Test seat for SOT packaging chip
By introducing adjustable thimble and return spring structures into the SOT packaged chip test base, the problems of overvoltage damage and removal difficulties during chip installation are solved, and efficient chip replacement and flexible testing adaptability are achieved.
Patent Information
- Application Number
- CN202421480580.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-26
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-06-26
AI Technical Summary
The existing SOT package chip test seats are easily damaged due to overpressure and stress during installation, and are not easy to remove and replace after the test is completed.
A test seat including a base and a guide positioning seat is designed, and adopts an adjustable thimble and a return spring structure. Through the cooperation of the guide plate and the limiting block, buffer protection and convenient chip removal are achieved, adapting to chip installation at different clamping depths.
It effectively avoids chip damage during installation, improves chip replacement efficiency, and enhances the flexibility and practicality of the test seat.
Smart Images
Figure CN223284243U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip testing, in particular to a test socket for SOT packaged chips. Background Art
[0002] The SOT package is a surface-mount package for low-power devices. It's ideal for small semiconductor devices such as transistors, voltage regulators, and diodes. Its compact size allows for high-density board assembly. Common SOT package types include 3-pin, 4-pin, and 6-pin, adapting to varying circuit designs and functional requirements. Before SOT-packaged chips are released to the market, they must be tested for continuity at all pins to ensure proper function.
[0003] A test socket is an indispensable tool for testing SOT packaged chips. It is mainly used to install SOT packaged chips and establish a communication connection with the test device. Generally speaking, a chip test socket includes a base and a spring probe set on the base. The chip can be tested by contacting the spring probe with the chip. However, the existing chip test socket still has some shortcomings. For example, when installing SOT packaged chips, it is easy to be damaged by overpressure, and the SOT packaged chip is not easy to remove and replace after the test is completed. Utility Model Content
[0004] The purpose of the present invention is to provide a test socket for a SOT packaged chip to solve the problems raised in the above background technology.
[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a test seat for SOT packaged chips, comprising a base and a guide positioning seat, wherein a rectangular groove is provided on the upper surface of the base, the guide positioning seat is slidingly sleeved inside the rectangular groove, a pair of guide plates are integrally formed on the upper surface of the guide positioning seat, and a chip insertion slot is provided between the pair of guide plates, a first circular hole is further provided at the center position of the bottom surface of the guide positioning seat, an adjustable ejector pin is sleeved inside the first circular hole, a pair of round rods are fixed to the bottom end of the guide positioning seat, and the pair of round rods are symmetrically arranged on both sides of the adjustable ejector pin;
[0006] A support seat is fixedly installed at the bottom end of the base, and a rectangular notch is provided on the top of the support seat. Three second circular holes are provided on the bottom surface of the rectangular notch, and a circular ring piece is fixed to the inner wall of each of the second circular holes. A round rod is sleeved inside each of the circular ring pieces, and a limiting convex ring is integrally formed on the outer wall of each of the round rods. A reset spring is also sleeved on the outer wall of each of the round rods. A pressure plate is fixed to the bottom surface of the rectangular notch by screws, and three third circular holes are provided on the pressure plate to cooperate with the round rods.
[0007] As a further improvement to the above solution, the adjustable ejector includes a needle seat, a screw, a screw sleeve and a needle rod. The top of the needle seat is integrally formed with the screw, the outer wall of the screw is threadedly connected to the screw sleeve, and the top of the screw sleeve is integrally formed with the needle rod.
[0008] As a further improvement to the above scheme, a limiting block is fixed at the center position of the bottom surface of the chip socket, and a fourth circular hole is opened inside the limiting block for the needle rod to pass freely. Two groups of ceramic limiting plates are also fixed to the bottom surface of the chip socket, and the two groups of ceramic limiting plates are symmetrically arranged on both sides of the limiting block.
[0009] As a further improvement to the above solution, the reset springs are respectively sleeved inside the second circular holes, and the reset springs are arranged between the circular ring pieces and the limiting protruding rings, and the circular ring pieces are slidably sleeved on the inner wall of the second circular hole.
[0010] As a further improvement to the above solution, the adjustable ejector pin and the bottom ends of the pair of round rods are both provided with sockets, the bottom end of the adjustable ejector pin is plugged into the top end of the middle round rod, and the bottom ends of the pair of round rods are respectively plugged into the top ends of the two outer round rods.
[0011] As a further improvement to the above scheme, two groups of fixing holes are opened on the upper surface of the base, and the two groups of fixing holes are symmetrically distributed on both sides of the rectangular groove. Two groups of positioning rods are also fixed on the upper surface of the base, and the two groups of positioning rods are symmetrically distributed on both sides of the rectangular groove.
[0012] As a further improvement to the above solution, a reinforcement block is integrally formed between the outer wall of the guide piece and the upper surface of the guide positioning seat.
[0013] Compared with the prior art, the beneficial effects of the present invention are:
[0014] The utility model is provided with three second circular holes on the bottom surface of the rectangular notch, and a circular ring piece is fixed on the inner wall of each second circular hole, and a round rod is sleeved inside each circular ring piece, and a limited convex ring is integrally formed on the outer wall of each round rod, and a return spring is also sleeved on the outer wall of each round rod, and a first circular hole is provided at the center position of the bottom surface of the guide positioning seat, and an adjustable ejector pin is sleeved inside the first circular hole, and a pair of round rods are fixed at the bottom end of the guide positioning seat, wherein the bottom end of the adjustable ejector pin is plugged into the top end of the middle round rod, and the bottom ends of the pair of round rods are respectively plugged into the top ends of the two outer round rods in a one-to-one correspondence, so that the entire guide positioning seat is supported by the two outer return springs, and the return spring plays a buffering and protective role, so that The SOT packaged chip installed inside the guide positioning seat by the manipulator is not easily damaged by over-pressure; at the same time, after the test is completed, the guide positioning seat can be pressed by the manipulator, and the two return springs on the outside are in a compressed state, and the adjustable ejector can eject the SOT packaged chip after the test. After taking it out, it is convenient to replace the new SOT packaged chip for testing, which greatly improves work efficiency; furthermore, the adjustable ejector includes a needle seat, a screw, a screw sleeve and a needle rod. The screw sleeve is threadedly connected to the outer wall of the screw, and the top of the screw sleeve is integrally formed with a needle rod. Therefore, the initial height of the needle rod can be adjusted by rotating the screw sleeve, which can adapt to the installation and testing of SOT packaged chips with different clamping depths. It is more flexible to use and highly practical. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model from a first perspective;
[0017] Figure 2 This is a schematic diagram of the third perspective structure of the present invention;
[0018] Figure 3 This is a schematic diagram of the three-dimensional structure of the base in the utility model;
[0019] Figure 4 This is a schematic diagram of the assembly of the guide positioning seat and the support seat in the utility model;
[0020] Figure 5 This is a schematic diagram of the three-dimensional structure of the guide positioning seat in the utility model from a first perspective;
[0021] Figure 6 This is a schematic diagram of the three-dimensional structure of the adjustable ejector in the present utility model;
[0022] Figure 7 For this utility model Figure 5 A schematic diagram of the partially enlarged structure at center A;
[0023] Figure 8 This is a schematic diagram of the third perspective structure of the guide and positioning seat in the present invention;
[0024] Figure 9 This is a schematic diagram of the three-dimensional structure of the support base in the present utility model;
[0025] Figure 10 This is a schematic diagram of the split structure of the support base in the utility model;
[0026] Figure 11 It is a schematic diagram of the half-section structure of the support seat in the utility model.
[0027] In the figure: 1-base; 2-guide positioning seat; 3-rectangular groove; 4-guide plate; 5-chip socket; 6-first circular hole; 7-adjustable ejector pin; 701-needle seat; 702-screw; 703-screw sleeve; 704-needle rod; 8-round rod; 9-support seat; 10-rectangular notch; 11-second circular hole; 12-circular ring; 13-round rod; 14-limiting convex ring; 15-reset spring; 16-pressure plate; 17-third circular hole; 18-limiting block; 19-fourth circular hole; 20-ceramic limiting plate; 21-fixing hole; 22-positioning rod; 23-reinforcement block. DETAILED DESCRIPTION
[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0029] A test socket for SOT packaged chips, such as Figure 1 、 Figure 2 、 Figure 3 、 Figure 5 、 Figure 7 and Figure 8As shown, it includes a base 1 and a guide and positioning seat 2. A rectangular groove 3 is provided on the upper surface of the base 1, and a guide and positioning seat 2 is slidingly sleeved inside the rectangular groove 3. A pair of guide plates 4 are integrally formed on the upper surface of the guide and positioning seat 2, and a chip plugging slot 5 is provided between the pair of guide plates 4. A reinforcement block 23 is also integrally formed between the outer wall of the guide plate 4 and the upper surface of the guide and positioning seat 2. The setting of the reinforcement block 23 can improve the strength of the pair of guide plates 4; a first circular hole 6 is also provided at the center position of the bottom surface of the guide and positioning seat 2, and an adjustable ejector pin 7 is sleeved inside the first circular hole 6. A pair of round rods 8 are fixed to the bottom end of the guide and positioning seat 2, and the pair of round rods 8 are symmetrically arranged on both sides of the adjustable ejector pin 7.
[0030] like Figure 1 、 Figure 2 、 Figure 9 、 Figure 10 and Figure 11 As shown, a support seat 9 is fixedly installed at the bottom end of the base 1, and a rectangular notch 10 is also provided on the top of the support seat 9. Three second circular holes 11 are provided on the bottom surface of the rectangular notch 10. A circular ring piece 12 is fixed to the inner wall of each second circular hole 11. A round rod 13 is sleeved inside each circular ring piece 12. The round rod 13 can slide up and down along the inside of the circular ring piece 12. The outer wall of each circular rod 13 is integrally formed with a limited convex ring 14. The outer wall of each circular rod 13 is also sleeved with a reset spring 15, and the reset springs 15 are sleeved one by one on Inside the second circular hole 11, the reset spring 15 is arranged between the circular ring piece 12 and the limiting convex ring 14. The circular ring piece 12 is slidably sleeved on the inner wall of the second circular hole 11. The outer diameters of the circular ring piece 12 and the limiting convex ring 14 are larger than the spring outer diameter of the reset spring 15; a pressure plate 16 is also fixed to the bottom surface of the rectangular notch 10 by screws, and three third circular holes 17 are provided on the pressure plate 16 to cooperate with the round rod 13. The pressure plate 16 is used to limit the limiting convex ring 14, limiting the limiting convex ring 14 to slide up and down only inside the second circular hole 11.
[0031] like Figure 4 、 Figure 5 、 Figure 6 、 Figure 8 and Figure 9As shown, the bottom ends of the adjustable ejector pin 7 and the pair of round rods 8 are both provided with sockets. The bottom end of the adjustable ejector pin 7 is plugged into the top end of the middle round rod 13, and the bottom ends of the pair of round rods 8 are respectively plugged into the top ends of the two outer round rods 13 in a one-to-one correspondence; the adjustable ejector pin 7 includes a needle seat 701, a screw rod 702, a screw sleeve 703 and a needle rod 704. The top end of the needle seat 701 is integrally formed with a screw rod 702, the outer wall of the screw rod 702 is threadedly connected with a screw sleeve 703, and the top end of the screw sleeve 703 is integrally formed with a needle rod 704. The screw sleeve 703 can be rotated to adjust the combined height of the screw rod 702 and the screw sleeve 703, and the initial height of the needle rod 704 can be further changed, which can adapt to the installation and testing of SOT packaged chips with different clamping depths. It is more flexible to use and has strong practicality.
[0032] like Figure 5 、 Figure 6 and Figure 7 As shown, the chip socket 5 is used to install and test the SOT packaged chip. A limit block 18 is fixed at the center position of the bottom surface of the chip socket 5. The limit block 18 can limit the maximum moving height of the screw sleeve 703. A fourth circular hole 19 is opened inside the limit block 18 for the needle rod 704 to pass freely. The needle rod 704 is pressed to slide up and down along the inside of the fourth circular hole 19. The return spring 15 located in the middle can buffer the up and down movement of the needle rod 704; two groups of ceramic limit plates 20 are also fixed to the bottom surface of the chip socket 5, and the two groups of ceramic limit plates 20 are symmetrically arranged on both sides of the limit block 18. The arrangement of the ceramic limit plates 20 can not only increase the wear resistance, but also improve the insulation effect; the number of single-group ceramic limit plates 20 is not less than 2, and the gap between adjacent ceramic limit plates 20 is filled with contact springs for installing gold fingers, and the gap between the ceramic limit plates 20 and the guide plate 4 is also filled with contact springs for installing gold fingers.
[0033] like Figure 1 and Figure 2 As shown, two groups of fixing holes 21 are opened on the upper surface of the base 1, and the two groups of fixing holes 21 are symmetrically distributed on both sides of the rectangular groove 3. The setting of the fixing holes 21 is to fix the gold finger on the upper surface of the base 1. Two groups of positioning rods 22 are also fixed on the upper surface of the base 1, and the two groups of positioning rods 22 are symmetrically distributed on both sides of the rectangular groove 3. The setting of the positioning rods 22 is to determine the installation position of the gold finger on the upper surface of the base 1.
[0034] When the present invention is in use, first, two matching test gold fingers are symmetrically installed on the upper surface of the base 1, and then the multiple contact springs of the gold fingers are pressed into the inside of the two groups of ceramic limiting pieces 20, and the ceramic limiting pieces 2 separate and limit the contact springs. Then, the robot presses the SOT packaged chip to be tested vertically downward from just above the guide positioning seat 2, and guides the SOT packaged chip into the chip socket 5 through a pair of guide pieces 4. The pins of the SOT packaged chip are vertically contacted with the contact springs through the ceramic limiting pieces 20 to ensure that the bottom surface of the pins of the SOT packaged chip are in complete electrical contact with the test gold fingers, thereby achieving the purpose of conductive testing. During the installation of the SOT packaged chip, three second circular holes 11 are provided on the bottom surface of the rectangular notch 10, and a circular ring piece 12 is fixed to the inner wall of each second circular hole 11. A round rod 13 is sleeved inside each circular ring piece 12, and a limiting convex ring 14 is integrally formed on the outer wall of each circular rod 13. A reset spring 15 is also sleeved on the outer wall of each circular rod 13. A first circular hole 6 is provided at the center position of the bottom surface of the guide positioning seat 2, and an adjustable ejector pin 7 is sleeved inside the first circular hole 6. A pair of round rods 8 are fixed to the bottom end of the guide positioning seat 2, wherein the bottom end of the adjustable ejector pin 7 is inserted into the top end of the middle circular rod 13, and the bottom ends of the pair of round rods 8 are respectively inserted into the top ends of the two outer circular rods 13, so that the entire guide positioning seat 2 is supported by the two outer reset springs 15, and the reset spring 15 plays a role in buffering. The guide positioning seat 2 has an impact protection effect, so the SOT packaged chip installed in the guide positioning seat 2 by the manipulator is not easily damaged by over-pressure. After the test is completed, the guide positioning seat 2 can also be pressed by the manipulator, and the two outer return springs 15 are in a compressed state. Since the fourth circular hole 19 opened inside the limit block 18 will not prevent the pressing needle rod 704 from sliding, the adjustable ejector pin 7 and the return spring 15 located in the middle will not be subjected to the pressure of the guide positioning seat 2 in the initial stage, until the SOT packaged chip inside the chip socket 5 is continuously pushed up by the needle rod 704. During the lifting process, the return spring 15 located in the middle also has a buffering protection effect on the SOT packaged chip. Therefore, the SOT packaged chip after the test can be easily ejected, and it is also convenient to replace the new SOT packaged chip for testing later, which greatly improves the work efficiency.
[0035] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A test seat for SOT packaged chips, comprising a base (1) and a guide and positioning seat (2), characterized in that: A rectangular groove (3) is provided on the upper surface of the base (1), the guide positioning seat (2) is slidingly sleeved inside the rectangular groove (3), a pair of guide plates (4) are integrally formed on the upper surface of the guide positioning seat (2), and a chip insertion slot (5) is provided between the pair of guide plates (4), a first circular hole (6) is also provided at the center position of the bottom surface of the guide positioning seat (2), an adjustable ejector pin (7) is sleeved inside the first circular hole (6), a pair of round rods (8) are fixed to the bottom end of the guide positioning seat (2), and the pair of round rods (8) are symmetrically arranged on both sides of the adjustable ejector pin (7); A support seat (9) is fixedly installed at the bottom end of the base (1), and a rectangular notch (10) is also provided on the top of the support seat (9). Three second circular holes (11) are provided on the bottom surface of the rectangular notch (10), and a circular ring (12) is fixed to the inner wall of each of the second circular holes (11). A round rod (13) is sleeved inside each of the circular rings (12), and a limiting convex ring (14) is integrally formed on the outer wall of each of the round rods (13). A reset spring (15) is also sleeved on the outer wall of each of the round rods (13). A pressure plate (16) is also fixed on the bottom surface of the rectangular notch (10) by screws, and three third circular holes (17) are provided on the pressure plate (16) to match the round rods (13).
2. A test socket for a SOT packaged chip according to claim 1, characterized in that: The adjustable ejector pin (7) comprises a needle seat (701), a screw rod (702), a screw sleeve (703) and a needle rod (704); the top end of the needle seat (701) is integrally formed with the screw rod (702); the outer wall of the screw rod (702) is threadedly connected to the screw sleeve (703); and the top end of the screw sleeve (703) is integrally formed with the needle rod (704).
3. The test socket for SOT packaged chips according to claim 2, characterized in that: A limiting block (18) is fixed at the center of the bottom surface of the chip insertion slot (5), and a fourth circular hole (19) is provided inside the limiting block (18) for the needle rod (704) to freely pass through. Two groups of ceramic limiting plates (20) are also fixed to the bottom surface of the chip insertion slot (5), and the two groups of ceramic limiting plates (20) are symmetrically arranged on both sides of the limiting block (18).
4. The test socket for a SOT packaged chip according to claim 1, wherein: The reset springs (15) are sleeved inside the second circular holes (11) in a one-to-one correspondence, and the reset springs (15) are arranged between the circular ring (12) and the limiting protruding ring (14), and the circular ring (12) is slidably sleeved on the inner wall of the second circular hole (11).
5. The test socket for SOT packaged chips according to claim 1, characterized in that: The bottom ends of the adjustable ejector pin (7) and the pair of round rods (8) are both provided with sockets. The bottom end of the adjustable ejector pin (7) is plugged into the top end of the middle round rod (13), and the bottom ends of the pair of round rods (8) are plugged into the top ends of the two outer round rods (13) in a one-to-one correspondence.
6. The test socket for SOT packaged chips according to claim 1, characterized in that: Two groups of fixing holes (21) are provided on the upper surface of the base (1), and the two groups of fixing holes (21) are symmetrically distributed on both sides of the rectangular groove (3). Two groups of positioning rods (22) are also fixed on the upper surface of the base (1), and the two groups of positioning rods (22) are symmetrically distributed on both sides of the rectangular groove (3).
7. The test socket for a SOT packaged chip according to claim 1, wherein: A reinforcement block (23) is also integrally formed between the outer wall of the guide piece (4) and the upper surface of the guide positioning seat (2).