Long-wave non-refrigeration infrared machine core refrigeration device

Abstract

The utility model provides a long-wave non-refrigeration infrared machine core refrigeration device, and belongs to the technical field of infrared imaging. Comprising a long-wave uncooled infrared movement, a semiconductor radiating fin group and a radiating fin group, the semiconductor cooling fin set is attached to the outer surface of the long-wave uncooled infrared movement, the cooling fin set is arranged on the outer side of the semiconductor cooling fin set, and the semiconductor cooling fin set is fixed to the outer surface of the long-wave uncooled infrared movement. The radiating fin group is formed by connecting single radiating fins; the heat dissipation fins comprise transverse pieces and longitudinal pieces, heat dissipation fins are arranged on the surfaces of the transverse pieces, and the longitudinal pieces are connected to the two sides of one end of each transverse piece. According to the utility model, through an effective refrigeration means, the working temperature of the infrared movement is reduced to the optimal working temperature, so that the quality of infrared images is improved, and the accuracy of target detection and identification is improved.

Description

Technical Field

[0001] The utility model relates to a long-wave non-refrigeration infrared core refrigeration device, belonging to the technical field of infrared imaging. Background Art

[0002] Currently, there are two main types of infrared imaging cores: long-wave uncooled and medium-wave cooled. Long-wave uncooled cores, with their mature technology and low cost, dominate many low-cost detection applications. However, these cores also have limitations. Their relatively high NETD (equivalent noise temperature difference) results in poor capture of target details, and they are also susceptible to weather conditions. In contrast, medium-wave cooled cores offer higher sensitivity, enabling high-resolution detection of target details. However, this comes at a significantly higher cost, often more than ten times that of long-wave uncooled cores.

[0003] In specific application scenarios, such as those with temperatures exceeding 60°C and humidity exceeding 80%, the performance of long-wave uncooled infrared sensors is particularly limited. Because the sensor's NETD value significantly increases in high-temperature and high-humidity environments, the sensor's inherent noise increases, leading to image blur and reduced contrast, making it difficult to detect and identify targets. To address this issue, the industry has been exploring technical means to improve the imaging quality of long-wave uncooled infrared sensors in high-temperature and high-humidity environments. Utility Model Content

[0004] The purpose of the utility model is to provide a long-wave non-refrigerated infrared core refrigeration device, which reduces the working temperature of the infrared core to its optimal working temperature through effective refrigeration means, thereby improving the quality of infrared images and enhancing the accuracy of target detection and recognition.

[0005] In order to achieve the above-mentioned purpose, the present invention is realized through the following technical solutions:

[0006] Including long-wave uncooled infrared core, semiconductor heat sink group, and heat dissipation fin group;

[0007] The semiconductor heat sink group is attached to the outer surface of the long-wave non-cooled infrared core, and the heat dissipation fin group is arranged outside the semiconductor heat sink group, and the semiconductor heat sink group is fixed to the outer surface of the long-wave non-cooled infrared core; the heat dissipation fin group is composed of a single heat dissipation fin connected;

[0008] The heat dissipation fins include a transverse member and a longitudinal member, the transverse member is provided with heat dissipation fins on its surface, and the longitudinal member is connected to both sides of one end of the transverse member;

[0009] The two sides of the transverse member are provided with card slots;

[0010] The longitudinal member comprises two symmetrically designed longitudinal rods, and opposite surfaces of the longitudinal rods are provided with rails that are used in sliding cooperation with the slots.

[0011] Preferably, it further includes a connecting piece and a fan; the fan is fixed to the rear end of the heat dissipation fin group through the connecting piece.

[0012] Preferably, the connecting piece is cross-shaped, and each end thereof is provided with a fan fixing hole and a connecting fixing hole for the screw to move in the extension direction.

[0013] Preferably, a threaded hole is provided at the rear end of the heat dissipation fin group, and the connecting member is fixed to the rear end of the heat dissipation fin group by screws.

[0014] Preferably, the inner surface of the heat dissipation fin group is evenly coated with heat dissipation silicone grease, and the gap between the semiconductor heat dissipation fin group and the long-wave non-cooling infrared core is filled with silicone grease.

[0015] Preferably, the outer surface of the long-wave non-cooled infrared core is rectangular, the heat sink fin group consists of four heat sinks, the slot of each heat sink fin is slidably connected to the rail, and the semiconductor heat sink group is fixed to the outer surface of the long-wave non-cooled infrared core.

[0016] The advantage of this utility model lies in its ability to effectively cool the infrared core to its optimal operating temperature, thereby improving infrared image quality and enhancing the accuracy of target detection and recognition. This innovative solution not only addresses the limitations of existing technologies but also takes cost control into account, keeping the overall price of the refrigeration device at a low level, thus promising broad market application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation to the present invention.

[0018] Figure 1 Diagram of long-wave uncooled infrared core refrigeration device;

[0019] Figure 2 Composition diagram of long-wave uncooled infrared core refrigeration device;

[0020] Figure 3 Semiconductor heat sink assembly installation diagram;

[0021] Figure 4 Front view of a single heat sink fin structure;

[0022] Figure 5 Left view of a single heat sink fin structure;

[0023] Figure 6A three-dimensional diagram of the structure of a single heat sink fin;

[0024] Figure 7 Single heat sink fin installation diagram;

[0025] Figure 8 Heat sink fin group size adjustment diagram;

[0026] Figure 9 Connector installation diagram;

[0027] Figure 10 Overall installation drawing;

[0028] In the figure: 1. Long-wave non-cooled infrared movement, 2. Semiconductor heat sink assembly, 3. Heat sink fin assembly, 31. Heat sink fin, 32. Horizontal member, 33. Longitudinal member, 34. Slot, 35. Rail, 4. Connector, 41. Fan fixing hole, 42 Connecting fixing hole, 5. Fan. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] like Figure 1-Figure 3 As shown, a long-wave non-cooled infrared core refrigeration device includes a long-wave non-cooled infrared core 1, a semiconductor heat sink group 2, and a heat sink fin group 3; the semiconductor heat sink group 2 is attached to the outer surface of the long-wave non-cooled infrared core 1, and the heat sink fin group 3 is arranged on the outside of the semiconductor heat sink group 2, and the semiconductor heat sink group 2 is fixed to the outer surface of the long-wave non-cooled infrared core 1; the heat sink fin group 3 is composed of a single heat sink fin 31 connected together.

[0031] like Figure 4-Figure 6 As shown, the heat dissipation fin 31 includes a horizontal member 32 and a longitudinal member 33. The surface of the horizontal member 32 is provided with heat dissipation fins, and the longitudinal member 33 is connected to both sides of one end of the horizontal member 32; the two sides of the horizontal member 32 are provided with card slots 34; the longitudinal member 33 includes two symmetrically designed longitudinal rods, and the opposite surfaces of the longitudinal rods are provided with card rails 35 that slide in conjunction with the card slots 34.

[0032] The device further includes a connector 4 and a fan 5 ; the fan 5 is fixed to the rear end of the heat dissipation fin group 3 via the connector 4 .

[0033] like Figure 9-10As shown, the connecting member 4 is cross-shaped, and is provided with a fan fixing hole 41 and a connecting fixing hole 42 for the screw to move in the extension direction at each end.

[0034] The rear end of the heat dissipation fin group 3 is provided with a threaded hole, and the connecting member 4 is fixed to the rear end of the heat dissipation fin group 3 by screws.

[0035] The inner surface of the heat dissipation fin group 3 is evenly coated with heat dissipation silicone grease, and the gap between the semiconductor heat dissipation fin group 2 and the long-wave non-cooling infrared core 1 is filled with silicone grease.

[0036] The outer surface of the long-wave uncooled infrared core 1 is rectangular, and the heat sink fin group 3 is composed of four heat sinks 31. The slot 34 of each heat sink fin 31 is slidably connected to the rail 35 to fix the semiconductor heat sink group 2 on the outer surface of the long-wave uncooled infrared core 1.

[0037] The semiconductor heat sink generates a lot of heat when working. This device is designed to increase the heat dissipation through the heat dissipation fin group 3, connector 4 and fan 5 and other components to improve the heat dissipation speed. The heat dissipation fin group 3 is mainly composed of 4 single heat dissipation fins. The structure of a single heat dissipation fin is as follows: Figure 6 As shown, there are slots around the heat sink fins, providing slide rails for the free movement of the four heat sink fins. The inner surface of the heat sink fin group 3 is evenly coated with heat dissipation silicone grease, and it is put on the left, right, top and bottom sides of the infrared core, and pressed firmly to make it fully contact with the semiconductor heat sinks on each side. The position of a single heat sink fin installed on the semiconductor heat sink is as shown in the figure. Figure 7 shown.

[0038] like Figure 8 As shown, each heat sink fin in the heat sink fin group 3 can move freely along the slide rail, so the size of the middle envelope area can be changed. Figure 8 Middle a can be adapted to small size infrared movement, Figure 8 Medium B can be adapted to large-size infrared movements.

[0039] Connector 4 is installed as follows Figure 9 As shown, there are through slots on the four walls of the connecting piece 4 for the screws to move freely. This design can ensure that the heat dissipation fin groups 3 of different sizes can be fixed.

[0040] Fix the fan 5 to the connector 4 with screws, as shown in the following example. Figure 10 shown.

[0041] It should be noted that: for the application of non-refrigerated long-wave infrared core in high temperature and high humidity environment, this refrigeration device brings significant beneficial effects.

[0042] Before the addition of a cooling device, the uncooled long-wave infrared core exhibited poor imaging performance in high-temperature and high-humidity environments, resulting in blurred images and reduced contrast, making target detection and identification difficult. However, the addition of this cooling device effectively controlled the operating temperature of the infrared core, reducing it to the optimal operating temperature of around 25°C. This significantly improved the clarity of the infrared image and the imaging quality.

[0043] Secondly, compared with existing refrigerated long-wave infrared equipment, this refrigeration device offers a significant price advantage. Currently, refrigerated long-wave infrared devices typically utilize a Type II superlattice infrared detector and an integrated Dewar refrigerator assembly, which are costly, costing at least 200,000 yuan. This refrigeration device, however, is based on a cost-effective, uncooled vanadium oxide infrared detector core, modified with a refrigeration unit. The overall price is kept below 50,000 yuan, significantly reducing operational costs.

[0044] In addition, the refrigeration device has good adaptability. Due to the addition of a movable design of the heat dissipation fin group, the refrigeration device can adapt to infrared cores of different sizes for heat dissipation, thereby improving the flexibility and versatility of the device.

[0045] In summary, the refrigeration device has shown significant beneficial effects in the application of non-refrigerated long-wave infrared movement in high temperature and high humidity environments. It not only improves the clarity of infrared images and reduces the cost of use, but also has good adaptability.

[0046] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A long-wave non-refrigerated infrared core refrigeration device, characterized in that: It includes a long-wave non-cooled infrared core (1), a semiconductor heat sink group (2), and a heat sink fin group (3); The semiconductor heat sink group (2) is attached to the outer surface of the long-wave non-cooled infrared core (1), and the heat dissipation fin group (3) is arranged outside the semiconductor heat sink group (2) to fix the semiconductor heat sink group (2) to the outer surface of the long-wave non-cooled infrared core (1); the heat dissipation fin group (3) is composed of a single heat dissipation fin (31) connected together; The heat dissipation fin (31) comprises a transverse member (32) and a longitudinal member (33), the surface of the transverse member (32) is provided with heat dissipation fins, and the longitudinal member (33) is connected to both sides of one end of the transverse member (32); The transverse member (32) is provided with slots (34) on both sides; The longitudinal member (33) comprises two symmetrically designed longitudinal rods, and opposite surfaces of the longitudinal rods are provided with a clamping rail (35) that is used in sliding cooperation with the clamping slot (34).

2. The long-wave non-refrigerated infrared core refrigeration device according to claim 1, characterized in that: It also includes a connecting piece (4) and a fan (5); the fan (5) is fixed to the rear end of the heat dissipation fin group (3) through the connecting piece (4).

3. The long-wave non-refrigerated infrared core refrigeration device according to claim 2, characterized in that: The connecting piece (4) is cross-shaped, and is provided with a fan fixing hole (41) and a connecting fixing hole (42) for the screw to move in the extension direction at each end.

4. The long-wave non-refrigerated infrared core refrigeration device according to claim 3, characterized in that: The rear end of the heat dissipation fin group (3) is provided with a threaded hole, and the connecting member (4) is fixed to the rear end of the heat dissipation fin group (3) by means of screws.

5. The long-wave non-refrigerated infrared core refrigeration device according to claim 1, characterized in that: The inner surface of the heat dissipation fin group (3) is evenly coated with heat dissipation silicone grease, and the gap between the semiconductor heat dissipation fin group (2) and the long-wave non-refrigeration infrared core (1) is filled with silicone grease.

6. The long-wave non-refrigerated infrared core refrigeration device according to claim 1, characterized in that: The outer surface of the long-wave non-cooled infrared core (1) is rectangular, and the heat dissipation fin group (3) is composed of four heat dissipation fins (31). The slot (34) of each heat dissipation fin (31) is slidably connected to the rail (35), thereby fixing the semiconductor heat dissipation fin group (2) to the outer surface of the long-wave non-cooled infrared core (1).

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