Liquid cooling radiator, liquid cooling system and frequency converter

Abstract

The utility model discloses a liquid cooling radiator, a liquid cooling system and a frequency converter, and relates to the technical field of liquid cooling heat dissipation. The liquid cooling radiator comprises a plate body, the plate body is provided with a liquid inlet and a liquid outlet, the surface of the plate body is provided with an installation position for installing a heating device, a flow channel communicated with the liquid inlet and the liquid outlet is arranged in the plate body, the flow channel comprises a first flow path and a second flow path which are communicated with each other, and the first flow path and the second flow path are arranged on a projection plane in the thickness direction of the plate body. The projection of the first flow path and the projection of the mounting position are staggered, the projection of the second flow path coincides with the projection of at least part of the mounting position, and the height of the second flow path is smaller than that of the first flow path in the thickness direction of the plate body. According to the utility model, the flow velocity of the cooling liquid in the second flow path is increased, and the overall heat dissipation efficiency of the liquid cooling radiator is further enhanced; meanwhile, it is ensured that the overall flow resistance of a flow path cannot be excessively increased, and the possibility that the flow of cooling liquid is insufficient is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid cooling and heat dissipation, in particular to a liquid cooling radiator, a liquid cooling system and a frequency converter. Background Art

[0002] In related technologies, liquid cooling plates are a key component in the inverter's liquid cooling system. They achieve cooling by circulating coolant through the flow channels within the plate. To achieve a higher convective heat transfer coefficient, existing liquid cooling plates often reduce the cross-sectional area of ​​the flow channels to increase the coolant flow rate. However, excessively reducing the flow channel cross-sectional area increases the flow resistance, resulting in insufficient coolant flow and reduced cooling effectiveness. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a liquid cooling radiator that can increase the flow rate of the coolant without excessively increasing the flow resistance of the flow channel, thereby improving the heat dissipation efficiency.

[0004] The utility model also provides a liquid cooling system and a frequency converter having the liquid cooling radiator.

[0005] According to the liquid-cooled radiator of the first aspect embodiment of the present utility model, it includes: a plate body, the plate body is provided with a liquid inlet and a liquid outlet, the surface of the plate body is provided with a mounting position for installing a heating device, the plate body is provided with a flow channel connected to the liquid inlet and the liquid outlet, the flow channel includes a first flow path and a second flow path connected to each other, on the projection surface along the thickness direction of the plate body, the projection of the first flow path and the projection of the mounting position are staggered, the projection of the second flow path coincides with the projection of at least part of the mounting position, and along the thickness direction of the plate body, the height of the second flow path is less than the height of the first flow path.

[0006] The liquid cooling radiator according to the embodiment of the utility model has at least the following beneficial effects:

[0007] The liquid-cooled radiator of the embodiment of the present invention is provided with a flow channel in the plate body, wherein the flow channel includes a first flow channel and a second flow channel. On the projection surface along the thickness direction of the plate body, the projection of the first flow channel and the projection of the installation position are staggered, and the projection of the second flow channel coincides with the projection of at least part of the installation position, so that the second flow channel can effectively dissipate heat; in addition, along the thickness direction of the plate body, the height of the second flow channel is less than the height of the first flow channel, thereby reducing the cross-sectional area of ​​the second flow channel, increasing the flow rate of the coolant in the second flow channel, and increasing the convection heat transfer coefficient corresponding to the second flow channel, thereby enhancing the overall heat dissipation efficiency of the liquid-cooled radiator; at the same time, the first flow channel is maintained at a higher height, thereby ensuring that the overall flow resistance of the flow channel does not increase excessively, reducing the possibility of insufficient coolant flow.

[0008] According to some embodiments of the present utility model, the plate body includes a base plate and a cover plate, the surface of the base plate is provided with a first groove and a second groove, the depth of the second groove is less than the depth of the first groove, the mounting position is provided on the cover plate, the cover plate covers the surface of the base plate, the cover plate and the first groove define the first flow path, and the cover plate and the second groove define the second flow path.

[0009] According to some embodiments of the present invention, the liquid-cooled radiator also includes cooling fins, which are arranged in the second flow path, and the cooling fins are arranged along the extension direction of the second flow path. The cooling fins are connected to the cover plate to conduct the heat of the cover plate to the coolant in the flow channel.

[0010] According to some embodiments of the present invention, the heat dissipation fins include a plurality of heat dissipation plates and a plurality of connecting plates, the plurality of heat dissipation plates are arranged at intervals along the width direction of the second flow path, and each of the heat dissipation plates is provided with the connecting plates at both ends along the height direction of the second flow path, one of the connecting plates is fitly connected to the cover plate, and the other connecting plate is fitly connected to the bottom plate.

[0011] According to some embodiments of the present invention, a channel is formed between adjacent heat dissipation plates, and the channel is bent along the extension direction of the second flow path, or the channel includes at least one bent section.

[0012] According to some embodiments of the present invention, the cover plate and the bottom plate are respectively fixed to the connecting plate by welding.

[0013] According to some embodiments of the present invention, at least two installation areas are provided on the surface of the plate body, each of the installation areas is provided with the installation position, at least two of the installation areas are spaced apart on the surface of the plate body, at least two second flow paths are provided, at least two of the second flow paths are arranged in a one-to-one correspondence with at least two of the installation areas, two adjacent second flow paths are connected through the first flow path, the heating device includes an insulated gate bipolar transistor and a rectifier bridge, and the insulated gate bipolar transistor and the rectifier bridge are installed in two of the installation areas in sequence along the flow direction of the coolant.

[0014] According to some embodiments of the present invention, the heating device includes a first element, and the first element is respectively provided with second through holes at both ends along the width direction of the second flow path. On the projection surface along the thickness direction of the plate body, the projection of the second through hole and the projection of the second flow path are staggered. The base plate is provided with a first mounting hole, and the first mounting hole is spaced apart from the second flow path. The cover plate is provided with a first through hole corresponding to the first mounting hole. The liquid-cooled radiator also includes a first fastener, and the first fastener is passed through the second through hole, the first through hole and the first mounting hole to fasten the first element to the cover plate.

[0015] According to some embodiments of the present invention, the heating device includes a second element, and on the projection surface along the thickness direction of the plate body, the projection of the second element is located within the outer contour line of the projection of the second flow path, and two fixing parts are provided in the second flow path, and the two fixing parts are connected to the base plate, and the two fixing parts are respectively provided with second mounting holes, the cover plate is provided with a third through hole corresponding to the second mounting hole, and the second element is provided with a fourth through hole, and the liquid-cooled radiator also includes a second fastener, and the second fastener is passed through the fourth through hole, the third through hole and the second mounting hole to fasten the second element to the cover plate.

[0016] According to some embodiments of the present invention, the liquid inlet and the liquid outlet are first circular holes, and the liquid cooling radiator also includes a joint, which is provided with a second circular hole. The joint is fixed to the plate body so that the second circular hole is connected to the first circular hole, and the aperture of the second circular hole is larger than the aperture of the first circular hole.

[0017] According to the liquid cooling system of the second aspect embodiment of the present invention, it includes a power device, a liquid inlet pipe, a liquid outlet pipe and the liquid cooling radiator described in the first aspect embodiment, the liquid inlet pipe is connected to the liquid inlet, the liquid outlet pipe is connected to the liquid outlet, and the power device is used to drive the coolant to flow in the flow channel.

[0018] The liquid cooling system according to the embodiment of the present invention has at least the following beneficial effects:

[0019] The liquid cooling system of the embodiment of the present utility model adopts the liquid cooling radiator of the embodiment of the first aspect, and a flow channel is arranged in the plate body, wherein the flow channel includes a first flow channel and a second flow channel. On the projection surface along the thickness direction of the plate body, the projection of the first flow channel and the projection of the installation position are staggered, and the projection of the second flow channel coincides with the projection of at least part of the installation position, so that the second flow channel can effectively dissipate heat; in addition, along the thickness direction of the plate body, the height of the second flow channel is less than the height of the first flow channel, thereby reducing the cross-sectional area of ​​the second flow channel, increasing the flow rate of the coolant in the second flow channel, and increasing the convection heat transfer coefficient corresponding to the second flow channel, thereby enhancing the overall heat dissipation efficiency of the liquid cooling system and improving the heat dissipation performance of the liquid cooling system; at the same time, the first flow channel is maintained at a higher height, thereby ensuring that the overall flow resistance of the flow channel does not increase excessively, reducing the possibility of insufficient coolant flow, and thereby improving the reliability of the liquid cooling system.

[0020] The frequency converter according to the third embodiment of the present invention includes a heating device and the liquid cooling system according to the second embodiment, wherein the heating device is fixedly connected to the installation position.

[0021] The frequency converter according to the embodiment of the present utility model has at least the following beneficial effects:

[0022] The inverter of the embodiment of the present utility model adopts the liquid cooling system of the embodiment of the second aspect. By optimizing the structure of the liquid cooling radiator, the overall heat dissipation efficiency and heat dissipation performance of the liquid cooling system are improved. When the inverter is running, the heat generated by the heating device can be carried away by the coolant more quickly, reducing the risk of the heating device affecting the performance due to overheating, thereby reducing the failure rate of the inverter, and further improving the reliability of the inverter, which helps to extend the service life of the inverter.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0025] Figure 1 This is a structural diagram of a liquid cooling radiator according to an embodiment of the present invention;

[0026] Figure 2 This is a partial perspective diagram of a liquid cooling radiator according to an embodiment of the present invention;

[0027] Figure 3 This is a schematic structural diagram of a bottom plate according to an embodiment of the present invention;

[0028] Figure 4 for Figure 3Schematic cross-section in the middle BB direction;

[0029] Figure 5 This is an exploded diagram of a liquid cooling radiator according to an embodiment of the present invention;

[0030] Figure 6 This is a schematic top view of a base plate according to an embodiment of the present invention;

[0031] Figure 7 This is a schematic structural diagram of a base plate according to another embodiment of the present invention;

[0032] Figure 8 for Figure 7 A partial enlarged view of point C in the middle;

[0033] Figure 9 This is a schematic structural diagram of a heat dissipation fin according to an embodiment of the present invention;

[0034] Figure 10 This is a schematic structural diagram of a heat dissipation fin according to another embodiment of the present invention;

[0035] Figure 11 This is a schematic structural diagram of a heat dissipation fin according to another embodiment of the present invention;

[0036] Figure 12 This is a schematic structural diagram of a heat dissipation fin according to another embodiment of the present invention;

[0037] Figure 13 for Figure 2 A partial enlarged view of point A in the middle.

[0038] Figure Number:

[0039] Liquid cooling radiator 1000; heating device 2000;

[0040] Plate 100; bottom plate 110; liquid inlet 111; liquid outlet 112; first circular hole 1121; first groove 113; second groove 114; first mounting hole 115; fixing portion 116; second mounting hole 117;

[0041] Cover plate 120; mounting area 121; first area 122; second area 123; first through hole 124; third through hole 125; mounting position 126; non-overlapping area 127;

[0042] Flow channel 200; first flow path 210; second flow path 220;

[0043] Heat dissipation fins 300; heat dissipation plate 310; protrusion 311; connecting plate 320;

[0044] First component 400; insulated gate bipolar transistor 410; rectifier bridge 420; second through hole 430;

[0045] Second component 500; discharge resistor 510; fourth through hole 520;

[0046] Connector 600; second circular hole 610. DETAILED DESCRIPTION

[0047] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0048] In the description of the present invention, it should be understood that descriptions involving orientation, such as the orientation or positional relationship indicated by up, down, etc., are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0049] In the description of this utility model, "a plurality" means more than two. The use of "first" or "second" is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features indicated, or implicitly indicating the order of the technical features indicated.

[0050] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0051] It's understandable that the convective heat transfer coefficient is an important indicator of heat transfer efficiency, reflecting the strength of heat exchange between the fluid and the solid surface. Traditional liquid cooling plates often reduce the cross-sectional area of ​​the flow channel to achieve a higher convective heat transfer coefficient. Specifically, by reducing the cross-sectional area of ​​the flow channel, the flow rate of the coolant in the flow channel can be increased, thereby improving the convective heat transfer coefficient of the liquid cooling plate and enhancing its cooling effect.

[0052] However, although reducing the cross-sectional area of ​​the flow channel can increase the coolant flow rate and convection heat transfer coefficient, it also greatly increases the flow resistance of the flow channel, resulting in an increase in the flow resistance of the coolant in the flow channel, which in turn causes insufficient coolant flow, directly affecting the coolant circulation efficiency, making it impossible for heat to be taken away in time, thereby reducing the cooling effect.

[0053] To this end, some embodiments of the present invention provide a liquid cooling radiator 1000 suitable for heat dissipation of a heating device 2000. Figures 1 to 13 The liquid cooling radiator 1000 is shown for illustration.

[0054] Reference Figure 1 and Figure 2 As shown, in an embodiment of the present invention, the liquid-cooled radiator 1000 includes a plate body 100. Specifically, the surface of the plate body 100 is provided with a mounting position 126 for installing a heating device 2000. It should be noted that the heating device 2000 can be welded to the mounting position 126, or fixed to the mounting position 126 by fasteners, or fixed to the mounting position 126 by other mounting methods. A flow channel 200 for the flow of coolant is formed inside the plate body 100. The liquid inlet 111 and the liquid outlet 112 of the flow channel 200 are arranged on the side wall of the plate body 100. The coolant can flow into the flow channel 200 from the liquid inlet 111 and be discharged from the liquid outlet 112 under the drive of a water pump or other power device. It should be noted that the coolant can be a fluid such as pure water, ethylene glycol solution, fluorinated liquid, silicone oil, etc.

[0055] Reference Figure 2 and Figure 3 As shown, in the embodiment of the present invention, the flow channel 200 includes a first flow path 210 and a second flow path 220 that are interconnected. It should be noted that the first flow path 210 and the second flow path 220 can be one, two or more, and their specific number can be adjusted according to the setting form of the installation position 126, which is not limited in this embodiment. In one example, referring to Figure 2 and Figure 3 As shown, there are multiple first flow paths 210 and second flow paths 220 respectively, and the first flow paths 210 and second flow paths 220 are alternately arranged along the flow direction of the flow channel 200, wherein the first flow paths 210 extend along the length direction of the plate body 100, and the second flow paths 220 extend along the width direction of the plate body 100.

[0056] Specifically, continue to refer to Figure 2As shown, in this embodiment of the present invention, on a projection plane along the thickness direction of the plate body 100, the projection of the first flow path 210 and the projection of the mounting position 126 are staggered, while the projection of the second flow path 220 overlaps with at least a portion of the projection of the mounting position 126. It will be understood that in this embodiment, the first flow path 210 serves solely as a passage for the coolant. On a projection plane perpendicular to the thickness direction of the plate body 100, the projection of the first flow path 210 is located outside the projection of the mounting position 126. Conversely, on a projection plane perpendicular to the thickness direction of the plate body 100, the projection of the second flow path 220 partially overlaps with the projection of the mounting position 126, meaning that the second flow path 220 flows through the mounting position 126. Therefore, the second flow path 220 can exchange heat with the heat-generating device 2000 mounted in the mounting position 126, effectively dissipating heat.

[0057] It should be noted that in the embodiment of the present invention, one, two, or more mounting positions 126 may be provided, and this embodiment does not limit this. Specifically, in one example, there is only one mounting position 126, and the flow channel 200 includes two first flow paths 210 and one second flow path 220. The two first flow paths 210 are connected to the two ends of the second flow path 220, respectively. One of the first flow paths 210 is connected to the liquid inlet 111, and the other first flow path 210 is connected to the liquid outlet 112. The second flow path 220 flows through the mounting position 126.

[0058] In another example, there is one installation position 126 , and the flow channel 200 includes multiple first flow paths 210 and multiple second flow paths 220 . The multiple first flow paths 210 and the multiple second flow paths 220 are alternately arranged, and the multiple second flow paths 220 are arranged side by side and all flow through the installation position 126 .

[0059] In another example, there are multiple mounting positions 126, and the multiple mounting positions 126 are arranged side by side. The flow channel 200 includes two first flow paths 210 and one second flow path 220. The two first flow paths 210 are respectively connected to the two ends of the second flow path 220. One of the first flow paths 210 is connected to the liquid inlet 111, and the other first flow path 210 is connected to the liquid outlet 112. The second flow path 220 flows through multiple mounting positions 126.

[0060] In order to improve the heat exchange efficiency of the second flow path 220, refer to Figure 4As shown, in this embodiment of the present invention, the height of the second flow path 220 along the thickness direction of the plate body 100 is less than the height of the first flow path 210. It will be appreciated that the relatively low height of the second flow path 220, for example, a height of 5 mm, increases the flow rate of the coolant to achieve a higher convective heat transfer coefficient. Therefore, the area through which the second flow path 220 flows can be referred to as a heat dissipation area. In contrast, the high height of the first flow path 210, for example, a height of 10 mm, creates a region with low coolant flow rate, thereby maintaining low flow resistance in this region. Therefore, the area through which the first flow path 210 flows can be referred to as a passage area.

[0061] It can be understood that in the embodiment of the present invention, by making the height of the second flow path 220 smaller than the height of the first flow path 210, the cross-sectional area of ​​the second flow path 220 is reduced, the flow rate of the coolant in the second flow path 220 is increased, and the convection heat transfer coefficient corresponding to the second flow path 220 is increased, thereby enhancing the overall heat dissipation efficiency of the liquid-cooled radiator 1000; at the same time, the first flow path 210 is maintained at a relatively high height, thereby ensuring that the overall flow resistance of the flow path does not increase excessively, reducing the possibility of insufficient coolant flow.

[0062] Reference Figure 3 and Figure 5 As shown, in the embodiment of the present invention, the plate body 100 is a split structure. Specifically, the plate body 100 includes a base plate 110 and a cover plate 120. The base plate 110 and the cover plate 120 can be made of aluminum. The mounting position 126 is provided on the cover plate 120. The surface of the base plate 110 is provided with a first groove 113 and a second groove 114. It is understood that the first groove 113 and the second groove 114 are formed by the surface of the base plate 110 being recessed inward. The first groove 113 and the second groove 114 can be manufactured through computer digitally controlled precision machining, casting, forging, welding, and other processes, which are not limited in this embodiment.

[0063] Reference Figure 2 、 Figure 3 and Figure 4 As shown, in this embodiment of the present invention, the depth of the second groove 114 is less than the depth of the first groove 113. It will be appreciated that, in this embodiment, the cover plate 120 and the base plate 110 are plates of substantially the same shape, and the cover plate 120 can be placed on the surface of the base plate 110. When the cover plate 120 covers the surface of the base plate 110, it can simultaneously block the first flow path 210 and the second flow path 220, thereby defining the first flow path 210 together with the first groove 113 and the second flow path 220 together with the second groove 114.

[0064] Reference Figure 5 and Figure 6As shown, in this embodiment of the present invention, the liquid-cooled radiator 1000 further includes a heat dissipation fin 300, which is disposed in the second flow path 220. Specifically, the size of the heat dissipation fin 300 matches the width of the second groove 114, so that the second groove 114 can accommodate the heat dissipation fin 300. The heat dissipation fin 300 is disposed along the extension direction of the second flow path 220. Specifically, the second flow path 220 extends along the width direction of the plate body 100, so the heat dissipation fin 300 is disposed along the width direction of the plate body 100. In this embodiment, one heat dissipation fin 300 can be disposed in each second flow path 220, or two or more heat dissipation fins 300 can be disposed, and this embodiment is not limited to this.

[0065] In this embodiment of the present invention, the heat dissipation fins 300 can be made of aluminum and are connected to the cover plate 120. Therefore, heat from the cover plate 120 can be transferred to the heat dissipation fins 300, which in turn can transfer the heat from the cover plate 120 to the coolant in the flow channel 200. Compared to contacting the coolant in the second flow channel 220 solely with the end surface of the cover plate 120 facing the base plate 110, the provision of the heat dissipation fins 300 increases the contact area with the coolant, allowing heat to be transferred to the coolant more quickly and improving heat dissipation efficiency.

[0066] Reference Figure 7 and Figure 8 As shown, in an embodiment of the present invention, the heat dissipation fin 300 includes a plurality of heat dissipation plates 310 and a plurality of connecting plates 320, wherein the plurality of heat dissipation plates 310 are arranged at intervals along the width direction of the second flow path 220, and the plurality of heat dissipation plates 310 can separate the second flow path 220 into a plurality of channels. The arrangement of the plurality of heat dissipation plates 310 can greatly increase the contact area with the coolant, thereby improving the heat transfer efficiency.

[0067] Reference Figure 8 and Figure 9 As shown, in this embodiment of the present invention, each heat sink 310 is provided with connecting plates 320 at both ends along the height direction of the second flow path 220. One connecting plate 320 is bonded to the cover plate 120, and the other connecting plate 320 is bonded to the bottom plate 110. Specifically, connecting plates 320 are connected between two adjacent heat sinks 310. Adjacent connecting plates 320 are staggered, with one connecting plate 320 provided at the upper end of the heat sink 310 and the other provided at the lower end of the heat sink 310.

[0068] In an embodiment of the present invention, the connecting plate 320 located on the upper side is fitted with the cover plate 120, and the connecting plate 320 located on the lower side is fitted with the base plate 110, which not only fixes the heat sink 310, enhances the overall stability of the heat sink fins 300, and reduces the increase in flow resistance that the heat sink fins 300 may cause to the second flow path 220, but also can more quickly guide the heat of the cover plate 120 to the heat sink 310, and then transfer the heat to the coolant through the heat sink 310.

[0069] In order to further increase the contact area with the coolant, refer to Figure 6 and Figure 10 As shown, in one example, the heat sink 310 is curved along the extension direction of the second flow path 220, that is, the heat sink 310 is curved and extended along the width direction of the plate body 100. Based on this, the channel formed between adjacent heat sinks 310 is curved and extended along the second flow path 220. It can be understood that the actual length of the curved heat sink 310 is longer than the actual length of a straight heat sink 310, which means that the coolant has a longer contact path with the heat sink 310 during flow, thereby further increasing the contact area between the heat sink 310 and the coolant and improving heat transfer efficiency.

[0070] Reference Figure 11 and Figure 12 As shown, in another example, the channel includes at least one bending section. In one example, the surface of the heat dissipation plate 310 is provided with a protrusion 311. Specifically, referring to Figure 11 As shown, in this embodiment, the heat sink 310 is in the form of a sheet, and a plurality of heat sinks 310 are staggered along the flow direction of the second flow path 220 to form a staggered structure. The plurality of staggered structures are arranged side by side along the width direction of the second flow path 220 and are interconnected, thereby further increasing the contact area between the heat sink 310 and the coolant. Figure 11 As shown, in this embodiment, a plurality of raised oblique teeth are provided on the surface of the heat sink 310, and the plurality of oblique teeth are arranged side by side along the flow direction of the second flow path 220, thereby further increasing the contact area between the heat sink 310 and the coolant.

[0071] It should be noted that in the embodiment of the present invention, the cover plate 120 and the base plate 110 are respectively welded to the connecting plate 320, which not only can achieve a firm connection between the connecting plate 320 and the cover plate 120 and the base plate 110, thereby improving the overall stability of the heat dissipation fins 300, but also can reduce the contact thermal resistance and improve the heat dissipation efficiency.

[0072] Reference Figure 5As shown, in the embodiment of the present invention, the surface of the plate body 100 is provided with at least two installation areas 121, and each installation area 121 is provided with an installation position 126. Specifically, each installation area 121 can be provided with one installation position 126, or can be provided with two or more installation positions 126, which is not limited in this embodiment. At least two installation areas 121 are provided on the surface of the plate body 100 at intervals. For example, referring to Figure 2 As shown, three mounting areas 121 are provided, and the three mounting areas 121 can be spaced apart along the length of the plate body 100. Correspondingly, at least two second flow paths 220 are provided, and the at least two second flow paths 220 are arranged in a one-to-one correspondence with the at least two mounting areas 121 to meet the heat dissipation requirements of the mounting positions 126 of each mounting area 121. In particular, two adjacent second flow paths 220 are connected through the first flow path 210.

[0073] In an embodiment of the present invention, the liquid-cooled radiator 1000 can be applied to a high-voltage inverter, wherein the heating device 2000 in the high-voltage inverter includes an insulated gate bipolar transistor 410 (IGBT) and a rectifier bridge 420. Since the heat flux density of the insulated gate bipolar transistor 410 is greater than the heat flux density of the rectifier bridge 420, it means that the insulated gate bipolar transistor 410 will generate a relatively larger amount of heat during operation.

[0074] For this purpose, refer to Figure 1 and Figure 2 As shown, in this embodiment of the present invention, an insulated gate bipolar transistor 410 and a rectifier bridge 420 are sequentially mounted in two mounting areas 121 along the coolant flow direction. Specifically, taking three mounting areas 121 as an example, two of them are first areas 122, arranged side by side, and the remaining one is a second area 123. In this embodiment, the flow channel 200 first flows sequentially through the two first areas 122 and then through the second area 123. The first area 122 is used to mount the insulated gate bipolar transistor 410, and the second area 123 is used to mount the rectifier bridge 420. It is understandable that the heat generated by the insulated gate bipolar transistor 410 is relatively large, and the heat generated by the rectifier bridge 420 is relatively small. Therefore, the coolant first flows through the insulated gate bipolar transistor 410 to absorb a large amount of its heat, and then flows through the rectifier bridge 420 to dissipate heat, ensuring that the heat of the insulated gate bipolar transistor 410 can be taken away in time, effectively preventing it from overheating, and at the same time ensuring that the rectifier bridge 420 can also be properly cooled, making full use of the heat dissipation capacity of the coolant.

[0075] In the embodiment of the present invention, the heating device 2000 includes a first element 400. On the projection surface along the thickness direction of the plate 100, the projection of part of the first element 400 is located outside the projection of the second flow path 220. It should be noted that the first element 400 can be an insulated gate bipolar transistor 410 or a rectifier bridge 420. Figure 2 As shown, the width of the IGBT 410 and the rectifier bridge 420 are both greater than the width of the corresponding second flow path 220, that is, the IGBT 410 and the rectifier bridge 420 can span the second flow path 220. Based on this, the fixing points of the IGBT 410 and the rectifier bridge 420 can be located outside the second flow path 220.

[0076] Specifically, refer to Figure 2 and Figure 5 As shown, the base plate 110 is provided with a first mounting hole 115. The projection of the first mounting hole 115 is offset from the projection of the second flow path 220 along the thickness direction of the plate body 100. Specifically, the projection of the first element 400 and the projection of the second flow path 220 have a non-overlapping region 127. The first mounting hole 115 is spaced apart from the second flow path 220 and is located within the non-overlapping region 127. The cover plate 120 is provided with a first through-hole 124 corresponding to the first mounting hole 115, and the first element 400 is provided with a second through-hole 430. It will be understood that the first element 400 is provided with a second through-hole 430 at each end along the width direction of the second flow path 220. The projection of the second through-hole 430 is offset from the projection of the second flow path 220 along the thickness direction of the plate body 100. Among them, the liquid-cooled radiator 1000 also includes a first fastener. Based on this, when assembling the first component 400, the first fastener can be passed through the second through hole 430, the first through hole 124 and the first mounting hole 115 in sequence, so as to achieve the first component 400 being fixed to the plate body 100.

[0077] In one example, the first fastener is a screw, and the first mounting hole 115 is a screw hole that can be threadedly engaged with the screw. Based on this, the first fastener can be inserted into the second through hole 430 and the first through hole 124 and engage with the screw hole of the base plate 110 to achieve a fastened connection in a threaded connection. It should be noted that the first fastener is not limited to a screw, and can also be a rivet, etc., which is not limited in this embodiment.

[0078] In the embodiment of the present invention, the heating device 2000 includes a second element 500. On the projection surface along the thickness direction of the plate 100, the projection of the second element 500 is located within the outer contour line of the projection of the second flow path 220. It should be noted that the second element 500 can be a discharge resistor 510. Figure 2As shown, the width of the discharge resistor 510 is smaller than the width of the corresponding second flow path 220 , that is, the discharge resistor 510 cannot span the second flow path 220 . Therefore, the fixing point of the discharge resistor 510 needs to be set within the second flow path 220 .

[0079] Specifically, refer to Figure 3 As shown, two fixed portions 116 are provided in the second flow path 220 at intervals, and the two fixed portions 116 are connected to the base plate 110. The fixed portions 116 can be columnar or plate-shaped, which is not limited in this embodiment. In one example, the fixed portion is plate-shaped, and the two fixed portions 116 are respectively arranged along the flow direction of the second flow path 220. It should be noted that the arrangement of the two fixed portions 116 will divide the second flow path 220 into three sub-paths. In this embodiment, the formation of the fixed portion 116 can be formed by milling out three sub-paths by a milling cutter. The two fixed portions 116 are respectively provided with a second mounting hole 117, the cover plate 120 is provided with a third through hole 125 corresponding to the second mounting hole 117, and the second element 500 is provided with a fourth through hole 520.

[0080] Among them, the liquid-cooled radiator 1000 also includes a second fastener. Based on this, when assembling the second component 500, the second fastener can be passed through the fourth through hole 520, the third through hole 125 and the second mounting hole 117 in sequence, so that the second component 500 is fixed to the plate body 100.

[0081] In one example, the second fastener is a screw, and the second mounting hole 117 is a screw hole that can be threadedly engaged with the screw. Based on this, the second fastener can be inserted into the fourth through hole 520 and the third through hole 125 and engage with the screw hole of the fixing portion 116 to achieve a fastened connection in a threaded connection. It should be noted that the second fastener is not limited to a screw, and can also be a rivet, etc., which is not limited in this embodiment.

[0082] It should be noted that in the embodiment of the present utility model, the first element 400 is not limited to the insulated gate bipolar transistor 410 and the rectifier bridge 420, and other heating devices 2000 that can cross the second flow path 220 can all be the first element 400; similarly, the first element 400 is not limited to the discharge resistor 510, and the heating device 2000 that is projected within the outer contour line of the projection of the second flow path 220 on the projection surface along the thickness direction of the plate body 100 can all be the second element 500.

[0083] In an embodiment of the present invention, the liquid-cooled radiator 1000 can be applied to a liquid cooling system. When the liquid inlet 111 and the liquid outlet 112 of the liquid-cooled radiator 1000 are connected to a large-diameter pipeline, the thickness of the plate body 100 is often required to match the pipe diameter, which inevitably leads to the thickness of the plate body 100 also increasing as the pipe diameter increases, thereby increasing the weight and production cost of the plate body 100.

[0084] For this purpose, refer to Figure 1 and Figure 5 As shown, in this embodiment of the present invention, the liquid cooling radiator 1000 further includes a connector 600, which is fixedly attached to the plate 100 and is used to connect to a conduit. For example, the connector 600 can be welded to the plate 100. When a connection to a larger diameter conduit is required, the connector 600 can simply be replaced with a correspondingly larger size, without increasing the thickness of the plate 100.

[0085] Reference Figure 2 and Figure 13 As shown, in this embodiment of the present invention, the liquid inlet 111 and the liquid outlet 112 are first circular holes 1121, and the connector 600 is provided with a second circular hole 610. Taking the connector 600 connected to the liquid inlet 111 as an example, the first circular hole 1121 and the second circular hole 610 are in communication. The diameter of the second circular hole 610 is R, and the diameter of the first circular hole 1121 is r, satisfying the following relationship: R>r. The diameter of the second circular hole 610 is larger than the diameter of the first circular hole 1121, thereby increasing the flow diameter and reducing flow resistance.

[0086] The present invention also provides a liquid cooling system, comprising a power device, a liquid inlet pipe, a liquid outlet pipe, and the liquid cooling radiator 1000 of the above embodiment. The liquid inlet pipe is connected to the liquid inlet 111, and the liquid outlet pipe is connected to the liquid outlet 112. The power device is used to drive the coolant to flow in the flow channel 200. For example, the power device can be a water pump.

[0087] It can be understood that the liquid cooling system of the embodiment of the present invention adopts the liquid cooling radiator 1000 of the above embodiment, and a flow channel 200 is set in the plate body 100, wherein the flow channel 200 includes a first flow channel 210 and a second flow channel 220. On the projection surface along the thickness direction of the plate body 100, the projection of the first flow channel 210 and the projection of the mounting position 126 are staggered, and the projection of the second flow channel 220 coincides with the projection of at least part of the mounting position 126, that is, the second flow channel 220 corresponds to the mounting position 126, so that the second flow channel 220 can effectively dissipate heat; in addition, Along the thickness direction of the plate body 100, the height of the second flow path 220 is less than the height of the first flow path 210, thereby reducing the cross-sectional area of ​​the second flow path 220, increasing the flow rate of the coolant in the second flow path 220, and increasing the convection heat transfer coefficient corresponding to the second flow path 220, thereby enhancing the overall heat dissipation efficiency of the liquid cooling system and improving the heat dissipation performance of the liquid cooling system; at the same time, the first flow path 210 is maintained at a relatively high height, thereby ensuring that the overall flow resistance of the flow path does not increase excessively, reducing the possibility of insufficient coolant flow, and thereby improving the reliability of the liquid cooling system.

[0088] Since the liquid cooling system adopts all the technical solutions of the liquid cooling radiator 1000 of the above embodiment, it has at least all the beneficial effects brought by the technical solutions of the above embodiment, which will not be repeated here.

[0089] The embodiment of the present invention further provides a frequency converter, comprising a heating device 2000 and the liquid cooling system of the above embodiment, wherein the heating device 2000 is fixed to the mounting position 126. Specifically, the frequency converter may be a high-voltage frequency converter.

[0090] It can be understood that the inverter of the embodiment of the present invention adopts the liquid cooling system of the above-mentioned embodiment, and by optimizing the structure of the liquid cooling radiator 1000, the overall heat dissipation efficiency and heat dissipation performance of the liquid cooling system are improved. When the inverter is running, the heat generated by the heating device 2000 can be taken away by the coolant more quickly, reducing the risk of the heating device 2000 affecting performance due to overheating, thereby reducing the failure rate of the inverter, and further improving the reliability of the inverter, which helps to extend the service life of the inverter.

[0091] Since the frequency converter adopts all the technical solutions of the liquid cooling system of the above embodiment, it has at least all the beneficial effects brought by the technical solutions of the above embodiment, which will not be described in detail here.

[0092] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. Liquid cooling radiator, characterized in that, include: The plate body is provided with a liquid inlet and a liquid outlet, and a mounting position for installing a heating device is provided on the surface of the plate body. A flow channel connected to the liquid inlet and the liquid outlet is provided in the plate body, and the flow channel includes a first flow channel and a second flow channel that are connected to each other. On the projection surface along the thickness direction of the plate body, the projection of the first flow channel and the projection of the mounting position are staggered, and the projection of the second flow channel coincides with the projection of at least part of the mounting position. Along the thickness direction of the plate body, the height of the second flow channel is less than the height of the first flow channel.

2. The liquid cooling radiator according to claim 1, characterized in that: The plate body includes a base plate and a cover plate, the surface of the base plate is provided with a first groove and a second groove, the depth of the second groove is less than the depth of the first groove, the mounting position is provided on the cover plate, the cover plate covers the surface of the base plate, the cover plate and the first groove define the first flow path, and the cover plate and the second groove define the second flow path.

3. The liquid cooling radiator according to claim 2, characterized in that: The liquid-cooled radiator further includes cooling fins, which are arranged in the second flow path and along the extension direction of the second flow path. The cooling fins are connected to the cover plate to transfer the heat of the cover plate to the coolant in the flow channel.

4. The liquid cooling radiator according to claim 3, characterized in that: The heat dissipation fins include a plurality of heat dissipation plates and a plurality of connecting plates. The plurality of heat dissipation plates are arranged at intervals along the width direction of the second flow path. Each heat dissipation plate is provided with a connecting plate at both ends along the height direction of the second flow path. One of the connecting plates is fitted and connected to the cover plate, and the other connecting plate is fitted and connected to the bottom plate.

5. The liquid cooling radiator according to claim 4, characterized in that: A channel is formed between adjacent heat dissipation plates, and the channel is bent along the extending direction of the second flow path, or the channel includes at least one bent section.

6. The liquid cooling radiator according to claim 4, characterized in that: The cover plate and the bottom plate are respectively fixed to the connecting plate by welding.

7. The liquid cooling radiator according to claim 1, characterized in that: At least two installation areas are provided on the surface of the plate body, each of the installation areas is provided with the installation position, and at least two of the installation areas are arranged at intervals on the surface of the plate body. At least two second flow paths are provided, and at least two second flow paths are arranged in a one-to-one correspondence with at least two of the installation areas. Two adjacent second flow paths are connected through the first flow path. The heating device includes an insulated gate bipolar transistor and a rectifier bridge, and the insulated gate bipolar transistor and the rectifier bridge are installed in two of the installation areas in sequence along the flow direction of the coolant.

8. The liquid cooling radiator according to claim 2, characterized in that: The heating device includes a first element, and the first element is respectively provided with second through holes at both ends along the width direction of the second flow path. On the projection surface along the thickness direction of the plate body, the projection of the second through hole and the projection of the second flow path are staggered. The base plate is provided with a first mounting hole, and the first mounting hole is spaced apart from the second flow path. The cover plate is provided with a first through hole corresponding to the first mounting hole. The liquid-cooled radiator also includes a first fastener, and the first fastener is passed through the second through hole, the first through hole and the first mounting hole to fasten the first element to the cover plate.

9. The liquid cooling radiator according to claim 2 or 8, characterized in that: The heating device includes a second element. On the projection surface along the thickness direction of the plate body, the projection of the second element is located within the outer contour line of the projection of the second flow path. Two fixed parts are provided in the second flow path, and the two fixed parts are connected to the base plate. The two fixed parts are respectively provided with second mounting holes. The cover plate is provided with a third through hole corresponding to the second mounting hole, and the second element is provided with a fourth through hole. The liquid-cooled radiator also includes a second fastener, which is passed through the fourth through hole, the third through hole and the second mounting hole to fasten the second element to the cover plate.

10. The liquid cooling radiator according to claim 1, characterized in that: The liquid inlet and the liquid outlet are first circular holes. The liquid cooling radiator also includes a joint, which is provided with a second circular hole. The joint is fixed to the plate body so that the second circular hole is connected to the first circular hole. The aperture of the second circular hole is larger than the aperture of the first circular hole.

11. Liquid cooling system, characterized in that, It comprises a power device, a liquid inlet pipe, a liquid outlet pipe and the liquid-cooled radiator according to any one of claims 1 to 10, wherein the liquid inlet pipe is connected to the liquid inlet, the liquid outlet pipe is connected to the liquid outlet, and the power device is used to drive the coolant to flow in the flow channel.

12. A frequency converter, characterized in that: It comprises a heating device and the liquid cooling system according to claim 11, wherein the heating device is fixed to the mounting position.

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