Memory module testing device
By introducing components such as traceless connectors, LED indicators and buzzers into the memory module test device, the problem of good contact between the memory module and the connector and visualization of the test process is solved, and the testing efficiency and user experience are improved.
Patent Information
- Application Number
- CN202422440245.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-08
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-10-08
AI Technical Summary
Traditional memory module testing devices cannot determine whether the memory module and the connector are in good contact, and operators have difficulty understanding the test process, which affects the testing efficiency and user experience.
A memory module testing device is designed, including a PCB circuit board, a traceless connector, a memory module LED indicator, a working status indicator, a switch button and a buzzer. Through the combination of these components, the identification of the contact status of the memory module and the connector, visualization and auditory feedback of the test process are achieved.
Effectively identify the contact status between the memory module and the connector, improve testing efficiency and optimize user experience, simplify operational processes, and enhance the feedback mechanism of the test process.
Smart Images
Figure CN223284742U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip testing equipment, and more particularly to a memory module testing device. Background Art
[0002] A memory module tester is a device specifically designed to test and verify the performance and reliability of memory modules (such as DDR and SDRAM). It is primarily used in manufacturing, R&D, and quality control to ensure the stability and performance of memory modules under various conditions. Traditional memory module testers cannot verify proper contact between the memory module and the connector during testing, and they make it difficult for operators to understand the test progress, thus affecting test efficiency.
[0003] To this end, the utility model provides a memory module testing device that can effectively identify whether the memory module and the connector are in good contact, and facilitates the operator to understand the testing process of the memory module, thereby improving the testing efficiency and optimizing the user experience. Utility Model Content
[0004] In order to overcome the shortcomings of the existing technology, the utility model provides a memory module testing device that can effectively identify whether the memory module and the connector are in good contact, and facilitates the operator to understand the testing process of the memory module, thereby improving the testing efficiency and optimizing the user experience.
[0005] The technical solution adopted by the utility model to solve its technical problem is: a memory module testing device, the improvement of which is that the memory module testing device includes a PCB circuit board, a seamless connector, a memory module LED indicator light, a working status indicator light, a switch button and a buzzer; the seamless connector, the memory module LED indicator light, the working status indicator light, the switch button and the buzzer are all welded to the top surface of the PCB circuit board, and the memory module LED indicator light, the working status indicator light, the switch button and the buzzer are all electrically connected to the seamless connector;
[0006] The seamless connectors are arranged parallel to each other, with one end close to the memory module LED indicator light and the other end close to the working status indicator light; the buzzer is arranged between the switch and the side of the working status indicator light away from the seamless connector.
[0007] In the above structure, the memory module testing device further includes a bottom support plate, and the bottom support plate is fixedly mounted on the bottom surface of the PCB circuit board.
[0008] In the above structure, the memory module testing device further includes fixing bolts, which are distributed at the four corners of the PCB circuit board, pass through the top surface of the PCB circuit board and are inserted into the bottom tray.
[0009] In the above structure, the number of the memory module LED indicator lights is adapted to the upper limit number of memory modules that can be plugged into the memory module testing device.
[0010] In the above structure, the memory module testing device further includes a cable connector, which is soldered to the top surface of the PCB circuit board and is located at an edge of the PCB circuit board.
[0011] In the above structure, the seamless connector includes a plurality of solder pins, which are arranged at the bottom of the seamless connector and are fixedly connected to the PCB circuit board.
[0012] In the above structure, a plurality of pads are provided on the PCB circuit board. The pads are elliptical in shape, and a circular inner hole is provided in the middle of the pads, and the solder pins pass through the circular inner hole.
[0013] In the above structure, the size of the circular inner hole is adapted to the size of the welding foot.
[0014] In the above structure, the number of the solder pads is the same as the number of the solder feet.
[0015] The beneficial effects of the present utility model are as follows: this solution designs a memory module LED indicator light on one side of the seamless connector. When the memory module is in good contact with the seamless connector, the memory module LED indicator light will light up to effectively identify whether the memory module is in good contact with the connector; the test status is indicated visually and auditorily by the working status indicator light and the buzzer, so that the operator can understand the test progress of the memory module; thereby improving the test efficiency and optimizing the user experience. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of the overall structure of a memory module testing device of the present invention. Figure 1 ;
[0017] Figure 2 This is a schematic diagram of the overall structure of a memory module testing device of the present invention. Figure 2 ;
[0018] Figure 3 This is a structural schematic diagram of a traceless connector of a memory module testing device of the present invention. DETAILED DESCRIPTION
[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0020] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by technical personnel in this field without creative work are within the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the creation of the present invention can be combined interactively without conflicting with each other.
[0021] Reference Figure 1 and Figure 2 As shown, the utility model discloses a memory module testing device, which includes a PCB circuit board 1, a seamless connector 2, a memory module LED indicator light 3, a working status indicator light 4, a switch button 6 and a buzzer 5; the seamless connector 2, the memory module LED indicator light 3, the working status indicator light 4, the switch button 6 and the buzzer 5 are all welded to the top surface of the PCB circuit board 1, and the memory module LED indicator light 3, the working status indicator light 4, the switch button 6 and the buzzer 5 are all electrically connected to the seamless connector 2; the seamless connectors 2 are arranged parallel to each other, and one end is close to the memory module LED indicator light 3, and the other end is close to the working status indicator light 4; the buzzer 5 is arranged between the switch and the side of the working status indicator light 4 away from the seamless connector 2.
[0022] It should be noted that, in this embodiment, the seamless connector 2, as the core component of the memory module testing device, is mainly responsible for establishing a good connection with the gold fingers of the memory module to ensure the smooth progress of the memory module test; the memory module LED indicator 3 is used to indicate whether the memory module is in good contact with the seamless connector 2. When the memory module is in good contact with the seamless connector 2, the memory module LED indicator 3 will light up, otherwise it will go out, which helps the operator to quickly identify whether the memory module is in good contact with the seamless connector 2; the working status indicator 4 is used to display the status of the test process, such as test in progress, test completed, test failed and other information, to help the operator understand the current test progress; the switch button 6 is used to start or stop the test process, and the operator can press the switch button The key 6 is used to control the start and end of the test, which simplifies the operation process; the buzzer 5 provides the operator with the test status by issuing sound prompts. For example, when the test is completed or an error occurs, the buzzer 5 will issue different sound signals to remind the operator to pay attention, thereby enhancing the feedback during the test and ensuring that the operator can respond to the test results in a timely manner; the PCB circuit board 1 serves as the basis of the entire memory module testing device and is used to provide a circuit structure for electrical connection between various components; when the utility model is specifically implemented, the memory module LED indicator 3 can effectively identify whether the memory module and the connector are in good contact; the test status is indicated visually and audibly by the working status indicator 4 and the buzzer 5, so that the operator can understand the test progress of the memory module; thereby improving the test efficiency and optimizing the user experience.
[0023] It should also be noted that in this embodiment, the seamless connector 2 is a splint-type double-position seamless connector. Figure 3As shown, the splint-type double-position seamless connector includes: a connector body, a first slot 10 and a second slot 11 are provided on the top, and a spring pin 17, a first pusher 12 and a second pusher 13 are provided inside; the spring pin 17 is distributed on the inner side of the first slot 10 and the inner side of the second slot 11; the first pusher 12 is close to the side of the spring pin 17 on the outer side of the first slot 10; the second pusher 13 is located between the spring pin 17 on the inner side of the first slot 10 and the spring pin 17 on the inner side of the second slot 11; the pushing mechanism includes a pressure rod 14, a metal rod 15 and a metal member 16; the pressure rod 14 is rotatably connected to the metal rod 15 and is located on one side of the connector body; The metal rod 15 is close to the bottom of the second pusher 13; the metal member 16 is fixedly installed on the bottom of the second pusher 13 and is close to the metal rod 15; the connector body is the basic structure of the entire splint-type double-position seamless connector, wherein the first slot 10 and the second slot 11 provided on the top of the connector body are used to install the circuit board and electrically connect with the circuit board; the spring pins 17 are key components for electrically connecting the splint-type double-position seamless connector to the circuit board, and are distributed on the inner sides of the first slot 10 and the second slot 11. They are made of elastic metal material and can generate elastic deformation after the components are inserted to contact with the gold fingers of the circuit board to ensure good electrical connection; The first pushing member 12 is used to apply a thrust to the spring pins 17 on the outside of the first slot 10, so as to help the spring pins 17 on both sides of the first slot 10 to contact with the gold fingers of the inserted circuit board; the second pushing member 13 is used to apply pressure to the spring pins 17 on the inside of the second slot 11, so as to help the spring pins 17 on both sides of the second slot 11 to contact with the gold fingers of the inserted circuit board; the pushing mechanism is used to apply power to the second pushing member 13, so that the second pushing member 13 pushes the spring pins 17 on the inside of the second slot 11 to move closer to the circuit board in the second slot 11; specifically, by applying pressure to the pressure rod 14, the pressure rod 14 rotates, driving the metal rod 15 to push the metal member 16, and then driving the second The pushing member 13 pushes the spring pin 17 on the inner side of the second slot 11 toward the circuit board in the second slot 11. When the present invention is implemented, the user first inserts the gold fingers of the two circuit boards into the first slot 10 and the second slot 11 respectively. Since the spacing between the spring pins 17 on both sides of the first slot 10 and the second slot 11 is slightly larger than the thickness of the circuit boards, the gold fingers of the circuit boards do not contact the spring pins 17 at this time, and the insertion of the circuit boards will not cause scratches on the gold finger surfaces. Then, the pushing block is pushed to move the spring pin 17 on the outer side of the first slot 10 toward the circuit board in the first slot 10, so that the spring pins 17 on both sides of the first slot 10 clamp the circuit board in the first slot 10.And by operating the pushing mechanism, that is, by applying pressure to the pressure rod 14, the pressure rod 14 rotates, driving the metal rod 15 to push the metal part 16, and then driving the second pushing member 13 to push the spring pin 17 on the inside of the second slot 11 closer to the circuit board in the second slot 11, so that the spring pins 17 on both sides of the second slot 11 clamp the circuit board in the second slot 11; during this process, when inserting the gold finger of the circuit board, the gold finger of the circuit board does not need to rub against the spring pin 17, so as to avoid scratches and wear caused by repeated plugging and unplugging during testing, thereby achieving seamless plugging and unplugging and optimizing the user experience. In addition, the memory module test device is designed with a total of 4 seamless connectors 2, which can test 8 memory modules. Compared with traditional memory module test devices, it saves the space occupied by connector spacing and reduces the area of the test device by more than 20%.
[0024] Reference Figure 2 As shown, the memory module testing device further includes a bottom support plate 9 , which is fixedly mounted on the bottom surface of the PCB circuit board 1 .
[0025] It should be noted that, in this embodiment, the base plate 9 provides physical support for the entire memory module testing device, ensuring that the PCB circuit board 1 and various components remain stable during the test process, avoiding displacement or damage caused by external forces, and improving the wear resistance and stability of the memory module testing device.
[0026] Reference Figure 1 As shown, the memory module testing device further includes fixing bolts 8 , which are distributed at the four corners of the PCB circuit board 1 , pass through the top surface of the PCB circuit board 1 , and are inserted into the bottom tray.
[0027] It should be noted that, in this embodiment, the fixing bolts 8 are used to firmly fix the PCB circuit board 1 on the bottom support plate 9 to ensure that the PCB circuit board 1 does not move or tilt during the test, thereby improving the accuracy and reliability of the test.
[0028] Continue to refer to Figure 1 As shown, the number of the memory module LED indicator lights 3 matches the upper limit number of memory modules plugged into the memory module testing device.
[0029] It should be noted that, in this embodiment, the design number of the memory module LED indicator lights 3 is 8, which is the same as the upper limit number of memory modules that the memory module testing device can test at one time. This is to ensure that each memory module is equipped with a memory module LED indicator light 3, so that the operator can intuitively confirm whether each memory module is in good contact with each seamless connector 2.
[0030] Continue to refer to Figure 1As shown, the memory module testing device further includes a cable connector 7 , which is soldered to the top surface of the PCB circuit board 1 and is located at an edge of the PCB circuit board 1 .
[0031] It should be noted that, in this embodiment, the cable connector 7 is designed to connect to a device such as a writer.
[0032] Reference Figure 3 As shown, the seamless connector 2 includes a plurality of solder pins 18, which are arranged at the bottom of the seamless connector 2 and are fixedly connected to the PCB circuit board 1; a plurality of solder pads are provided on the PCB circuit board 1, and the solder pads are elliptical, and a circular inner hole is provided in the middle position of the solder pad, and the solder pins pass through the circular inner hole; the size of the circular inner hole is adapted to the size of the solder pins 18; the number of the solder pads is the same as the number of the solder pins 18.
[0033] It should be noted that in this embodiment, since the number of solder pins of the seamless connector 2 is large and the density is high, pin-type soldering is adopted to reduce the difficulty of soldering and improve the electrical performance; the solder pad is designed to be elliptical, and a circular inner hole is designed in the middle position, which can maximize the amount of tin and the stress-bearing anchoring area, enhance the soldering firmness, and avoid the high-density spacing being too small, causing a soldering short circuit.
[0034] The above is a specific description of the preferred implementation of the present invention, but the invention of the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.
Claims
1. A memory module testing device, characterized in that: The memory module testing device includes a PCB circuit board, a seamless connector, a memory module LED indicator light, a working status indicator light, a switch button, and a buzzer; the seamless connector, the memory module LED indicator light, the working status indicator light, the switch button, and the buzzer are all welded to the top surface of the PCB circuit board, and the memory module LED indicator light, the working status indicator light, the switch button, and the buzzer are all electrically connected to the seamless connector; The seamless connectors are arranged parallel to each other, with one end close to the memory module LED indicator light and the other end close to the working status indicator light; the buzzer is arranged between the switch and the side of the working status indicator light away from the seamless connector.
2. A memory module testing device according to claim 1, characterized in that: The memory module testing device further comprises a bottom support plate, which is fixedly mounted on the bottom surface of the PCB circuit board.
3. The memory module testing device according to claim 2, wherein: The memory module testing device further includes fixing bolts, which are distributed at the four corners of the PCB circuit board, pass through the top surface of the PCB circuit board and are inserted into the bottom tray.
4. The memory module testing device according to claim 1, wherein: The number of the memory module LED indicator lights is adapted to the upper limit number of memory modules that can be plugged into the memory module testing device.
5. The memory module testing device according to claim 1, wherein: The memory module testing device further comprises a cable connector which is welded to the top surface of the PCB circuit board and is located at an edge of the PCB circuit board.
6. The memory module testing device according to claim 1, wherein: The seamless connector includes a plurality of solder pins, which are arranged at the bottom of the seamless connector and are fixedly connected to the PCB circuit board.
7. The memory module testing device according to claim 6, wherein: A plurality of pads are arranged on the PCB circuit board. The pads are elliptical in shape, and a circular inner hole is arranged in the middle of the pads, through which the solder legs pass.
8. The memory module testing device according to claim 7, wherein: The size of the circular inner hole is adapted to the size of the welding foot.
9. The memory module testing device according to claim 7, wherein: The number of the solder pads is the same as the number of the solder feet.