Automobile high-power high-side drive test load board and test system
By designing a high-power, high-side drive test load board for automobiles including temperature detection module and fan, the problems of large volume and poor heat dissipation effect of external electronic load are solved, efficient heat dissipation and cost control are achieved, and testing reliability is improved.
Patent Information
- Application Number
- CN202422436812.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-10-10
AI Technical Summary
In the prior art, the external electronic load is large in size and high in cost during testing of high-side drive circuits, and the power resistance heat dissipation effect is limited, resulting in the test effect being affected by temperature increase and the production cost is high.
Design a high-power high-side drive test load board for automobiles, including a control module, a temperature detection module and a fan. The fan speed is controlled through the temperature detection module feedback to achieve intelligent heat dissipation and avoid heat accumulation.
Effectively adjust the fan speed, improve heat dissipation effect, avoid rapid aging and damage caused by high temperature, reduce production costs, and improve testing reliability.
Smart Images

Figure CN223284314U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the field of automobile high-power high-side drive testing, and in particular relates to an automobile high-power high-side drive testing load board and a testing system. Background Art
[0002] With the increasing penetration of new energy vehicles and the trend toward wire-controlled vehicles, automotive high-side drivers are widely used in vehicles due to their high reliability, flexibility, low power consumption, and compact size and lightweight design. These drivers are used in interior lighting, headlights and taillights, heated seats and steering wheels, rearview mirrors, solenoid valves, and door lock motors. These high-side driver circuits require load capacity testing to verify their performance. In existing technologies, external electronic loads or power resistors are typically used as simulated loads to test high-side driver output performance.
[0003] In existing testing methods, an external electronic load is used. The electronic load is large in size and relatively expensive, which makes it inconvenient to test. When a power resistor is used as a simulated load for driving, the heat dissipation effect of the power resistor is limited. In addition, this type of resistor is large in size. When high-power driving is involved, a large number of resistors are required, which takes up a large space. In addition, when matching different power requirements, this type of resistor often needs to be customized, which has a high production cost.
[0004] Therefore, due to the technical problem that the temperature rise affects the test results due to the limited heat dissipation effect during the test, it is necessary to design a new automotive high-power high-side drive test load board and test system.
[0005] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Utility Model Content
[0006] The embodiments of the present disclosure at least provide an automotive high-power high-side driver test load board and a test system.
[0007] In a first aspect, an embodiment of the present disclosure provides an automotive high-power high-side driver test load board, comprising:
[0008] A control module, and at least one load board electrically connected to the control module;
[0009] The control module is suitable for driving the load board; wherein
[0010] The load board includes: a temperature detection module and at least one fan;
[0011] The temperature detection module is electrically connected to the control module;
[0012] The fan is electrically connected to the control module;
[0013] The temperature detection module is suitable for detecting temperature;
[0014] The control module is adapted to control the rotation speed of the fan according to the temperature.
[0015] In an optional embodiment, there are two load boards, and each load board is provided with two fans.
[0016] In an optional embodiment, the load board further includes: a plurality of load modules;
[0017] The load module is connected to the control module via a load channel, and the control module drives the load module via the load channel;
[0018] The control module is adapted to stop driving the load module when the temperature exceeds a preset maximum value.
[0019] In an optional embodiment, a current acquisition module is connected to the load channel, and the current acquisition module is electrically connected to the control module;
[0020] The current acquisition module is suitable for acquiring the current in the corresponding load channel;
[0021] The control module is adapted to stop driving the corresponding load module when the current exceeds a preset maximum value.
[0022] In an optional embodiment, an indicator light module is connected to the load channel, and the indicator light module is electrically connected to the control module;
[0023] The control module lights up the corresponding indicator light module when driving the load module.
[0024] In an optional embodiment, the load module includes: a plurality of packaged resistors;
[0025] The package resistors are connected in parallel;
[0026] The packaged resistor array is arranged on one side of the PCB board, and the packaged resistors are arranged in a centralized manner.
[0027] In an optional embodiment, a bottom heat dissipation module corresponding to the load card is connected to the other side of the PCB board through heat dissipation adhesive;
[0028] The bottom heat dissipation module is arranged on the back side of the area where the package resistors are concentrated.
[0029] In an optional embodiment, the fan is provided on one side of the bottom heat dissipation module;
[0030] The temperature detection module is arranged on one side of the fan;
[0031] The fan and the temperature detection module are both arranged on a PCB board.
[0032] In an optional embodiment, a power supply module is provided on the PCB board, and the power supply module is suitable for supplying power to the fan.
[0033] In a second aspect, an embodiment of the present disclosure further provides a testing system, comprising:
[0034] The above-mentioned automotive high-power high-side driver test load board.
[0035] The beneficial effects of the present utility model are as follows: the automobile high-power high-side driver test load board comprises: a control module, and at least one load board electrically connected to the control module; the control module is suitable for driving the load board; wherein the load board comprises: a temperature detection module and at least one fan; the temperature detection module is electrically connected to the control module; the fan is electrically connected to the control module; the temperature detection module is suitable for detecting temperature; the control module is suitable for controlling the rotation speed of the fan according to the temperature; the rotation speed of the fan is adjusted according to the temperature when the load board is working, so as to adjust the heat dissipation effect, avoid heat accumulation causing temperature increase to affect the automobile high-power high-side driver test load board, and also avoid the rapid aging and damage of the load board due to high temperature.
[0036] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or understood by practicing the present invention. The objectives and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.
[0037] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited herein and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0038] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0039] Figure 1 A block diagram of a high-power high-side driver test load board for an automobile provided in an embodiment of the present disclosure;
[0040] Figure 2 A circuit schematic diagram of a high-power high-side driver test load board for an automobile provided in an embodiment of the present disclosure;
[0041] Figure 3 A circuit diagram of a high-power high-side driver test load board for an automobile provided in an embodiment of the present disclosure. DETAILED DESCRIPTION
[0042] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.
[0043] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Thus, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations, aspects, or designs. Instead, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.
[0044] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.
[0045] like Figures 1 to 3As shown, at least one disclosed embodiment provides a high-power high-side driver test load board for an automobile, comprising: a control module, and at least one load board electrically connected to the control module; the control module is adapted to drive the load board; the load board comprises: a temperature detection module and at least one fan (fan module); the temperature detection module may employ an NCT sampling resistor; the temperature detection module is electrically connected to the control module; the fan is electrically connected to the control module; the temperature detection module is adapted to detect temperature; the temperature detection module is adapted to collect the temperature at a corresponding position and provide feedback; the temperature feedback is used to linearly control the power supply module of the fan, thereby achieving linear and intelligent control of the fan speed; the control module is adapted to control the fan speed according to the temperature; the fan speed is adjusted according to the temperature when the load board is operating to adjust the heat dissipation effect, thereby preventing the temperature increase caused by heat accumulation from affecting the high-power high-side driver test load board for the automobile, and also preventing the high-temperature-induced rapid aging and damage thereof; the control module may be connected to the high-side driver chip to be tested to receive the high-side output signal emitted by the high-side driver chip.
[0046] In an optional embodiment, there are two load boards, and each load board is provided with two fans; the two load boards are identical, and providing two load boards can meet more high-side drive test requirements; the control module can receive high-side output signals sent by an external controller, and the control module controls the corresponding load module according to the high-side output signals to perform high-side drive testing; there are many high-side output signals, so two load boards are connected to the control module to meet the test requirements. The load board includes functions such as driving the load, indicator light display, current feedback, temperature sampling, and fan power supply; the load board is manufactured using PCB SMT technology, which facilitates mass production, reduces labor costs, and improves production reliability.
[0047] In an optional embodiment, the load board also includes: a plurality of load modules; the load modules are connected to the control module through a load channel, and the control module drives the load modules through the load channel; the control module is suitable for stopping driving the load modules when the temperature exceeds a preset maximum value, at which time the fan maintains the maximum speed, and when the temperature drops to room temperature, the control module drives the load modules again; the load modules act as high-side drivers to output the loads of each load channel.
[0048] In an optional embodiment, a current acquisition module is connected to the load channel, and the current acquisition module is electrically connected to the control module; the current acquisition module is suitable for acquiring the current in the corresponding load channel; the control module is suitable for stopping the drive of the corresponding load module when the current exceeds a preset maximum value; the current acquisition part is used to acquire the current of each load channel, so as to judge the driving load capacity of each load channel, and at the same time, shut down the output port in case of overcurrent to protect the test port; the current acquisition module can be an ACS712 chip.
[0049] In an optional embodiment, an indicator light module is connected to the load channel, and the indicator light module is electrically connected to the control module; the control module lights up the corresponding indicator light module when driving the load module to realize visual operation; the indicator light module is used to indicate different load channels and their working status; the indicator light module connected to each load channel has a different color, and the indicator lights of various colors during testing facilitate the judgment of the working status of different load channels; the indicator light module can use LED.
[0050] In an optional embodiment, the load module includes: a plurality of packaged resistors; the packaged resistors are connected in parallel; the packaged resistor array is arranged on one side of the PCB board, and the packaged resistors are centrally arranged; the packaged resistors can be 2512 packaged resistors; the load channel can be connected to different numbers of packaged resistors according to different needs; 2512 packaged resistors are used to simulate the drive load, with a rectangular distribution, to miniaturize the load and make it easy to carry, simplify the construction of the test bench, and facilitate various reliability experiments; for the test of high-side driver chips with different driving capabilities, the resistance value and quantity of the packaged resistors can be directly changed to achieve the function, the load board has high universality, and the test method can be implemented on a platform.
[0051] In an optional embodiment, a bottom heat dissipation module corresponding to the load board is connected to the other side of the PCB board via heat dissipation adhesive; the bottom heat dissipation module is arranged on the back side of the package resistor concentrated arrangement area; the fan is arranged on one side of the bottom heat dissipation module; the temperature detection module is arranged on one side of the fan; the fan and the temperature detection module are both arranged on the PCB board; the load board is connected to the radiator via heat dissipation adhesive and a fan is added on one or both sides of the radiator, the temperature of the load board is collected, and the fan speed is linearly controlled to improve the heat dissipation capacity of the load board, thereby avoiding safety hazards caused by untimely heat dissipation.
[0052] In an optional embodiment, a power supply module (fan power supply) is provided on the PCB board, and the power supply module is suitable for supplying power to the fan; the power supply module can supply power to multiple fans at the same time.
[0053] The specific circuit diagram of the automotive high-power high-side driver test load board places the connections at the edge of the board for easy connection. 2512 package resistors are selected for the load modules and are centrally placed in the center of the corresponding PCB of the load board. The PCB board for the two load boards can be a single PCB board. A heat sink is attached to the bottom of the PCB board to facilitate heat dissipation. An ACS712 chip is connected in series within each load channel for current acquisition, enabling judgment of the driver's load capacity and overcurrent detection. The indicator light module is placed next to the load module for load channel indication and operating status judgment. The NCT sampling resistor is placed next to the fan to simultaneously collect the PCB board temperature. The fan power module is placed at the edge of the board. An external fan is connected to the bottom of the PCB here to enhance PCB heat dissipation.
[0054] A specific implementation method, after analyzing the high-side drive signal output requirements, the high-side drive output port has 24 channels, the maximum output load of the port is 39W, and the overall output is 254W. The high-power high-side drive output design corresponds to the automotive high-power high-side drive test load board, and the 24-channel drive output is externally connected to two load boards. One load board has 12 channels and a power of about 130W to achieve heat dispersion and avoid problems such as poor heat dissipation due to excessive heat concentration. The two load boards are exactly the same, and the PCB board adopts SMT process. , which is convenient for batch production; for the load board, the maximum output port is 4.3A / 39W, and 2512 package resistors are selected here with rectangular distribution. The maximum load power of 2512 package resistors is 1W. In order to achieve the best heat dissipation effect, the efficiency of each resistor is controlled at 50%-60%, that is, 0.5-0.6W. Here, 80 2512 package 390R resistors are selected in parallel to achieve 4.3A / 39W load capacity test. According to the different driving capabilities of each test port, different numbers and resistance values of 2512 package resistors are selected. This constitutes 12 load channels matching 12 drive outputs; the maximum current is 4.3A, and the current acquisition chip ACS712-5A is selected to be connected in series inside the 12 load channels to collect the current and feed it back to the test port, thereby realizing the test of the 12-channel drive load capacity; different color indicator lights are placed on each load channel on the load board to judge the working status of each load channel; the temperature of the load board is sampled and fed back to the control module to control the fan power supply, achieving a linear control effect. As the temperature rises, the fan speed increases. When the temperature exceeds a certain value, the drive output is shut down to stop driving the load module, and the fan runs at the highest speed until the temperature drops to room temperature and the drive output is turned on again, thereby protecting the output port of the control module; the bottom of the load board is connected to the radiator through thermal glue, and the fan is fixed outside the radiator to achieve a better heat dissipation effect.
[0055] At least one other disclosed embodiment further provides a test system comprising: the above-mentioned automotive high-power high-side driver test load board; the automotive high-power high-side driver test load board is connected to the high-side driver chip to be tested to receive the high-side output signal emitted by the high-side driver chip.
[0056] In summary, the automotive high-power high-side driver test load board comprises: a control module, and at least one load board electrically connected to the control module; the control module is suitable for driving the load board; wherein the load board comprises: a temperature detection module and at least one fan; the temperature detection module is electrically connected to the control module; the fan is electrically connected to the control module; the temperature detection module is suitable for detecting temperature; the control module is suitable for controlling the speed of the fan according to the temperature; the speed of the fan is adjusted according to the temperature when the load board is working to adjust the heat dissipation effect, avoid heat accumulation causing temperature increase to affect the automotive high-power high-side driver test load board, and also avoid its rapid aging and damage due to high temperature.
[0057] Based on the above-mentioned ideal embodiment of the present invention, and in accordance with the above description, relevant personnel can make various changes and modifications without departing from the technical scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, but must be determined according to the scope of the claims.
Claims
1. A high-power high-side driver test load board for automobiles, characterized in that: include: A control module, and at least one load board electrically connected to the control module; The control module is suitable for driving the load board; wherein The load board includes: a temperature detection module and at least one fan; The temperature detection module is electrically connected to the control module; The fan is electrically connected to the control module; The temperature detection module is suitable for detecting temperature; The control module is adapted to control the rotation speed of the fan according to the temperature.
2. The automotive high-power high-side driver test load board according to claim 1, characterized in that: There are two load boards, and each load board is provided with two fans.
3. The automotive high-power high-side driver test load board according to claim 1, wherein: The load board also includes: a number of load modules; The load module is connected to the control module via a load channel, and the control module drives the load module via the load channel; The control module is adapted to stop driving the load module when the temperature exceeds a preset maximum value.
4. The automotive high-power high-side driver test load board according to claim 3, characterized in that: A current acquisition module is connected to the load channel, and the current acquisition module is electrically connected to the control module; The current acquisition module is suitable for acquiring the current in the corresponding load channel; The control module is adapted to stop driving the corresponding load module when the current exceeds a preset maximum value.
5. The automotive high-power high-side driver test load board according to claim 4, characterized in that: An indicator light module is connected to the load channel, and the indicator light module is electrically connected to the control module; The control module lights up the corresponding indicator light module when driving the load module.
6. The automotive high-power high-side driver test load board according to claim 3, characterized in that: The load module includes: a plurality of packaged resistors; The package resistors are connected in parallel; The packaged resistor array is arranged on one side of the PCB board, and the packaged resistors are arranged in a centralized manner.
7. The automotive high-power high-side driver test load board according to claim 6, characterized in that: The other side of the PCB is connected to a bottom heat dissipation module corresponding to the load card through heat dissipation adhesive; The bottom heat dissipation module is arranged on the back side of the area where the package resistors are concentrated.
8. The automotive high-power high-side driver test load board according to claim 6, wherein: The fan is arranged on one side of the bottom heat dissipation module; The temperature detection module is arranged on one side of the fan; The fan and the temperature detection module are both arranged on a PCB board.
9. The automotive high-power high-side driver test load board according to claim 6, characterized in that: A power supply module is provided on the PCB board, and the power supply module is suitable for supplying power to the fan.
10. A testing system, characterized in that: include: The automotive high-power high-side driver test load board according to any one of claims 1 to 9.