Printed circuit board easy to dissipate heat

Abstract

The utility model discloses a printed circuit board easy to dissipate heat, which comprises a plurality of LEDs arranged on the surface of an aluminum substrate body, a plurality of movable mechanisms with different sizes are arranged on the surface of the aluminum substrate body, each movable mechanism is composed of a movable seat, a movable cavity and a limiting assembly, the movable cavity is arranged on the inner side of the aluminum substrate body, and the limiting assembly is arranged on the inner side of the aluminum substrate body. The movable seat is arranged in the movable cavity, the limiting assembly is arranged between the movable seat and the movable cavity, the movable seat is of a hollow cylinder structure, and the movable cavity is of a hole-shaped structure; through the designed movable mechanism, the problems that in the using process of an original printed circuit board easy to dissipate heat, when the circuit board is installed at a required position, deviation exists between the circuit board and a plurality of holes in the required position due to production tolerance, and smooth installation cannot be achieved are solved, through the design of the movable mechanism, the positions of the holes in the circuit board can be moved, and the heat dissipation efficiency is improved. And smooth installation of the circuit board is ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, and in particular relates to a printed circuit board which is easy to dissipate heat. Background Art

[0002] A printed circuit board that is easy to dissipate heat is an aluminum substrate with good heat dissipation function. It is generally composed of a three-layer structure, namely a circuit layer, an insulating layer and a metal base layer. It is commonly used in LED lighting products and has two sides. The white side is for welding LED pins, and the other side is aluminum in color. It is generally coated with thermal conductive slurry and then in contact with the heat conductive part. Among them, the insulating layer is the core technology of the aluminum substrate, which mainly plays the functions of bonding, insulation and heat conduction. The aluminum substrate insulating layer is the largest thermal barrier in the power module structure. The better the thermal conductivity of the insulating layer, the more conducive it is to the diffusion of heat generated during device operation, and the more conducive it is to reducing the operating temperature of the device, thereby achieving the purpose of increasing the power load of the module, reducing the volume, extending the life, and increasing power output.

[0003] During use, an existing printed circuit board that is easy to dissipate heat is installed at a desired location. During installation, the circuit board is first fitted to the desired location, and multiple holes for passing bolts between the two are aligned and installed. Due to tolerances in the production of the multiple holes, deviations occur during the alignment process between the circuit board and the multiple holes at the desired location, resulting in problems such as inability to install smoothly. Therefore, the present invention proposes a printed circuit board that is easy to dissipate heat. Utility Model Content

[0004] The purpose of the present invention is to provide a printed circuit board that is easy to dissipate heat, so as to solve the problem of unsmooth installation of the printed circuit board that is easy to dissipate heat proposed in the above background art.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a printed circuit board that is easy to dissipate heat, comprising a plurality of LEDs arranged on the surface of an aluminum substrate body, the surface of the aluminum substrate body being provided with a plurality of movable mechanisms of different sizes, the movable mechanisms being composed of a movable seat, a movable cavity, and a limit assembly, the movable cavity being opened on the inner side of the aluminum substrate body, the movable seat being arranged inside the movable cavity, and the limit assembly being arranged between the movable seat and the movable cavity.

[0006] Preferably, the movable seat is a hollow cylindrical structure, and the movable cavity is a hole-shaped structure.

[0007] Preferably, the top of the movable seat and the top of the aluminum substrate body are in the same horizontal plane, and the bottom of the movable seat and the bottom of the aluminum substrate body are at different heights.

[0008] Preferably, the limiting assembly consists of a movable block and a movable groove, the movable groove is opened on the inner wall of the movable cavity, the movable block is arranged on the inner side of the movable groove, and the inner side of the movable block is fixed to the outer surface of the movable seat.

[0009] Preferably, the movable block is a hollow cylindrical structure.

[0010] Preferably, a plurality of silicone seats are fixed on the surface of the aluminum substrate body, and the inner diameter of the silicone seat is consistent with the inner diameter of the active cavity.

[0011] Preferably, the aluminum substrate body consists of a circuit layer, an insulating layer, and a metal base layer. The circuit layer is arranged on the top of the insulating layer, and the metal base layer is arranged on the bottom of the insulating layer.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] Through the designed movable mechanism, the original printed circuit board that was easy to dissipate heat is improved. During use, when the circuit board is installed at the required position, due to production tolerances, there are deviations between the circuit board and the required positions, resulting in failure to install smoothly. By designing a movable mechanism, the positions of multiple holes on the circuit board can be moved, ensuring the smooth installation of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural diagram of the utility model;

[0015] Figure 2 For this utility model Figure 1 A magnified schematic diagram of the A region in FIG;

[0016] Figure 3 This is a side sectional schematic diagram of the active mechanism of the utility model;

[0017] Figure 4 This is a schematic cross-sectional view of the interior of the aluminum substrate body of the present invention;

[0018] In the figure: 1. Aluminum substrate body; 10. Silicone seat; 11. Circuit layer; 12. Insulation layer; 13. Metal base layer; 2. LED; 3. Movable mechanism; 31. Movable seat; 32. Movable cavity; 33. Limiting assembly; 331. Movable block; 332. Movable slot. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] See also Figures 1 to 4 The present invention provides a technical solution: a printed circuit board that is easy to dissipate heat, comprising a plurality of LEDs 2 arranged on the surface of an aluminum substrate body 1, a plurality of movable mechanisms 3 of different sizes being arranged on the surface of the aluminum substrate body 1, the movable mechanism 3 being composed of a movable seat 31, a movable cavity 32, and a limiting component 33, the movable cavity 32 being opened on the inner side of the aluminum substrate body 1, the movable seat 31 being arranged inside the movable cavity 32, and the limiting component 33 being arranged between the movable seat 31 and the movable cavity 32. Through the designed movable mechanism 3, the original printed circuit board that is easy to dissipate heat is improved during use. When the circuit board is installed at the required position, due to production tolerances, there are deviations between the multiple holes of the circuit board and the required position, resulting in failure to install smoothly. Through the design of the movable mechanism 3, the positions of the multiple holes on the circuit board can be moved, ensuring the smooth installation of the circuit board. The movable seat 31 is a hollow cylindrical structure. The movable cavity 32 is a hole-shaped structure. The top of the movable seat 31 is at the same horizontal plane as the top of the aluminum substrate body 1. The bottom of the movable seat 31 is inconsistent in height with the bottom of the aluminum substrate body 1. The limiting component 33 is composed of a movable block 331 and a movable groove 332. The limiting component 33 makes the position of the hole used for installation on the circuit board movable. The movable groove 332 is opened on the inner wall of the movable cavity 32, and the movable block 331 is arranged on the inner side of the movable groove 332. The inner side of the movable block 331 is fixed to the outer surface of the movable seat 31. The movable block 331 is a hollow cylindrical structure. The aluminum substrate body 1 is composed of a circuit layer 11, an insulating layer 12, and a metal base layer 13. The circuit layer 11 is arranged at the top of the insulating layer 12, and the metal base layer 13 is arranged at the bottom of the insulating layer 12. During operation, the better the thermal conductivity of the insulating layer 12, the heat generated by the surface LED2 is dissipated through the insulating layer 12.

[0021] In this embodiment, preferably, a plurality of silicone seats 10 are fixed on the surface of the aluminum substrate body 1, and the inner diameter of the silicone seat 10 is consistent with the inner diameter of the movable cavity 32. When the circuit board is installed, after the bolt is penetrated, the top part of the bolt squeezes the silicone seat 10 to fix the position of the aluminum substrate body 1 and the movable seat 31, thereby ensuring the stability of the circuit board after installation.

[0022] The working principle and use process of the present invention are as follows: during the installation process of the printed circuit board that is easy to dissipate heat, the printed circuit board that is easy to dissipate heat is fitted to the required position, and the holes between the two are initially aligned. When there is a deviation between the holes, the movable seat 31 is moved so that the movable seat 31 slides on the inner side of the movable cavity 32 through the movable block 331 and the movable groove 332, so that the inner side of the movable seat 31 is aligned with the hole at the required position, and then the subsequent bolt penetration operation is performed. When the printed circuit board that is easy to dissipate heat is in operation, the heat generated by the LED 2 is quickly conducted to the metal base layer 13 through the internal insulation layer 12 of the aluminum substrate body 1, and then the metal base layer 13 transfers the heat away, thereby achieving heat dissipation of the device.

[0023] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A printed circuit board that is easy to dissipate heat, comprising a plurality of LEDs (2) arranged on the surface of an aluminum substrate body (1), characterized in that: The surface of the aluminum substrate body (1) is provided with a plurality of movable mechanisms (3) of different sizes, and the movable mechanism (3) is composed of a movable seat (31), a movable cavity (32), and a limit assembly (33). The movable cavity (32) is opened on the inner side of the aluminum substrate body (1), the movable seat (31) is arranged inside the movable cavity (32), and the limit assembly (33) is arranged between the movable seat (31) and the movable cavity (32). The movable seat (31) is a hollow cylindrical structure, and the movable cavity (32) is a hole-shaped structure. The top of the movable seat (31) is in the same horizontal plane as the top of the aluminum substrate body (1). The bottom end of the movable seat (31) is not in height consistent with the bottom of the aluminum substrate body (1); the limiting assembly (33) is composed of a movable block (331) and a movable groove (332); the movable groove (332) is opened on the inner wall of the movable cavity (32); the movable block (331) is arranged on the inner side of the movable groove (332); the inner side of the movable block (331) is fixed to the outer surface of the movable seat (31); the movable block (331) is a hollow cylindrical structure; a plurality of silicone seats (10) are fixed on the surface of the aluminum substrate body (1); the inner diameter of the silicone seat (10) is consistent with the inner diameter of the movable cavity (32).

2. The printed circuit board according to claim 1, wherein: The aluminum substrate body (1) is composed of a circuit layer (11), an insulating layer (12), and a metal base layer (13); the circuit layer (11) is arranged on the top of the insulating layer (12), and the metal base layer (13) is arranged on the bottom of the insulating layer (12).

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