes a lead frame 710 embedded in a dielectric layer 720. The first electronic component 121 can be located in the dielectric layer 720. The first electronic component 121 can be connected to the lead frame 710. The lead frame 710 can include a groove 115. The first electronic component 121 avoids the area of ​​the groove 115. In this embodiment, a mold with a height of 200 μm can be used to form a first mold layer 161 with a mold thickness of 60 μm. Figure 28B Compared with the mold sealing layer 161' formed without the groove 115, the mold sealing thickness formed by using a mold with a height of 200 μm is 180 μm. It can be seen that the technical solution of the present application can produce a lower mold sealing thickness.

[0068] In summary, in the technical solution of the present application, different depth adjustments are made to the substrate, allowing the mold to produce different mold sealing variations without making any changes. From the process, it can be seen that several different heights are first made on the substrate according to the needs, and then the electronic components are set. Next, the mold is mounted on the substrate and the molding material is poured in. After the molding is completed, the mold is removed, and the original mold is used to form the exposed features of the substrate. Then, depending on the product situation, the product can be cut into single pieces or the package can be formed with the substrate as a unit. The protruding part of the substrate left on the edge after cutting can be wired to increase the possibility of electrical connection. More packaging thickness options are provided, and even through the adjustment of the molding thickness, better warping control of the product can be provided, so that there is more room for product design and operability.

[0069] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A packaging structure, characterized in that: include: a substrate including a groove; A first electronic component is disposed on the substrate and avoids an area of ​​the groove; a first molding layer, covering the first electronic component and extending to the side surface of the groove but exposing the bottom surface of the groove; as well as The inner circuit is located in the substrate and extends to the bottom surface of the groove, and electrically connects the substrate with the first electronic component.

2. The packaging structure according to claim 1, wherein: The substrate is divided into a first plane and a second plane by the groove, and the first electronic component is arranged on the first plane. Wherein, the packaging structure further includes a second electronic component arranged on the second plane.

3. The packaging structure according to claim 2, wherein: The first plane is higher than the second plane.

4. The packaging structure according to claim 3, wherein: A top surface of the first electronic component is exposed by the first molding layer.

5. The packaging structure according to claim 2, wherein: Also includes: The second molding layer covers the second electronic component, extends to the other side of the groove, and does not contact the first molding layer.

6. The packaging structure according to claim 5, wherein: The top surface of the first molding layer is flush with the top surface of the second molding layer.

7. The packaging structure according to claim 5, wherein: The side surface of the first molding layer is parallel to the side surface of the second molding layer.

8. The packaging structure according to claim 5, wherein: The first molding layer and the second molding layer are made of different materials.

9. The packaging structure according to claim 2, wherein: Also includes: The third electronic component is disposed on the first plane and is covered by the first molding layer.

10. The packaging structure according to claim 1, wherein: The top surface of the first molding layer and the substrate have at least two different distances in a vertical direction.

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