Mask assembly

Abstract

A mask assembly includes: a mask frame having an open region; and a first mask sheet covering the mask frame. The first mask sheet includes: a first layer including a plurality of first ribs extending in a first direction and a plurality of second ribs extending in a second direction crossing the first direction, and having a plurality of first openings defined by the first ribs and the second ribs; a second layer on a first surface of the first layer and extending around the plurality of first openings; and a third layer on the second surface of the first layer and having a plurality of pattern holes overlapping the plurality of first openings.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0132700 filed in the Korean Intellectual Property Office on October 5, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Aspects of embodiments of the present disclosure relate to a mask assembly and a method of manufacturing the mask assembly. Background Art

[0004] Electronic devices have been widely used. Electronic devices have been used in various forms, such as mobile electronic devices and stationary electronic devices. Electronic devices include display devices that can provide visual information, such as images or videos, to users to support various functions.

[0005] A display device that visually displays data can be formed by depositing various layers such as organic layers, inorganic layers, metal layers, etc. Deposition materials can be deposited to form multiple layers of the display device. For example, the deposition material can be sprayed from a deposition source (or emitted by a deposition source) and deposited on a display substrate through a mask assembly.

[0006] When the mask assembly is in close contact with the display device, a shadow phenomenon can be reduced and deposition quality can be improved.

[0007] The background art described above is information the inventor possessed for the purpose of obtaining the present disclosure or obtained in the process of developing the present disclosure, and it may not constitute related (or prior) art. Utility Model Content

[0008] Embodiments of the present disclosure include a mask assembly and a method of manufacturing the mask assembly, which can improve deposition quality.

[0009] However, such aspects and features are merely examples, and aspects and features of the present disclosure are not limited thereto.

[0010] Additional aspects and features will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments of the disclosure.

[0011] According to one embodiment of the present disclosure, a mask assembly includes: a mask frame having an opening area; and a first mask sheet covering the mask frame. The first mask sheet includes: a first layer including a plurality of first ribs extending in a first direction and a plurality of second ribs extending in a second direction intersecting the first direction, and having a plurality of first openings defined by the first and second ribs; a second layer extending on a first surface of the first layer and surrounding the plurality of first openings; and a third layer on a second surface of the first layer and having a plurality of patterned holes overlapping the plurality of first openings.

[0012] The first layer may further include a first through portion extending along a center in a width direction of the first rib in a longitudinal direction of the first rib and extending along a center in a width direction of the second rib in a longitudinal direction of the second rib.

[0013] When viewed from the second surface of the first layer, the second layer may cover the first through portion such that the second layer is exposed through the first through portion.

[0014] The first mask sheet may further include a first welding portion on the second layer exposed through the first through portion, and the first welding portion may be arranged along the first through portion in a plan view.

[0015] The first through portion, the second layer, and the first welding portion may overlap with each other in a plan view.

[0016] The mask assembly may further include a second mask sheet having a plurality of second openings corresponding to the plurality of first openings, and the second mask sheet may be welded to the second layer through the first welding portion.

[0017] The first through portion may be formed in the form of a line in an extending direction of the first rib and an extending direction of the second rib.

[0018] The first through portion may be formed in the form of a plurality of points spaced apart from each other in the longitudinal direction of the first rib and the longitudinal direction of the second rib.

[0019] The first layer may further include a second through portion extending along a periphery of the first layer.

[0020] When viewed from the second surface of the first layer, the second layer may cover the second through portion such that the second layer is exposed by the second through portion.

[0021] The first mask sheet may further include a second welding portion on the second layer exposed through the second through portion, and the second welding portion may be arranged along the second through portion in a plan view.

[0022] The second through portion may be formed in the form of a line extending along the circumference of the first layer.

[0023] The second through portion may be formed in the form of a plurality of points spaced apart from each other along the circumference of the first layer.

[0024] According to another embodiment of the present disclosure, a method for manufacturing a mask assembly includes: arranging a first layer including a unit area; arranging a second layer including a metal material on a first surface of the first layer to extend around the periphery of the unit area; forming a first opening by etching the unit area of ​​the first layer; forming a first through portion overlapping with the second layer by etching the first layer to expose the second layer; and welding the exposed second layer to a mask sheet through the first through portion.

[0025] The first through portion may be formed in the form of a grid in a plan view.

[0026] The method may further include disposing the second layer on the first surface of the first layer along a perimeter of the first layer.

[0027] The method may further include forming a second through portion by etching the first layer to expose a second layer disposed along a circumference of the first layer.

[0028] The second through portion may be formed in the form of a line along a circumference of the first layer.

[0029] The second through portion may be formed in the form of a plurality of points spaced apart from each other along the circumference of the first layer.

[0030] The method may further include soldering the exposed second layer to the mask sheet through the second through portion.

[0031] Aspects and features other than those described above will become apparent from the following drawings, claims, and detailed description of embodiments of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and other aspects and features of the embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0033] Figure 1 is a cross-sectional view of an apparatus for manufacturing a display device according to an embodiment;

[0034] Figure 2 To follow Figure 4 A schematic cross-sectional view of a mask assembly according to an embodiment, taken along line II-II';

[0035] Figure 3 is a schematic plan view of a mask assembly according to an embodiment;

[0036] Figure 4 for Figure 3 Magnified view of zone IV in ;

[0037] Figure 5 According to another embodiment Figure 3 Magnified view of zone IV in ;

[0038] Figures 6 to 10 is a schematic diagram of steps of a method for manufacturing a mask assembly according to an embodiment;

[0039] Figure 11 is a schematic perspective view of a display device manufactured by using an apparatus for manufacturing a display device according to an embodiment;

[0040] Figure 12 To include in Figure 11 An equivalent circuit diagram of a pixel circuit in the display device shown in ; and

[0041] Figure 13 for Figure 11 Schematic cross-sectional view of the display device shown in . DETAILED DESCRIPTION

[0042] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. In this regard, the embodiments described may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the embodiments are described below only by reference to the accompanying drawings to explain the aspects and features of the present description. It will be understood that when an element or layer is referred to as being "on" another element or layer, "connected to" or "coupled to" another element or layer, it may be directly on, connected to or coupled to another element or layer, or one or more intervening elements or layers may also be present. When an element or layer is referred to as being "directly on" another element or layer, "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers. For example, when a first element is described as being "coupled" or "connected" to a second element, the first element may be directly coupled or connected to the second element, or the first element may be indirectly coupled or connected to the second element via one or more intervening elements.

[0043] In the drawings, the sizes of various elements, layers, etc. may be exaggerated for clarity of illustration. The same reference numerals represent the same elements. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. In addition, when describing an embodiment of the present disclosure, the use of "may" relates to "one or more embodiments of the present disclosure." Expressions such as "at least one of..." and "any of..." modify the entire list of elements when following a list of elements, rather than modifying the individual elements of the list. For example, the expression "at least one of a, b, or c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof. As used herein, the term "using" may be considered synonymous with the term "utilizing." As used herein, the terms "substantially," "about," and similar terms are used as approximate terms rather than terms of degree, and are intended to illustrate the inherent variations in measured or calculated values ​​that a person of ordinary skill in the art would recognize.

[0044] It will be understood that although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections are not limited by these terms. These terms are used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, a first element, component, region, layer, or section discussed below may be referred to as a second element, component, region, layer, or section without departing from the teachings of the example embodiments.

[0045] For ease of description, spatially relative terms such as "below," "beneath," "down," "above," and "on" may be used herein to describe the relationship of one element or feature illustrated in the figures to another element or feature. It will be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is flipped, an element described as being "below" or "beneath" other elements or features will then be oriented "above" or "above" the other elements or features. Thus, the term "below" can encompass both above and below orientations. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0046] The terms used herein are for the purpose of describing the embodiments of the present disclosure and are not intended to limit the present disclosure. As used herein, the singular form "a" is intended to also include the plural form, unless the context clearly indicates otherwise. It will be further understood that the terms "comprise" and / or "comprising" when used in this specification clearly indicate the presence of stated features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups thereof.

[0047] In the following detailed description, the x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0048] When a certain embodiment can be implemented differently, a specific process sequence can be performed in a different manner than the described sequence. For example, two consecutively described processes can be performed simultaneously or substantially simultaneously, or can be performed in a reverse order to the described sequence.

[0049] Figure 1 FIG. 4 is a cross-sectional view of an apparatus for manufacturing a display device according to an embodiment.

[0050] The apparatus 2 for manufacturing a display device may include a chamber 10 , a first supporting part 20 , a second supporting part 30 , a mask assembly MA, a deposition source 50 , a magnetic part 60 , a vision part 70 , and a pressure control part 80 .

[0051] The chamber 10 may have a space formed therein, and the display substrate DS and the mask assembly MA may be accommodated in the chamber 10. A portion of the chamber 10 may be formed to be open, and a gate valve 11 may be provided in the open portion of the chamber 10. The open portion of the chamber 10 may be opened or closed according to the operation of the gate valve 11.

[0052] The display substrate DS may refer to a display substrate DS during a process of manufacturing a display device, in which at least one of an organic layer, an inorganic layer, or a metal layer is deposited on a substrate 100 (see FIG. Figure 13 ), which will be described in more detail below. In some embodiments, the display substrate DS may be the substrate 100 without depositing an organic layer, an inorganic layer, and a metal layer.

[0053] The first supporting portion 20 may support the display substrate DS, and the first supporting portion 20 may be a plate fixed in the chamber 10. In another embodiment, the first supporting portion 20 is where the display substrate DS is placed, and may be provided as a shuttle configured to perform linear motion inside the chamber 10. In another embodiment, the first supporting portion 20 may include an electrostatic chuck or an adhesive chuck fixed to the chamber 10 or arranged in the chamber 10 to be movable in the chamber 10 (e.g., movably arranged in the chamber 10).

[0054] The second support portion 30 may support the mask assembly MA. The second support portion 30 may be disposed in the chamber 10. The second support portion 30 may be configured to perform fine adjustment of the position of the mask assembly MA. The second support portion 30 may include a separate driving portion (e.g., a separate driver), an alignment unit, etc. to move the mask assembly MA in different directions.

[0055] In another embodiment, the second support portion 30 may be provided as a shuttle. In such an embodiment, the mask assembly MA is placed on the second support portion 30, and the second support portion 30 can transport the mask assembly MA. For example, the second support portion 30 can be moved to the outside of the chamber 10 and can enter the chamber 10 from the outside after the mask assembly MA is placed thereon.

[0056] In the above embodiment, the first support portion 20 and the second support portion 30 may be integrally formed. In such an embodiment, the first support portion 20 and the second support portion 30 may each include a movable shuttle. The first support portion 20 and the second support portion 30 may include a structure to fix the mask assembly MA and the display substrate DS thereon, and the display substrate DS is placed on the mask assembly MA, and the first support portion 20 and the second support portion 30 are configured to linearly move the display substrate DS and the mask assembly MA simultaneously.

[0057] However, in the following description, for convenience of explanation, an embodiment in which the first supporting portion 20 and the second supporting portion 30 are respectively formed at different positions in the chamber 10 is mainly described.

[0058] The deposition source 50 may be arranged to face the mask assembly MA. The deposition source 50 may include a deposition material, and by applying heat to the deposition material, the deposition material may evaporate or sublime. The deposition source 50 may be arranged to be fixed in the chamber 10 or capable of performing linear motion in one direction in the chamber 10.

[0059] The mask assembly MA may be disposed in the chamber 10. The mask assembly MA may include a mask frame MF and a mask sheet MS, which will be described in more detail below. A deposition material may be deposited on the display substrate DS through the mask assembly MA.

[0060] A magnetic portion (e.g., a magnet or a magnetic plate) 60 may be disposed in the chamber 10 so as to face the display substrate DS and / or the mask assembly MA. The magnetic portion 60 may apply a magnetic force to the mask assembly MA, thereby forcing the mask assembly MA toward the display substrate DS. For example, the magnetic portion 60 may not only prevent the mask sheet MS from sagging but may also move (or pull) the mask sheet MS to be adjacent to the display substrate DS. Furthermore, the magnetic portion 60 may maintain a uniform distance between the mask sheet MS and the display substrate DS.

[0061] The vision section 70 is arranged in the chamber 10 and can capture images of the positions of the display substrate DS and the mask assembly MA. The vision section 70 may include a camera for capturing images of the display substrate DS and the mask assembly MA. The positions of the display substrate DS and the mask assembly MA can be identified based on the images captured by the vision section 70, and thus the deformation of the mask assembly MA can be checked (e.g., measured). In addition, based on the images, the first support section 20 can fine-tune the position of the display substrate DS, or the second support section 30 can fine-tune the position of the mask assembly MA. However, in the following description, an embodiment in which the second support section 30 fine-tunes the position of the mask assembly MA to align the positions of the display substrate DS and the mask assembly MA will be mainly described.

[0062] The pressure control portion 80 is connected to the chamber 10 and can control the pressure in the chamber 10. For example, the pressure control portion 80 can control the pressure in the chamber 10 to be the same as or similar to the atmospheric pressure. In addition, the pressure control portion 80 can control the pressure in the chamber 10 to be the same as or similar to a vacuum state.

[0063] The pressure control portion 80 may include a connection pipe 81 connected to the chamber 10 and a pump 82 provided on (or along) the connection pipe 81. Depending on the operation of the pump 82, external air may be introduced into the chamber 10 through the connection pipe 81, or gas inside the chamber 10 may be guided (or drawn) to the outside through the connection pipe 81.

[0064] In the method of manufacturing a display device by using the apparatus 2 for manufacturing a display device described above, first, a display substrate DS may be prepared.

[0065] The pressure control portion 80 may maintain the pressure inside the chamber 10 to be the same as or similar to the atmospheric pressure, and operate the gate valve 11 to open the open portion of the chamber 10 .

[0066] Then, the display substrate DS can be loaded from the outside of the chamber 10 to the inside of the chamber 10. The display substrate DS can be loaded into the chamber 10 by various methods. For example, the display substrate DS can be loaded from the outside of the chamber 10 to the inside of the chamber 10 by a robot arm arranged outside the chamber 10. In another embodiment, when the first support portion 20 is a shuttle, the first support portion 20 can be transported from the inside of the chamber 10 to the outside of the chamber 10, the display substrate DS can be placed on the first support portion 20 by another robot arm arranged outside the chamber 10, and the first support portion 20 can be loaded into the chamber 10 from the outside of the chamber 10.

[0067] The mask assembly MA may be arranged in the chamber 10 as described above. In another embodiment, the mask assembly MA is loaded into the chamber 10 from outside the chamber 10 in the same or similar manner as the display substrate DS.

[0068] When the display substrate DS is loaded into the chamber 10, the display substrate DS may be placed on the first supporting portion 20. In this state, the vision portion 70 may capture an image of the positions of the display substrate DS and the mask assembly MA. The positions of the display substrate DS and the mask assembly MA may be recognized (or determined) based on the image captured by the vision portion 70. The apparatus 2 for manufacturing a display device includes a separate controller for recognizing the positions of the display substrate DS and the mask assembly MA.

[0069] When the recognition of the positions of the display substrate DS and the mask assembly MA is completed, the second supporting portion 30 may finely adjust the position of the mask assembly MA.

[0070] Then, when the deposition source 50 is operated, a deposition material can be supplied toward the mask assembly MA, and the deposition material passes through the plurality of pattern holes (or pattern openings) in the mask sheet MS to be deposited on the display substrate DS. In this state, the deposition source 50 can move parallel to the display substrate DS and the mask assembly MA, or the display substrate DS and the mask assembly MA can move parallel to the deposition source 50. For example, the deposition source 50 can move relative to the display substrate DS and the mask assembly MA. In this state, the pump 82 sucks (or extracts) gas from the chamber 10 and discharges the gas to the outside, so that the pressure in the chamber 10 can be maintained at the same or similar to a vacuum state.

[0071] As described above, the deposition material supplied from the deposition source 50 passes through the mask assembly MA and is then deposited on the display substrate DS, thereby forming at least one of multiple layers (e.g., organic layers, inorganic layers, and metal layers) to be stacked on the display device described below.

[0072] Figure 2 To follow Figure 4Schematic cross-sectional view of a mask assembly according to an embodiment, taken along line II-II'. Figure 3 is a schematic plan view of a mask assembly according to one embodiment. Figure 4 for Figure 3 Magnified view of region IV.

[0073] refer to Figures 2 to 4 , the mask assembly MA may include a mask frame MF and a mask sheet MS.

[0074] The mask frame MF is a frame that supports the mask sheet MS and may be a frame that defines (or has) an opening area OA at its center. In one embodiment, the mask frame MF is a circular frame, and the opening area OA may also be defined as a circle. However, the shape of the mask frame MF is not limited thereto and may have various polygonal shapes. In the following description, for ease of explanation, an embodiment in which the mask frame MF is a circular frame is mainly described.

[0075] The mask sheet MS may be provided on the mask frame MF. The opening area OA in the center of the mask frame MF may be covered by the mask sheet MS. In one embodiment, the mask sheet MS may be fixed to the mask frame MF by welding. In one embodiment, the mask sheet MS may have a circular shape corresponding to the shape of the opening area OA in the mask frame MF.

[0076] The mask sheet MS may include a first mask sheet MS1 and a second mask sheet MS2. The first mask sheet MS1 may include a first layer L100, a second layer L200, and a third layer L300.

[0077] The first layer L100 may include a silicon material. For example, the first layer L100 may include a silicon material selected from silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiO x N y ) at least one material.

[0078] The first layer L100 may be formed to correspond to the shape of the mask frame MF. For example, the first layer L100 may be formed to have a circular shape to cover the opening area OA in the mask frame MF. However, the present disclosure is not limited thereto, and the first layer L100 may be formed to have various polygonal shapes. Hereinafter, for ease of explanation, an embodiment in which the first layer L100 has a circular shape to correspond to the shape of the mask frame MF will be mainly described.

[0079] The first layer L100 may have a plurality of first openings OP1. In one embodiment, each of the plurality of first openings OP1 may be formed to have a quadrilateral shape. Each of the plurality of first openings OP1 may correspond to the shape of a display panel. In other words, each of the plurality of first openings OP1 may correspond to the shape of a cell.

[0080] In addition, the first layer L100 may include Figure 3 The first rib L110 extending in the x-direction (eg, the x-direction) and the second rib L110 extending in the second direction (eg, the x-direction) intersecting the first direction Figure 3 In one embodiment, the first ribs L110 and the second ribs L120 may include a plurality of first ribs L110 and a plurality of second ribs L120, respectively. The plurality of first ribs L110 may be spaced apart from each other in the second direction and may extend parallel to each other. The plurality of second ribs L120 may be spaced apart from each other in the first direction and may extend parallel to each other. The plurality of first ribs L110 and the plurality of second ribs L120 may be arranged in the form of a grid. In addition, the first opening OP1 may be defined by the plurality of first ribs L110 and the plurality of second ribs L120. For example, the first ribs L110 and the second ribs L120 may extend to surround the first opening OP1 (for example, extend around the periphery of the first opening OP1) and define the first opening OP1.

[0081] The first layer L100 may have a first through portion L130 and a second through portion L140. The first through portion L130 may be formed in the longitudinal direction of the first rib L110 (eg, Figure 3 The width of the first rib L110 (eg, Figure 3 The length in the y direction) direction of the first layer L100 may extend from the center thereof and may extend from the center thereof in the thickness direction of the first layer L100 (eg, Figure 3 The first rib L110 may be completely passed through (or extended through) the first layer L100 in the z-direction. For example, the first rib L110 may be divided into two parts by the first through portion L130 relative to the center of the first rib L110 in the width direction. In addition, the first through portion L130 may be provided in the longitudinal direction of the second rib L120 (e.g., Figure 3 y direction) along the width of the second rib L120 (eg, Figure 3The first through portion L130 may extend from the center of the first layer L100 in the direction of the thickness of the first layer L100 (or extend through) the first layer L100. For example, the second rib L120 may be divided into two parts relative to (or about) the center of the second rib L120 in the width direction by the first through portion L130. The first through portion L130 may be formed in the form of a line in the extending direction of the first rib L110 and the extending direction of the second rib L120. Therefore, the first through portion L130 may pass through (or extend through) the first layer L100 to form a grid as a whole in a plan view.

[0082] The second through portion L140 may extend along the periphery of the first layer L100 and may completely pass through (or extend through) the first layer L100 in the thickness direction. In one embodiment, the second through portion L140 may be in the form of a line extending along the periphery of the first layer L100. The second through portion L140 may be located between the periphery of the first layer L100 and the first opening OP1. In addition, the second through portion L140 may be located between the periphery of the first layer L100 and the first through portion L130. In other words, in a plan view, the second through portion L140 may be arranged to surround the first opening OP1 and / or the first through portion L130 (or may extend around the periphery of the first opening OP1 and / or the first through portion L130).

[0083] In one embodiment, the second through portion L140 may have a shape corresponding to the shape of the periphery of the first layer L100 in a plan view. For example, when the periphery of the first layer L100 is circular, the second through portion L140 may also have a circular shape, such as a ring shape.

[0084] As described below, the first through portion L130 and the second through portion L140 may provide a passage through which welding may be performed.

[0085] The second layer L200 may be disposed on the first surface of the first layer L100. The first surface of the first layer L100 may refer to a surface of the first layer L100 facing the mask frame MF. In addition, a second surface of the first layer L100 opposite to the first surface of the first layer L100 may refer to a surface of the first layer L100 facing the display substrate DS.

[0086] The second layer L200 may include a metal material. For example, the second layer L200 may include at least one of aluminum (Al), copper (Cu), titanium (Ti), and molybdenum (Mo).

[0087] In a plan view, the first portion L210 of the second layer L200 can be arranged to surround the first opening OP1 (or extend around the periphery of the first opening OP1). In one embodiment, in a plan view, the first portion L210 can be arranged to overlap with the first rib L110 and the second rib L120. For example, in a plan view, the first portion L210 can be arranged to overlap with the first through portion L130. In other words, when viewed from the second surface of the first layer L100, the first portion L210 can be exposed by the first through portion L130 (or exposed through the first through portion L130), and the first portion L210 can be provided on the first surface of the first layer L100 to cover the first through portion L130 (or extend throughout the first through portion L130). Accordingly, the first portion L210 of the second layer L200 can be arranged in the form of a grid.

[0088] In a plan view, the second portion L220 of the second layer L200 may extend along the periphery of the first layer L100 and may be disposed on the first surface of the first layer L100. In one embodiment, in a plan view, the second portion L220 may be arranged to overlap with the second through portion L140. For example, when viewed from the second surface of the first layer L100, the second portion L220 may be exposed by (or exposed through) the second through portion L140, and the second portion L220 may be disposed on the first surface of the first layer L100 to cover the second through portion L140. Accordingly, the second portion L220 of the second layer L200 may have a circular shape, such as a ring shape.

[0089] In addition, in one embodiment, the thickness of the second layer L200 may be at least about 3 μm but not greater than about 10 μm. Accordingly, as described below, sufficient thickness may be provided as a weldable base material.

[0090] The third layer L300 may be disposed on the second surface of the first layer L100. As described above, the second surface of the first layer L100 is opposite to the first surface and may refer to one surface of the first layer L100 facing the display substrate DS.

[0091] In one embodiment, the third layer L300 may include a metal material. For example, the third layer L300 may include at least one of aluminum (Al), copper (Cu), titanium (Ti), and molybdenum (Mo). In another embodiment, the third layer L300 may include an inorganic material. For example, the third layer L300 may include a silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiO x N y ) at least one material.

[0092] In a plan view, the third layer L300 may be arranged to cover (or extend over) the first opening OP1 formed in the first layer L100. For example, the third layer L300 is provided as a plurality of parts, the number of which corresponds to the number of the first openings OP1, and each part may be arranged to cover each first opening OP1. In one embodiment, each part of the third layer L300 may have a plurality of pattern holes (e.g., pattern openings) PT overlapping with the first opening OP1. In one embodiment, the shape of the plurality of pattern holes PT may correspond to the shape of a deposition pattern to be deposited on the display substrate DS. For example, the plurality of pattern holes PT may have the shape of an emission layer pattern of a pixel to be deposited on the display substrate DS. Accordingly, the deposition material may pass through the plurality of pattern holes PT to form an emission layer on the display substrate DS.

[0093] In addition, in one embodiment, the thickness of the third layer L300 may be at least about 1 μm but not greater than about 2 μm.

[0094] The second mask sheet MS2 may include a metal material. For example, the second mask sheet MS2 may include at least one of aluminum (Al), copper (Cu), titanium (Ti), and molybdenum (Mo).

[0095] The second mask sheet MS2 can be arranged to face the second layer L200. For example, the second mask sheet MS2 can be arranged between the mask frame MF and the second layer L200. The second mask sheet MS2 can have a second opening OP2 corresponding to the first opening OP1. For example, the second opening OP2 can have a shape and size corresponding to the shape and size of the first opening OP1, and the number of second openings OP2 can correspond to the number of first openings OP1. In one embodiment, the second mask sheet MS2 can be an open mask and can connect the second layer L200 to the mask frame MF.

[0096] In one embodiment, the thickness of the second mask sheet MS2 may be at least about 100 μm but not greater than about 200 μm.

[0097] In addition, in a plan view, the second mask sheet MS2 can be arranged to overlap with the second layer L200. For example, the second mask sheet MS2 can be arranged to overlap with the second layer L200 (such as the first portion L210). Accordingly, a portion of the second mask sheet MS2 can be arranged in a grid form.

[0098] In addition, the first mask sheet MS1 may include a first welding portion WP1 and a second welding portion WP2. The first welding portion WP1 may be provided on the second layer L200 exposed by the first through portion L130, for example, on the first portion L210 of the second layer L200. The first through portion L130, the second layer L200, and the first welding portion WP1 may overlap with each other. The first welding portion WP1 may be a welding spot for welding, and the second layer L200 may be connected to the second mask sheet MS2 by welding the first welding portion WP1. In one embodiment, the first welding portion WP1 may be arranged along the first through portion L130. For example, when the first through portion L130 is formed in the form of a grid as a whole in a plan view, the first welding portion WP1 may form welding lines in the form of a grid on the second layer L200 along the first through portion L130.

[0099] The second welding portion WP2 can be provided on the second layer L200 exposed by the second through-portion L140, such as on the second portion L220 of the second layer L200. The second welding portion WP2 can refer to a welding spot, and the second layer L200 can be connected to the second mask sheet MS2 by welding through the second welding portion WP2. In this case, in one embodiment, the second welding portion WP2 can be arranged along the second through-portion L140. For example, when the second through-portion L140 is in the form of a line extending along the periphery of the first layer L100 in a plan view, the second welding portion WP2 can also form a welding line on the second layer L200 along the periphery of the first layer L100 along the second through-portion L140. Accordingly, the second welding portion WP2 can have a circular ring shape.

[0100] According to an embodiment, an integrated mask assembly MA can be provided. In other words, the first mask sheet MS1 and the second mask sheet MS2 can be welded to be integrated through the first welding portion WP1 and the second welding portion WP2. In addition, because the second mask sheet MS2 is fixed to the mask frame MF, the first mask sheet MS1, the second mask sheet MS2, and the mask frame MF can be integrated.

[0101] In addition, a separate component, such as a mask support for bringing the mask assembly MA including the mask sheet toward the display substrate DS, can be omitted. For example, because the second mask sheet MS2 is integrated with the first mask sheet MS1, the magnetic force of the magnetic portion 60 of the apparatus for manufacturing a display device can be applied to the second mask sheet MS2, which is relatively thick and includes a metal material. For example, the second mask sheet MS2 can function as an open mask and can receive (e.g., can simultaneously receive) the magnetic force of the magnetic portion 60, thereby bringing the mask assembly MA toward the display substrate DS and preventing it from sagging.

[0102] Because the first layer L100 of the first mask sheet MS1 does not contain a metal material, and the third layer L300 is a very thin film having a thickness of at least approximately 1 μm but not greater than approximately 2 μm, which is not thick enough to receive magnetic force, a separate component may be required to apply a force to the first mask sheet MS1 toward the display substrate DS. According to one embodiment, the first mask sheet MS1 can be integrated with the second mask sheet MS2 via the second layer L200. The second mask sheet MS2 has a sufficient thickness and is arranged in a grid pattern to surround the first opening OP1 (or extend around the periphery of the first opening OP1). Because the magnetic force of the magnetic portion 60 is sufficiently applied, the first mask sheet MS1 can be in close contact with the display substrate DS, and no additional separate component is required. Accordingly, shadowing can be reduced or minimized, thereby improving the deposition quality of the display substrate DS.

[0103] Figure 5 is a schematic plan view of a mask assembly according to another embodiment. Figure 5 The mask assembly shown in FIG. Figure 4 The mask components shown in FIG. 1 are similar, and therefore, in the following, mainly the differences are described.

[0104] refer to Figure 5 In one embodiment, the first through portion L130 may be formed in the form of a plurality of points that are arranged at the center in the width direction of the first rib L110 and spaced apart from each other in the longitudinal direction of the first rib L110. In addition, the first through portion L130 may be formed in the form of a plurality of points that are arranged at the center in the width direction of the second rib L120 and spaced apart from each other in the longitudinal direction of the second rib L120. The first portion L210 of the second layer L200 that overlaps with the first through portion L130 may be formed in the form of a line, such as Figure 3 shown in, or may be formed in the form of dots to correspond to Figure 5 A first through portion L130 is formed in the form of a dot.

[0105] In addition, in one embodiment, the second through portion L140 may be formed in the form of a plurality of points spaced apart from each other along the periphery of the first layer L100. The second portion L220 of the second layer L200 overlapping the second through portion L140 may be formed in the form of a line, such as Figure 3 shown in, or may be formed in the form of dots to correspond to Figure 5 A second through portion L140 is formed in the form of a dot.

[0106] In some embodiments, each of the first and second welding portions WP1 and WP2 disposed on the second layer L200 exposed by the first and second through portions L130 and L140 may also be formed in the form of a plurality of dots.

[0107] Because the first through-holes L130 and / or the second through-holes L140 are formed as dots rather than lines, the durability of the first mask sheet MS1 can be increased. For example, the first through-holes L130 and the second through-holes L140 are where the first mask sheet MS1, particularly the second layer L200, is welded to the second mask sheet MS2. However, this requires etching and removal of the first layer L100. Dotting the first through-holes L130 and / or the second through-holes L140 reduces the amount of etching and removal of the first layer L100, thereby increasing the durability of the first mask sheet MS1.

[0108] Figures 6 to 10 Schematic diagram of steps of a method for manufacturing a mask assembly according to an embodiment.

[0109] The method of manufacturing a mask assembly according to the present embodiment may be used to manufacture the mask assembly described above, but the present disclosure is not limited thereto.

[0110] refer to Figure 6 , a first mask sheet MS1 may be formed. For example, a first layer L100 may be arranged. The first layer L100 may include a silicon material, for example, silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiO x N y The first layer L100 may include a plurality of unit regions. Each unit region may refer to a region that is later etched to form the first opening OP1.

[0111] refer to Figure 7, the second layer L200 can be provided on the first surface of the first layer L100. The second layer L200 can include a metal material, for example, at least one of aluminum (Al), copper (Cu), titanium (Ti) and molybdenum (Mo). The second layer L200 includes a first portion L210 and a second portion L220, and can be formed on the first layer L100. The first portion L210 can be arranged around the first opening OP1 formed later (or extend around the periphery of the first opening OP1), that is, the unit area. The second portion L220 can be arranged along the periphery of the first layer L100. As described above, in one embodiment, the first portion L210 of the second layer L200 can be arranged in the form of a grid. In addition, the second portion L220 of the second layer L200 can be arranged in the form of a ring along the periphery of the first layer L100.

[0112] The first portion L210 and the second portion L220 may be formed by etching the second layer L200, or the first portion L210 and the second portion L220 may be formed by depositing a deposition material to be patterned.

[0113] refer to Figure 8 , the third layer L300 may be disposed on the second surface of the first layer L100. In one embodiment, the third layer L300 may include a metal material. In another embodiment, the third layer L300 may include an inorganic material. The third layer L300 may be arranged to include a plurality of pattern holes PT. In one embodiment, after the third layer L300 is disposed, a photoresist layer may be disposed on the third layer L300, and the plurality of pattern holes PT may be formed by etching the third layer L300. In another embodiment, a photoresist layer is patterned on the second surface of the first layer L100, and then the third layer L300 may be formed by electroforming to have pattern holes PT between the patterned photoresist layers.

[0114] refer to Figure 9 , the first layer L100 may be etched to form a first opening OP1, a first through portion L130, and a second through portion L140. As described above, the first opening OP1 may correspond to the cell region. The first through portion L130 and the second through portion L140 may expose the second layer L200 so that a welding portion may be provided thereon.

[0115] refer to Figure 10The second layer L200 exposed by the first through-hole portion L130 (e.g., the first portion L210) and the second layer L200 exposed by the second through-hole portion L140 (e.g., the second portion L220) can be welded to the second mask sheet MS2 via the first welding portion WP1 and the second welding portion WP2, respectively. The second mask sheet MS2 can include a metal material and can have a second opening OP2 corresponding to the first opening OP1. In addition, because the second mask sheet MS2 is fixedly connected to the mask frame MF, an integrated mask assembly MA can be manufactured.

[0116] Figure 11 is a schematic perspective view of a display device manufactured by using an apparatus for manufacturing a display device according to an embodiment.

[0117] refer to Figure 11 The display device 1 may include a display area DA for displaying an image and a peripheral area PA where no image is displayed. The display device 1 may provide an image by forming an array of multiple pixels arranged two-dimensionally on an xy plane in the display area DA. Each pixel may include different sub-pixels. The sub-pixels may emit light of different colors; for example, each sub-pixel may be one of a green sub-pixel, a red sub-pixel, and a blue sub-pixel.

[0118] In one embodiment, the plurality of subpixels may include a first subpixel PX1, a second subpixel PX2, and a third subpixel PX3. Hereinafter, for ease of explanation, an embodiment is described in which the first subpixel PX1 is a green subpixel, the second subpixel PX2 is a red subpixel, and the third subpixel PX3 is a blue subpixel.

[0119] The first subpixel PX1 , the second subpixel PX2 , and the third subpixel PX3 may be regions that may emit green light, red light, and blue light, respectively, and the display device 1 may provide an image by using the light emitted from the subpixels.

[0120] The peripheral area PA is an area that does not provide an image and may completely surround the display area DA (e.g., may completely extend around the periphery of the display area DA). Drivers or main voltage lines for providing electrical signals or power to pixel circuits may be arranged in the peripheral area PA. The peripheral area PA may include pads, i.e., areas that can be electrically connected to electronic components or a printed circuit board.

[0121] like Figure 11 As shown in FIG, the display area DA may have a polygonal shape, such as a quadrilateral. For example, the display area DA may have a rectangular shape with a horizontal length greater than a vertical length, a rectangular shape with a horizontal length less than a vertical length, or a square shape. In another embodiment, the display area DA may be circular, elliptical, or polygonal (such as a triangle or a pentagon). In addition, Figure 11 The display device 1 shown in FIG. 1 is a flat panel display device, but the display device 1 may be implemented in various forms such as a flexible display device, a foldable display device, and a rollable display device.

[0122] The display device 1 can be used as a display screen for various products (for example, not only portable electronic devices such as mobile phones, smart phones, tablet personal computers (PCs), mobile communication terminals, electronic organizers, e-books, portable multimedia players (PMPs), navigation devices, ultra mobile personal computers (UMPCs), etc., but also televisions, laptop computers, monitors, billboards, Internet of Things (IoT) devices, etc.). In addition, the display device 1 according to an embodiment can be used for wearable devices such as smart watches, watch phones, glasses-type displays, head-mounted displays (HMDs), etc. In addition, the display device 1 according to an embodiment can be used as a display for an instrument panel of a vehicle, a central information display (CID) arranged on a center instrument panel or dashboard of a vehicle, a room mirror display instead of a side mirror of a vehicle, or a display arranged on the rear side of a front seat as an entertainment device for rear seat passengers of the vehicle.

[0123] In addition, the following description will describe a display device 1 including an organic light-emitting diode (OLED) as a display element, but the display device 1 of the present disclosure is not limited thereto. In another embodiment, the display device 1 may be a light-emitting display device including an inorganic light-emitting diode, i.e., an inorganic light-emitting display device. In another embodiment, the display device 1 may be a quantum dot light-emitting display device.

[0124] Figure 12 FIG1 is an equivalent circuit diagram of a pixel circuit PC included in a display device manufactured using an apparatus for manufacturing a display device according to an embodiment. The pixel circuit PC may be electrically connected to a display element, and one display element may correspond to one pixel PX. For example, the display element may be an organic light emitting diode (OLED).

[0125] The pixel circuit PC may include a first transistor Td, a second transistor Ts, and a storage capacitor Cst. The second transistor Ts is a switching transistor and may be connected to a scan line SL and a data line DL. The second transistor Ts may be turned on by a switching signal input from the scan line SL to transmit a data signal input from the data line DL to the first transistor Td. The storage capacitor Cst may have one end electrically connected to the second transistor Ts and the other end electrically connected to a driving power line PL, and may store a voltage corresponding to a difference between a voltage received from the second transistor Ts and a driving power voltage ELVDD supplied to the driving power line PL.

[0126] The first transistor Td is a driving transistor and can be connected to the driving power line PL and the storage capacitor Cst, and can be configured to control the magnitude of the driving current flowing from the driving power line PL to the organic light emitting diode OLED according to the value of the voltage stored in the storage capacitor Cst. The organic light emitting diode OLED emits light with a certain brightness according to the driving current. The opposite electrode 230 of the organic light emitting diode OLED (see, for example Figure 13 ) can receive the electrode power supply voltage ELVSS.

[0127] Figure 12 The pixel circuit PC is shown as including two transistors and one storage capacitor, but the present disclosure is not limited thereto. For example, the number of transistors or the number of storage capacitors may vary depending on the design of the pixel circuit PC.

[0128] Figure 13 A display device manufactured by using an apparatus for manufacturing a display device according to an embodiment Figure 11 Schematic cross-sectional view of a display device shown in FIG.

[0129] refer to Figure 13 The display device 1 may include a substrate 100, a pixel circuit layer 110 including a transistor TR, a via insulating layer 120 on the pixel circuit layer 110, a display element layer 140 disposed on the via insulating layer 120, and an encapsulation layer 300 on the display element layer 140.

[0130] The substrate 100 may have an upper surface that is a plane extending along the x-direction and the y-direction. The substrate 100 may include a semiconductor material, such as a Group IV semiconductor, a Group III-V compound semiconductor, or a Group II-VI compound semiconductor. For example, the substrate 100 may be a semiconductor substrate including a semiconductor material. In one embodiment, the substrate 100 may include silicon (Si). For example, the substrate 100 may include a silicon substrate (e.g., a silicon semiconductor substrate). For example, the substrate 100 may be a silicon wafer. The silicon wafer may be a single crystal silicon wafer, a polycrystalline silicon wafer, or an amorphous silicon wafer.

[0131] An organic light-emitting diode display device using a semiconductor substrate as substrate 100 may be referred to as an OLED on silicon (OLEDoS). Because OLEDoS uses a semiconductor substrate as substrate 100, transistor manufacturing processes commonly used in the semiconductor technology field can be applied to display device manufacturing processes. Consequently, because ultra-small pixels can be formed and controlled, OLEDoS can display ultra-high-resolution images.

[0132] In some embodiments, the type of substrate 100 is not limited to a semiconductor substrate. For example, the substrate 100 may include glass, metal, or a polymer resin. In addition, the substrate 100 may include a polymer resin such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. The substrate 100 may have a multilayer structure including two layers, each layer including a polymer resin and an inorganic material (e.g., silicon oxide (SiO X ), silicon nitride (SiN X ) and / or silicon oxynitride (SiO X N Y )) of the barrier layer, and various modifications may be made. Hereinafter, an embodiment in which the substrate 100 is a silicon substrate is mainly described.

[0133] The pixel circuit layer 110 may be provided on the substrate 100. The pixel circuit layer 110 may include circuits corresponding to the pixels (ie, as shown in the above reference Figure 11 Each of the plurality of pixel circuits may include the plurality of pixel circuits of the first sub-pixel PX1, the second sub-pixel PX2 and the third sub-pixel PX3 described above. Figure 12 The pixel circuit layer 110 may include at least one transistor TR and at least one insulating layer.

[0134] Figure 13 In this embodiment, an organic light emitting diode OLED as a display element is provided on the substrate 100. When the organic light emitting diode OLED is electrically connected to the pixel circuit PC, it may mean that the pixel electrode 210 included in the organic light emitting diode OLED is electrically connected to the pixel circuit PC (see, for example, FIG. Figure 12 ) in the transistor TR. For ease of explanation, Figure 13 An embodiment in which the transistor TR is connected to each of the first organic light emitting diode OLED1, the second organic light emitting diode OLED2, and the third organic light emitting diode OLED3 is illustrated, and the transistor TR may correspond to the first transistor Td (see, for example, Figure 12 ).

[0135] The transistor TR may include a gate dielectric layer GO, a gate electrode GE, and an active area ACT. The transistor TR may be, for example, a metal oxide semiconductor field effect transistor (MOSFET), but is not limited thereto. In one embodiment, each of the transistors TR may be isolated from each other by an element isolation region disposed between the transistors TR.

[0136] The active area ACT may be arranged in the substrate 100. The active area ACT may be formed as a portion of the substrate 100. The active area ACT may be arranged to extend in a first direction (e.g., in the x-direction) within the substrate 100. A portion of the substrate 100 may be recessed, and the active area ACT may be provided on the recessed portion of the substrate 100. The active area ACT may include a channel region C and a drain region D and a source region S respectively disposed on either side (e.g., opposite sides) of the channel region C. Each of the drain region D and the source region S may be a region doped with impurities on the substrate 100 comprising a semiconductor material. The channel region C may overlap with the gate electrode GE.

[0137] The gate dielectric layer GO may be disposed between the gate electrode GE and the active area ACT. The gate dielectric layer GO may include, for example, an inorganic insulating material such as silicon oxide (eg, SiO 2 ), silicon nitride (SiN X ), silicon oxynitride (e.g., SiON), aluminum oxide (e.g., Al2O3), titanium oxide (e.g., TiO2), tantalum oxide (e.g., Ta2O5), hafnium oxide (e.g., HfO2), or zinc oxide (e.g., ZnO2).

[0138] The gate electrode GE may be disposed on the active area ACT. The gate electrode GE may be arranged to intersect the active area ACT and extend in one direction (e.g., in the y direction). The channel region C of the transistor TR may be formed in the active area ACT intersecting with the gate electrode GE. For example, the gate electrode GE may overlap with the channel region C of the transistor TR. The gate electrode GE may be disposed on the gate dielectric layer GO. The gate electrode GE may include a conductive material. For example, the gate electrode GE may include a metal nitride (such as titanium nitride (TiN), tantalum nitride (TaN), or tungsten nitride (WN)) and / or a metal material (such as aluminum (Al), tungsten (W), copper (Cu), or molybdenum (Mo)) or a semiconductor material (such as doped polysilicon). The gate electrode GE may be formed as a multilayer structure or a single layer, each layer including the material described above.

[0139] The interlayer insulating layer 111 may be provided on the substrate 100 and may cover the transistor TR. The interlayer insulating layer 111 may include at least one of oxide, nitride, and oxynitride. The interlayer insulating layer 111 may have a single layer or a multi-layer structure.

[0140] The drain electrode DE and the source electrode SE may be provided on the interlayer insulating layer 111. The drain electrode DE and the source electrode SE may be connected to the drain region D and the source region S of the active region ACT, respectively, through contact holes (e.g., contact openings) provided in the interlayer insulating layer 111. Each of the drain electrode DE and the source electrode SE may include a material exhibiting excellent conductivity. Each of the drain electrode DE and the source electrode SE may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti), and may be formed as a multilayer or single layer, each layer including the materials described above.

[0141] The via insulating layer 120 may be provided on the pixel circuit layer 110. The via insulating layer 120 may be an organic insulating layer that covers the upper surface of the drain electrode DE and the source electrode SE and has a substantially flat upper surface, thereby serving as a planarization film. The via insulating layer 120 may include an organic material such as acrylic acid, benzocyclobutene (BCB), or hexamethyldisiloxane (HMDSO). The via insulating layer 120 is shown as a single layer, but is not limited thereto and may be formed as multiple layers.

[0142] The display element layer 140 may be disposed on the via insulating layer 120. The display element layer 140 may include a first organic light emitting diode OLED1, a second organic light emitting diode OLED2, and a third organic light emitting diode OLED3.

[0143] Each of the first to third organic light emitting diodes OLED1, OLED2, and OLED3 may include a structure of a stack of pixel electrodes 210, an emission layer 220, and an opposing electrode 230. The first to third organic light emitting diodes OLED1, OLED2, and OLED3 may each emit light having the same peak spectrum. For example, each of the first to third organic light emitting diodes OLED1, OLED2, and OLED3 may emit white light. For example, the peak spectrum of each of the first to third organic light emitting diodes OLED1, OLED2, and OLED3 may have a peak in a first wavelength region within a range of about 435 nm to about 490 nm, in a second wavelength region within a range of about 500 nm to about 590 nm, and in a third wavelength region within a range of about 600 nm to about 710 nm. The first to third organic light emitting diodes OLED1, OLED2, and OLED3 emit light, and the regions emitting light may be defined as a first emission area EA1, a second emission area EA2, and a third emission area EA3, respectively.

[0144] A plurality of pixel electrodes 210 may be provided on the via insulating layer 120. Each of the pixel electrodes 210 may be electrically connected to the transistor TR via a contact hole (e.g., a contact opening) provided in the via insulating layer 120. Each of the pixel electrodes 210 may include a transmissive conductive layer formed of a transmissive conductive oxide (such as ITO, In2O3, or IZO) and a reflective layer formed of a metal (such as Al or Ag). For example, each of the pixel electrodes 210 may have a three-layer structure of ITO / Ag / ITO.

[0145] like Figure 13 , the pixel electrode 210 may include a first pixel electrode 210a, a second pixel electrode 210b, and a third pixel electrode 210c. When viewed in a direction perpendicular to the substrate 100, the first to third pixel electrodes 210a, 210b, and 210c may be arranged to be separated from each other.

[0146] The pixel defining layer 130 may be disposed on the via insulating layer 120. The pixel defining layer 130 may have an opening 130OP corresponding to each of the first to third sub-pixels PX1, PX2, and PX3. The opening 130OP in the pixel defining layer 130 may expose at least a portion (e.g., a central portion) of each of the pixel electrodes 210. In one embodiment, the first to third emission areas EA1, EA2, and EA3 may be defined as areas exposed by the opening 130OP in the pixel defining layer 130. The pixel defining layer 130 may include an organic insulating material and / or an inorganic insulating material. The pixel defining layer 130 may include, for example, an organic material such as polyimide or hexamethyldisiloxane (HMDSO).

[0147] A spacer for preventing the mask from being scratched may be further provided on the pixel defining layer 130. In one embodiment, the spacer may be integrally formed with the pixel defining layer 130. For example, the spacer and the pixel defining layer 130 may be simultaneously formed in the same process using a half-tone mask process.

[0148] The emission layer 220 may be disposed on the pixel electrode 210. The emission layer 220 may be arranged to cover the pixel electrode 210 exposed by the opening 130OP in the pixel defining layer 130. In one embodiment, the emission layer 220 may be integrally formed on the plurality of pixel electrodes 210.

[0149] The emission layer 220 may emit light of a specific color. For example, the emission layer 220 may emit white light.

[0150] In one embodiment, the emission layer 220 may include a polymer or oligomer organic material. The emission layer 220 may include an organic emission layer. For example, the emission layer 220 may include a polymer material, such as a polyphenylene vinylene (PPV)-based polymer material and a polyfluorene-based polymer material. The emission layer 220 may be formed by screen printing, inkjet printing, laser induced thermal imaging (LITI), etc. However, the present disclosure is not limited thereto, and the emission layer 220 may include an inorganic light-emitting material or may include quantum dots.

[0151] In one embodiment, the functional layer may be disposed below or above the emission layer 220. The functional layer may include a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and / or an electron injection layer (EIL). The functional layer may be integrally formed on the plurality of pixel electrodes 210 and may be patterned to correspond to each of the plurality of pixel electrodes 210.

[0152] The opposing electrode 230 may be disposed on the pixel electrode 210 and may overlap with the pixel electrode 210. The opposing electrode 230 may be disposed on the emissive layer 220. The opposing electrode 230 may include a conductive material having a low work function. For example, the opposing electrode 230 may include a (semi) transparent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or an alloy thereof. In some embodiments, the opposing electrode 230 may further include a layer comprising ITO, IZO, ZnO, or In2O3 on the (semi) transparent layer comprising the aforementioned materials. The opposing electrode 230 may be formed integrally to completely cover the substrate 100.

[0153] The encapsulation layer 300 may be disposed on the opposing electrode 230. The encapsulation layer 300 may be arranged to cover the first to third organic light-emitting diodes OLED1, OLED2, and OLED3. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In one embodiment, the encapsulation layer 300 may include a first inorganic encapsulation layer 310, an organic encapsulation layer 320 on the first inorganic encapsulation layer 310, and a second inorganic encapsulation layer 330.

[0154] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may each include one or more inorganic materials selected from the group consisting of aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 320 may include a polymer material. Polymer materials may include acrylic resins, epoxy resins, polyimides, and polyethylene. In one embodiment, the organic encapsulation layer 320 may include acrylate. The organic encapsulation layer 320 may be formed by curing a monomer or applying a polymer. The organic encapsulation layer 320 may be transparent.

[0155] The touch sensor layer can be provided on the encapsulation layer 300, and the optical functional layer can be provided on the touch sensor layer. The touch sensor layer can obtain coordinate information based on external input (e.g., a touch event). The optical functional layer can reduce the reflectivity of light (e.g., external light) incident on the display device from the outside and / or can improve the color purity of the light emitted from the display device. In one embodiment, the optical functional layer may include a retarder and / or a polarizer. The retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretched synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a certain array. The retarder and the polarizer may further include a protective film.

[0156] The adhesive member may be disposed between the touch sensor layer and the optical functional layer. The adhesive member may be any commonly used adhesive known in the art without limitation. In one embodiment, the adhesive member may be a pressure sensitive adhesive (PSA).

[0157] According to embodiments, the mask assembly may be better aligned with the display substrate, and thus the deposition quality of the deposition material may be improved.

[0158] It should be understood that the embodiments described herein should be considered illustrative and not for purposes of limitation. The description of features or aspects in each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope defined by the appended claims and their equivalents.

Claims

1. A mask assembly, characterized in that: The mask assembly comprises: a mask frame having an opening area; and a first mask sheet, covering the mask frame and comprising: a first layer including a plurality of first ribs extending in a first direction and a plurality of second ribs extending in a second direction intersecting the first direction, and having a plurality of first openings defined by the first ribs and the second ribs; a second layer on the first surface of the first layer and extending around the plurality of first openings; and The third layer is on the second surface of the first layer and has a plurality of patterned holes overlapping the plurality of first openings.

2. The mask assembly according to claim 1, wherein: The first layer further includes a first through portion extending along a center in a width direction of the first rib in a longitudinal direction of the first rib and extending along a center in a width direction of the second rib in a longitudinal direction of the second rib.

3. The mask assembly according to claim 2, wherein: When viewed from the second surface of the first layer, the second layer covers the first through portion such that the second layer is exposed through the first through portion.

4. The mask assembly according to claim 3, wherein: The first mask sheet further includes a first welding portion on the second layer exposed by the first through portion, and The first welding portion is arranged along the first through portion in a plan view.

5. The mask assembly according to claim 4, wherein: The first through portion, the second layer, and the first welding portion overlap each other in a plan view.

6. The mask assembly according to claim 4, wherein: The mask assembly further includes a second mask sheet having a plurality of second openings corresponding to the plurality of first openings, and The second mask sheet is welded to the second layer through the first welding portion.

7. The mask assembly according to claim 2, wherein: The first through portion is formed in the form of a line in an extending direction of the first rib and an extending direction of the second rib.

8. The mask assembly according to claim 1, wherein: The first layer further includes a second through portion extending along a periphery of the first layer.

9. The mask assembly according to claim 8, wherein: When viewed from the second surface of the first layer, the second layer covers the second through portion such that the second layer is exposed by the second through portion.

10. The mask assembly according to claim 9, wherein: The first mask sheet further includes a second welding portion on the second layer exposed by the second through portion, and The second welding portion is arranged along the second through portion in a plan view.

Images