Sensor for monitoring vibration and temperature of mechanical equipment
Through the integrated design of sensor module, the data acquisition problem of unstable vibration and temperature monitoring of mechanical equipment in the prior art is solved, low power consumption, fast wireless networking and stable data transmission are achieved, and the operational safety and reliability of the equipment are improved.
Patent Information
- Application Number
- CN202422327050.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-23
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-09-23
AI Technical Summary
The vibration and temperature monitoring sensors of existing mechanical equipment have problems such as inability to collect data stably at the same time, weak wireless signals are susceptible to interference, and unstable data transmission, which affects the normal operation and safety of the equipment.
It adopts integrated design sensors, including wireless transmission module, main control module, sensor module and power module, combined with capacitors and microcontrollers, to achieve low-power stable data transmission and fast wireless networking, and supports real-time monitoring of vibration and temperature.
It realizes low power consumption, stable transmission of large amounts of data, fast on-site deployment, wireless monitoring adapted to complex environments, and improves the safety and reliability of equipment operation.
Smart Images

Figure CN223283683U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of sensors, in particular to a sensor used for monitoring vibration and temperature of mechanical equipment. Background Art
[0002] Modern industrial production utilizes a large number of mechanical equipment. After long-term use, these equipment can experience various faults, impacting normal operation and even causing personal injury. To ensure the continued safe and reliable operation of these equipment, continuous monitoring of their operating status is necessary. One effective approach is to continuously collect vibration and temperature data from mechanical equipment during operation. This data can be used to analyze operational trends and perform predictive maintenance, thereby reducing unplanned downtime and repair costs.
[0003] Currently, many sensors on the market for collecting vibration and temperature data from mechanical equipment have several drawbacks. For example, some sensors can only collect vibration signals alone, requiring additional equipment to collect temperature signals. Some sensors use traditional data transmission methods such as RS485, which prevents flexible deployment. While some sensors use wireless data transmission, the wireless signals are weak and easily affected by environmental interference and cannot overcome building obstructions, resulting in poor data transmission signals and high packet loss rates. Therefore, it is necessary to propose a sensor for mechanical equipment vibration and temperature monitoring to address these issues. Utility Model Content
[0004] The purpose of this utility model is to address the shortcomings of the existing technology and provide a sensor for vibration and temperature monitoring of mechanical equipment. It adopts an integrated design, has low power consumption, can stably transmit large amounts of data, is convenient and fast to deploy on site, and has fast and simple wireless networking.
[0005] The utility model provides a sensor for vibration and temperature monitoring of mechanical equipment, comprising: a wireless transmission module, a main control module, a sensor module and a power supply module; the wireless transmission module and the sensor module are respectively connected to the main control module, and the power supply module is respectively connected to the wireless transmission module, the main control module and the sensor module;
[0006] The sensor module includes: capacitor C12, capacitor C13, capacitor C14, capacitor C15, capacitor C16, capacitor C17, capacitor C18, capacitor C19, capacitor C20 and sensor U3; the SPI pin of the sensor U3 is connected to the main control module, and capacitors C12, C13 and C14 are connected in parallel between the VDD pin and the GND pin of the sensor U3; capacitors C15 and C16 are connected in parallel to the V1P8A pin of the sensor U3, capacitors C17 and C18 are connected in parallel to the V1P8D pin of the sensor U3, and capacitors C19 and C20 are connected in parallel to the VAA pin of the sensor U3.
[0007] Furthermore, the power module includes: a fuse F1, a battery BAT1, a capacitor C1, a capacitor C2, a capacitor C3 and an electrostatic protection tube TVS1; the fuse F1 is connected to the positive electrode of the battery BAT1, and the electrostatic protection tube TVS1, the capacitor C1, the capacitor C2, and the capacitor C3 are sequentially connected in parallel between the positive and negative electrodes of the battery BAT1.
[0008] Furthermore, the main control module includes: capacitor C4, capacitor C5, capacitor C6, capacitor C7, capacitor C8, crystal oscillator Y1, crystal oscillator Y2, resistor R1, resistor R2, single chip microcomputer U1, light emitting diode LED1 and key KEY1;
[0009] One end of capacitor C4 is connected to an OSC32 pin of microcontroller U1, and the other end of capacitor C4 is connected to one end of capacitor C5, and the other end of capacitor C5 is connected to another OSC32 pin of microcontroller U1; one end of crystal oscillator Y1 is connected between capacitor C4 and an OSC32 pin of microcontroller U1, and the other end of crystal oscillator Y1 is connected between capacitor C5 and another OSC32 pin of microcontroller U1;
[0010] One end of capacitor C7 is connected to an OSC pin of microcontroller U1, the other end of capacitor C7 is connected to one end of capacitor C8, the other end of capacitor C8 is connected to another OSC pin of microcontroller U1; one end of crystal oscillator Y2 is connected between capacitor C7 and an OSC pin of microcontroller U1, the other end of crystal oscillator Y2 is connected between capacitor C8 and another OSC pin of microcontroller U1;
[0011] Capacitor C6 is connected to the NRST pin of the microcontroller U1, and one end of the resistor R1 is connected between the capacitor C6 and the NRST pin of the microcontroller U1;
[0012] The button KEY1 is connected to the WKUP pin of the microcontroller U1, the resistor R2 is connected to the light-emitting diode LED1, the light-emitting diode LED1 is connected to the microcontroller U1, the SPI pin of the microcontroller U1 is connected to the sensor module, and the UART pin of the microcontroller U1 is connected to the wireless transmission module.
[0013] Furthermore, the wireless transmission module includes: capacitor C9, capacitor C10, capacitor C11, resistor R3 and communication module U2;
[0014] Capacitors C9, C10, and C11 are connected in parallel between the VCC pin and the GND pin of the communication module U2, resistor R3 is connected to the SLP pin of the communication module U2, the ANT pin of the communication module U2 is connected to the antenna, and the UART pin of the communication module U2 is connected to the main control module.
[0015] The utility model has the following beneficial effects: the utility model provides a sensor for vibration and temperature monitoring of mechanical equipment, which adopts an integrated design, has low power consumption, can stably transmit large amounts of data, is convenient and fast to deploy on site, and has fast and simple wireless networking. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0017] Figure 1 This is the overall functional block diagram of the sensor for vibration and temperature monitoring of mechanical equipment of the present invention;
[0018] Figure 2 This is the power module circuit diagram of the sensor for mechanical equipment vibration and temperature monitoring of the utility model;
[0019] Figure 3 This is the circuit diagram of the main control module of the sensor for vibration and temperature monitoring of mechanical equipment of the utility model;
[0020] Figure 4 This is a circuit diagram of a wireless transmission module of a sensor for vibration and temperature monitoring of mechanical equipment in the present utility model;
[0021] Figure 5 The utility model is a sensor module circuit diagram of a sensor for monitoring vibration and temperature of mechanical equipment. DETAILED DESCRIPTION
[0022] It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments. It should be noted that the following detailed descriptions are illustrative and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this application belongs.
[0023] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.
[0024] Now, exemplary embodiments according to the present application will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in a variety of different forms and should not be interpreted as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of this application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for clarity, the thickness of layers and regions is exaggerated, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.
[0025] See also Figures 1 to 5 The present invention provides a sensor for monitoring the vibration and temperature of mechanical equipment, comprising a wireless transmission module, a main control module, a sensor module, and a power supply module. The wireless transmission module and the sensor module are respectively connected to the main control module, and the power supply module is respectively connected to the wireless transmission module, the main control module, and the sensor module. The power supply module is used to supply power to the wireless transmission module, the main control module, and the sensor module. The sensor module is used to collect temperature and vibration data and transmit it to the main control module, which then processes the data and transmits it to the monitoring platform via the wireless transmission module.
[0026] In this embodiment, the power module includes a fuse F1, a battery BAT1, capacitors C1, C2, and C3, and an electrostatic protection diode TVS1. Fuse F1 is connected to the positive terminal of battery BAT1, while the electrostatic protection diode TVS1, capacitors C1, C2, and C3 are connected in parallel between the positive and negative terminals of battery BAT1. The battery provides power for the entire temperature vibration sensor. This module's function is to transmit the battery output voltage, after protection and filtering, to other modules.
[0027] The main control module includes: capacitor C4, capacitor C5, capacitor C6, capacitor C7, capacitor C8, crystal oscillator Y1, crystal oscillator Y2, resistor R1, resistor R2, single-chip microcomputer U1, light-emitting diode LED1 and key KEY1; one end of capacitor C4 is connected to an OSC32 pin of single-chip microcomputer U1, the other end of capacitor C4 is connected to one end of capacitor C5, and the other end of capacitor C5 is connected to another OSC32 pin of single-chip microcomputer U1; one end of crystal oscillator Y1 is connected between capacitor C4 and an OSC32 pin of single-chip microcomputer U1, and the other end of crystal oscillator Y1 is connected between capacitor C5 and another OSC32 pin of single-chip microcomputer U1; one end of capacitor C7 is connected to an OSC pin of single-chip microcomputer U1, and the other end of capacitor C7 is connected to Connect one end of capacitor C8 to another OSC pin of microcontroller U1. Connect one end of crystal oscillator Y2 between capacitor C7 and one OSC pin of microcontroller U1, and the other end of crystal oscillator Y2 between capacitor C8 and another OSC pin of microcontroller U1. Connect capacitor C6 to the NRST pin of microcontroller U1, and one end of resistor R1 between capacitor C6 and the NRST pin of microcontroller U1. Connect key KEY1 to the WKUP pin of microcontroller U1, resistor R2 to LED1, and LED1 to microcontroller U1. Microcontroller U1's SPI pin is connected to the sensor module, and its UART pin is connected to the wireless transmission module. Microcontroller U1 receives data from other modules, processes it, and transmits it to the wireless transmission module. The crystal oscillator provides a stable clock signal to microcontroller U1. LED1 indicates the operating status of microcontroller U1. Key KEY1 wakes up the device. Microcontroller U1 can be an STM32L452RCT6.
[0028] The wireless transmission module includes capacitors C9, C10, and C11, resistor R3, and communication module U2. Capacitors C9, C10, and C11 are connected in parallel between the VCC and GND pins of communication module U2. Resistor R3 is connected to the SLP pin of communication module U2. The ANT pin of communication module U2 is connected to the antenna, and the UART pin of communication module U2 is connected to the main control module. Communication module U2 can optionally use the SZ05-L-PRO-3. The communication module communicates with the main control module and sends its data to the monitoring platform.
[0029] The sensor module includes capacitors C12, C13, C14, C15, C16, C17, C18, C19, and C20, as well as sensor U3. Sensor U3's SPI pin is connected to the main control module. Capacitors C12, C13, and C14 are connected in parallel between sensor U3's VDD and GND pins. Capacitors C15 and C16 are connected in parallel to sensor U3's V1P8A pin. Capacitors C17 and C18 are connected in parallel to sensor U3's V1P8D pin. Capacitors C19 and C20 are connected in parallel to sensor U3's VAA pin. Sensor U3 can optionally use the ADXL357. This module collects real-time vibration and temperature data from the device and transmits it to the main control module.
[0030] In summary, the sensor for vibration and temperature monitoring of mechanical equipment provided by the embodiment of the present invention adopts an integrated design, has low power consumption, can stably transmit large amounts of data, is convenient and fast to deploy on site, and has fast and simple wireless networking.
[0031] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.
[0032] It should be noted that the terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, such that the embodiments of the present application described herein can, for example, be implemented in an order other than that illustrated or described herein.
[0033] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.
Claims
1. A sensor for vibration and temperature monitoring of mechanical equipment, characterized in that: include: A wireless transmission module, a main control module, a sensor module and a power supply module; the wireless transmission module and the sensor module are respectively connected to the main control module, and the power supply module is respectively connected to the wireless transmission module, the main control module and the sensor module; The sensor module includes: capacitor C12, capacitor C13, capacitor C14, capacitor C15, capacitor C16, capacitor C17, capacitor C18, capacitor C19, capacitor C20 and sensor U3; the SPI pin of the sensor U3 is connected to the main control module, and capacitors C12, C13 and C14 are connected in parallel between the VDD pin and the GND pin of the sensor U3; capacitors C15 and C16 are connected in parallel to the V1P8A pin of the sensor U3, capacitors C17 and C18 are connected in parallel to the V1P8D pin of the sensor U3, and capacitors C19 and C20 are connected in parallel to the VAA pin of the sensor U3.
2. A sensor for monitoring vibration and temperature of mechanical equipment according to claim 1, characterized in that: The power module includes: a fuse F1, a battery BAT1, a capacitor C1, a capacitor C2, a capacitor C3, and an electrostatic protection tube TVS1; the fuse F1 is connected to the positive electrode of the battery BAT1, and the electrostatic protection tube TVS1, the capacitor C1, the capacitor C2, and the capacitor C3 are sequentially connected in parallel between the positive and negative electrodes of the battery BAT1.
3. A sensor for monitoring vibration and temperature of mechanical equipment according to claim 1, characterized in that: The main control module includes: capacitor C4, capacitor C5, capacitor C6, capacitor C7, capacitor C8, crystal oscillator Y1, crystal oscillator Y2, resistor R1, resistor R2, single chip microcomputer U1, light emitting diode LED1 and key KEY1; One end of capacitor C4 is connected to an OSC32 pin of microcontroller U1, and the other end of capacitor C4 is connected to one end of capacitor C5, and the other end of capacitor C5 is connected to another OSC32 pin of microcontroller U1; one end of crystal oscillator Y1 is connected between capacitor C4 and an OSC32 pin of microcontroller U1, and the other end of crystal oscillator Y1 is connected between capacitor C5 and another OSC32 pin of microcontroller U1; One end of capacitor C7 is connected to an OSC pin of microcontroller U1, the other end of capacitor C7 is connected to one end of capacitor C8, the other end of capacitor C8 is connected to another OSC pin of microcontroller U1; one end of crystal oscillator Y2 is connected between capacitor C7 and an OSC pin of microcontroller U1, the other end of crystal oscillator Y2 is connected between capacitor C8 and another OSC pin of microcontroller U1; Capacitor C6 is connected to the NRST pin of the microcontroller U1, and one end of the resistor R1 is connected between the capacitor C6 and the NRST pin of the microcontroller U1; The button KEY1 is connected to the WKUP pin of the microcontroller U1, the resistor R2 is connected to the light-emitting diode LED1, the light-emitting diode LED1 is connected to the microcontroller U1, the SPI pin of the microcontroller U1 is connected to the sensor module, and the UART pin of the microcontroller U1 is connected to the wireless transmission module.
4. A sensor for monitoring vibration and temperature of mechanical equipment according to claim 1, characterized in that: The wireless transmission module includes: capacitor C9, capacitor C10, capacitor C11, resistor R3 and communication module U2; Capacitors C9, C10, and C11 are connected in parallel between the VCC pin and the GND pin of the communication module U2, resistor R3 is connected to the SLP pin of the communication module U2, the ANT pin of the communication module U2 is connected to the antenna, and the UART pin of the communication module U2 is connected to the main control module.