Circuit board and test fixture

Abstract

The utility model relates to a circuit board and a test fixture, the circuit board comprises a board body, the board body is provided with at least one test area, a test copper layer is laid in the test area, and at least one test reference point conducted with the test copper layer is arranged in the test area. The test copper layer is provided with a plurality of isolation rings which are not conducted with the test copper layer, the diameters of the plurality of isolation rings are sequentially increased, and each isolation ring is correspondingly provided with a test hole. According to the utility model, the alignment degree from the hole to the copper of the product can be rapidly and accurately measured, and the test efficiency and the product quality are improved.

Description

Technical Field

[0001] The utility model relates to the field of circuit board production, in particular to a circuit board and a test fixture. Background Art

[0002] Lamination and drilling are crucial steps in PCB (printed circuit board) manufacturing, crucial for ensuring the board's electrical performance. The precision of interlayer alignment, the accuracy of drill hole placement, and the amount of expansion and contraction during the manufacturing process all require strict control, as these factors can directly impact the risk of opens and shorts on the PCB. In particular, a small hole-to-copper distance can result in contact between the hole and the copper layer, leading to shorts.

[0003] Even if no short circuit issues are discovered during initial processing and testing, the smaller hole-to-copper distance can lead to ion migration (CAF) over time. This phenomenon is particularly common in high-temperature and high-humidity environments. CAF is a particular concern for automotive electronics, which require extremely high reliability and durability.

[0004] Existing circuit boards lack a structure that can quickly and accurately test the alignment of holes to copper, resulting in the inability to effectively control the risks of short circuits and CAF failures on the circuit boards, affecting product quality. Utility Model Content

[0005] The purpose of the utility model is to provide a circuit board and a test fixture, which can quickly and accurately measure the alignment degree of the hole to the copper layer of the product, thereby improving the test efficiency and product quality.

[0006] A circuit board includes a board body, wherein at least one test area is provided on the board body, a test copper layer is laid on the test area, at least one test reference point is provided in the test area and is conductive with the test copper layer, and the test copper layer is provided with a plurality of isolation rings that are not conductive with the test copper layer, wherein the diameters of the plurality of isolation rings increase successively, and each isolation ring is provided with a corresponding test hole.

[0007] In the above technical solution, a test area is provided on the board, and a test copper layer is provided in the test area. A test reference point that is conductive with the test copper layer and an isolation ring that is not conductive with the test copper layer are respectively provided in the test area, and a test hole is provided in the isolation ring. During the test, the test reference point and multiple test holes are connected at the same time. If the test hole in the isolation ring is conductive with the test reference point, it means that the position offset of the test hole in the isolation ring causes the test hole to contact the test copper layer. By setting the diameter of the isolation ring to increase successively, the distance of the hole offset can be judged by the diameter of the corresponding isolation ring. For example, when the test result of the test hole in the isolation ring with a diameter of 5.0 mil is open circuit, and the test result of the test hole in the isolation ring with a diameter of 4.5 mil is short circuit, it can be considered that the actual processed circuit board hole to copper distance is 4.5-5.0 mil, thereby quickly and intuitively measuring the alignment of the product's hole to the copper layer, thereby improving test efficiency and product quality.

[0008] Furthermore, the test area is provided at least one of the four corners of the plate.

[0009] In the above technical solution, the test area is arranged at at least one of the four corners of the board, which can facilitate the layout of the board and facilitate testing.

[0010] Furthermore, the plate includes a main body and a process edge provided on at least one side of the main body, and the test area is provided on the process edge.

[0011] In the above technical solution, the test area is set at the process side, which can avoid occupying the board space and make the overall structure more compact and reasonable.

[0012] Furthermore, the isolation rings are arranged in a row, and the distance between the centers of two adjacent isolation rings is equal.

[0013] In the above technical solution, the isolation rings are arranged in rows, which can facilitate processing on the one hand, and facilitate testing on the other hand, and can intuitively reflect the position of the holes.

[0014] Furthermore, a silk screen is provided on one side of each isolation ring for identifying the diameter of the isolation ring.

[0015] In the above technical solution, by setting the silk screen, the diameter of the isolation ring corresponding to the test hole can be observed more intuitively and conveniently, so as to quickly identify the alignment degree between the hole and the copper.

[0016] Furthermore, the diameter of the test hole is smaller than the diameter of the isolation ring.

[0017] In the above technical solution, the diameter of the test hole is smaller than the diameter of the isolation ring, ensuring that when the hole position is accurate, the isolation ring can surround the test hole, thereby ensuring the accuracy of the test.

[0018] Furthermore, the test copper layer is located in the inner layer or surface layer of the test area.

[0019] A test fixture is used to test the above-mentioned circuit board, comprising at least one reference probe and a plurality of test probes, wherein the reference probe corresponds to the test reference point, and the plurality of test probes are arranged in a one-to-one correspondence with the isolation ring.

[0020] In the above technical solution, during the test, the reference probe is brought into contact with the test reference point, and at the same time, the test probe is brought into contact with the corresponding test hole, that is, whether the test hole and the test reference point are conductive can be identified by an external device such as a computer, thereby determining the alignment degree of the hole to the copper.

[0021] Furthermore, it also includes a plurality of indicator lights for displaying whether the test probe and the reference probe are conductive, and the plurality of indicator lights correspond to the test probes one by one.

[0022] In the above technical solution, indicator lights are set one by one for each test probe. When the test hole is connected to the test reference point, the corresponding indicator light lights up, making it convenient for the operator to intuitively see whether the hole is offset and the probe position corresponding to the offset hole.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows: a test area is provided on the board, a test copper layer is provided in the test area, a test reference point that is conductive with the test copper layer, and an isolation ring that is not conductive with the test copper layer are respectively provided in the test area, and a test hole is provided in the isolation ring. During the test, the test reference point and multiple test holes are connected at the same time. If the test hole in the isolation ring is conductive with the test reference point, it means that the position offset of the test hole in the isolation ring causes the test hole to contact the test copper layer. By setting the diameter of the isolation ring to increase successively, the distance of the hole offset can be judged by the diameter of the corresponding isolation ring. For example, when the test result of the test hole in the isolation ring with a diameter of 5.0 mil is open circuit, and the test result of the test hole in the isolation ring with a diameter of 4.5 mil is short circuit, it can be considered that the actual processed circuit board hole to copper distance is 4.5-5.0 mil, thereby quickly and intuitively measuring the alignment of the product's hole to the copper layer, thereby improving test efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic structural diagram of a circuit board according to the first embodiment of the present invention.

[0025] Figure 2 This is a schematic structural diagram of the test area of ​​an embodiment of the present utility model.

[0026] Figure 3 This is a schematic structural diagram of a circuit board according to a second embodiment of the present invention.

[0027] Figure 4This is a schematic structural diagram of the test fixture of the present utility model.

[0028] Description of Figure Numbers:

[0029] Board body 1, test area 2, test copper layer 3, test reference point 4, isolation ring 5, test hole 6, process edge 7, reference probe 8, test probe 9, indicator light 10, main body 11. DETAILED DESCRIPTION

[0030] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0031] Please refer to Figures 1 to 3 In a preferred embodiment, the circuit board of the present invention mainly includes a board body 1, at least one test area 2 is provided on the board body 1, a test copper layer 3 is laid on the test area 2, at least one test reference point 4 that is conductive with the test copper layer 3 is provided in the test area 2, and a plurality of isolation rings 5 ​​that are not conductive with the test copper layer 3 are opened on the test copper layer 3, the diameters of the plurality of isolation rings 5 ​​increase successively, and each isolation ring 5 is correspondingly provided with a test hole 6.

[0032] To facilitate understanding of the above technical solution, the principle is described below: the test copper layer 3 is located in the inner layer or surface layer of the test area 2, the test reference point 4 is set to 1, and the isolation ring 5 is set to 9. The diameter of the isolation ring 5 increases successively, namely 2.0mil, 2.5mil, 3.0mil, 3.5mil, 4.0mil, 4.5mil, 5.0mil, 5.5mil, and 6.0mil. During the test, if the test hole 6 in the isolation ring 5 with a diameter of 5.0mil tests as an open circuit, and the test hole 6 in the isolation ring 5 with a diameter of 4.5mil tests as a short circuit, it can be considered that the actual processed circuit board hole to copper distance is 4.5-5.0mil.

[0033] As can be seen from the above technical solution, the board 1 is provided with a test area 2, in which a test copper layer 3 is provided. A test reference point 4 that is conductive with the test copper layer 3 and an isolation ring 5 that is not conductive with the test copper layer 3 are respectively provided in the test area 2, and a test hole 6 is provided in the isolation ring 5. During testing, the test reference point 4 and multiple test holes 6 are connected simultaneously. If the test hole 6 in the isolation ring 5 is conductive with the test reference point 4, it means that the position of the test hole 6 in the isolation ring 5 is offset, causing the test hole 6 to contact the test copper layer 3. By setting the diameter of the isolation ring 5 to increase successively, the distance of the hole offset can be determined by the corresponding diameter of the isolation ring 5, thereby quickly and intuitively measuring the alignment of the product's hole to the copper layer, thereby improving testing efficiency and product quality.

[0034] Please refer to Figure 1 In the first embodiment of the present invention, the test area 2 is provided at least one of the four corners of the board 1. By providing the test area 2 at least one of the four corners of the board 1, the layout of the board 1 can be facilitated and the test can be facilitated.

[0035] Please refer to Figure 3 The second embodiment of the present invention differs from the first embodiment in that the plate body 1 includes a main body 11 and a process edge 7 provided on at least one side of the main body 11, and the test area 2 is provided on the process edge 7. Providing the test area 2 on the process edge 7 can avoid occupying space on the plate body 1, making the overall structure more compact and reasonable.

[0036] As a preferred embodiment, the spacer rings 5 ​​are arranged in a row, and the distance between the centers of two adjacent spacer rings 5 ​​is equal. Arranging the spacer rings 5 ​​in a row can facilitate processing on the one hand, and facilitate testing on the other hand, and intuitively reflect the position of the hole.

[0037] A silk screen is provided on one side of each isolation ring 5 to identify the diameter of the isolation ring 5. By providing the silk screen, the diameter of the isolation ring 5 corresponding to the test hole 6 can be observed more intuitively and conveniently, thereby quickly identifying the alignment degree of the hole to the copper.

[0038] The diameter of the test hole 6 is smaller than the diameter of the isolation ring 5, ensuring that when the hole position is accurate, the isolation ring 5 can surround the test hole 6, thereby ensuring the accuracy of the test.

[0039] Please refer to Figure 4 The present invention also provides a test fixture for testing the aforementioned circuit board, comprising at least one reference probe 8 and a plurality of test probes 9. The reference probe 8 corresponds to the test reference point 4, and the plurality of test probes 9 are arranged in a one-to-one correspondence with the isolation ring 5. During testing, the reference probe 8 is brought into contact with the test reference point 4, and the test probes 9 are simultaneously brought into contact with the corresponding test hole 6. This allows an external device, such as a computer, to identify whether the test hole 6 is conductively connected to the test reference point 4, thereby determining the hole-to-copper alignment.

[0040] In this embodiment, the test fixture also includes several indicator lights 10 for indicating whether the test probes 9 and the reference probes 8 are conducting. These indicator lights 10 correspond one to one with the test probes 9. By providing the indicator lights 10, when the test holes 6 are conducting with the test reference points 4, the corresponding indicator lights 10 illuminate, allowing the operator to intuitively determine whether the holes are misaligned and the corresponding probe positions for any misaligned holes.

[0041] It can be understood that in a specific implementation, the test fixture can also be provided with a positioning structure for positioning the circuit board, and a driving mechanism for driving the reference probe 8 and several test probes 9 close to or away from the positioning structure. The positioning structure and the driving mechanism can both adopt the existing structure, which will not be elaborated in this application.

[0042] In the description of the present invention, it should be understood that terms such as "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0044] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board, characterized in that: It includes a board body, on which at least one test area is provided, on which a test copper layer is laid, in which at least one test reference point that is conductive with the test copper layer is provided, and in which a plurality of isolation rings that are not conductive with the test copper layer are provided. The diameters of the plurality of isolation rings increase successively, and each isolation ring is provided with a corresponding test hole.

2. The circuit board according to claim 1, wherein: The test area is arranged at at least one of the four corners of the plate body.

3. The circuit board according to claim 1, wherein: The plate body includes a main body and a process edge arranged on at least one side of the main body, and the test area is arranged on the process edge.

4. The circuit board according to claim 1, wherein: The isolation rings are arranged in a row, and the distance between the centers of two adjacent isolation rings is equal.

5. The circuit board according to claim 1, wherein: A silk screen is provided on one side of each isolation ring for identifying the diameter of the isolation ring.

6. The circuit board according to claim 1, wherein: The diameter of the test hole is smaller than the diameter of the isolation ring.

7. The circuit board according to claim 1, wherein: The test copper layer is located in the inner layer or the surface layer of the test area.

8. A test fixture, characterized in that: Used for testing the circuit board according to any one of claims 1 to 7, comprising at least one reference probe and several test probes, wherein the reference probe corresponds to the test reference point, and the several test probes are arranged in a one-to-one correspondence with the isolation ring.

9. The test fixture according to claim 8, wherein: It also includes several indicator lights for displaying whether the test probe and the reference probe are conducting, and the several indicator lights correspond to the test probes one by one.

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