Cleaning device for flip-chip interconnection circuit

Abstract

The utility model provides a cleaning device for a flip-chip interconnection circuit, which comprises a device main body, and the device main body is internally provided with a brush cleaning component which is used for at least contacting with the back surface of the circuit to clean the circuit; the cleaning liquid spraying component is used for spraying cleaning liquid required by cleaning; the circuit supporting plate is used for supporting a to-be-cleaned circuit; and the control module is used for controlling cleaning programs of the brush cleaning mechanism and the cleaning fluid spraying mechanism. According to the cleaning device of the flip-chip interconnection circuit, automatic cleaning of the circuit is achieved through automatic cleaning of the brush cleaning component and the cleaning fluid spraying component, a circuit back cleaning procedure is added, and stains and foreign matter on the back of the circuit can be mechanically treated. According to the circuit cleaning device, the efficiency of manually cleaning a single circuit is greatly improved, and the cleanness and flatness of the front and back surfaces of the circuit before the flip-chip interconnection circuit is loaded are ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a cleaning device for flip-chip interconnection circuits. Background Art

[0002] Cooled infrared detectors are a key area of ​​current infrared technology development, finding widespread application in aerospace, military, security testing, and airborne applications. These detectors primarily consist of a detector chip, a microdewar, and a refrigeration unit. The detector chip is the core component, where the photoelectric material converts light into electrical signals. The detector chip consists of a photodiode connected to a readout circuit via an indium bump array, completing the photoelectric transmission within a low-temperature operating environment.

[0003] Infrared detectors typically utilize flip-chip bonding technology to align and interconnect the detector chip and readout circuitry via an indium bump array. This technology offers advantages such as short bonding wires, minimal signal transmission delay, excellent high-frequency performance, and high packaging density. In this flip-chip structure, the silicon chip is connected to the readout circuitry via solder indium bumps, effectively reducing thermal mismatch between the materials, limiting relative movement, and increasing their service life. High-precision flip-chip bonding enables direct interconnection between large arrays and fine-pitch megapixel chips and circuitry.

[0004] Before flip-chip bonding, ensuring the integrity and cleanliness of the chip and circuit is crucial for precision interconnection. Foreign matter on the front side of the circuit can affect interconnect bonding. After heating and pressurization, any remaining foreign matter on the front side is squeezed, creating a certain number of overheating blind spots. Large foreign matter can also obscure alignment marks, potentially causing interconnect bonding to tilt and resulting in a weak connection. Contaminants on the back side can make the bottom uneven, blurring or overlapping the optical reflection image formed by the flip-chip optical path, which can cause leveling errors. If the back side of the chip or circuit is not properly cleaned, the chip and circuit will be interconnected in a non-parallel state, significantly reducing the precision and accuracy of interconnect alignment. Unleveled interconnects can result in unconnected areas of the chip, forming large dead spots, and areas of the chip, due to pixel squeezing, forming overheating blind spots. Therefore, before alignment and bonding, the front and back sides of the chip and circuit must be clean and flat.

[0005] During the process, the chip and circuit surfaces must be free of foreign matter, damage, or defects. The indium pillars in the circuits must be intact and independent, with no surface damage or adhesion between them. After cleaning, drying, and inspecting the chips and circuits, the front side is relatively easy to keep clean. However, after the indium vaporization and shrinking process, the back side of the circuits may retain traces of small particles, cleaning fluid residue, and liquid traces. Therefore, after inspecting the front side of the device chip and circuit, the circuit and chip must be flipped over to the back side for further cleaning and finishing. The back side of the circuit and chip is typically cleaned with an air gun or brush to remove surface debris, and a damp cotton swab to gently wipe away stubborn stains. After backside cleaning, the chip is still flipped upside down for loading into the flip-flop soldering machine. An alignment tool is used to hold it at a certain height and then blow air to remove dust from the front side. After cleaning the back side, the circuit must be flipped over to inspect the integrity and cleanliness of the indium pillars.

[0006] The front of the circuit is covered in a large area of ​​indium bumps. For example, for a circuit with a 15μm center-to-center spacing, the indium bumps are typically 7-8μm. Millions of these bumps are evenly spaced and independent of each other. During circuit inspection, the circuit must be flipped over, with the front side in contact with a cleanroom paper. Wiping away stains and foreign matter from the back can easily cause the circuit to shift and rub against the cleanroom paper. Because indium is soft and the indium pillars are fragile, even the slightest movement can cause scratches and adhesions. Damage to the indium pillars can result in individual pillars being insufficient in height, preventing a complete bond between the chip and the circuit. Adhesion can cause an electrical short between the chip and the circuit under pressure. Circuits with significant damage and adhesion will be rejected after flipping over and inspecting the front side. This cleaning method significantly increases the number of scrapped circuits. Utility Model Content

[0007] In order to solve the above technical problems, the utility model proposes a cleaning device for flip-chip interconnect circuits, which improves the efficiency of manual cleaning of a single circuit and ensures the cleanliness and flatness of the front and back surfaces of the flip-chip interconnect circuits before loading.

[0008] The cleaning device for flip-chip interconnect circuits of the present invention comprises a device body, wherein the device body is provided with:

[0009] a brush cleaning mechanism, configured to contact at least the back side of the circuit to clean the circuit;

[0010] A cleaning liquid spraying mechanism, used for spraying the cleaning liquid required for cleaning the circuit;

[0011] A circuit support plate, used to support the circuit to be cleaned;

[0012] The control module is used to control the cleaning procedures of the brush cleaning mechanism and the cleaning liquid spraying mechanism.

[0013] In one embodiment, the device further comprises a nitrogen air shower mechanism, which comprises a retractable robotic arm and a nitrogen air gun connected thereto, for spraying nitrogen to air-dry the cleaned circuit.

[0014] In one embodiment, the brush cleaning mechanism includes a retractable mechanical arm and a rotating brush connected thereto, and the arm head of the retractable mechanical arm is provided with a motor, and the motor drives the brush to rotate in one direction.

[0015] In one embodiment, the cleaning liquid spraying mechanism includes a retractable mechanical arm and a three-tube spray head connected thereto, and each tube of the three-tube spray head sprays a specific cleaning liquid.

[0016] In one embodiment, the circuit support board is provided with an inner groove fixed substrate for multiple circuits, the middle of the inner groove fixed substrate is a rectangular bracket supporting the edge of the circuit, the middle of the rectangular bracket is a hollow structure, and an arc-shaped area is provided on its outer side along the edge of the rectangular bracket.

[0017] In one embodiment, the device further comprises a liftable tray disposed below the circuit support plate, wherein the liftable tray is provided with a tray inner groove, and the tray inner groove is adapted to the circuit support plate for fixing the circuit support plate.

[0018] In one embodiment, the specific cleaning solution includes an organic cleaning solution and a deionized water cleaning solution.

[0019] In one embodiment, a cleaning liquid storage tank is provided at the bottom of the device body for storing an organic solvent cleaning liquid and a deionized water cleaning liquid respectively.

[0020] In one embodiment, a waste liquid storage tank is further provided at the bottom of the device body for storing organic waste liquid and other waste liquids.

[0021] In one embodiment, the control module is further configured to set program parameters of the relevant program, wherein the program parameters are selected from one or more of the following: operating time, operating pressure, range of motion of the robot arm, and spray flow rate.

[0022] Compared to existing technologies, the flip-chip interconnect circuit cleaning device of this invention achieves automated circuit cleaning through a brush cleaning mechanism and a cleaning liquid spray mechanism. It also adds a backside cleaning procedure to mechanically remove stains and foreign matter from the backside of the circuit. This circuit cleaning device significantly improves the efficiency of manual cleaning of individual circuits and ensures that both the front and back sides of the flip-chip interconnect circuit are clean and smooth before installation.

[0023] The above technical features can be combined in various technically feasible ways to produce new implementation plans, as long as the purpose of the present invention can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be described in more detail below based on non-limiting embodiments and with reference to the accompanying drawings, wherein:

[0025] Figure 1 A schematic structural diagram of a cleaning device for a flip-chip interconnect circuit according to the present invention is shown;

[0026] Figure 2 Shows Figure 1 A schematic structural diagram of an air gun robotic arm of a cleaning device;

[0027] Figure 3 Shows a schematic structural diagram of the brush robot arm;

[0028] Figure 4A Shows Figure 1 A schematic structural diagram of a circuit support plate of a cleaning device for a flip-chip interconnect circuit;

[0029] Figure 4B Shows Figure 4A Schematic diagram of the structure of the fixed base plate and rectangular bracket in the middle inner tank;

[0030] Figure 4C A schematic diagram of the circuit to be cleaned is shown;

[0031] Figure 5 It shows a schematic diagram of the structure when the inner groove of the tray is fixed to the circuit support plate;

[0032] Figure 6 A schematic structural diagram of a cleaning fluid storage tank is shown.

[0033] In the drawings, like components are designated by like reference numerals, but the drawings are not necessarily drawn to scale.

[0034] Wherein, the accompanying drawings are marked as follows:

[0035] 1. Device body; 2. Brush cleaning mechanism; 21. Rotating brush; 3. Cleaning liquid spraying mechanism; 4. Nitrogen air shower mechanism; 5. Circuit support plate; 51. Inner groove fixed base plate; 511. Rectangular bracket; 512. Hollow area; 513. Arc area; 514. Edge area of ​​the circuit edge; 515. Effective area of ​​the circuit; 6. Liftable tray; 61. Screw blocking plate; 7. Cleaning liquid storage tank; 8. Waste liquid storage tank; 9. Control module; 10. Retractable robotic arm; 101. Bearing joint; 102. Connecting rod; 103. Cotton core; 104. Base. DETAILED DESCRIPTION

[0036] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, as long as no conflict arises, the various embodiments and features of the present invention can be combined with each other, and the resulting technical solutions are all within the scope of protection of the present invention.

[0037] Parts not described in the present invention can be realized by adopting or drawing on existing technologies.

[0038] like Figure 1 As shown, the cleaning device for flip-chip interconnect circuit of the present invention includes a device body 1. Specifically, the device body 1 can be a cleaning device. The device body 1 is provided with:

[0039] A brush cleaning mechanism 2, used for contacting at least the back side of the circuit to clean the circuit;

[0040] The cleaning liquid spraying mechanism 3 is used to spray the cleaning liquid required for cleaning;

[0041] Circuit support plate 5, used to support the circuit to be cleaned;

[0042] The control module 9 is used to control the cleaning procedures of the brush cleaning mechanism 2 and the cleaning liquid spraying mechanism 3 .

[0043] The cleaning device for flip-chip interconnected circuits of the present invention realizes automatic cleaning of the circuits through automatic cleaning by a brush cleaning mechanism and a cleaning liquid spraying mechanism, and adds a circuit back cleaning procedure, which can mechanically handle stains and foreign matter on the back of the circuit. The circuit cleaning device greatly improves the efficiency of manual cleaning of a single circuit, and ensures the cleanliness and flatness of the front and back of the circuit before the flip-chip interconnected circuit is loaded. The cleaning device can avoid damage such as bruises, scratches, and friction on the front of the chip and circuit. The cleaning tool is small in size and easy to operate, and can handle the cleaning of small-volume and small-quantity circuits. It can also be used for cleaning small-sized chips. During the back cleaning process, the chip and circuit can be fixed, which facilitates the handling of foreign matter and the removal of stains, reduces the difficulty of cleaning the chip and circuit before interconnection, improves the interconnection efficiency of flip-chip welding, and makes preliminary preparations for further leveling of the circuit and chip.

[0044] In an optional embodiment, the device further includes a nitrogen air shower mechanism 4, which includes a retractable robotic arm and a nitrogen air gun connected thereto, for spraying nitrogen to air-dry the cleaned circuit.

[0045] like Figure 2As shown, the telescopic robotic arm 10 includes a bearing joint 101 and a connecting rod 102. The movement of the telescopic robotic arm 10 is primarily composed of a transmission device, a motion axis system, a driver, and a sensor. The driver is driven by a motor, which drives the robotic arm to perform various movements. A controller transmits control signals to the driver, which in turn controls the movement of the bearing joint 101 and connecting rod 102 of the robotic arm, enabling the robotic arm to extend and retract to a certain length. Specifically, the bearing joint 101 is configured with multiple joints, and the controller controls the robotic arm to extend and retract sequentially. All joints extend to a certain angle according to program settings to complete the length extension and retraction of the robotic arm.

[0046] A retractable robotic arm 10 (hereinafter referred to as the airgun robotic arm) connected to the nitrogen gas gun is equipped with a gas pipeline. A cotton wick 103 is located at the top of the robotic arm to filter out gas impurities. The rear end of the robotic arm is the gas outlet, and a pressure valve is located at the base of the robotic arm 104. The pressure valve is used to control the on / off of the gas and the amount of gas flow.

[0047] Optionally, the nitrogen gas purge time is 60-120 s, and the gas flow rate is about 30-100 sccm.

[0048] like Figure 3 As shown, in an optional embodiment, the brush cleaning mechanism 2 includes a retractable robotic arm 10 and a rotating brush 21 connected thereto. The arm head of the retractable robotic arm is provided with a motor, which drives the brush to rotate in one direction.

[0049] The basic structure of the retractable robotic arm 10 (hereinafter referred to as the brush robotic arm) of the brush cleaning mechanism 2 is the same as that of the air gun robotic arm. The difference is that the end of the brush robotic arm is connected to the rotating brush 21, and the brush is driven to rotate by the motor at the end.

[0050] Optionally, the brush rotates at a speed of 20-200 rpm, and the brush head is a nylon brush. The rotational position of the brush head can be determined by the control module 9 based on the position of the circuit on the circuit support plate 5. The bristles of the brush head are approximately 10 mm long, and the length of the bristles contacting the circuit is 0.5-1 mm.

[0051] In an optional embodiment, the cleaning liquid spraying mechanism 3 includes a retractable mechanical arm and a three-tube spray head connected thereto, and each tube of the three-tube spray head is used for spraying a specific cleaning liquid.

[0052] Specifically, the specific cleaning liquid may include an organic cleaning liquid and a deionized water cleaning liquid. More specifically, the organic cleaning liquid is acetone and anhydrous ethanol.

[0053] The basic structure of the retractable robotic arm 10 (hereinafter referred to as the spraying robotic arm) of the cleaning liquid spraying mechanism 3 is the same as that of the robotic arm connected to the air gun robotic arm. The difference is that three liquid pipelines are arranged inside the spraying robotic arm. The switches of the liquid pipelines are located at the base of the robotic arm and are controlled by the control module 9.

[0054] Specifically, the order of spraying the cleaning liquid is to spray the organic reagent first, then spray the deionized water for rinsing. The spraying time of each liquid medium is about 60~120s, the pressure is about 5~50 MPa, and the flow rate is about 20~50 m 3 / h.

[0055] like Figures 4A-4C As shown, in an optional embodiment, an inner groove fixed substrate 51 for multiple circuits is provided on the circuit support board 5, and the middle of the inner groove fixed substrate 51 is a rectangular bracket 511 that supports the edge of the circuit. The middle of the rectangular bracket 511 is a hollow structure 512, and an arc-shaped area 513 is provided on the outside along the edge of the rectangular bracket 511.

[0056] Among them, Figure 4B and Figure 4C As shown, the rectangular bracket 511 is used to support the circuit's reserved area or edge region 514, which is free of indium bumps. After the circuit is placed within the inner groove of the circuit's fixed substrate 51, the circuit's active area 515 (where the ordered indium array exists) is suspended upside down within the hollow structure 512. Therefore, when the circuit is supported and fixed by the circuit support plate 5, no pressure damage is caused to the active pixels or graphics on the front surface. The rectangular bracket 511 has a depth of approximately 0.8 mm, making it convenient to use tweezers to grasp the circuit's reserved area or edge region 514 at the curved region 513.

[0057] In a specific embodiment, the circuit support plate 5 is made of an antistatic material. Both the circuit support plate 5 and the inner slot fixed base plate 51 are rectangular. The dimensions of the inner slot fixed base plate 51 can be flexibly customized to suit different circuit models. Specifically, the dimensions of the circuit support plate 5 can be 12 × 10 × 1.5 cm (length × width × height), and the maximum size of the circuit that can be carried can be 20 × 18 × 0.5 mm (length × width × height).

[0058] In an optional embodiment, the device further includes a liftable tray 6 disposed below the circuit support plate, the liftable tray 6 being provided with a tray inner groove adapted to fit within the circuit support plate 5 for securing the circuit support plate 5. Optionally, the tray inner groove is a rectangular inner groove adapted to fit within the circuit support plate 5, and the circuit support plate 5 is secured by inserting the tray inner groove.

[0059] like Figure 5As shown, the depth of the tray inner groove on the liftable tray 6 can be optionally 1~1.5 cm, and a screw blocking piece 61 is provided at the edge of the tray inner groove. When the circuit support board 5 is embedded in the tray inner groove, the circuit support board 5 is fixed in the tray inner groove by tightening the screw blocking piece 61.

[0060] Optionally, four screw blocking pieces 61 are provided and symmetrically distributed in the middle of the edge of the inner groove of the tray.

[0061] The liftable tray 6 is lifted and lowered by a screw lifting mechanism (not shown in the figure), and the lifting height is 0-15 cm.

[0062] The screw lift mechanism converts rotational motion into linear motion. Specifically, the screw lift mechanism may include a motor, a screw, and a nut. The motor drives the screw to rotate, which in turn rotates the spiral groove between the screw and the nut. The nut, with an internal thread structure in the middle of the spiral groove, enables the screw to move vertically, thereby driving the vertical movement of the tray. The tray can be raised and lowered by rotating the motor in the forward and reverse directions. Adjusting the motor speed controls the nut's lifting speed, thereby controlling the tray's lifting speed. The screw lift mechanism is preferably provided with a housing made of antistatic material.

[0063] In an optional embodiment, the diameter of the liftable tray 6 is about 18 cm. The shape of the liftable tray 6 can be selected according to actual needs.

[0064] In an optional embodiment, a cleaning liquid storage tank 7 is further provided at the bottom of the device body 1 for storing the organic solvent cleaning liquid and the deionized water cleaning liquid respectively. Optionally, the capacity of the cleaning liquid storage tank 7 is 3-5L.

[0065] like Figure 6 As shown, each cleaning liquid storage tank 7 is provided with a liquid output pipe 71 and a gas inlet pipe 72. The liquid output pipe is connected to the retractable robotic arm 10 of the cleaning liquid spraying mechanism 3. The gas inlet pipe 72 is connected to a gas delivery device, such as a sealed gas tank or a process gas pipeline. The liquid output pipe 71 is open, with its tail end connected to atmospheric pressure. After spraying begins, gas is delivered to the cleaning liquid storage tank 7 to increase the pressure within the tank. The fluid, affected by the pressure within the tank, is automatically ejected from the tank (from high pressure to low pressure) through the liquid output pipe 71, achieving spraying.

[0066] In an optional embodiment, a waste liquid storage tank 8 is further provided at the bottom of the device body 1 for storing organic waste liquid and other waste liquids. Optionally, the volume of the waste liquid storage tank 8 is 3-5L.

[0067] Below the liftable tray 6 is a liquid collection tank with drainage holes around it. The sprayed liquid flows through the drainage holes of the liftable tray 6 into the liquid tank for collection. The liquid collection tank is provided with a water outlet and is connected to a waste liquid pipeline. The waste liquid collected in the liquid collection tank ultimately flows through the waste liquid pipeline into the waste liquid storage tank 8. In an optional embodiment, the control module 9 is also used to set program parameters for related programs, including but not limited to the running time, operating pressure, range of motion of the robotic arm, spray flow rate, and other detailed program parameters of the brush vibration cleaning program, the organic cleaning liquid cleaning program, the deionized water cleaning program, and the air shower drying program. The control module 9 is controlled by an independent computer terminal.

[0068] This flip-chip interconnect cleaning device utilizes a brush cleaning mechanism and a cleaning liquid spray mechanism, along with a robotic arm, to automatically clean the circuit. It also incorporates a backside cleaning procedure, allowing for the mechanized removal of stains and foreign matter from the backside of the circuit. This circuit cleaning device significantly improves the efficiency of manual cleaning of individual circuits, ensuring the cleanliness and smoothness of both the front and back sides of the flip-chip interconnect before installation.

[0069] The following describes a cleaning method using the device for cleaning with a specific embodiment.

[0070] Step 1: Preparation

[0071] Place the circuit to be cleaned upside down on the rectangular circuit support plate 5 of the liftable tray 6, with the front of the circuit suspended in the air. Check the circuit's placement. Check the level of the cleaning liquid (including two organic reagents and deionized water) in the cleaning device's cleaning tank 7 and the level of the waste liquid tank 8.

[0072] Step 2: Run and set cleaning device parameters

[0073] Turn on the power button of the cleaning device and complete the self-test of the cleaning device. Select the appropriate cleaning program on the control panel of the cleaning device. Set the appropriate liquid flow rate, cleaning time, liquid injection pressure, nitrogen (N2) purge time and gas flow rate in the program.

[0074] Step 3: Start the cleaning process

[0075] After the cleaning parameters are set, the cleaning device can be activated to execute the cleaning program. Upon activation, the liftable tray 6 is automatically raised to the cleaning position. The cleaning program controls the movement of the robotic arm within the tray, automatically positioning the circuit based on the circuit's position parameters on the circuit support plate 5.

[0076] First, the brush rotation cleaning process is performed through automatic positioning of the robotic arm. The brush rotation cleaning time is 30-90 seconds and the speed is 20-200 rpm.

[0077] Subsequently, the first organic cleaning liquid and the second organic cleaning liquid are sprayed, and deionized water is sprayed. The cleaning liquid spraying time is set to 60~120s, the pressure is about 5~50 MPa, and the flow rate is about 20~50 m 3 / h;

[0078] Finally, perform a N2 air shower, setting the N2 air shower time to 60-120 seconds and the air flow rate to approximately 30-100 sccm. During the cleaning process, pay attention to the working status of the cleaning device to ensure that the cleaning is normal.

[0079] Step 4: Cleaning completed

[0080] After the cleaning device completes the cleaning process, the liftable tray 6 automatically descends back to its initial position. The cleaned circuit is manually removed and the back of the circuit is checked to see if it has been cleaned effectively. The circuit is flipped over and suspended on its back, and the cleaning process is repeated to complete the cleaning of both the front and back sides of the circuit. It should be noted that when cleaning the front side of the circuit, the brush rotation sweeping process is no longer activated. The front side of the circuit is cleaned only by spraying the cleaning liquid and N2 air shower.

[0081] Unless otherwise defined, the technical or scientific terms used in this utility model shall have the usual meanings understood by persons of ordinary skill in the field to which this utility model belongs. The terms "first", "second" and similar words used in this utility model do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprising" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0082] At this point, those skilled in the art will recognize that while the present invention has been described with reference to preferred embodiments, various modifications may be made thereto and components may be substituted with equivalents without departing from the scope of the present invention. In particular, the various technical features described in the various embodiments may be combined in any manner, provided there are no structural conflicts. The present invention is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions within the scope of the claims.

Claims

1. A cleaning device for a flip-chip interconnect circuit, comprising a device body, characterized in that: The device body is provided with: a brush cleaning mechanism, configured to contact at least the back side of the circuit to be cleaned and clean the circuit; A cleaning liquid spraying mechanism, used for spraying the cleaning liquid required for cleaning the circuit; A circuit support plate, used to support the circuit to be cleaned; The control module is used to control the cleaning procedures of the brush cleaning mechanism and the cleaning liquid spraying mechanism.

2. The device according to claim 1, characterized in that The device also includes a nitrogen air shower mechanism, which includes a retractable mechanical arm and a nitrogen air gun connected thereto, and is used for spraying nitrogen to air-dry the cleaned circuit.

3. The device according to claim 2, characterized in that The brush cleaning mechanism includes a retractable mechanical arm and a rotating brush connected thereto. The arm head of the retractable mechanical arm is provided with a motor, and the motor drives the brush to rotate in one direction.

4. The device according to claim 3, characterized in that The cleaning liquid spraying mechanism comprises a retractable mechanical arm and a three-tube spraying head connected thereto, and each tube of the three-tube spraying head is used for spraying a specific cleaning liquid.

5. The device according to any one of claims 1 to 4, characterized in that: The circuit support board is provided with an inner groove fixed substrate for multiple circuits, the middle of the inner groove fixed substrate is a rectangular bracket supporting the edge of the circuit, the middle of the rectangular bracket is a hollow structure, and an arc-shaped area is provided on its outer side along the edge of the rectangular bracket.

6. The device according to claim 5, characterized in that The device further comprises a liftable tray arranged below the circuit support plate. The liftable tray is provided with a tray inner groove, which is adapted to the circuit support plate for fixing the circuit support plate.

7. The device according to claim 4, characterized in that A cleaning liquid storage tank is provided at the bottom of the device body for storing an organic solvent cleaning liquid and a deionized water cleaning liquid respectively.

8. The device according to claim 7, characterized in that A waste liquid storage tank is also provided at the bottom of the device body for storing organic waste liquid and other waste liquids.

9. The device according to claim 8, characterized in that The control module is further used to set program parameters of the relevant program, and the program parameters are selected from one or more of the operating time, operating pressure, range of motion of the robot arm and spray flow rate.

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