Durable computer mainboard cooling fin

Abstract

The utility model discloses a durable computer mainboard radiating fin in the technical field of computer mainboards, which comprises a radiating base, a plurality of groups of U-shaped copper heat conduction pipes are fixedly mounted on two sides of the radiating base in a penetrating manner, cooling liquid is filled in the copper heat conduction pipes in a sealing manner, nickel layers are plated on the surfaces of the copper heat conduction pipes, and the nickel layers are coated on the surfaces of the U-shaped copper heat conduction pipes. The surface of the copper heat conduction pipe is evenly and fixedly provided with the aluminum heat conduction pieces in a penetrating mode, the multiple sets of aluminum heat conduction pieces are vertically installed in a column mode, the middle of the surface of the connecting plate is fixedly provided with a heat dissipation through hole, and the inner side of the heat dissipation through hole is fixedly provided with a heat dissipation fan. And a plurality of groups of heat dissipation sheets are arranged on the surface of the aluminum heat conduction sheet and are matched with each other to form a heat dissipation air channel, so that the density is increased, the contact surface with air is increased, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of computer mainboards, and in particular relates to a durable computer mainboard heat sink. Background Art

[0002] A heat sink is a device that dissipates heat from heat-prone electronic components in electrical appliances. It is usually made of aluminum alloy, brass, or bronze in the form of plates, sheets, or multiple sheets. For example, a computer's CPU central processing unit requires a fairly large heat sink, as do power tubes, line tubes, and amplifier tubes in televisions. The main materials for computer motherboard heat sinks include silver, copper, aluminum, and steel.

[0003] Existing computer motherboards usually only have one cooling fan installed to dissipate heat for the motherboard, which results in the heat generated during computer operation not being completely dissipated but still circulating around the motherboard, resulting in poor heat dissipation of the motherboard. To this end, we propose a durable computer motherboard heat sink. Utility Model Content

[0004] The purpose of the utility model is to provide a durable computer motherboard heat sink to solve the problem in the above background technology that the existing computer motherboard usually only has one cooling fan installed to dissipate heat for the computer motherboard, which has a poor effect.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a durable computer motherboard heat sink, comprising a heat sink base, copper heat pipes are provided on both sides of the heat sink base, coolant is provided inside the copper heat pipes, an aluminum heat sink is provided on the surface of the copper heat pipes, a connecting plate is provided on one side of the aluminum heat sink, a heat dissipation through-hole is provided on the surface of the connecting plate, a heat dissipation fan is provided on the inner side of the heat dissipation through-hole, a fixing hole is provided on the surface of the connecting plate, heat dissipation fins are provided on the surface of the aluminum heat sink, heat dissipation air ducts are provided between the heat dissipation fins, and thermal grease is provided on the bottom of the heat sink base.

[0006] Preferably, a plurality of groups of U-shaped copper heat pipes are fixedly installed on both sides of the heat dissipation base, the interior of the copper heat pipes is sealed and filled with coolant, and the surface of the copper heat pipes is plated with a nickel layer.

[0007] Preferably, aluminum heat conducting sheets are evenly and fixedly installed on the surface of the copper heat conducting pipe, and the aluminum heat conducting sheets are installed in multiple groups vertically.

[0008] Preferably, a heat dissipation through hole is fixedly opened in the middle of the surface of the connecting plate, and a heat dissipation fan is fixedly installed on the inner side of the heat dissipation through hole.

[0009] Preferably, fixing holes are provided through the four corners of the surface of the connecting plate, and a plurality of groups of heat dissipation fins are evenly installed on the surface of the aluminum heat conducting plate.

[0010] Preferably, a heat dissipation duct is formed between the heat dissipation sheets, and the bottom surface of the heat dissipation base is evenly coated with thermal grease.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] The bottom of the heat sink is welded to the surface of the CPU. The heat generated by the CPU evaporates the coolant inside the copper heat pipe into gas. The gas releases heat at the condensation end above the copper heat pipe and then turns back into liquid. The heat transfer effect is achieved through repeated evaporation and condensation inside the copper heat pipe. The nickel layer increases the service life of the copper heat pipe and plays an anti-corrosion role. The surface of the aluminum heat conductor is increased by setting multiple groups of heat dissipation fins and forming a heat dissipation air duct, thereby increasing the contact area with the air and improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the front structure of the utility model;

[0014] Figure 2 It is a side structural diagram of the utility model;

[0015] Figure 3 This is a schematic diagram of the structure of the aluminum heat conducting plate of the present utility model.

[0016] In the figure: 1. Heat sink base; 2. Copper heat pipe; 3. Aluminum heat conducting plate; 4. Connecting plate; 5. Heat dissipation hole; 6. Cooling fan; 7. Fixing hole; 8. Heat dissipation fin; 9. Heat dissipation air duct; 10. Thermal grease. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] See also Figure 1-3The utility model provides a technical solution: a durable computer motherboard heat sink, comprising a heat sink base 1, copper heat pipes 2 are provided on both sides of the heat sink base 1, coolant is provided inside the copper heat pipes 2, an aluminum heat sink 3 is provided on the surface of the copper heat pipes 2, a connecting plate 4 is provided on one side of the aluminum heat sink 3, a heat dissipation through-hole 5 is provided on the surface of the connecting plate 4, a heat dissipation fan 6 is provided on the inner side of the heat dissipation through-hole 5, a fixing hole 7 is provided on the surface of the connecting plate 4, a heat dissipation fin 8 is provided on the surface of the aluminum heat sink 3, a heat dissipation air duct 9 is provided between the heat dissipation fins 8, and a thermal grease 10 is provided on the bottom of the heat sink base 1.

[0019] Specifically, multiple groups of U-shaped copper heat pipes 2 are fixedly installed on both sides of the heat dissipation base 1, the interior of the copper heat pipes 2 is sealed and filled with coolant, the surface of the copper heat pipes 2 is plated with a nickel layer, and aluminum heat conducting sheets 3 are evenly fixedly installed on the surface of the copper heat conducting tubes 2. Multiple groups of aluminum heat conducting sheets 3 are installed vertically, a heat dissipation through-hole 5 is fixedly opened in the middle of the surface of the connecting plate 4, a heat dissipation fan 6 is fixedly installed on the inner side of the heat dissipation through-hole 5, fixing holes 7 are opened at the four corners of the surface of the connecting plate 4, multiple groups of heat dissipation fins 8 are evenly installed on the surface of the aluminum heat conducting sheet 3, and heat dissipation air ducts 9 are formed between the heat dissipation fins 8. The bottom surface of the heat dissipation base 1 is evenly coated with thermal grease 10.

[0020] In this embodiment, during specific use, the bottom of the heat sink 1 is contacted and welded to the surface of the CPU. The thermal grease 10 provided is used to increase the heat transfer efficiency between the CPU and the heat sink 1. The heat sink 1 absorbs the heat generated by the CPU and then transfers it to the copper heat pipe 2. The part of the copper heat pipe 2 that contacts the heat source absorbs heat, causing the internal liquid to evaporate into gas. The gas releases heat at the condensation end above the copper heat pipe 2 and then turns back into liquid. Through this repeated evaporation and condensation inside the copper heat pipe 2, the heat transfer effect is achieved. The nickel layer provided increases the service life of the copper heat pipe 2 and can play an anti-corrosion role. The surface of the aluminum heat conductive sheet 3 is provided with multiple groups of heat dissipating fins 8, which cooperate to form a heat dissipation duct 9, thereby increasing the density, thereby increasing the contact area with the air and improving the heat dissipation efficiency. After absorbing the heat from the copper heat pipe 2, the aluminum heat conductive sheet 3 is discharged by the rotating heat dissipation fan 6, thereby improving the heat dissipation efficiency of the device and facilitating long-term use.

[0021] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A durable computer motherboard heat sink, comprising a heat dissipation base (1), characterized in that: Copper heat pipes (2) are provided on both sides of the heat dissipation base (1), coolant is provided inside the copper heat pipes (2), aluminum heat conducting sheets (3) are provided on the surface of the copper heat conducting sheets (2), a connecting plate (4) is provided on one side of the aluminum heat conducting sheets (3), a heat dissipation through hole (5) is provided on the surface of the connecting plate (4), a heat dissipation fan (6) is provided on the inner side of the heat dissipation through hole (5), a fixing hole (7) is provided on the surface of the connecting plate (4), heat dissipation sheets (8) are provided on the surface of the aluminum heat conducting sheets (3), heat dissipation air ducts (9) are provided between the heat dissipation sheets (8), and thermal conductive silicone grease (10) is provided on the bottom of the heat dissipation base (1).

2. The durable computer motherboard heat sink according to claim 1, characterized in that: Multiple groups of U-shaped copper heat conducting pipes (2) are fixedly installed on both sides of the heat dissipation base (1); the interior of the copper heat conducting pipes (2) is sealed and filled with coolant; and the surface of the copper heat conducting pipes (2) is plated with a nickel layer.

3. The durable computer motherboard heat sink according to claim 1, characterized in that: Aluminum heat conducting sheets (3) are evenly and fixedly installed on the surface of the copper heat conducting pipe (2), and the aluminum heat conducting sheets (3) are installed in multiple groups in a vertical arrangement.

4. The durable computer motherboard heat sink according to claim 1, characterized in that: A heat dissipation through hole (5) is fixedly provided in the middle of the surface of the connecting plate (4), and a heat dissipation fan (6) is fixedly installed on the inner side of the heat dissipation through hole (5).

5. The durable computer motherboard heat sink according to claim 1, characterized in that: Fixing holes (7) are provided through the four corners of the surface of the connecting plate (4), and a plurality of groups of heat dissipation fins (8) are evenly installed on the surface of the aluminum heat conducting plate (3).

6. The durable computer motherboard heat sink according to claim 1, characterized in that: A heat dissipation duct (9) is formed between the heat dissipation sheets (8), and the bottom surface of the heat dissipation base (1) is evenly coated with thermal conductive silicone grease (10).

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