Double-shaft positioning movement device

Abstract

The embodiment of the utility model provides a double-shaft positioning motion device which comprises a motion platform, a laser emitting device, a first laser processing part, a second laser processing part, a driving part and a central control device, and the central control device is correspondingly connected with the driving part, the first laser processing part and the second laser processing part. The central control device can control the driving part to drive the carrying platform to move to a preset position according to information fed back by the first laser processing part and the second laser processing part. According to the double-shaft positioning movement device, the situation that the position of the wafer to be processed can be finely adjusted only through the assistance of an external device is avoided, the positioning precision is effectively improved, the precision requirement of high-precision processing is met, and a guarantee is provided for the subsequent processing technology.

Description

Technical Field

[0001] The utility model relates to the technical field of precision measurement, in particular to a dual-axis positioning motion device. Background Art

[0002] With the advancement of semiconductor technology, chip manufacturing processes are placing higher demands on the precision and efficiency of lithography machines. Therefore, a two-dimensional motion platform is needed to meet the growing demands for overlay accuracy and production efficiency. Currently, most two-dimensional motion platforms only have simple positioning functions, and the corresponding chip transfer and transportation require the coordination of external equipment. This often cannot guarantee the precise placement of chips in the specified position, which can easily lead to positioning errors.

[0003] In view of the problems existing in the above-mentioned prior art, it is urgent to design a dual-axis positioning motion device to solve the above-mentioned problems. Utility Model Content

[0004] In order to overcome the technical problems existing in the prior art, the present application provides a dual-axis positioning motion device, thereby being able to solve the problems raised in the above background technology.

[0005] The present application provides a dual-axis positioning motion device, comprising:

[0006] A motion platform, wherein the motion platform is hollow to form a test cavity, and a placement carrier is movably provided in the test cavity, and the placement carrier is used to place the wafer to be processed;

[0007] a laser emitting device disposed on one side of the motion platform, wherein the laser emitting device is provided with a first laser emitting port and a second laser emitting port, wherein the first laser emitting port and the second laser emitting port respectively emit a first laser for positioning in a first direction and a second laser for positioning in a second direction, wherein the first direction and the second direction are perpendicular to each other;

[0008] a first laser processing component, comprising a first movable reflector and a first laser interferometer assembly, wherein the first movable reflector is correspondingly arranged on a side of the placement platform facing the first direction; the first laser interferometer assembly is provided with a first incident port and a first measuring laser exit port, the first incident port is correspondingly connected to the first laser exit port so that the first laser interferometer assembly can process the first laser into a first measuring laser; the first measuring laser exit port is correspondingly oriented and directly faces the first movable reflector so that the first measuring laser can be emitted onto the first movable reflector, and the first measuring laser is reflected by the first movable reflector onto the first laser interferometer assembly, so that the displacement of the first movable reflector in the first direction can be measured;

[0009] a second laser processing component, comprising a second movable reflector and a second laser interferometer assembly, wherein the second movable reflector is correspondingly arranged on a side of the placement platform facing the second direction and is correspondingly perpendicular to the first movable reflector; a second incident port and a second measuring laser outlet are provided on the second laser interferometer assembly, the second incident port is correspondingly connected to the second laser outlet, so that the second laser interferometer assembly can process the second laser into a second measuring laser; the second measuring laser outlet is correspondingly oriented and directly faces the second movable reflector, so that the second measuring laser can be emitted onto the second movable reflector, and the second measuring laser is reflected by the second movable reflector onto the second laser interferometer assembly, so that the displacement of the second movable reflector in the second direction can be measured;

[0010] A driving component includes a first driving assembly and a second driving assembly, wherein the first driving assembly is used to drive the placement platform to move along the first direction, and the second driving assembly is used to drive the placement platform to move along the second direction;

[0011] A central control device is correspondingly connected to the driving component, the first laser processing component and the second laser processing component block, so that the central control device can control the driving component to drive the placement platform to a preset position based on the information fed back by the first laser processing component and the second laser processing component.

[0012] By setting up a central control device to coordinate the driving components, the first laser processing component and the second laser processing component, the placement stage can be moved to the specified position, avoiding the need for external devices to assist in fine-tuning the position of the wafer to be processed, effectively improving the positioning accuracy to meet the accuracy requirements of high-precision processing, and providing guarantees for subsequent processing processes.

[0013] In some embodiments, a sliding plate, a first slide rail, and a second slide rail are further provided in the test chamber, the first slide rail is parallel to the first direction, the second slide rail is parallel to the second direction, the placement platform is correspondingly slidably set on the first slide rail, the first slide rail is set on the sliding plate, and the sliding plate is correspondingly slidably set on the second slide rail.

[0014] By setting the movement in the first direction and the movement in the second direction to be independently realized by the placement platform moving along the first slide rail and the sliding plate moving along the second slide rail, the placement platform can be moved freely on a plane, and the wafer to be processed can be transferred and fine-tuned to the specified position.

[0015] In some embodiments, the first drive assembly includes a first drive motor and a first extension member, wherein the output end of the first drive motor is connected to the first extension member, and the first extension member is arranged along the first direction and is slidably connected to the placement platform, so that the placement platform can be driven by the first drive motor to perform telescopic movement along the first direction;

[0016] The second drive assembly includes a second drive motor and a second extension member, the output end of the second drive motor is connected to the second extension member, the second extension member is arranged along the second direction and is correspondingly connected to the sliding plate, so that the sliding plate can be driven by the second drive motor to perform telescopic movement along the second direction.

[0017] In some embodiments, the first driving assembly further includes a slider, and the slider is correspondingly disposed on an end of the first extension member away from the first transmission assembly;

[0018] A connecting sliding groove is provided on the side of the placement platform corresponding to the first protruding member, and the connecting sliding groove is parallel to the second direction. The sliding hook corresponding to the slider is provided in the connecting sliding groove so that the placement platform can slide relative to the first protruding member along the second direction.

[0019] By arranging the slider and the placement platform to be correspondingly slidably connected, the placement platform can be slidably displaced along the second direction.

[0020] In some embodiments, the dual-axis positioning motion device provided by the present application further includes:

[0021] a first integrated box, wherein the interior of the first integrated box is hollow to form an integrated cavity, the first laser interferometer assembly is disposed in the integrated cavity, the first integrated box is in communication with the laser emitting device via a first laser channel, and the first integrated box is in communication with a side of the motion platform that is close to the first movable reflector;

[0022] The driving motor is arranged on the outside of the first integrated box and extends into the integrated cavity through the first vacuum transmission component to be correspondingly connected to the first protruding piece. The first protruding piece extends into the integrated cavity through the telescopic hole.

[0023] In some embodiments, the first vacuum transmission component includes a magnetic fluid sealing assembly and a variable axis transmission assembly, the magnetic fluid sealing assembly is arranged in the sealing shell is arranged between the first integrated box and the drive motor, the magnetic fluid sealing assembly includes a magnetic transmission shaft, a magnetic fluid and a sealing shell, the magnetic fluid is arranged between the magnetic transmission shaft and the sealing shell, one end of the magnetic transmission shaft is connected to the output end of the drive motor through a drive coupling, and the other end of the magnetic transmission shaft is correspondingly connected to the first protrusion through the variable axis transmission assembly.

[0024] In some embodiments, the variable axis transmission assembly includes a transmission screw and a connecting block, the transmission screw is connected to the magnetic transmission shaft through a vacuum coupling 621, and the transmission screw is parallel to the first protruding member. The connecting block is spirally sleeved on the transmission screw and fixedly connected to the first protruding member so that the first protruding member can perform telescopic movement under the drive of the drive motor.

[0025] In some embodiments, the variable axle transmission assembly further includes a guide rail, the guide rail is parallel to the first protruding member, and a directional slide groove corresponding to the guide rail is formed on the connecting block.

[0026] In some embodiments, the laser emitting device includes a laser and a main beam splitter, which is arranged on the optical path of the laser emitted by the laser, and the main beam splitter is used to split the laser emitted by the laser into the first laser and the second laser.

[0027] In some embodiments, the first laser interferometer assembly includes a first fixed reflector, a first beam splitter, and a first laser receiving end. The first beam splitter is disposed on the optical path of the first laser and is used to split the first laser into a first reference laser and a first measurement laser. The propagation direction of the first reference laser and the propagation direction of the first measurement laser are not parallel. The fixed reflector is disposed on the optical path of the first reference light and is used to reflect the first reference light onto the first beam splitter. The first laser receiving end is used to receive the first reference light and the first measurement light after being reflected by the first beam splitter.

[0028] The second laser interferometer assembly includes a second fixed reflector, a second beam splitter and a second laser receiving end. The second beam splitter is arranged on the light path of the second laser. The second beam splitter is used to split the second laser into a second reference laser and the first measurement laser. The propagation direction of the second reference laser is not parallel to the propagation direction of the second measurement laser. The fixed reflector is arranged on the light path of the second reference light. The fixed reflector is used to reflect the second reference light onto the second beam splitter. The second laser receiving end is used to receive the second reference light and the second measurement light after reflection transmitted by the first two beam splitters.

[0029] The utility model has at least the following beneficial effects:

[0030] 1. By setting up a central control device to coordinate the driving components, the first laser processing component and the second laser processing component, the placement stage can be moved to the specified position, avoiding the need for external devices to assist in fine-tuning the position of the wafer to be processed, effectively improving the positioning accuracy to meet the accuracy requirements of high-precision processing, and providing a guarantee for subsequent processing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic top view of the dual-axis positioning motion device according to an embodiment of the present application;

[0032] Figure 2 This is a schematic diagram of the structure inside the first integrated box of the dual-axis positioning motion device of an embodiment of the present application;

[0033] Figure 3 This is a schematic diagram of the structure inside the test chamber of the dual-axis positioning motion device according to an embodiment of the present application;

[0034] Figure 4 Schematic diagram of the overall structure of the driving component, the sliding plate, the first slide rail and the second slide rail in the dual-axis positioning motion device of an embodiment of the present application;

[0035] Description of reference numerals:

[0036] 10: motion platform; 11: placement of the carrier; 12: sliding plate; 13: connecting sliding slot;

[0037] 20: Laser emitting device;

[0038] 30: first laser processing component; 31: first protruding member; 32: slider;

[0039] 40: second laser processing component; 41: second extension member; 42: second drive motor;

[0040] 50: second drive assembly;

[0041] 60: First drive assembly; 611: Connecting block; 612: Transmission screw; 613: Guide rail; 621: Vacuum coupling; 622: Magnetic fluid sealing assembly; 63: First drive motor;

[0042] 70: first integrated box;

[0043] 80: first slide rail;

[0044] 90: Second slide rail. DETAILED DESCRIPTION

[0045] The following specific embodiments illustrate the implementation of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation. On the contrary, the purpose of introducing the application in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide an in-depth understanding of the present application, the following description will contain many specific details. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other unless there is a conflict.

[0046] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0047] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0048] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0049] This application provides a dual-axis positioning motion device, see Figures 1 to 4, including a motion platform 10, a laser emitting device 20, a first laser processing component 30, a second laser processing component 40, a driving component and a central control device, wherein the motion platform 10 is hollow to form a test chamber, and a placement stage 11 is movably provided in the test chamber, and the placement stage 11 is used to place the wafer to be processed; the laser emitting device 20 is arranged on one side of the motion platform 10, and the laser emitting device 20 is provided with a first laser emitting port and a second laser emitting port, and the first laser emitting port and the second laser emitting port respectively emit a first laser for positioning in a first direction and a second laser for positioning in a second direction, and the first direction and the second direction are perpendicular to each other; the first laser processing The component 30 includes a first movable reflector and a first laser interferometer assembly, wherein the first movable reflector is correspondingly arranged on a side of the placement platform 11 facing the first direction, and the first laser interferometer assembly is provided with a first incident port and a first measuring laser outlet. The first incident port is correspondingly connected to the first laser outlet so that the first laser interferometer assembly can process the first laser into a first measuring laser. The first measuring laser outlet is correspondingly oriented and facing the first movable reflector so that the first measuring laser can be emitted onto the first movable reflector, and the first measuring laser is reflected by the first movable reflector onto the first laser interferometer assembly, so as to achieve the measurement of the first movable reflector. The second laser processing component 40 includes a second movable reflecting component and a second laser interferometer assembly, wherein the second movable reflecting component is correspondingly arranged on the side of the placement platform 11 facing the second direction and is correspondingly perpendicular to the first movable reflecting component. The second laser interferometer assembly is provided with a second incident port and a second measuring laser outlet port, the second incident port is correspondingly connected to the second laser emission port, so that the second laser interferometer assembly can process the second laser into a second measuring laser, and the second measuring laser outlet port is correspondingly oriented and facing the second movable reflecting component so that the second measuring laser can be emitted onto the second movable reflecting component, and the second measuring laser is reflected by the second movable reflecting component. The moving reflector is reflected onto the second laser interferometer assembly, so that the displacement of the second moving reflector in the second direction can be measured; the driving component includes a first driving component 60 and a second driving component 50, the first driving component 60 is used to drive the placement platform 11 to move along the first direction, and the second driving component 50 is used to drive the placement platform 11 to move along the second direction; the central control device is correspondingly connected to the driving component, the first laser processing component 30 and the second laser processing component 40, so that the central control device can control the driving component to drive the placement platform 11 to move to a preset position according to the information fed back by the first laser processing component 30 and the second laser processing component 40.

[0050] Specifically, two adjacent side surfaces of the motion platform 10 are provided with laser through holes, which are respectively oriented in the first direction and the second direction, and are respectively connected to the first laser processing component and the second laser processing component 40, so that the first laser and the second laser can be irradiated onto the first movable reflector and the second movable reflector. A test entrance connected to the test cavity is provided on the side of the motion platform 10 opposite to the laser through hole, so that the user can send the wafer to be processed onto the placement carrier 11. The laser emitting device 20 is arranged on one side of the motion platform 10. The first laser emitting port and the second laser emitting port can be arranged in the second direction and the first direction, respectively. The first laser processing component and the second laser processing component 40 both have the function of refracting light, so that the first laser and the second laser can be processed by the first laser processing component and the second laser processing component 40 respectively and then turn 90° to enter the test cavity. The first movable reflector and The second movable reflector is placed on two adjacent side surfaces of the platform 11 respectively, and the first movable reflector and the second movable reflector are perpendicular to each other. The length of the first movable reflector along the second direction is not less than the displacement range of the platform 11 in the second direction, and the length of the second movable reflector along the first direction is not less than the displacement range of the platform 11 in the first direction, so that when the platform 11 moves to any position, the first movable reflector and the second movable reflector can still play the role of reflecting light, effectively ensuring the effectiveness of laser reflection. In addition, the central control device can be arranged at the bottom of the placement platform so that it can play a role without affecting the propagation of light. The central control device receives the coordinate information of the specified position, and then integrates the coordinate information of the placement platform 11 detected in real time by the first laser processing component and the second laser processing component 40 to obtain the amount and direction of displacement of the placement platform 11, and controls the driving component to move the placement platform 11 to the specified position.

[0051] In some embodiments, see Figure 3 and Figure 4 A sliding plate 12, a first slide rail 80 and a second slide rail 90 are also provided in the test chamber. The first slide rail 80 is parallel to the first direction, and the second slide rail 90 is parallel to the second direction. The carrier 11 is slidably arranged on the first slide rail 80, the first slide rail 80 is arranged on the sliding plate 12, and the sliding plate 12 is slidably arranged on the second slide rail 90.

[0052] Specifically, the first slide rail 80 is extended along the first direction, the second slide rail 90 is arranged along the second direction, and a first sliding member is arranged under the placement carrier 11. The first sliding member is provided with a first slide groove corresponding to the first slide rail 80, so that the placement carrier 11 can slide along the first slide rail 80. A second sliding member is provided on the side of the sliding plate 12 corresponding to the side away from the first slide rail 80, and the second sliding member is provided with a second slide groove corresponding to the second slide rail 90, so that the sliding plate 12 can slide along the second slide rail 90, thereby driving the placement carrier 11 to slide along the second slide rail 90, so that the placement carrier 11 can be displaced in the test chamber, and then the wafer to be processed is transferred to the specified position.

[0053] It should be pointed out that the number of the first slide rails 80 or the second slide rails 90 can be two, and the two first slide rails 80 or the second slide rails 90 are arranged in parallel and correspondingly arranged on the two side lines of the placement platform 11 or the sliding plate 12, so as to effectively improve the stability of the movement of the placement platform 11. The number of the first slide rails 80 or the second slide rails 90 can also be three. The specific number can be determined according to actual needs and is not limited here.

[0054] In some embodiments, see Figure 3 and Figure 4 The first drive assembly 60 includes a first drive motor 63 and a first protruding member 31. The output end of the first drive motor 63 is connected to the first protruding member 31. The first protruding member 31 is arranged along the first direction and is correspondingly connected to the placement platform 11 for sliding, so that the placement platform 11 can be driven by the first drive motor 63 to perform telescopic movement along the first direction. The second drive assembly 50 includes a second drive motor 42 and a second protruding member 41. The output end of the second drive motor 42 is connected to the second protruding member 41. The second protruding member 41 is arranged along the second direction and is correspondingly connected to the sliding plate 12, so that the sliding plate 12 can be driven by the second drive motor 42 to perform telescopic movement along the second direction.

[0055] Specifically, the first protruding member 31 and the second protruding member 41 can both be rod-shaped objects, and the first drive motor 63 and the second drive motor 42 are both arranged outside the motion platform 10, extending into the test cavity through the first protruding member 31 and the second protruding member 41 respectively and connected to the placement platform 11, so that the placement platform 11 can move freely in two-dimensional space under the joint drive of the first drive motor 63 and the second drive motor 42.

[0056] In some embodiments, see Figure 3 and Figure 4The first driving component 60 also includes a slider 32, which is correspondingly arranged on the end of the first protruding member 31 away from the first transmission component; a connecting sliding groove 13 is opened on the side of the placement platform 11 corresponding to the first protruding member 31, and the connecting sliding groove 13 is parallel to the second direction. The sliding hook corresponding to the slider 32 is arranged in the connecting sliding groove 13, so that the placement platform 11 can slide relative to the first protruding member 31 along the second direction.

[0057] Specifically, the opening of the connecting sliding groove 13 can be set to face the direction perpendicular to the moving plane of the placement platform 11, and the opening of the connecting sliding groove 13 can also be set to face the first protruding piece 31. The connecting sliding groove 13 extends inwardly toward the perpendicular first direction, that is, the connecting sliding groove 13 can be T-shaped or L-shaped, and a connecting hook is provided on the corresponding slider 32. The corresponding hook of the connecting hook is provided in the connecting sliding groove 13, so that when the slider 32 slides along the connecting sliding groove 13, the first protruding piece 31 can always be kept connected to the placement platform 11. By setting the slider 32 and the placement platform 11 to have a corresponding sliding connection, the placement platform 11 can be able to slide and displace along the second direction.

[0058] In some embodiments, see Figure 2 The dual-axis positioning motion device provided in the present application also includes a first integrated box 70. The interior of the first integrated box 70 is hollow to form an integrated cavity. The first laser interferometer assembly is arranged in the integrated cavity. The first integrated box 70 is connected to the laser emitting device 20 through the first laser channel. The first integrated box 70 is connected to the side of the motion platform 10 corresponding to the first movable reflector. The drive motor is arranged on the outside of the first integrated box 70 and extends into the integrated cavity through the first vacuum transmission component and is connected to the first protruding member 31. The first protruding member 31 extends into the integrated cavity through the telescopic hole.

[0059] Specifically, by setting up the first integrated box 70, the first drive assembly 60 and the first laser interferometer assembly are integrated into a sealed shell, which effectively optimizes the overall spatial structure of the dual-axis positioning motion device, further strengthens the sealing of the test chamber, and provides a guarantee for the vacuum environment required for high-precision operations.

[0060] In some embodiments, see Figure 1 and Figure 2 The first vacuum transmission component includes a magnetic fluid sealing assembly 622 and a variable axis transmission assembly. The magnetic fluid sealing assembly 622 is arranged in a sealing shell between the first integrated box 70 and the drive motor. The magnetic fluid sealing assembly 622 includes a magnetic transmission shaft, a magnetic fluid and a sealing shell. The magnetic fluid is arranged between the magnetic transmission shaft and the sealing shell. One end of the magnetic transmission shaft is connected to the output end of the drive motor through a drive coupling, and the other end of the magnetic transmission shaft is correspondingly connected to the first protrusion 31 through the variable axis transmission assembly.

[0061] Specifically, by setting up a magnetic fluid sealing assembly 622, the sealing performance of the connection between the first integrated box 70 and the drive motor is effectively improved, thereby providing a guarantee for the vacuum environment requirement of the test chamber. In addition, by setting up a variable axis transmission assembly to connect the magnetic transmission shaft and the first protrusion 31, convenience is provided for subsequent maintenance.

[0062] In some embodiments, see Figure 1 and Figure 2 The variable axis transmission assembly includes a transmission screw 612 and a connecting block 611. The transmission screw 612 is connected to the magnetic transmission shaft through a vacuum coupling 621, and the transmission screw 612 is parallel to the first protruding member 31. The connecting block 611 is spirally sleeved on the transmission screw 612 and fixedly connected to the first protruding member 31, so that the first protruding member 31 can perform telescopic movement under the drive of the driving motor.

[0063] Specifically, a transmission thread is provided on the transmission screw 612, and a threaded hole is opened on the connecting block 611, so that the transmission screw 612 can transmit its own rotational power to the connecting block 611 and convert it into the power of the linear motion of the connecting block 611. By setting the transmission screw 612 and the connecting block 611 for threaded transmission, the accuracy of movement can be effectively improved, thereby effectively improving the reliability and stability of the dual-axis positioning motion device. At the same time, rolling contact is adopted between the two, and the friction is small, which can achieve more efficient energy conversion and effectively reduce energy consumption.

[0064] In some embodiments, see Figure 2 and Figure 4 The variable axis transmission assembly further includes a guide rail 613 , which is parallel to the first extension member 31 , and a directional groove corresponding to the guide rail 613 is provided on the connecting block 611 .

[0065] Specifically, by setting up the guide rail 613, the rigidity of the entire transmission system is effectively increased. In addition, by arranging the guide rail 613 parallel to the screw rod, the guide rail 613 can disperse and bear part of the radial load, thereby reducing the load on the screw rod itself. In addition, it also effectively prevents vibration during the transmission process, ensuring the smooth movement of the first protrusion 31. Its setting also limits the movement of the first protrusion 31 in other directions, and only allows it to move in the first direction, thereby ensuring precise linear motion and further improving the positioning accuracy.

[0066] In some embodiments, the laser emitting device 20 includes a laser and a main beam splitter. The beam splitter is arranged on the optical path of the laser emitted by the laser. The main beam splitter is used to split the laser emitted by the laser into a first laser and a second laser.

[0067] Specifically, the main beam splitter has a semi-transmissive and semi-reflective function, that is, the main beam splitter refracts a part of the laser light emitted by the laser into the first laser light, and directly transmits the other part as the second laser light. By setting the main beam splitter, the laser light emitted by the laser is split into the first laser light and the second laser light, so that the first laser light and the second laser light have the same vibration direction, frequency and phase, thereby effectively improving the working accuracy and reliability of the first laser interferometer component and the second laser interferometer component, and at the same time can effectively reduce the light loss, so as to achieve the effect of saving equipment cost while ensuring performance.

[0068] In some embodiments, the first laser interferometer assembly includes a first fixed reflector, a first beam splitter and a first laser receiving end. The first beam splitter is arranged on the light path of the first laser, and the first beam splitter is used to split the first laser into a first reference laser and a first measurement laser. The propagation direction of the first reference laser is not parallel to the propagation direction of the first measurement laser. The fixed reflector is arranged on the light path of the first reference light, and the fixed reflector is used to reflect the first reference light onto the first beam splitter. The first laser receiving end is used to receive the first reference light and the first measurement light after reflection transmitted by the first beam splitter. The second laser interferometer assembly includes a second fixed reflector, a second beam splitter and a second laser receiving end. The second beam splitter is arranged on the light path of the second laser, and the second beam splitter is used to split the second laser into a second reference laser and a first measurement laser. The propagation direction of the second reference laser is not parallel to the propagation direction of the second measurement laser. The fixed reflector is arranged on the light path of the second reference light, and the fixed reflector is used to reflect the second reference light onto the second beam splitter. The second laser receiving end is used to receive the second reference light and the second measurement light after reflection transmitted by the first two beam splitters.

[0069] Specifically, the first fixed reflector, the first beam splitter, the first laser receiving end and the first movable reflector are at the same plane height, and the second fixed reflector, the second beam splitter, the second laser receiving end and the second movable reflector are at the same plane height to further ensure the measurement accuracy. The first beam splitter and the second beam splitter both have a semi-transmissive and semi-reflective function, thereby being able to respectively generate two light beams with inconsistent propagation directions, thereby realizing the function of laser interferometer measurement. At the same time, the use of laser interferometer measurement greatly improves the measurement accuracy of the device, and the use of laser interferometer measurement greatly improves the measurement accuracy of the system.

[0070] Obviously, those skilled in the art may make various modifications and variations to this application without departing from the spirit and scope of this application. Thus, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application is intended to include such modifications and variations.

Claims

1. A dual-axis positioning motion device, characterized in that: include: A motion platform, wherein the motion platform is hollow to form a test cavity, and a placement carrier is movably provided in the test cavity, and the placement carrier is used to place the wafer to be processed; a laser emitting device disposed on one side of the motion platform, wherein the laser emitting device is provided with a first laser emitting port and a second laser emitting port, wherein the first laser emitting port and the second laser emitting port respectively emit a first laser for positioning in a first direction and a second laser for positioning in a second direction, wherein the first direction and the second direction are perpendicular to each other; a first laser processing component, comprising a first movable reflector and a first laser interferometer assembly, wherein the first movable reflector is correspondingly arranged on a side of the placement platform facing the first direction; the first laser interferometer assembly is provided with a first incident port and a first measuring laser exit port, the first incident port is correspondingly connected to the first laser exit port so that the first laser interferometer assembly can process the first laser into a first measuring laser; the first measuring laser exit port is correspondingly oriented and directly faces the first movable reflector so that the first measuring laser can be emitted onto the first movable reflector, and the first measuring laser is reflected by the first movable reflector onto the first laser interferometer assembly, so that the displacement of the first movable reflector in the first direction can be measured; a second laser processing component, comprising a second movable reflector and a second laser interferometer assembly, wherein the second movable reflector is correspondingly arranged on a side of the placement platform facing the second direction and is correspondingly perpendicular to the first movable reflector; a second incident port and a second measuring laser outlet are provided on the second laser interferometer assembly, the second incident port is correspondingly connected to the second laser outlet, so that the second laser interferometer assembly can process the second laser into a second measuring laser; the second measuring laser outlet is correspondingly oriented and directly faces the second movable reflector, so that the second measuring laser can be emitted onto the second movable reflector, and the second measuring laser is reflected by the second movable reflector onto the second laser interferometer assembly, so that the displacement of the second movable reflector in the second direction can be measured; A driving component includes a first driving assembly and a second driving assembly, wherein the first driving assembly is used to drive the placement platform to move along the first direction, and the second driving assembly is used to drive the placement platform to move along the second direction; A central control device is correspondingly connected to the driving component, the first laser processing component and the second laser processing component block, so that the central control device can control the driving component to drive the placement platform to a preset position based on the information fed back by the first laser processing component and the second laser processing component.

2. The dual-axis positioning motion device according to claim 1, characterized in that: The test chamber is also provided with a sliding plate, a first slide rail and a second slide rail, the first slide rail is parallel to the first direction, the second slide rail is parallel to the second direction, the placement platform is correspondingly slidably set on the first slide rail, the first slide rail is set on the sliding plate, and the sliding plate is correspondingly slidably set on the second slide rail.

3. The dual-axis positioning motion device according to claim 2, characterized in that: The first drive assembly includes a first drive motor and a first extension member, wherein the output end of the first drive motor is connected to the first extension member, and the first extension member is arranged along the first direction and is slidably connected to the placement platform, so that the placement platform can be driven by the first drive motor to perform telescopic movement along the first direction; The second drive assembly includes a second drive motor and a second extension member, the output end of the second drive motor is connected to the second extension member, the second extension member is arranged along the second direction and is correspondingly connected to the sliding plate, so that the sliding plate can be driven by the second drive motor to perform telescopic movement along the second direction.

4. The dual-axis positioning motion device according to claim 3, characterized in that: The first driving assembly further includes a slider, the slider being correspondingly arranged on an end of the first extension member away from the first driving motor; A connecting sliding groove is provided on the side of the placement platform corresponding to the first protruding member, and the connecting sliding groove is parallel to the second direction. The sliding hook corresponding to the slider is provided in the connecting sliding groove so that the placement platform can slide relative to the first protruding member along the second direction.

5. The dual-axis positioning motion device according to claim 4, characterized in that: Also includes: a first integrated box, wherein the interior of the first integrated box is hollow to form an integrated cavity, the first laser interferometer assembly is disposed in the integrated cavity, the first integrated box is in communication with the laser emitting device via a first laser channel, and the first integrated box is in communication with a side of the motion platform that is close to the first movable reflector; The driving motor is arranged on the outside of the first integrated box and extends into the integrated cavity through the first vacuum transmission component to be correspondingly connected to the first protruding piece. The first protruding piece extends into the integrated cavity through the telescopic hole.

6. The dual-axis positioning motion device according to claim 5, characterized in that: The first vacuum transmission component includes a magnetic fluid sealing assembly and a variable axis transmission assembly. The magnetic fluid sealing assembly is arranged between the first integrated box and the drive motor. The magnetic fluid sealing assembly includes a magnetic transmission shaft, a magnetic fluid and a sealing shell. The magnetic fluid is arranged between the magnetic transmission shaft and the sealing shell. One end of the magnetic transmission shaft is connected to the output end of the drive motor through a drive coupling, and the other end of the magnetic transmission shaft is correspondingly connected to the first protrusion through the variable axis transmission assembly.

7. The dual-axis positioning motion device according to claim 6, characterized in that: Also includes: The variable shaft transmission assembly includes a transmission screw and a connecting block. The transmission screw is connected to the magnetic transmission shaft through a vacuum coupling, and the transmission screw is parallel to the first protruding member. The connecting block is spirally sleeved on the transmission screw and fixedly connected to the first protruding member so that the first protruding member can perform telescopic movement under the drive of the drive motor.

8. The dual-axis positioning motion device according to claim 7, characterized in that: The variable-axle transmission assembly further includes a guide rail, which is parallel to the first protruding member, and a directional sliding groove corresponding to the guide rail is formed on the connecting block.

9. The dual-axis positioning motion device according to any one of claims 1 to 8, characterized in that: The laser emitting device includes a laser and a main beam splitter. The beam splitter is arranged on the optical path of the laser emitted by the laser, and the main beam splitter is used to split the laser emitted by the laser into the first laser and the second laser.

10. The dual-axis positioning motion device according to claim 9, characterized in that: The first laser interferometer assembly includes a first fixed reflector, a first beam splitter, and a first laser receiving end. The first beam splitter is arranged on the optical path of the first laser and is used to split the first laser into a first reference laser and a first measurement laser. The propagation direction of the first reference laser and the propagation direction of the first measurement laser are not parallel. The first fixed reflector is arranged on the optical path of the first reference laser and is used to reflect the first reference laser onto the first beam splitter. The first laser receiving end is used to receive the first reference laser and the first measurement laser after being reflected by the first beam splitter. The second laser interferometer assembly includes a second fixed reflector, a second beam splitter and a second laser receiving end. The second beam splitter is arranged on the light path of the second laser. The second beam splitter is used to split the second laser into a second reference laser and a second measurement laser. The propagation direction of the second reference laser is not parallel to the propagation direction of the second measurement laser. The second fixed reflector is arranged on the light path of the second reference laser. The second fixed reflector is used to reflect the second reference laser onto the second beam splitter. The second laser receiving end is used to receive the reflected second reference laser and the second measurement laser transmitted by the second beam splitter.

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