Temperature control mechanism for IC test

Abstract

The utility model relates to the technical field of IC testing, in particular to a temperature control mechanism for IC testing, which comprises an IC testing machine, the IC testing machine is used for testing an IC, the top of the IC testing machine is provided with a homogenizing mechanism, and the homogenizing mechanism comprises a top hollow block, a main shaft, a driving motor, a belt and a stirring piece. By arranging the temperature control mechanism, when the temperature in the IC testing machine is too high, carbon dioxide gas in the thermal expansion cavity is heated to expand, and the carbon dioxide gas pushes the light transmission rod to move upwards, so that the light transmission rod moves to the position of the gas inlet pipe through the groove; according to the utility model, high-pressure air in the air inlet pipe enters the top hollow block through the groove and then enters the IC test machine through the through hole, so that high-temperature air in the IC test machine is replaced and rapidly cooled, the temperature in the IC test machine is reduced, the test environment is maintained in a safe range, and an IC is prevented from being damaged due to too high temperature.

Description

Technical Field

[0001] The utility model relates to the technical field of IC testing, in particular to a temperature control mechanism for IC testing. Background Art

[0002] IC testing is the process of evaluating the performance of integrated circuits (ICs). Its primary purpose is to ensure that the ICs function properly within design parameters and avoid potential malfunctions or failures. Testing typically includes functional testing, parametric testing, and temperature testing, covering aspects of the IC's electrical characteristics, logic functionality, and thermal stability. During testing, the IC is run on specific test equipment, monitoring its behavior under varying voltage, current, and temperature conditions to ensure compliance with specifications. IC testing can uncover design flaws or quality issues that may arise during the production process, thereby improving product reliability and performance and ensuring its suitability for a variety of applications.

[0003] Accurate temperature control is crucial during IC testing. If improper temperature control due to operator error leads to excessive temperatures, the IC can be damaged. During testing, ICs are exposed to a specific operating temperature range, set according to the IC's design and specifications. If the temperature exceeds the IC's safe operating range, the semiconductor materials within the IC may be affected. High temperatures can cause thermal failure of the materials, manifesting as transistor breakdown, wire melting, or expansion of the packaging material. These factors can cause physical damage to the IC, impacting its performance or even causing complete failure.

[0004] In view of this, we propose a temperature control mechanism for IC testing. Utility Model Content

[0005] The purpose of the present invention is to provide a temperature control mechanism for IC testing, which solves the problem that during the IC testing process, if the temperature control error causes the temperature to be too high, it will cause thermal failure of the semiconductor material, resulting in damage to the IC or performance degradation.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A temperature control mechanism for IC testing includes an IC testing machine, which is used to test ICs. A homogenizing mechanism is provided on the top of the IC testing machine, and the homogenizing mechanism includes a top hollow block, a main shaft, a driving motor, a belt, and a stirring member. The temperature control mechanism is provided on the top of the IC testing machine, and the temperature control mechanism includes: an air intake pipe, the air intake pipe is fixedly connected to the top hollow block, a vertical hollow pipe is fixedly connected to the inner wall of the air intake pipe, one end of a spring 1 is fixedly connected to the inner wall of the vertical hollow pipe, the other end of the spring 1 is fixedly connected to a lightweight transmission rod, a through groove is provided on the inner wall of the lightweight transmission rod, a thermal expansion cavity is fixedly connected to the bottom of the vertical hollow pipe, the top of the lightweight transmission rod is fixedly connected to a connecting transmission rod, the bottom of the connecting transmission rod is fixedly connected to a fixing ring-shaped member, the bottom of the fixing ring-shaped member is fixedly connected to one end of a spring 2, the other end of the spring 2 is fixedly connected to a reciprocating sliding member, and an entry through hole is provided on the main shaft.

[0008] Preferably, the top hollow block is fixedly connected to the top of the IC testing machine, a main shaft is rotatably connected to the inner wall of the top hollow block, a driving motor is fixedly connected to the top of the IC testing machine, the output shaft of the driving motor is connected to the main shaft through a belt drive, and a stirring member is fixedly connected to the bottom of the main shaft.

[0009] Preferably, the stirring member includes a central connecting disk, the central connecting disk is fixedly connected to the bottom of the main shaft, the outer wall of the central connecting disk is fixedly connected to an impeller, and the outer side of the impeller is fixedly connected to a gear ring.

[0010] Preferably, three groups of stirring members are provided, and the three groups of stirring members are arranged in an array.

[0011] Preferably, the outer wall of the lightweight transmission rod is piston-connected to the inner wall of the vertical hollow tube, and the reciprocating sliding member is slidingly connected to the outer wall of the connecting transmission rod.

[0012] Preferably, an exhaust port is provided on the top of the IC tester, and the exhaust port on the top of the IC tester is located at the bottom of the reciprocating slide.

[0013] Preferably, the inner wall of the main shaft is hollow, and the hollow inner wall of the main shaft is communicated with the inner wall of the IC testing machine.

[0014] By means of the above technical solution, the present invention provides a temperature control mechanism for IC testing, which has at least the following beneficial effects:

[0015] (1) The present invention is provided with a temperature control mechanism. When the temperature inside the IC test machine is too high, the carbon dioxide gas in the thermal expansion chamber expands due to the heat, and the carbon dioxide gas pushes the lightweight transmission rod to move upward, so that the lightweight transmission rod moves to the position of the air intake pipe through the groove, so that the high-pressure air in the air intake pipe enters the top hollow block through the groove, and then enters the IC test machine through the through hole, replacing the high-temperature air in the IC test machine and cooling it quickly, thereby reducing the temperature inside the IC test machine, ensuring that the test environment is maintained within a safe range, and preventing the IC from being damaged due to excessive temperature.

[0016] (2) The utility model is provided with a homogenizing mechanism, and the stirring member drives the air to circulate up and down, so that the air temperature distribution in the test area is more uniform, avoiding local overheating or overcooling. The impeller drives the air flow to accelerate the transfer and dissipation of heat, preventing the IC from thermal failure due to excessive temperature. The air circulation can quickly balance the temperature changes in the environment, provide a stable test temperature environment for the IC, ensure the accuracy and consistency of the test results, reduce the impact of overheating on the performance and life of the IC through effective temperature control, and reduce product damage caused by abnormal test temperature.

[0017] (3) The present invention sets a temperature control mechanism. The lightweight transmission rod drives the connecting transmission rod to move upward, and the connecting transmission rod drives the fixed ring part, spring 2, and reciprocating sliding part to move upward, so that the exhaust port on the top of the IC tester is released, promoting the discharge of hot air, accelerating the release of heat in the machine, and further helping to reduce the temperature in the test environment to avoid damage to the IC due to excessive temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application:

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 It is a structural diagram of the homogenizing mechanism in the present utility model;

[0021] Figure 3 This is a schematic diagram of the cross-sectional structure of the top hollow block in the utility model;

[0022] Figure 4 This is a schematic structural diagram of the stirring member in the present utility model;

[0023] Figure 5 This is a schematic diagram of the cross-sectional structure of the air intake pipe in the present invention;

[0024] Figure 6 It is a structural schematic diagram of the reciprocating sliding member in the utility model.

[0025] In the figure: 1. IC tester; 2. Homogenizing mechanism; 21. Top hollow block; 22. Main shaft; 23. Drive motor; 24. Belt; 25. Agitator; 251. Middle connecting plate; 252. Impeller; 253. Ring gear; 3. Temperature control mechanism; 31. Inlet pipe; 32. Vertical hollow tube; 33. Spring 1; 34. Lightweight transmission rod; 35. Through slot; 36. Thermal expansion cavity; 37. Connecting transmission rod; 38. Fixed annular member; 39. Spring 2; 310. Reciprocating sliding member; 311. Entering through hole. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] See also Figures 1-6 As shown, the present invention provides a technical solution: a temperature control mechanism for IC testing, including an IC tester 1, the IC tester 1 is used to test ICs and can adjust the temperature of the test environment according to the settings during the test. The top of the IC tester 1 is provided with a homogenizing mechanism 2, the homogenizing mechanism 2 includes a top hollow block 21, a main shaft 22, a drive motor 23, a belt 24, and a stirring member 25. The top of the IC tester 1 is provided with a temperature control mechanism 3, the temperature control mechanism 3 includes: an air inlet pipe 31, the air inlet pipe 31 is fixedly connected to the top hollow block 21, and a vertical hollow is fixedly connected to the inner wall of the air inlet pipe 31. Tube 32, one end of a spring 1 33 is fixedly connected to the inner wall of the vertical hollow tube 32, the other end of the spring 1 33 is fixedly connected to a lightweight transmission rod 34, a through groove 35 is provided on the inner wall of the lightweight transmission rod 34, the bottom of the vertical hollow tube 32 is fixedly connected to a thermal expansion cavity 36, the top of the lightweight transmission rod 34 is fixedly connected to a connecting transmission rod 37, the bottom of the connecting transmission rod 37 is fixedly connected to a fixed annular part 38, the bottom of the fixed annular part 38 is fixedly connected to one end of a spring 2 39, the other end of the spring 2 39 is fixedly connected to a reciprocating sliding part 310, and an entry through hole 311 is provided on the main shaft 22.

[0028] The top hollow block 21 is fixedly connected to the top of the IC tester 1. The main shaft 22 is rotatably connected to the inner wall of the top hollow block 21. The top of the IC tester 1 is fixedly connected to a drive motor 23. The output shaft of the drive motor 23 is connected to the main shaft 22 through a belt 24. The bottom of the main shaft 22 is fixedly connected to a stirring member 25.

[0029] The stirring member 25 includes a central connecting disk 251, which is fixedly connected to the bottom of the main shaft 22. The outer wall of the central connecting disk 251 is fixedly connected to an impeller 252, and the outer side of the impeller 252 is fixedly connected to a gear ring 253. The stirring member 25 is provided with three groups, and the three groups of stirring members 25 are arranged in an array. When the central stirring member 25 rotates, the central stirring member 25 drives the stirring members 25 on both sides to reverse through the gear ring 253. At this time, the central stirring member 25 rotates forward to drive the air upward, and the stirring members 25 on both sides drive the air to move downward, realizing the circulation of air, so that the air in the IC tester 1 circulates and the temperature can be effectively and evenly distributed. Ensure that the temperature of the test environment remains stable. This air circulation helps to avoid local areas where the temperature is too high or too low, thereby reducing test errors or IC damage caused by uneven temperature. Specifically, when the agitator 25 rotates, the air is driven by the ring gear 253 to circulate, so that the heat in the test area is evenly distributed and helps dissipate heat, thereby effectively controlling the temperature around the IC during the test, ensuring that the test is carried out within the set temperature range, and avoiding adverse effects on IC performance due to abnormal temperature. The outer wall of the lightweight transmission rod 34 is connected to the inner wall piston of the vertical hollow tube 32, and the reciprocating slide 310 is slidably connected to the outer wall of the connecting transmission rod 37.

[0030] An exhaust port is provided at the top of the IC tester 1. The top exhaust port of the IC tester 1 is located at the bottom of the reciprocating slide 310. When in normal use, the reciprocating slide 310 contacts the top exhaust port of the IC tester 1. The inner wall of the main shaft 22 is hollow, and the hollow inner wall of the main shaft 22 is connected to the inner wall of the IC tester 1. The air enters the through hole 311 to let the outside air into the hollow inner wall of the main shaft 22, and then enters the inner wall of the IC tester 1.

[0031] When the temperature control mechanism for IC testing of the present invention is used, when the IC tester 1 is used to perform a temperature test on the IC, the air inlet pipe 31 is connected to the air compressor for inputting high-pressure air, and then the drive motor 23 is turned on to drive the main shaft 22 to rotate through the belt 24, and the main shaft 22 drives the stirring member 25 to rotate. The impeller 252 on the stirring member 25 drives the air to move upward, and the central stirring member 25 drives the stirring members 25 on both sides to reverse through the ring gear 253, so that the air on both sides moves downward. The stirring member 25 drives the air to circulate up and down, so that the air temperature distribution in the test area is more uniform, avoiding local overheating or overcooling. The impeller 252 drives the air flow to accelerate the transfer and dissipation of heat, preventing the IC from thermal failure due to excessive temperature. The air circulation can quickly balance the temperature changes in the environment, provide a stable test temperature environment for the IC, ensure the accuracy and consistency of the test results, reduce the impact of overheating on the performance and life of the IC through effective temperature control, and reduce product damage caused by abnormal test temperature.

[0032] When the temperature inside the IC tester 1 is too high, the carbon dioxide gas in the thermal expansion chamber 36 expands due to the heat. The carbon dioxide gas pushes the lightweight transmission rod 34 upward, causing the lightweight transmission rod 34 to move through the slot 35 to the position of the air inlet pipe 31. The high-pressure air in the air inlet pipe 31 enters the top hollow block 21 through the slot 35 and then enters the IC tester 1 through the inlet hole 311. This displaces the high-temperature air in the IC tester 1 and quickly cools it, thereby reducing the temperature inside the IC tester 1, ensuring that the test environment is maintained within a safe range, and preventing the IC from being damaged due to excessive temperature.

[0033] At this time, the lightweight transmission rod 34 drives the connecting transmission rod 37 to move upward, and the connecting transmission rod 37 drives the fixed ring part 38, the second spring 39, and the reciprocating sliding part 310 to move upward, so that the exhaust port on the top of the IC tester 1 is released, promoting the discharge of hot air, accelerating the release of heat in the machine, and further helping to reduce the temperature in the test environment to prevent damage to the IC caused by excessive temperature.

[0034] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0035] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A temperature control mechanism for IC testing, comprising an IC testing machine (1), characterized in that: The IC tester (1) is used to test ICs. A homogenizing mechanism (2) is provided on the top of the IC tester (1). The homogenizing mechanism (2) comprises a top hollow block (21), a main shaft (22), a driving motor (23), a belt (24), and a stirring member (25). A temperature control mechanism (3) is provided on the top of the IC tester (1). The temperature control mechanism (3) comprises: An air intake pipe (31) is fixedly connected to the top hollow block (21). A vertical hollow pipe (32) is fixedly connected to the inner wall of the air intake pipe (31). One end of a spring (33) is fixedly connected to the inner wall of the vertical hollow pipe (32). The other end of the spring (33) is fixedly connected to a light transmission rod (34). A through groove (35) is provided on the inner wall of the light transmission rod (34). The bottom of the light transmission rod (34) is fixedly connected to a heat expansion cavity (36), the top of the light transmission rod (34) is fixedly connected to a connecting transmission rod (37), the bottom of the connecting transmission rod (37) is fixedly connected to a fixed annular member (38), the bottom of the fixed annular member (38) is fixedly connected to one end of a spring 2 (39), the other end of the spring 2 (39) is fixedly connected to a reciprocating sliding member (310), and an entry through hole (311) is opened on the main shaft (22).

2. The temperature control mechanism for IC testing according to claim 1, characterized in that: The top hollow block (21) is fixedly connected to the top of the IC tester (1); a main shaft (22) is rotatably connected to the inner wall of the top hollow block (21); a driving motor (23) is fixedly connected to the top of the IC tester (1); an output shaft of the driving motor (23) is connected to the main shaft (22) via a belt (24); and a stirring member (25) is fixedly connected to the bottom of the main shaft (22).

3. The temperature control mechanism for IC testing according to claim 2, characterized in that: The stirring member (25) comprises a central connecting disk (251), wherein the central connecting disk (251) is fixedly connected to the bottom of the main shaft (22), an impeller (252) is fixedly connected to the outer wall of the central connecting disk (251), and a gear ring (253) is fixedly connected to the outer side of the impeller (252).

4. The temperature control mechanism for IC testing according to claim 2, wherein: The stirring members (25) are provided in three groups, and the three groups of stirring members (25) are arranged in an array.

5. The temperature control mechanism for IC testing according to claim 1, characterized in that: The outer wall of the light transmission rod (34) is piston-connected to the inner wall of the vertical hollow tube (32), and the reciprocating sliding member (310) is slidably connected to the outer wall of the connecting transmission rod (37).

6. The temperature control mechanism for IC testing according to claim 5, characterized in that: An exhaust port is provided on the top of the IC tester (1), and the exhaust port on the top of the IC tester (1) is located at the bottom of the reciprocating slide (310).

7. The temperature control mechanism for IC testing according to claim 1, characterized in that: The inner wall of the main shaft (22) is hollow, and the hollow inner wall of the main shaft (22) is connected to the inner wall of the IC testing machine (1).

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