Vibration reduction structure of bonding machine and bonding machine

Abstract

The utility model discloses a bonding machine vibration reduction structure and a bonding machine, the bonding machine vibration reduction structure comprises a moving part, a rack and a vibration reduction device, the moving part is located above the rack and is in transmission connection with the rack, the moving part comprises a moving mechanism and a bearing mechanism, the bearing mechanism is used for bearing the moving mechanism, and the moving mechanism is used for assembling and driving a bonding head to move; the damping device comprises a buffer mechanism, an outer leading mechanism and a damping mechanism, the buffer mechanism is located between the bearing mechanism and the rack, the first end of the outer leading mechanism is connected with the bearing mechanism, and the second end of the outer leading mechanism is in transmission connection with the rack through the damping mechanism. According to the bonding machine vibration reduction structure provided by the invention, the motion counter-force of the motion part on the rack in the height direction is reduced through the buffer mechanism, and meanwhile, the motion counter-force of the motion part on the rack in the horizontal direction is reduced through the cooperation between the external leading mechanism and the damping mechanism, so that the overall vibration of equipment is reduced to realize the dynamic balance of the whole equipment; and therefore, foundation vibration is avoided, and influence on other surrounding equipment is prevented.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor chip bonding technology, and in particular relates to a bonding machine vibration damping structure and a bonding machine. Background Art

[0002] In the process of wire bonding of semiconductor chips, it is necessary to use a bonding head to accurately weld the metal wires between the chip and the substrate to achieve electrical connection between the chip and the substrate. In order to ensure the production capacity of the wire bonding machine, the bonding head will perform high-speed reciprocating motion between the wire welding points during the bonding process. The high-speed motion will cause a large impact on the equipment, causing the entire equipment to vibrate. The existing vibration reduction method is to separate the motion module and the basic support module of the bonding machine by setting a passive vibration reduction pad to reduce the vibration and impact transmitted to the basic support module. This method can absorb and slow down the vibration to a certain extent, but there are still problems such as excessive impact of the motion reaction force, poor low-frequency vibration isolation effect, and slow attenuation. Especially for low-frequency or ultra-low-frequency large shocks, conventional passive vibration reduction methods are difficult to produce good vibration isolation and vibration elimination effects. Furthermore, the overall vibration of the equipment caused by this large impact not only affects the bonder's speed, accuracy, and production capacity, but also, because the bonder needs to work in conjunction with other semiconductor equipment in the upstream and downstream sections of the entire semiconductor packaging and testing production line, the overall vibration of the bonder not only causes the bonder itself to shift within the workshop, but also transmits this vibration to the foundation, causing vibration in the foundation and affecting other adjacent semiconductor equipment. Therefore, how to reasonably reduce the large impact caused by the reciprocating motion of the bond head and quickly attenuate it is the key to reducing the vibration of the entire bonder and improving the performance of the bonder. Summary of the Invention

[0003] The purpose of the present application is to provide a bonding machine vibration reduction structure and a bonding machine, so as to solve the problems of slow response speed and limited vibration reduction effect of the existing vibration reduction method.

[0004] To achieve this goal, this application adopts the following technical solutions:

[0005] In the first aspect, the present application proposes a bonding machine vibration reduction structure, which includes a moving part, a frame and a vibration reduction device, wherein: the moving part is located above the frame and is transmission-connected to the frame, the moving part includes a moving mechanism and a supporting mechanism, the supporting mechanism is located below the moving mechanism and is used to support the moving mechanism, and the moving mechanism is configured to assemble and drive the bonding head to move; the vibration reduction device includes a buffering mechanism, an external introduction mechanism and a damping mechanism, the buffering mechanism is arranged between the supporting mechanism and the frame, and is respectively connected to the supporting mechanism and the frame, the first end of the external introduction mechanism is fixedly connected to the supporting mechanism, and the second end of the external introduction mechanism is transmission-connected to the frame through the damping mechanism.

[0006] The bonding machine vibration reduction structure proposed in this application uses a buffer mechanism to reduce the vertical reaction force of the moving part on the frame. Simultaneously, through the cooperation between the external introduction mechanism and the damping mechanism, the horizontal reaction force of the moving part on the frame is reduced, thereby reducing the overall vibration of the equipment and achieving dynamic balance of the entire equipment. Using the bonding machine vibration reduction structure of this application to reduce vibration of the equipment can quickly reduce the vibration amplitude of the equipment, shorten the overall stabilization time of the equipment, and prevent displacement of the equipment, thereby improving the stability of the equipment. It also avoids foundation vibration and prevents impact on other surrounding equipment.

[0007] Optionally, the external lead mechanism is located below the supporting mechanism, and a through hole for the external lead mechanism to pass through is opened on the side of the frame close to the supporting mechanism. The second end of the external lead mechanism passes through the through hole and is transmission-connected to the frame via a damping mechanism inside the frame.

[0008] By providing a through hole on the frame for the external introduction mechanism to pass through, the external introduction mechanism can transmit the vibration of the upper moving part to the interior of the lower frame, thereby improving the overall balance of the equipment.

[0009] Optionally, the external drawing mechanism includes at least one support arm, a first end of the support arm is fixedly connected to the bottom of the supporting mechanism, and a second end of the support arm passes through the through hole and is transmission-connected to the frame via a damping mechanism inside the frame.

[0010] At least one support arm is provided for vibration transmission, so as to disperse the motion reaction force transmitted to the inside of the frame. In addition, the number of support arms used for transmitting vibration can be adjusted according to the actual motion conditions of the equipment, so as to better achieve the overall dynamic balance of the equipment.

[0011] Optionally, the outward-drawing mechanism further includes a counterweight block, and a counterweight block is fixedly mounted on the second end of each support arm.

[0012] By arranging a counterweight block under the support arm to increase the overall mass of the support arm and the supporting mechanism connected above, the amplitude can be reduced under the premise of the same impact force generated by the moving mechanism. In addition, the setting of the counterweight block can lower the overall center of gravity of the equipment, making the equipment more stable.

[0013] Optionally, the damping mechanism includes a first damper and a second damper arranged perpendicularly to each other in the horizontal direction, the first ends of the first damper and the second damper are respectively connected to the second end of the counterweight or the support arm, and the second ends of the first damper and the second damper are respectively connected to two mutually perpendicular side surfaces inside the frame.

[0014] By arranging the first damper and the second damper, vibration reduction is achieved in two horizontal directions perpendicular to each other, thereby improving the vibration reduction effect and making the device more stable as a whole.

[0015] Optionally, the damping mechanism includes at least one of a hydraulic damper, a pneumatic damper, a friction damper, a spring damper and an electromagnetic damper.

[0016] The type of damper can be selected according to actual conditions. It is simple, reliable and highly compatible.

[0017] Optionally, the buffer assembly includes a vibration-damping pad, which is made of an elastic material, and the elastic material includes at least one of rubber, foam plastic and metal spring.

[0018] By setting the vibration-damping pad to an elastic material, installation and selection are facilitated, which can reduce the vibration transmitted from the moving part to the frame in the vertical direction and reduce the vibration of the moving part in the horizontal direction to a certain extent.

[0019] Optionally, the bonding machine vibration reduction structure further includes a displacement sensor, which is arranged between the moving part and the frame and is used to detect the relative displacement between the moving part and the frame.

[0020] By arranging a displacement sensor between the moving part and the frame, the displacement parameters between the moving part and the frame can be monitored in real time.

[0021] Optionally, the damping mechanism further includes a damping element with adjustable damping force, and the damping element adjusts the corresponding damping force according to the detection result of the displacement sensor.

[0022] By setting a damping element with adjustable damping force, the damping force can be adjusted in real time according to the detection results of the displacement sensor, which can make the overall running equipment more stable.

[0023] In the second aspect, the present application also proposes a bonding machine, which includes a bonding head, a substrate feeding mechanism and the bonding machine vibration damping structure in the first aspect, wherein: the substrate feeding mechanism is installed on the carrying mechanism and is configured to fix or transport the substrate; the bonding head is installed at the driving end of the moving mechanism, the moving mechanism is configured to drive the bonding head to a predetermined bonding position, and the bonding head electrically connects the chip and the substrate through the lead at the predetermined bonding position, and the bonding machine vibration damping structure is configured to reduce the movement reaction force of the bond head and the moving part on the frame during the bonding process through the cooperation of the external lead mechanism and the damping mechanism.

[0024] The bonding machine proposed in this application can quickly reduce the vibration amplitude of the equipment through the bonding machine vibration reduction structure during the process of the bonding head bonding the chip and substrate on the substrate feeding mechanism, reduce the movement reaction force of the bonding head on the frame during the movement, reduce the overall vibration of the equipment, and improve the overall stability of the equipment. In addition, it can avoid foundation vibration and prevent it from affecting other surrounding equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 11 is a schematic structural diagram of a vibration reduction structure of a bonding machine provided in an embodiment of the present application from a first perspective;

[0026] Figure 2 2 is a schematic structural diagram of the external introduction mechanism and the damping mechanism in the embodiment of the present application from a second viewing angle;

[0027] Figure 3 1 is a schematic structural diagram of another external introduction mechanism and damping mechanism in an embodiment of the present application from a second viewing angle;

[0028] Figure 4 This is a simulation result diagram of the change in the motion reaction force on the moving part of the bonding machine using the bonding machine vibration reduction structure of the present application;

[0029] Figure 5 1 is a simulation diagram of the displacement response of the moving part before and after the bonding machine vibration reduction structure in the embodiment of the present application is adopted;

[0030] Figure 6 This is a simulation diagram of the displacement response of the frame before and after adopting the bonding machine vibration reduction structure in the embodiment of the present application.

[0031] Figures 1 to 6 The following reference numerals are included:

[0032] Motion part 1: motion mechanism 11, carrying mechanism 12;

[0033] Rack 2;

[0034] Vibration reduction device 3: buffer mechanism 31, external guide mechanism 32, support arm 321, counterweight 322, damping mechanism 33, first damper 331, second damper 332;

[0035] Bonding head 4. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0037] In the field of semiconductor chip processing, a common vibration reduction method is to separate the equipment's motion module and base support module by installing passive vibration-damping pads to reduce the vibration and impact transmitted to the base support module. This method can absorb and reduce vibration to a certain extent and is suitable for equipment with low motion impact, such as photolithography machines. However, in the field of chip bonding, due to the large mass of the bonder's motion module and the rapid reciprocating motion of the bond head between the chip and the lead soldering points on the substrate during the bonding process, the impact of the motion module on the base support module is too great to be absorbed by the vibration-damping pads. As a result, the motion module exhibits a swinging oscillation relative to the base support module, with the vibration-damping pads as the fulcrum, resulting in a decrease in the bonding accuracy of the bonder itself. Furthermore, this large-scale shaking will cause vibrations in the foundation, which in turn affects other adjacent equipment.

[0038] Therefore, the present invention proposes a vibration reduction structure for a bonding machine, such as Figure 1 As shown, the vibration reduction structure of the bonding machine in the embodiment of the present application includes a moving part 1, a frame 2 and a vibration reduction device 3, wherein: the moving part 1 is located above the frame 2 and is transmission-connected to the frame 2, the moving part 1 includes a moving mechanism 11 and a supporting mechanism 12, the supporting mechanism 12 is located below the moving mechanism 11 and is used to support the moving mechanism 11, and the moving mechanism 11 is configured to assemble and drive the bonding head 4 to move; the vibration reduction device 3 includes a buffer mechanism 31, an external introduction mechanism 32 and a damping mechanism 33, the buffer mechanism 31 is arranged between the supporting mechanism 12 and the frame 2, and is respectively connected to the supporting mechanism 12 and the frame 2, that is, the supporting mechanism 12 is transmission-connected to the frame 2 through the buffer mechanism 31, the first end of the external introduction mechanism 32 is fixedly connected to the supporting mechanism 12, and the second end of the external introduction mechanism 32 is transmission-connected to the frame 2 through the damping mechanism 33.

[0039] In order to facilitate the conduction of vibration caused by the impact of the motion mechanism 11, the external introduction mechanism 32 is arranged below the supporting mechanism 12, and a through hole for the external introduction mechanism 32 to pass through is opened on the side of the frame 2 close to the supporting mechanism 12. The second end of the external introduction mechanism 32 passes through the through hole and is transmission-connected to the frame 2 via the damping mechanism 33 inside the frame 2.

[0040] When the motion mechanism 11 drives the bonding head 4 to move horizontally and vertically, the reaction force generated during the movement is transmitted to the frame 2 via the supporting mechanism 12. The bonding machine vibration reduction structure proposed in this application reduces the reaction force of the motion part 1 on the frame 2 in the height direction through the buffer mechanism 31. At the same time, through the cooperation between the external introduction mechanism 32 and the damping mechanism 33, the reaction force of the motion part 1 on the frame 2 in the horizontal direction is reduced, thereby reducing the overall vibration of the equipment. Using the bonding machine vibration reduction structure of this application to implement vibration reduction of the equipment can quickly reduce the vibration amplitude of the equipment and shorten the overall stabilization time of the equipment, thereby reducing the overall vibration of the equipment, avoiding displacement of the equipment, improving the stability of the equipment, and achieving dynamic balance of the entire equipment. In addition, it avoids foundation vibration and prevents it from affecting other surrounding equipment.

[0041] In one possible implementation, the external guide mechanism 32 includes at least one arm 321. The first end of the arm 321 is fixedly connected to the bottom of the support mechanism 12 via bolts. The second end of the arm 321 extends through a through hole and is transmission-connected to the frame 2 via the damping mechanism 33 within the frame 2. Bolting the arm 321 to the bottom of the support mechanism 12 facilitates assembly and allows for replacement of the arm 321 with a suitable length or mass based on the space available within the frame 2. Alternatively, the arm 321 and the bottom of the support mechanism 12 can be fixedly connected by welding. The connection method between the arm 321 and the support mechanism 12 is not specifically limited herein.

[0042] Specifically, the external introduction mechanism 32 also includes a counterweight 322, and a counterweight 322 is fixedly installed at the second end of each support arm 321. Since the support arm 321 is fixedly connected to the supporting mechanism 12 above, the overall mass of the support arm 321 and the supporting mechanism 12 is indirectly increased by arranging a counterweight 322 at the second end of each support arm 321. Under the premise of the same impact force generated in the process of the bond head 4 being driven by the motion mechanism 11, the amplitude of the supporting mechanism 12 can be reduced, thereby reducing the vibration transmitted to the frame 2, and then reducing the vibration of the entire device. In addition, by arranging the counterweight 322 below the support arm 321, the center of gravity of the entire device can be lowered, thereby making the device more stable. Of course, the counterweight 322 can be fixedly connected to the support arm 321 by welding or bolts, and the connection method of the counterweight 322 and the support arm 321 is not further limited here.

[0043] In one possible implementation, see Figure 2As shown, the damping mechanism 33 includes a first damper 331 and a second damper 332 arranged perpendicularly to each other in the horizontal direction. The first ends of the first damper 331 and the second damper 332 are respectively connected to the second end of the counterweight 322 or the support arm 321, and the second ends of the first damper 331 and the second damper 332 are respectively connected to two mutually perpendicular side surfaces inside the frame 2. By arranging the first damper 331 and the second damper 332, vibration reduction is achieved in two mutually perpendicular horizontal directions, thereby improving the vibration reduction effect.

[0044] In practical applications, the frame 2 may be a rectangular parallelepiped frame. Figure 2 The example in which the first ends of the first and second dampers 331, 332 are connected to the counterweight 322 is used for illustration. The second ends of the first and second dampers 331, 332 are respectively connected to two adjacent vertical surfaces within the frame 2. It can be seen that with the vertical arrangement of the first and second dampers 331, 332, when the support mechanism 12 is displaced relative to the frame 2 due to an impact, the counterweight 322 is driven by the support arm 321 to move synchronously with the support mechanism 12. At this time, the reaction force of the movement acts on the first and second dampers 331, 332. The first and second dampers 331, 332 then offset the reaction force of the movement transmitted from the support mechanism 12 to the frame 2 via the support arm 321 in two perpendicular horizontal directions, thereby ensuring the overall stability of the equipment. Of course, depending on the actual space conditions within the frame 2, the first ends of the first and second dampers 331, 332 can also be connected to the support arm 321 above the counterweight 322, thereby also achieving the effect of offsetting the reaction force of the movement portion 1 on the frame 2. The connection positions of the first damper 331 and the second damper 332 on the external introduction mechanism 32 are not further limited here.

[0045] In another possible implementation, the external guide mechanism 32 includes multiple groups of support arms 321 and counterweights 322. A counterweight 322 is mounted on the lower end of each support arm 321. Each group of support arms 321 and counterweight 322 is connected to a corresponding first damper 331 and / or second damper 332 according to its installation position in the frame 2. Figure 3In the illustrated embodiment, under certain motion conditions, the reaction force in the second horizontal direction may be greater than the reaction force in the first horizontal direction. In this case, the external guide mechanism 32 can be configured as three sets of arms 321 and counterweights 322, one of which is connected to a first damper 331, and the other two counterweights 322 are each connected to a second damper 332. The three dampers are connected to three side surfaces inside the frame 2. As can be seen, by providing three sets of arms 321 and counterweights 322 in this embodiment, the reaction force transmitted to the frame 2 is dispersed. Furthermore, the first damper 331 balances the reaction force in the first horizontal direction, while the two second dampers 332 balance the reaction force in the second horizontal direction, thereby improving the vibration damping effect of the vibration damping structure and the overall stability of the bonding machine. Of course, the number of arms 321 and counterweights 322 can be increased or decreased based on actual conditions. For example, two or four sets can be provided, with each arm 321 connected to a different side surface inside the frame 2 via at least one damper. Of course, each set of support arms 321 and counterweights 322 can be connected to the first damper 331 and the second damper 332 at the same time to improve the vibration reduction effect. The number of support arms 321 and counterweights 322, and the connection method of the first damper 331 and the second damper 332 to the support arms 321 and the counterweights 322 will not be elaborated here.

[0046] Optionally, the damping mechanism 33 includes at least one of a hydraulic damper, a pneumatic damper, a friction damper, a spring damper, and an electromagnetic damper. The first damper 331 and the second damper 332 may be of the same or different types.

[0047] Specifically, the buffer assembly 31 includes a vibration-damping pad, which is made of an elastic material, including at least one of rubber, foam plastic, and a metal spring. By setting the vibration-damping pad to an elastic material, installation and selection are facilitated, and the vibration transmitted from the moving part 1 to the frame 2 in the vertical direction can be reduced, and the vibration of the moving part 1 in the horizontal direction can be reduced to a certain extent. Figure 1 The supporting mechanism 12 is mounted on the frame 2 through the buffer assembly 31. The lower end of the buffer assembly 31 is fixedly connected to the frame 2, and the upper end is fixedly connected to the supporting mechanism 12. When the motion mechanism 11 drives the bonding head 4 to move, the buffer assembly 31 generates elastic deformation to offset part of the reaction force.

[0048] In one possible implementation, in order to monitor the vibration state of the equipment during movement, the bonding machine vibration reduction structure also includes a displacement sensor (not shown in the figure), which is arranged between the moving part 1 and the frame 2 to detect the relative displacement between the moving part 1 and the frame 2. Optionally, the displacement sensor may include a grating scale and a reading head, wherein the grating scale is fixedly mounted on the frame 2, and the reading head is fixedly mounted on the supporting mechanism 12, and the reading head and the grating scale are arranged correspondingly. The reading head cooperates with the grating scale in the process of following the movement of the supporting mechanism 12 to monitor the relative displacement parameters between the supporting mechanism 12 and the frame 2 in real time. Of course, as long as the effect of monitoring the relative displacement between the supporting mechanism 12 and the frame 2 can be achieved, the installation positions of the reading head and the grating scale are not further restricted.

[0049] To achieve the effect of adjusting the damping force in real time based on the detection results of the displacement sensor, thereby ensuring a more stable operation of the entire device, the damping mechanism 33 also includes a damping element with adjustable damping force. The damping element adjusts the damping force accordingly based on the detection results of the displacement sensor. Optionally, the damping element adjusts its damping force by adjusting its own parameters such as current, voltage, air pressure, or hydraulic pressure.

[0050] In one embodiment, finite element simulation is used to obtain simulation results such as Figure 4 The figure shows the change of impact force on the moving part of the bonding machine when the bonding head moves. It can be seen that taking the maximum impact force of 1000N as an example, the entire impact process takes about 0.05s. Figure 5 , it can be seen that under the same magnitude of impact force, before the bonding machine vibration reduction structure proposed in this application is adopted, the displacement peak value of the moving part reaches about -0.72mm and 0.32mm, and it takes about 0.25s to basically stabilize. After the bonding machine vibration reduction structure proposed in this application is adopted, the displacement peak value of the moving part is about -0.48mm and 0.02mm, and it only takes about 0.1s to basically stabilize. See also Figure 6 It can be seen that under the same magnitude of impact force, before adopting the bonding machine vibration reduction structure proposed in this application, the displacement peaks of the frame reached approximately -0.036mm and 0.018mm, and it took about 0.25s to reach basic stability. After adopting the bonding machine vibration reduction structure proposed in this application, the displacement peaks of the frame were approximately -0.03mm and 0.005mm, and it only took about 0.1s to reach basic stability. It can be seen that under the premise that the moving part is subjected to the same magnitude of impact force (i.e., the reaction force exerted on the moving part during the movement of the bond head), compared with the existing bonding machine vibration reduction method, after using the bonding machine vibration reduction structure proposed in this application, both the moving part itself and the frame below the moving part can effectively reduce their own vibration amplitude. Therefore, it is feasible and effective to use the vibration reduction structure proposed in this application to reduce the vibration of the bonding machine.

[0051] In the second aspect, the present application also proposes a bonding machine, which includes a bonding head, a substrate feeding mechanism and the bonding machine vibration damping structure in the first aspect, wherein: the substrate feeding mechanism is installed on the carrying mechanism and is configured to fix or transport the substrate; the bonding head is installed at the driving end of the moving mechanism, the moving mechanism is configured to drive the bonding head to a predetermined bonding position, and the bonding head electrically connects the chip and the substrate through the lead at the predetermined bonding position, and the bonding machine vibration damping structure is configured to reduce the movement reaction force of the bond head and the moving part on the frame during the bonding process through the cooperation of the external lead mechanism and the damping mechanism.

[0052] The bonding machine proposed in this application reduces the motion reaction force of the bonding head during the movement of the bonding head by using the bonding machine's vibration reduction structure during the process of bonding the chip and substrate on the substrate feeding mechanism, thereby reducing the overall vibration of the equipment and improving the stability of the equipment itself. In addition, it can avoid foundation vibration and prevent it from affecting other surrounding equipment.

[0053] The above embodiments merely illustrate the basic principles and features of the present application. The present application is not limited by the above examples. Various changes and modifications may be made to the present application without departing from the spirit and scope of the present application. Such changes and modifications are intended to fall within the scope of the present application. The scope of protection claimed in the present application is defined by the appended claims and their equivalents.

Claims

1. A bonding machine vibration reduction structure, characterized in that: The bonding machine vibration reduction structure includes a moving part, a frame and a vibration reduction device, wherein: The moving part is located above the frame and is in transmission connection with the frame. The moving part includes a moving mechanism and a carrying mechanism. The carrying mechanism is located below the moving mechanism and is used to carry the moving mechanism. The moving mechanism is configured to assemble and drive the bond head to move. The vibration reduction device includes a buffer mechanism, an external introduction mechanism and a damping mechanism. The buffer mechanism is arranged between the supporting mechanism and the frame and is connected to the supporting mechanism and the frame respectively. The first end of the external introduction mechanism is fixedly connected to the supporting mechanism, and the second end of the external introduction mechanism is transmission-connected to the frame through the damping mechanism. The external introduction mechanism is located below the supporting mechanism, and a through hole for the external introduction mechanism to pass through is opened on a side of the frame close to the supporting mechanism. The external introduction mechanism includes at least one support arm and a counterweight block. The first end of each support arm is fixedly connected to the bottom of the supporting mechanism, and the second end of each support arm passes through the through hole and is fixedly mounted with one of the counterweight blocks. The damping mechanism includes a first damper and a second damper arranged perpendicular to each other in a horizontal direction, wherein the first ends of the first damper and the second damper are respectively connected to the second end of the counterweight or the support arm, and the second ends of the first damper and the second damper are respectively connected to two mutually perpendicular side surfaces inside the frame; The damping mechanism includes at least one of a hydraulic damper, a pneumatic damper, a friction damper and an electromagnetic damper; The buffer mechanism includes a vibration-damping pad, which is made of an elastic material. The elastic material includes at least one of rubber and foam plastic.

2. The bonding machine vibration reduction structure according to claim 1, characterized in that: The bonding machine vibration reduction structure further includes a displacement sensor, which is arranged between the moving part and the frame and is used to detect the relative displacement between the moving part and the frame.

3. The bonding machine vibration damping structure according to claim 2, characterized in that: The damping mechanism further includes a damping element with adjustable damping force, and the damping element adjusts the corresponding damping force according to the detection result of the displacement sensor.

4. A bonding machine, characterized in that: The bonding machine comprises a bonding head, a substrate feeding mechanism and a bonding machine vibration reduction structure according to any one of claims 1 to 3, wherein: The substrate feeding mechanism is mounted on the carrying mechanism and is configured to fix or transport the substrate; The bonding head is mounted on the driving end of the motion mechanism, and the motion mechanism is configured to drive the bonding head to a predetermined bonding position. The bonding head electrically connects the chip and the substrate through leads at the predetermined bonding position. The vibration reduction structure of the bonding machine is configured to reduce the motion reaction force of the moving part on the frame during the movement and bonding of the bond head through the cooperation between the external lead mechanism and the damping mechanism.

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