Cold plate heat dissipation mechanism and semiconductor test equipment

Abstract

The utility model relates to the technical field of semiconductors, and discloses a cold plate heat dissipation mechanism and semiconductor test equipment. The cold plate heat dissipation mechanism comprises a cold plate assembly, a boss is arranged on the side wall of the cold plate assembly, a heat dissipation flow channel is arranged in the area, without the boss, of the cold plate assembly, a sinking flow channel communicated with the heat dissipation flow channel is arranged in the boss, and the heat dissipation flow channel and the sinking flow channel are used for circulating a cooling medium. The side wall of the sinking flow channel sinks into the boss relative to the side wall of the heat dissipation flow channel. By arranging the boss, the distance between the device of the board card and the cold plate is reduced, and the thermal resistance is reduced; moreover, the sinking flow channel is arranged in the boss, so that the flow resistance of the cooling medium in the sinking flow channel is reduced, the heat exchange efficiency is improved, the distance between the cooling medium and the device is reduced, the thermal resistance is further reduced, the device can be cooled, and the temperature drift of the device on the board card can be reduced. According to the utility model, the flexibility of the flow channel in the cold plate assembly is improved, and the temperature fluctuation of a temperature drift area needing to be focused is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a cold plate heat dissipation mechanism and semiconductor testing equipment. Background Art

[0002] With the continuous development of the semiconductor equipment industry, the functions required of semiconductor test equipment have become increasingly sophisticated and diverse. Miniaturization and high-integration of semiconductor-related components have become the current development trend of semiconductor products. However, the heat flux density of each component is increasing with miniaturization and high-integration. With the increasing number of components on a single board, chip loss is a current technological reality that cannot be overcome. Therefore, heat dissipation has become a difficult problem that semiconductor-related equipment needs to overcome.

[0003] In existing technology, a circuit board is populated with a variety of devices of varying sizes. Conventional cold plates have uniform flow channel thickness, maintaining a constant distance between the cold plate and the circuit board. Heat generated by the devices is primarily transferred to the cold plate via the thermally conductive material above them. However, because thermally conductive material has a certain thermal resistance, the thicker the thermal conductive material, the greater the thermal resistance between the device and the cold plate. This results in higher heat dissipation in smaller devices, making it difficult to meet production requirements.

[0004] Based on this, there is an urgent need for a cold plate heat dissipation mechanism and semiconductor testing equipment to solve the above problems. Utility Model Content

[0005] Based on the above, the purpose of the present invention is to provide a cold plate heat dissipation mechanism and semiconductor testing equipment, which improves the flexibility of the flow channel in the cold plate assembly, expands the range of applicable scenarios, and reduces the size of temperature fluctuations in the temperature drift area that needs to be focused on.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] On the one hand, a cold plate heat dissipation mechanism is provided, including a cold plate assembly, wherein a boss is provided on the side wall of the cold plate assembly, a heat dissipation channel is provided in the area of ​​the cold plate assembly where the boss is not provided, a sinking channel connected to the heat dissipation channel is provided in the boss, the heat dissipation channel and the sinking channel are used to circulate cooling medium, and the side wall of the sinking channel is sunk into the boss relative to the side wall of the heat dissipation channel.

[0008] As an optimal technical solution for a cold plate heat dissipation mechanism, a plurality of fins are evenly arranged in the downward flow channel.

[0009] As an optimal technical solution of a cold plate heat dissipation mechanism, the cold plate heat dissipation mechanism further includes a heat pipe, which is connected to one end of the cold plate assembly and is used to fit the device to be cooled.

[0010] As an optimal technical solution of a cold plate heat dissipation mechanism, a mounting groove is provided at one end of the cold plate assembly, the heat pipe is embedded in the mounting groove, and the heat pipe is welded to the cold plate assembly.

[0011] As an optimal technical solution for a cold plate heat dissipation mechanism, the heat dissipation channel includes a coolant inlet channel and a coolant outlet channel, and the coolant inlet channel, the sinking channel and the coolant outlet channel are connected in sequence.

[0012] As an optimal technical solution for a cold plate heat dissipation mechanism, the cold plate assembly includes an upper cover and a lower cover, one of the upper cover and the lower cover is provided with a flow rib, and the upper cover is connected to the lower cover so that the heat dissipation flow channel and the sinking flow channel are formed between the upper cover, the flow rib and the lower cover.

[0013] As an optimal technical solution for a cold plate heat dissipation mechanism, the bosses are symmetrically provided on both sides of the cold plate assembly.

[0014] As an optimal technical solution for a cold plate heat dissipation mechanism, the cold plate assembly is an aluminum alloy cold plate.

[0015] As an optimal technical solution for a cold plate heat dissipation mechanism, the heat pipe is a copper alloy heat pipe.

[0016] On the other hand, a semiconductor testing device is provided, comprising a board and a cold plate heat dissipation mechanism as described in any of the above schemes, wherein the cold plate heat dissipation mechanism is arranged on one side of the board and is used to dissipate heat from the board.

[0017] The beneficial effects of the utility model are:

[0018] The utility model provides a cold plate heat dissipation mechanism and semiconductor testing equipment. The side wall of the cold plate assembly is provided with a boss. The boss can be provided at a position opposite to a smaller device. When the distance between the cold plate assembly and the board is small, the boss is provided to reduce the distance between the device on the board and the cold plate, thereby reducing thermal resistance. In addition, a sinking flow channel is provided inside the boss. The side wall of the sinking flow channel sinks into the boss relative to the side wall of the heat dissipation flow channel, reducing the flow resistance of the cooling medium in the sinking flow channel, improving heat exchange efficiency, and reducing the distance between the cooling medium and the device, further reducing thermal resistance, which is more conducive to cooling the device and reducing the temperature drift of the device on the board. The utility model improves the flexibility of the flow channel within the cold plate assembly, making it applicable to a wider range of scenarios and reducing the size of temperature fluctuations in the temperature drift area that requires special attention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0020] Figure 1 This is a structural diagram of a cold plate heat dissipation mechanism provided by a specific embodiment of the utility model;

[0021] Figure 2 It is a structural explosion diagram of the cold plate heat dissipation mechanism provided in a specific embodiment of the present utility model.

[0022] The following are marked in the figure:

[0023] 1. Cold plate assembly; 11. Boss; 12. Downflow channel; 13. Heat dissipation channel; 131. Coolant inlet channel; 132. Coolant outlet channel; 14. Fin; 15. Mounting slot; 16. Upper cover; 17. Lower cover; 171. Channel ribs;

[0024] 2. Heat pipe. DETAILED DESCRIPTION

[0025] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0026] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0027] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0028] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are used to refer to positions or locations based on the positions or locations shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0029] In existing technology, a circuit board is populated with a variety of devices of varying sizes. Conventional cold plates have uniform flow channel thickness, maintaining a constant distance between the cold plate and the circuit board. Heat generated by the devices is primarily transferred to the cold plate via the thermally conductive material above them. However, because thermally conductive material has a certain thermal resistance, the thicker the thermal conductive material, the greater the thermal resistance between the device and the cold plate. This results in higher heat dissipation in smaller devices, making it difficult to meet production requirements.

[0030] To solve the above problems, Figure 1 and Figure 2 As shown, this embodiment provides a cold plate heat dissipation mechanism, which includes a cold plate assembly 1. The sidewall of the cold plate assembly 1 is provided with a boss 11. The area of ​​the cold plate assembly 1 not provided with the boss 11 is provided with a heat dissipation channel 13. The boss 11 is provided with a sinking channel 12 connected to the heat dissipation channel 13. The heat dissipation channel 13 and the sinking channel 12 are used to circulate a cooling medium. The sidewall of the sinking channel 12 is sunken into the boss 11 relative to the sidewall of the heat dissipation channel 13. In this embodiment, the cooling medium is a coolant.

[0031] The side wall of the cold plate assembly 1 is provided with a boss 11. The boss 11 can be provided at a position opposite to a smaller device. When the distance between the cold plate assembly 1 and the board is small, the boss 11 is provided to reduce the distance between the device on the board and the cold plate, thereby reducing thermal resistance. Moreover, a sinking channel 12 is provided inside the boss 11. The side wall of the sinking channel 12 sinks into the boss 11 relative to the side wall of the heat dissipation channel 13, thereby reducing the flow resistance of the cooling medium in the sinking channel 12, improving heat exchange efficiency, and reducing the distance between the cooling medium and the device, further reducing thermal resistance, and being more conducive to cooling the device, thereby reducing the temperature drift of the device on the board. This embodiment improves the flexibility of the flow channel in the cold plate assembly 1, making it applicable to a wider range of scenarios and reducing the size of temperature fluctuations in the temperature drift area that requires special attention.

[0032] Preferably, a plurality of fins 14 are evenly arranged in the downflow channel 12. The fins 14 extend to the interior of the boss 11, and the height of the fins 14 is greater than the thickness of the heat dissipation channel 13. The height of the fins 14 is consistent with the thickness of the downflow channel 12, fully utilizing the thickness of the cold plate assembly 1. Firstly, the heat exchange area between the coolant and the fins 14 can be increased; secondly, the flow resistance of the coolant can be reduced, thereby increasing the heat exchange efficiency; and thirdly, the heat transfer resistance of the device in the cold plate assembly 1 can be reduced. Therefore, the fins 14 in the downflow channel 12 can effectively improve the heat dissipation efficiency of the device.

[0033] Since part of the device to be cooled is located at one end of the cold plate assembly 1, the device to be cooled may be a chip, and the contact area between the device to be cooled and the cold plate assembly 1 is small, resulting in poor heat dissipation efficiency. Preferably, the cold plate heat dissipation mechanism also includes a heat pipe 2, which is connected to one end of the cold plate assembly 1 and is used to fit the device to be cooled. The heat pipe 2 has high thermal conductivity. By arranging the heat pipe 2 between the device to be cooled and the cold plate assembly 1, the device to be cooled effectively transfers heat to the heat pipe 2. The length of the heat pipe 2 is long, so the contact area between the heat pipe 2 and the cold plate assembly 1 is large, which improves the heat transfer efficiency between the heat pipe 2 and the cold plate assembly 1, thereby improving the heat dissipation efficiency of the device to be cooled.

[0034] In this embodiment, the device to be cooled is located at one end of the cold plate assembly 1 along the first direction, and there are two heat pipes 2 extending along the second direction. The first direction is X, the second direction is Y, and the second direction is perpendicular to the first direction. The heat pipe 2 evenly distributes the heat of the device to be cooled to the cold plate, reduces the diffusion thermal resistance along the second direction, and evenly distributes the heat of the device to be cooled to the cold plate assembly 1, thereby reducing the temperature drift of the device to be cooled.

[0035] Furthermore, a mounting groove 15 is provided at one end of the cold plate assembly 1, the heat pipe 2 is embedded in the mounting groove 15, and the heat pipe 2 is welded to the cold plate assembly 1, and the side walls of the mounting groove 15 are in contact with the heat pipe 2, so that the temperature of the cold plate assembly 1 is more uniform, which is more conducive to temperature uniformity, improves heat transfer efficiency, and further improves the heat dissipation efficiency of the device to be cooled.

[0036] In this embodiment, the cold plate assembly 1 is an aluminum alloy cold plate, which has excellent thermal conductivity and heat resistance.

[0037] The heat pipe 2 is a copper alloy heat pipe. Copper alloy heat pipes have excellent thermal conductivity, which is better than that of aluminum alloy cold plates, so that the heat pipe 2 can quickly and effectively transfer heat from the device to be cooled to the cold plate assembly 1.

[0038] Furthermore, the heat dissipation channel 13 includes a coolant inlet channel 131 and a coolant outlet channel 132. The coolant inlet channel 131, the downflow channel 12, and the coolant outlet channel 132 are sequentially connected. During operation, the cooling medium can enter through the coolant inlet channel 131, then flow through the downflow channel 12, and finally be discharged through the coolant outlet channel 132, ensuring the flow of the cooling medium and fully dissipating heat from the board.

[0039] In this embodiment, the cold plate assembly 1 includes an upper cover 16 and a lower cover 17. One of the upper cover 16 and the lower cover 17 is provided with a flow channel rib 171. The upper cover 16 is connected to the lower cover 17 so that a heat dissipation flow channel 13 and a sinking flow channel 12 are formed between the upper cover 16, the flow channel rib 171 and the lower cover 17. The upper cover 16 and the lower cover 17 can be connected by welding to form the heat dissipation flow channel 13 and the sinking flow channel 12.

[0040] In this embodiment, bosses 11 are symmetrically provided on both sides of the cold plate assembly 1. In this embodiment, two boards are symmetrically provided on both sides of the cold plate assembly 1. The bosses 11 on both sides of the cold plate assembly 1 can effectively dissipate heat for the smaller components of the two boards, thereby improving heat dissipation efficiency.

[0041] This embodiment also provides a semiconductor testing device, including a board and the above-mentioned cold plate heat dissipation mechanism. The cold plate heat dissipation mechanism is arranged on one side of the board. The cold plate heat dissipation mechanism is used to dissipate heat from the board, thereby improving the effective heat dissipation of various components on the board and meeting the temperature drift requirements of the components during the production process.

[0042] Note that the above are merely preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions are possible for those skilled in the art without departing from the scope of protection of the present invention. Therefore, while the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the scope of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A cold plate heat dissipation mechanism, characterized in that: The invention comprises a cold plate assembly (1), wherein a boss (11) is provided on a side wall of the cold plate assembly (1), a heat dissipation channel (13) is provided in an area of ​​the cold plate assembly (1) where the boss (11) is not provided, a sinking channel (12) in communication with the heat dissipation channel (13) is provided in the boss (11), the heat dissipation channel (13) and the sinking channel (12) are used for circulating a cooling medium, and a side wall of the sinking channel (12) is sunken into the boss (11) relative to a side wall of the heat dissipation channel (13).

2. The cold plate heat dissipation mechanism according to claim 1, characterized in that: A plurality of fins (14) are evenly arranged in the downward flow channel (12).

3. The cold plate heat dissipation mechanism according to claim 1, characterized in that: The cold plate heat dissipation mechanism further comprises a heat pipe (2), the heat pipe (2) being connected to one end of the cold plate assembly (1), and the heat pipe (2) being used to fit the device to be dissipated.

4. The cold plate heat dissipation mechanism according to claim 3, characterized in that: One end of the cold plate assembly (1) is provided with a mounting groove (15), the heat pipe (2) is embedded in the mounting groove (15), and the heat pipe (2) is welded to the cold plate assembly (1).

5. The cold plate heat dissipation mechanism according to claim 1, characterized in that: The heat dissipation channel (13) comprises a cooling liquid inlet channel (131) and a cooling liquid outlet channel (132), and the cooling liquid inlet channel (131), the sinking channel (12) and the cooling liquid outlet channel (132) are connected in sequence.

6. The cold plate heat dissipation mechanism according to any one of claims 1 to 5, characterized in that: The cold plate assembly (1) comprises an upper cover (16) and a lower cover (17), one of the upper cover (16) and the lower cover (17) being provided with a flow channel rib (171), and the upper cover (16) being connected to the lower cover (17) so that the heat dissipation flow channel (13) and the sinking flow channel (12) are formed between the upper cover (16), the flow channel rib (171) and the lower cover (17).

7. The cold plate heat dissipation mechanism according to claim 1, characterized in that: The bosses (11) are symmetrically arranged on both sides of the cold plate assembly (1).

8. The cold plate heat dissipation mechanism according to claim 1, characterized in that: The cold plate assembly (1) is an aluminum alloy cold plate.

9. The cold plate heat dissipation mechanism according to claim 3, characterized in that: The heat pipe (2) is a copper alloy heat pipe.

10. A semiconductor testing device, characterized in that: It comprises a board and a cold plate heat dissipation mechanism according to any one of claims 1 to 9, wherein the cold plate heat dissipation mechanism is arranged on one side of the board and is used to dissipate heat from the board.

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