Refrigeration and heat dissipation module

Abstract

The utility model discloses a refrigeration and heat dissipation module which comprises a TEC, a hot end heat exchanger, a cold end heat exchanger, a hot end heat exchange fan, a cold end heat exchange fan and a fluid soaking device, the cold end heat exchanger is in contact with the refrigeration end of the TEC, one end of the fluid soaking device is in contact with the heating end of the TEC, and the other end of the fluid soaking device is in contact with the hot end heat exchanger; the cold-end heat exchange fan is located on one side of the cold-end heat exchanger, and an air outlet faces the cold-end heat exchanger. The hot end heat exchange fan is arranged on the hot end heat exchanger, and an air outlet faces the hot end heat exchanger. During working, heat of the hot end of the TEC can be efficiently conducted to the hot end heat exchanger through the fluid soaking device, the heat dissipation efficiency is greatly improved, the heat dissipation bottleneck problem of the hot end of a traditional TEC module is effectively solved, and then the refrigeration effect is guaranteed. In addition, the heat-end heat exchanger, the cold-end heat exchanger, the hot-end heat exchange fan and the cold-end heat exchange fan are optimized and improved, the heat-end heat exchanger and the cold-end heat exchange fan are better matched with the TEC, and a better heat dissipation effect is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration and heat dissipation, in particular to a refrigeration and heat dissipation module used in electronic products requiring heat dissipation. Background Art

[0002] In the wireless charging industry, the typical dual-duct cooling and heat dissipation module structure is common. This cooling module primarily consists of a semiconductor refrigeration plate (TEC) coupled with a cold-end convection heat exchange module and a hot-end convection heat exchange module. The cold-end convection heat exchange module provides convection heat to the cold end of the TEC, while the hot end provides convection heat to the hot end of the TEC. Heat conduction between the convection heat exchange module and the cold / hot ends of the TEC is primarily facilitated by the interface material. However, from a thermal perspective, this design has significant drawbacks.

[0003] Under operating conditions, a TEC's COP (thermoelectric cooling efficiency) is generally around 0.5, where COP = cooling capacity / heat generation. This means that for every 1W of cooling generated by the TEC's cold side, the hot side generates approximately 2W of heat. From a thermal design perspective, the hot side requires a fin area at least twice that of the cold side, and the required flow rate should also be at least twice that of the cold side to match the TEC's operating characteristics. However, existing modules often struggle to meet these requirements.

[0004] Considering that the heat flux density at the hot end is approximately twice that of the cold end, if both hot and cold ends utilize similar heat conduction methods, the hot end will become the bottleneck of the thermal design. This is a point that is overlooked in conventional TEC dual-duct cooling modules. Conventional TEC dual-duct cooling modules utilize conventional interface materials, such as thermal grease, to conduct heat between the cold and hot ends, ignoring the fact that the heat flux density at the hot end is greater than that at the cold end, resulting in less than ideal heat dissipation. Utility Model Content

[0005] In view of the above-mentioned shortcomings, the purpose of the present invention is to provide a refrigeration and heat dissipation module with a reasonable structural design and improved heat dissipation effect.

[0006] In order to achieve the above purpose, the technical solution provided by the present utility model is:

[0007] A refrigeration and heat dissipation module includes a TEC, a hot-end heat exchanger, a cold-end heat exchanger, a hot-end heat exchange fan, a cold-end heat exchange fan and a fluid heat equalization device, wherein the cold-end heat exchanger is in contact with the cooling end of the TEC, one end of the fluid heat equalization device is in contact with the heating end of the TEC, and the other end is in contact with the hot-end heat exchanger; the cold-end heat exchange fan is located on one side of the cold-end heat exchanger, and the air outlet of the cold-end heat exchange fan faces the cold-end heat exchanger; the hot-end heat exchange fan is arranged on the hot-end heat exchanger, and the air outlet of the hot-end heat exchange fan faces the hot-end heat exchanger.

[0008] As a preferred embodiment of the present invention, the fluid heat-spreading device is a heat pipe or a vapor chamber. Heat pipes or vapor chambers have high thermal conductivity, with an equivalent thermal conductivity of over 100 times that of copper and over 2,000 times that of thermal grease. Adding a heat pipe or vapor chamber to the hot end can rapidly transfer heat from the TEC to the hot-end heat exchanger, effectively addressing the heat transfer bottleneck of traditional TEC modules, namely, how to more efficiently transfer heat from the hot end to the hot-end heat exchanger.

[0009] As a preferred embodiment of the present invention, the hot-end heat exchanger comprises a plurality of fins secured together using a fin-locking process. Alternatively, the hot-end heat exchanger comprises a base plate and fins formed on the base plate using a skived-tooth process. The fin area of ​​a hot-end heat exchanger manufactured using the fin-locking or skived-tooth process is significantly larger than that of a heat sink manufactured using a die-casting process. This effectively addresses the heat transfer bottleneck of traditional TEC modules, namely, the issue of how to better match the fin area with the heat output of the TEC's hot and cold ends.

[0010] As a preferred embodiment of the present invention, the hot-end heat exchange fan is an axial-flow fan. Axial-flow fans offer high airflow and low noise, effectively removing heat from the hot-end heat exchanger. This effectively alleviates the flow bottleneck issue of traditional TEC modules and better matches TEC thermal design requirements.

[0011] As a preferred embodiment of the present invention, one end of the cold-end heat exchanger is connected to the air outlet of the cold-end heat exchange fan, while the other end is lowered. This lower height significantly reduces the cold-end fin area by nearly 80%, effectively lowering product costs.

[0012] As a preferred solution of the present invention, the cold end heat exchange fan is a centrifugal fan. Centrifugal fans have the characteristics of high wind pressure and long air delivery distance, thereby improving the cooling effect.

[0013] As a preferred embodiment of the present invention, thermal grease or solder is provided between the cold end heat exchanger and the cooling end of the TEC. The thermal grease or solder can fill the small gap between the cold end heat exchanger and the cooling end of the TEC, thereby improving heat conduction efficiency.

[0014] As a preferred solution of the present invention, it also includes an air duct base, and the cold end heat exchanger, the cold end heat exchange fan and the hot end heat exchanger are all on the same surface of the air duct base. The overall structure is compact, small in size and occupies little space.

[0015] The beneficial effects of this utility model are as follows: The structure of this utility model is rationally designed. The fluid heat equalization device efficiently transfers heat from the hot end of the TEC to the hot end heat exchanger, greatly improving heat dissipation efficiency and effectively resolving the hot end heat dissipation bottleneck of traditional TEC modules, thereby ensuring cooling performance. Furthermore, the hot and cold end heat exchangers, as well as the hot and cold end heat exchange fans, have been optimized and improved to better match the TEC and achieve even better heat dissipation.

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural diagram of the utility model.

[0018] Figure 2 It is a schematic diagram of the exploded structure of the present utility model.

[0019] Figure 3 This is a schematic diagram of the structure of the utility model installed on the air duct base Figure 1 .

[0020] Figure 4 This is a schematic diagram of the structure of the utility model installed on the air duct base Figure 2 . DETAILED DESCRIPTION

[0021] For example, see Figure 1 and Figure 2 This embodiment provides a cooling and heat dissipation module comprising a TEC 1, a hot-end heat exchanger 2, a cold-end heat exchanger 3, a hot-end heat exchange fan 4, a cold-end heat exchange fan 5, and a fluid heat equalization device 6. The cold-end heat exchanger 3 contacts the cooling end of the TEC 1. Preferably, thermal grease or solder is provided between the cold-end heat exchanger 3 and the cooling end of the TEC 1. The thermal grease or solder can fill the small gap between the cold-end heat exchanger 3 and the cooling end of the TEC 1, thereby improving heat transfer efficiency.

[0022] One end of the fluid heat equalizing device 6 is in contact with the heating end of the TEC1, and the other end is in contact with the hot end heat exchanger 2; preferably, the fluid heat equalizing device 6 is preferably a heat pipe. In other embodiments, the fluid heat equalizing device 6 can also be a heat spreader. The heat pipe or heat spreader has a high thermal conductivity. The equivalent thermal conductivity of the heat pipe and heat spreader is more than 100 times that of copper alone, and can reach more than 2000 times that of thermal grease. Adding a heat pipe or heat spreader at the hot end can quickly transfer the heat of the TEC1 to the hot end heat exchanger 2, effectively improving the heat transfer bottleneck problem of the traditional TEC module, that is, how to effectively transfer the hot end heat to the hot end heat exchanger 2 more effectively.

[0023] The cold-end heat exchange fan 5 is located to one side of the cold-end heat exchanger 3, with its outlet facing the cold-end heat exchanger 3. Preferably, one end of the cold-end heat exchanger 3 is aligned with the outlet of the cold-end heat exchange fan 5, while the other end is lowered. This reduction in the height of the cold-end heat exchanger 3 significantly reduces the area of ​​the cold-end fins by nearly 80%, effectively lowering product costs. The cold-end heat exchange fan 5 is preferably a centrifugal fan. Centrifugal fans offer high air pressure and long air delivery distances, enhancing cooling efficiency.

[0024] The hot-end heat exchange fan 4 is disposed on the hot-end heat exchanger 2, and the air outlet of the hot-end heat exchange fan 4 faces the hot-end heat exchanger 2. In this embodiment, the hot-end heat exchanger 2 includes a plurality of fins fixed together using a buckle FIN process. In other embodiments, the hot-end heat exchanger 2 may also include a substrate and fins formed on the substrate using a skiving process. The hot-end heat exchanger 2 manufactured using the buckle FIN process or the skiving process has a fin area that is much larger than that of a heat sink manufactured using a die-casting process. This effectively improves the heat exchange bottleneck problem of traditional TEC modules, namely, how to make the fin area more compatible with the heat of the hot and cold ends of TEC1.

[0025] The hot-end heat exchange fan 4 is preferably an axial-flow fan. Axial-flow fans offer high airflow and low noise, effectively removing heat from the hot-end heat exchanger 2. This effectively alleviates the flow bottleneck issue of traditional TEC modules and better matches TEC thermal design requirements.

[0026] See also Figure 3 and Figure 4The present cooling and heat dissipation module also includes an air duct base 7, one surface of which is provided with a flow groove 71 adapted to the shape of the fluid heat equalizer 6. The flow groove 71 is used to accommodate the fluid heat equalizer 6. After installation, the cold-end heat exchanger 3, the cold-end heat exchange fan 5, and the hot-end heat exchanger 2 are all mounted on one surface of the air duct base 7. The air duct base 7 is provided with a cold-end air duct that connects to the cold-end heat exchanger 3. The overall structure is compact, small in size, and takes up little space.

[0027] During operation, TEC1 is powered on, and the cooling end of TEC1 begins cooling, while the heating end begins heating. The cooling capacity of the TEC's cooling end is transferred to the cold-end heat exchanger 3 via thermal grease or solder. The cold-end heat exchange fan 5 drives air through the cold-end heat exchanger 3, where the air exchanges heat with the fins of the cold-end heat exchanger 3. The air temperature decreases as it passes through the fins of the cold-end heat exchanger 3, and the cooled air is guided through the cold-end air duct to the desired cooling location. The heat generated by the TEC's heating end is transferred to the hot-end fins via a heat pipe or vapor chamber. The axial fan in the hot-end air duct drives air through the hot-end fins, where the air exchanges heat with the hot-end heat exchanger 2. The air temperature increases as it passes through the fins of the hot-end heat exchanger 2 and dissipates into the surrounding environment, effectively resolving the hot-end heat dissipation bottleneck problem of traditional TEC modules and ensuring effective cooling.

[0028] Based on the disclosure and teachings of the above description, those skilled in the art to which the present invention belongs may also make changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should also fall within the scope of protection of the claims of the present invention. In addition, although some specific terms are used in this description, these terms are only for convenience of description and do not constitute any limitation to the present invention. As described in the above embodiments of the present invention, other refrigeration and heat dissipation modules obtained by using the same or similar structures are all within the scope of protection of the present invention.

Claims

1. A cooling and heat dissipation module, comprising a TEC, characterized in that: It also includes a hot-end heat exchanger, a cold-end heat exchanger, a hot-end heat exchange fan, a cold-end heat exchange fan and a fluid heat equalization device. The cold-end heat exchanger is in contact with the cooling end of the TEC, one end of the fluid heat equalization device is in contact with the heating end of the TEC, and the other end is in contact with the hot-end heat exchanger; the cold-end heat exchange fan is located on one side of the cold-end heat exchanger, and the air outlet of the cold-end heat exchange fan is facing the cold-end heat exchanger; the hot-end heat exchange fan is arranged on the hot-end heat exchanger, and the air outlet of the hot-end heat exchange fan is facing the hot-end heat exchanger.

2. The refrigeration and heat dissipation module according to claim 1, characterized in that: The fluid heat equalizing device is a heat pipe or a heat equalizing plate.

3. The refrigeration and heat dissipation module according to claim 1, characterized in that: The hot end heat exchanger includes a plurality of fins fixed together using a FIN process.

4. The refrigeration and heat dissipation module according to claim 1, characterized in that: The hot end heat exchanger includes a base plate and fins formed on the base plate by using a skiving process.

5. The refrigeration and heat dissipation module according to claim 1, characterized in that: The hot end heat exchange fan is an axial flow fan.

6. The refrigeration and heat dissipation module according to claim 1, characterized in that: One end of the cold end heat exchanger is connected to the air outlet of the cold end heat exchange fan, and the other end is lowered in height.

7. The refrigeration and heat dissipation module according to claim 1 or 6, characterized in that: The cold end heat exchange fan is a centrifugal fan.

8. The refrigeration and heat dissipation module according to claim 1 or 6, characterized in that: Thermal conductive silicone grease or solder is provided between the cold end heat exchanger and the cooling end of the TEC.

9. The refrigeration and heat dissipation module according to any one of claims 1 to 6, characterized in that: It also includes an air duct base, and the cold end heat exchanger, the cold end heat exchange fan and the hot end heat exchanger are all on the same surface of the air duct base.

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