Electric control board of air conditioner and air conditioner
By distributing local areas on the air conditioner's electrical control board and setting up independent radiators for active power devices, the heat dissipation problem of the fan control module is solved, the heat dissipation effect is improved and the impact of electromagnetic compatibility performance is avoided.
Patent Information
- Application Number
- CN202422657487.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-10-31
AI Technical Summary
In the prior art, the fan control module of the air conditioner uses active power devices, which makes heat dissipation processing a problem, and the electromagnetic compatibility performance of the active power devices and passive power devices is affected.
Multiple layout areas are set up on the electrical control board of the air conditioner, which are used to arrange active and passive power devices, and an independent radiator is set for each active power device. The fan control module is arranged on an independent layout area. Other passive power devices share the same radiator, which is reasonably arranged to improve the heat dissipation effect and avoid the impact of electromagnetic compatibility performance.
It realizes effective heat dissipation for active power devices such as fan control modules, improves heat dissipation capabilities, and avoids the impact of the electromagnetic compatibility performance of active power devices on passive power devices.
Smart Images
Figure CN223283208U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of air conditioning, and in particular to an electric control panel of an air conditioner and an air conditioner. Background Art
[0002] The air conditioner's electronic control board is equipped with multiple power devices such as the fan control module, compressor control module, switching tube, fast recovery diode (FRD) and rectifier bridge stack. When the electronic control board is working, the power devices heat up severely, requiring heat dissipation treatment.
[0003] In the related art, a large heat sink is usually installed on the electronic control board, and all power devices are attached to the heat sink, and the heat sink is facing the fan cavity of the air conditioner for heat dissipation. However, since all power devices use the same heat sink for heat dissipation, power devices with a powered backplane (hereinafter referred to as active power devices) cannot be used as power devices. If some power devices use active power devices and the backplane of the active power device is attached to the heat sink, it will seriously affect the surge immunity performance of other power devices under the heat sink with no powered backplane (hereinafter referred to as passive power devices). At present, the fan control modules of air conditioners are mostly active intelligent power modules (IPMs), so the heat dissipation treatment of the fan control modules has become a problem. Utility Model Content
[0004] In view of this, an embodiment of the present application provides an electric control board of an air conditioner and an air conditioner, which aims to achieve effective heat dissipation of active power devices such as a fan control module of the air conditioner.
[0005] The technical solution of the embodiment of the present application is implemented as follows:
[0006] An embodiment of the present application provides an electric control board for an air conditioner, wherein the electric control board is provided with multiple layout areas, the layout areas including a first layout area and a second layout area, the first layout area being used to arrange a single active power device, and the second layout area being used to arrange multiple passive power devices; the power devices in the second layout area and each of the first layout areas are each provided with an independent heat sink;
[0007] The fan control module is arranged on the first layout area; the first layout area and the second layout area of the electric control board face the fan cavity of the air conditioner.
[0008] In some embodiments, at least one first layout area is provided on the electric control board.
[0009] In some embodiments, a second layout area is provided on the electric control board.
[0010] In some embodiments, one or more of a compressor control module, an IGBT, a fast recovery diode, and a rectifier bridge stack are arranged in the second layout area.
[0011] In some embodiments, the heat sink is a heat sink fin, and the heat sink is attached to the surface of the power device arranged on the corresponding layout area.
[0012] In some embodiments, the layout area further includes a third layout area, and the third layout area is used to arrange a plurality of non-power devices.
[0013] In some embodiments, the second layout area and each of the first layout areas are arranged on a first side of the electric control board, and the third layout area is arranged on a second side of the electric control board, where the second side is opposite to the first side.
[0014] In some embodiments, at least one electrolytic capacitor and a power factor correction (PFC) inductor are arranged on the third layout area.
[0015] In a second aspect, an embodiment of the present application provides an air conditioner, which includes the electric control board as described in the first aspect.
[0016] In some embodiments, the electric control board is arranged toward the fan cavity and the compressor cavity of the air conditioner; wherein, the electric control board also includes a third layout area for arranging multiple non-power devices, and the third layout area faces the compressor cavity.
[0017] The electric control board of the air conditioner provided in the embodiment of the present application has multiple layout areas set on the electric control board, and the layout areas include a first layout area and a second layout area. The first layout area is used to arrange a single active power device, and the second layout area is used to arrange multiple passive power devices. Independent heat sinks are correspondingly set on the second layout area and each first layout area. The fan control module is arranged on the first layout area, and the first layout area and the second layout area of the electric control board face the fan cavity of the air conditioner. In this way, the electric control board of the air conditioner in the embodiment of the present application is divided into multiple layout areas according to the charging characteristics of the power devices. Each active power device is arranged independently and uses a corresponding heat sink for heat dissipation. Multiple passive power devices are arranged centrally and use the same heat sink for heat dissipation. The layout of the electric control board is reasonable. When the air conditioner is running, the convection in the fan cavity dissipates heat for each heat sink on the electric control board. While improving the heat dissipation capacity of each power device, it avoids the influence of the active power device on the electromagnetic compatibility performance of other active power devices and passive power devices. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1This is a schematic diagram of the structure of the electric control board in the embodiment of the present application;
[0019] Figure 2 This is a schematic diagram of the layout of the electric control board according to an embodiment of the present application;
[0020] Figure 3 This is a structural diagram of an electric control board in an application example of this application;
[0021] Figure 4 This is a structural diagram of an electric control board in another application example of this application.
[0022] Description of reference numerals:
[0023] 100. Electric control panel; 101. First layout area; 102. Second layout area;
[0024] 103. Third layout area; 104. Radiator; 105. Fan control module;
[0025] 106. Compressor control module; 107. Switching tube; 108. Fast recovery diode;
[0026] 109. Rectifier bridge stack; 110. Electrolytic capacitor; 111. PFC inductor. DETAILED DESCRIPTION
[0027] The present application will be described in further detail below with reference to the accompanying drawings and embodiments.
[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.
[0029] In the description of this application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.
[0030] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood broadly. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.
[0031] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," "above," and "upper side" of a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," "below," and "lower side" of a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0032] The embodiment of the present application provides an electric control board of an air conditioner, such as Figure 1 As shown, multiple layout areas are provided on the electric control board 100, including a first layout area 101 and a second layout area 102. The first layout area 101 is used to arrange a single active power device, and the second layout area 102 is used to arrange multiple passive power devices. Independent heat sinks 104 are provided for the power devices in the second layout area 102 and each first layout area 101.
[0033] The fan control module is arranged on the first layout area 101; the second layout area 102 of the electric control board 100 and each first layout area 101 face the fan cavity of the air conditioner.
[0034] Here, an active power device is a power device whose back plate or housing is charged during operation, and a passive power device is a power device whose back plate or housing is not charged during operation.
[0035] It is understandable that when the electronic control board 100 is working, the temperature of the power devices rises seriously. Each heat sink 104 is used to increase the heat dissipation area of the power devices arranged in the corresponding layout area to improve the heat dissipation effect.
[0036] It should be noted that in the related art, a large heat sink is typically installed on the electronic control board. The heating surfaces of all power devices on the electronic control board are attached to this heat sink, which faces the fan cavity of the air conditioner. In other words, all power devices share the same heat sink for heat dissipation. However, although the large heat sink installed on the electronic control board has a good heat dissipation effect, it only supports heat dissipation of passive power devices. If active power devices are arranged on the electronic control board and the large heat sink is used for heat dissipation, the backplane of the active power devices is charged during operation and the heat sink is in direct contact with the active power devices. This will affect the electromagnetic compatibility performance of other power devices using the heat sink for heat dissipation. For example, the surge immunity performance of other power devices may not meet the design requirements. Therefore, based on the heat dissipation solution for the air conditioner electronic control board in the above-mentioned related art, the power devices arranged on the electronic control board are all passive power devices.
[0037] However, most fan control modules of current air conditioners are IPM modules, which are active power devices. Therefore, if the fan control module adopts an IPM module, it cannot be arranged on the electronic control board for heat dissipation.
[0038] It should be noted that a plurality of heat sinks 104 are provided on the electric control board 100 of the embodiment of the present application. Each active power device is independently arranged on the electric control board 100 and each active power device is provided with an independent heat sink 104 for heat dissipation. All passive power devices are centrally arranged in the second layout area 102 of the electric control board and use a common large-volume heat sink 104 for heat dissipation. While ensuring the heat dissipation effect of active power devices such as the fan control module on the electric control board 100, the influence of the active power devices on the electromagnetic compatibility performance of other active power devices and passive power devices is avoided.
[0039] Exemplarily, the heat sink 104 is a heat dissipation fin, and the heat sink 104 is attached to the surface of the power device arranged in the corresponding layout area.
[0040] Here, the heat sink 104 is provided above the top plate of the electric control board 100 .
[0041] It is understandable that the heat sink 104 is directly attached to the back plate of the power device to enhance the heat dissipation effect of the power device.
[0042] Here, the number of heat sinks 104 provided on the electric control board 100 of the embodiment of the present application is determined based on the number of active power devices arranged; parameters such as the volume, base plate thickness, number of fins, fin height and fin thickness of the heat sink 104 are determined based on parameters such as the volume, arrangement position and heat generation capacity of the corresponding power devices.
[0043] For example, the layout area of the electric control board 100 is arranged with, but not limited to, the following power devices: a fan control module, a compressor control module, a switch tube, a fast recovery diode, and a rectifier bridge stack.
[0044] For example, Figure 2 As shown, at least one first layout area 101 is provided on the electric control board 100. A second layout area 102 is provided on the electric control board.
[0045] Here, the number of first layout areas 101 provided on the electric control board 100 corresponds to the number of active power devices arranged. In addition to the fan control module being an active power module, power devices such as the compressor control module and the switch tube arranged on the electric control board 100 can also be active power devices.
[0046] Here, the switch tubes of the electric control board 100 may include but are not limited to: insulated-gate bipolar transistors (IGBTs), SiC MOS tubes, and GaN MOS tubes.
[0047] For example, one or more of a compressor control module, a switch tube, a fast recovery diode and a rectifier bridge stack are arranged on the second layout area 102. In an application example of the present application, Figure 3 As shown, the fan control module 105 is an active power device, and the compressor control module 106, the switch tube 107, the fast recovery diode 108, and the rectifier bridge stack 109 are passive power devices. The fan control module 105 is independently arranged in the first layout area 101, and a corresponding heat sink 104 (not shown in the figure) is provided in the first layout area 101; the compressor control module 106, the switch tube 107, the fast recovery diode 108, and the rectifier bridge stack 109 are arranged in the second layout area 102, and a corresponding heat sink 104 (not shown in the figure) is provided in the second layout area 102. That is, the fan control module 105 uses an independent heat sink 104 for heat dissipation, while the compressor control module 106, the switch tube 107, the fast recovery diode 108, and the rectifier bridge stack 109 share the same heat sink 104 for heat dissipation.
[0048] In an application example of this application, Figure 4As shown, the fan control module 105 and the compressor control module 106 are active power devices, and the switch tube 107, the fast recovery diode 108, and the rectifier bridge stack 109 are passive power devices. The fan control module 105 and the compressor control module 106 are active power devices and are arranged in different first layout areas 101, and a corresponding heat sink 104 (not shown in the figure) is provided in each first layout area 101; the switch tube 107, the fast recovery diode 108, and the rectifier bridge stack 109 are arranged in the second layout area 102, and a corresponding heat sink 104 (not shown in the figure) is provided in the second layout area 102. That is, the fan control module 105 uses an independent heat sink 104 for heat dissipation, the compressor control module 106 uses an independent heat sink 104 for heat dissipation, and the switch tube 107, the fast recovery diode 108, and the rectifier bridge stack 109 share the same heat sink 104 for heat dissipation.
[0049] For example, Figure 3 As shown, the layout area further includes a third layout area 103 , and the third layout area 103 is used for arranging a plurality of non-power devices.
[0050] It should be noted that the non-power components on the electronic control board 100 will not generate a serious temperature rise during operation, so there is no need to provide a heat sink 104 in the third layout area 103 .
[0051] It should be noted that, in addition to being used for arranging power devices, the first layout area 101 and the second layout area 102 are also used for arranging non-power devices connected to the power devices, that is, active power devices and non-power devices can be arranged in the first layout area 101, but the non-power devices in the first layout area 101 do not need to be provided with a heat sink for heat dissipation; passive power devices and non-power devices can be arranged in the second layout area 102, but the non-power devices in the second layout area 102 do not need to be provided with a heat sink for heat dissipation.
[0052] Exemplarily, at least one electrolytic capacitor 110 and a PFC inductor 111 are arranged in the third layout area 103 .
[0053] Here, the electrolytic capacitor 111 is used to filter the electrical signal rectified by the electric control board 110; the PFC inductor 111 is used to improve the power factor of the input power of the air conditioner. The electrolytic capacitor 110 and the PFC inductor 111 are non-power devices.
[0054] Exemplarily, the second layout area 102 and each first layout area 101 are arranged on a first side of the electric control board 100 , and the third layout area 103 is arranged on a second side of the electric control board 100 , where the second side is opposite to the first side.
[0055] It can be understood that the first side of the electronic control board 100 faces the fan cavity of the air conditioner, and the second layout area 102 and each first layout area 101 are arranged in a concentrated manner so that when the air conditioner is running, the convection in the fan cavity can centrally dissipate heat for the radiator 104 on the electronic control board 100.
[0056] An embodiment of the present application provides an air conditioner, which includes the aforementioned electric control board 100 .
[0057] Here, the air conditioner is used to adjust the temperature, humidity, etc. of the environment. The air conditioner can be a dual-purpose air conditioner for cooling and heating, and can be a wall-mounted air conditioner, a cabinet air conditioner, a window air conditioner, or a ceiling-mounted air conditioner, etc., which is not specifically limited in the embodiments of the present application.
[0058] Exemplarily, the electric control board 100 is arranged toward the fan cavity and the compressor cavity of the air conditioner; and the third layout area 103 is arranged toward the compressor cavity.
[0059] It can be understood that the electronic control board 100 is used to control the operation of the fan and compressor of the air conditioner, and the electronic control board 100 needs to be set close to the fan cavity and compressor cavity of the air conditioner; because when the air conditioner is running, convection will be generated in the fan cavity, but not in the compressor cavity, the second layout area 102 and each first layout area 101 on the electronic control board 100 that require forced air cooling are oriented towards the fan cavity, and the third layout area 102 with small device heat dissipation requirements is oriented towards the compressor cavity.
[0060] It should be noted that: "first", "second", etc. are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.
[0061] In addition, the technical solutions described in the embodiments of the present application can be arbitrarily combined without conflict.
[0062] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.
Claims
1. An electric control panel for an air conditioner, characterized in that: The electric control board is provided with a plurality of layout areas, the layout areas including a first layout area and a second layout area, the first layout area being used to arrange a single active power device, and the second layout area being used to arrange a plurality of passive power devices; the power devices in the second layout area and each of the first layout areas are each provided with an independent heat sink; The fan control module is arranged on the first layout area; the second layout area and each first layout area of the electric control board face the fan cavity of the air conditioner.
2. The electric control board according to claim 1, characterized in that: At least one first layout area is set on the electric control board.
3. The electric control board according to claim 1, characterized in that: A second layout area is provided on the electric control board.
4. The electric control board according to claim 3, characterized in that: One or more of a compressor control module, a switch tube, a fast recovery diode FRD and a rectifier bridge stack are arranged in the second layout area.
5. The electric control board according to any one of claims 1 to 4, characterized in that: The heat sink is a heat dissipation fin, and the heat sink is attached to the surface of the power device arranged in the corresponding layout area.
6. The electric control board according to claim 1, characterized in that: The layout area further includes a third layout area, and the third layout area is used for arranging a plurality of non-power devices.
7. The electric control board according to claim 6, characterized in that: The second layout area and each of the first layout areas are arranged on a first side of the electric control board, and the third layout area is arranged on a second side of the electric control board, where the second side is opposite to the first side.
8. The electric control board according to claim 6, characterized in that: At least one electrolytic capacitor and a power factor correction (PFC) inductor are arranged on the third layout area.
9. An air conditioner, characterized in that: The air conditioner includes the electric control board according to any one of claims 1 to 8.
10. The air conditioner according to claim 9, characterized in that The electric control panel is arranged toward the fan cavity and the compressor cavity of the air conditioner; The electric control board further includes a third layout area for arranging a plurality of non-power devices, and the third layout area faces the compressor cavity.