Wafer boat and vertical furnace tube

Abstract

The utility model provides a wafer boat and a vertical furnace tube. The wafer boat comprises a base; the first bearing assembly is arranged on the base, a plurality of first bearing parts are arranged on the first bearing assembly at intervals in the axial direction of the first bearing assembly, and the first bearing parts are used for bearing wafers with first depth-to-width ratio structures; the second bearing assembly is movably arranged on the base and is close to the first bearing assembly, second bearing parts are arranged on the second bearing assembly at intervals in the axial direction of the second bearing assembly, and the second bearing parts and the first bearing parts are matched to be used for bearing another wafer with a second depth-to-width ratio structure; the driving mechanism is connected with the second bearing assembly and used for driving the second bearing assembly to ascend and descend. According to the wafer boat provided by the utility model, the driving mechanism can drive the second bearing assembly to move, so that the distance between the first bearing part and the second bearing part can be adjusted, two kinds of wafers with depth-to-width ratio structures can be processed at one time, and the utilization rate and the compatibility of equipment are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to a crystal boat and a vertical furnace tube. Background Art

[0002] In semiconductor heat treatment processes, vertical furnaces are widely used due to their small footprint and high processing efficiency. The wafer boat is the carrier that carries the wafers into the furnace tube for processing, used for the transportation and processing of wafers or chips.

[0003] The existing wafer boat has several supporting components spaced apart in an upper and lower manner, and each supporting component is used to support wafers. Since the position of each supporting component on the wafer boat is fixed, each existing wafer boat can only be used for wafers with one aspect ratio structure according to process requirements, and cannot flexibly adjust the spacing for wafers with different aspect ratio structures. Therefore, when processing the wafers, wafers with different aspect ratio structures cannot be processed at one time. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer boat and a vertical furnace tube, which can adjust the distance between adjacent wafers and improve the utilization rate and compatibility of the equipment.

[0005] To achieve the above objectives, in a first aspect, the present invention provides a wafer boat, comprising:

[0006] base;

[0007] A first carrying assembly is provided on the base, wherein the first carrying assembly is provided with a plurality of first carrying members spaced apart along its axial direction, and the first carrying members are used to carry a wafer having a first aspect ratio structure;

[0008] a second carrying assembly, movably disposed on the base and close to the first carrying assembly, wherein the second carrying assembly is provided with second carrying members spaced apart along its axial direction, and the second carrying member cooperates with the first carrying member to carry another wafer having a second aspect ratio structure;

[0009] The driving mechanism is connected to the second bearing assembly and is used to drive the second bearing assembly to rise and fall.

[0010] The beneficial effect of the wafer boat provided by the present invention is that the first carrying component can be used to carry wafers with a first aspect ratio structure. Since the driving mechanism can drive the second carrying component to move, the distance between the first carrying component and the second carrying component can be adjusted, so that the second carrying component and the first carrying component can be used in conjunction with each other to carry another wafer with a second aspect ratio structure, so that two wafers each with an aspect ratio structure can be processed at one time, and the aspect ratio structures of the two wafers are different, thereby improving the utilization rate and compatibility of the equipment.

[0011] In some embodiments, the first bearing assembly includes a bottom plate, a top plate, and a plurality of first connecting rods;

[0012] The bottom plate is connected to the base;

[0013] A plurality of first connecting rods are distributed between the bottom plate and the top plate in an annular manner and at intervals, one end of the first connecting rod is connected to the bottom plate, and the other end is connected to the top plate;

[0014] The first supporting members are arranged on the first connecting rod at intervals along the axial direction of the first connecting rod, and the first supporting members located at the same height form a first supporting area for supporting wafers having a first aspect ratio structure. This has the beneficial effect of: the first supporting members are arranged on the first connecting rod at intervals along the axial direction of the first connecting rod, and the first supporting members located at the same height form a first supporting area for supporting wafers having a first aspect ratio structure, thereby enabling processing of wafers having a certain aspect ratio structure.

[0015] In some embodiments, the second bearing assembly includes a plurality of second connecting rods;

[0016] A plurality of second connecting rods are arranged in an annular and spaced arrangement, and each second connecting rod is close to a corresponding first connecting rod, and one end of the second connecting rod is connected to the driving mechanism;

[0017] A plurality of second carriers are arranged on the second connecting rod at intervals along the axial direction of the second connecting rod, and the plurality of second carriers located at the same height form a second carrier area. The second carrier area cooperates with the first carrier area to support wafers having a second aspect ratio. This advantageously provides the following advantages: by positioning each second connecting rod close to a corresponding first connecting rod, and connecting one end of the second connecting rod to a drive mechanism, when the drive mechanism drives the second connecting rod up and down, the position of the second carrier can be adjusted, thereby adjusting the spacing between the first carrier and the second carrier, thereby being suitable for processing wafers having different aspect ratios.

[0018] In some embodiments, a sliding groove is formed on the side wall of the first connecting rod along its axial direction;

[0019] The side wall of the second connecting rod is provided with a sliding portion along its axial direction, and the sliding portion is slidably arranged in the sliding groove. The beneficial effect is that by providing the sliding groove on the side wall of the first connecting rod and providing the sliding portion corresponding to the sliding groove on the side wall of the second connecting rod, the second connecting rod can remain stable during the up and down movement.

[0020] In some embodiments, the bottom plate is provided with a plurality of first through holes in an annular shape and at intervals;

[0021] Each second connecting rod passes through the corresponding first through hole and is arranged close to the first connecting rod.

[0022] In some embodiments, the driving mechanism includes a driver and a driving platform;

[0023] The driver is connected to the driving platform and is used to drive the driving platform to move up and down;

[0024] The driving platform is arranged between the base and the bottom plate;

[0025] One end of the second connecting rod is connected to the driving platform.

[0026] In some embodiments, a support member is provided on the base;

[0027] The driving platform is provided with a second through hole corresponding to the supporting member;

[0028] One end of the support member is connected to the base, and the other end passes through the second through hole and is connected to the bottom plate.

[0029] In some embodiments, the top plate is provided with a plurality of third through holes corresponding to the plurality of second connecting rods;

[0030] When the driving mechanism drives the second connecting rod to move toward the top plate, the other end of the second connecting rod can pass through the third through hole.

[0031] In some embodiments, a plurality of weight-reducing holes are opened on the driving platform, and the plurality of weight-reducing holes are evenly distributed on the driving platform.

[0032] In a second aspect, an embodiment of the present invention provides a vertical furnace tube, comprising a tube body and the wafer boat;

[0033] The wafer boat is arranged in the tube body, and the wafer boat includes a first carrying component and a second carrying component. The first carrying component and the second carrying component have different heights. A part of the first carrying member in the first carrying component is used to carry a wafer with a first aspect ratio structure, and another part of the first carrying member in the first carrying component and a part of the second carrying member in the second carrying component are used to carry another wafer with a second aspect ratio structure.

[0034] The beneficial effect of the vertical furnace tube provided by the present invention is that: the crystal boat provided by the present invention can adjust the distance between the first carrier and the second carrier because the driving mechanism can drive the second carrier to move. Therefore, by arranging the crystal boat provided by the present invention in the tube body, it is possible to process two wafers each having a depth-to-width ratio structure at one time, and the depth-to-width ratio structures of the two wafers are different, thereby improving the utilization rate and compatibility of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic structural diagram of a crystal boat according to an embodiment of the present invention;

[0036] Figure 2 This is a schematic structural diagram of an embodiment of the present invention in which a first connecting rod and a second connecting rod are arranged side by side;

[0037] Figure 3 A top view of the first connecting rod of the embodiment provided by the utility model;

[0038] Figure 4 A top view of the second connecting rod of the embodiment provided by the utility model;

[0039] Figure 5 A top view of the bottom plate of the embodiment provided by the utility model;

[0040] Figure 6 A top view of the driving platform according to an embodiment of the present invention;

[0041] Figure 7 This is a schematic structural diagram of a vertical furnace tube according to an embodiment of the present invention.

[0042] Reference numerals:

[0043] Base 1, support member 11, first bearing assembly 2, first bearing member 21, bottom plate 22, first through hole 221,

[0044] Top plate 23 , first connecting rod 24 , slide groove 241 , second bearing assembly 3 , second bearing member 31 , second connecting rod 32 , slide portion 321 , drive mechanism 4 , driver 41 , drive platform 42 , second through hole 421 , lightening hole 422 , wafer boat 10 , tube body 20 . DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the usual meanings understood by people with ordinary skills in the field to which the present invention belongs. The words "including" and similar words used in this article mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Unless otherwise specified, the "connection" described in this article can be a direct connection or an indirect connection, that is, a connection through an intermediate.

[0046] In view of the problems existing in the prior art, the embodiment of the present invention provides a wafer boat, referring to Figure 1 and Figure 2 As shown, the wafer boat includes a base 1, a first supporting assembly 2, a second supporting assembly 3, and a drive mechanism 4. The first supporting assembly 2 is fixedly mounted on the base 1 and is provided with a plurality of first supporting members 21 spaced apart along its axial direction. The first supporting members 21 are used to support wafers. The second supporting assembly 3 is movably mounted on the base 1 and adjacent to the first supporting assembly 2. The second supporting assembly 3 is provided with second supporting members 31 spaced apart along its axial direction. The second supporting members 31 are used to support wafers. The drive mechanism 4 is connected to the second supporting assembly 3 and is used to drive the second supporting assembly 3 to rise and fall.

[0047] In this embodiment, a plurality of the first carriers 21 are arranged at equal intervals along the axial direction of the first carrier assembly 2, so that a wafer having a first aspect ratio structure can be carried, and the wafer having the first aspect ratio structure can be transferred to a vertical furnace tube for processing. In addition, the base 1 is also movably provided with a second carrier assembly 3, and a plurality of the second carriers 31 are also arranged at equal intervals on the second carrier assembly 3, and the spacing between two adjacent second carriers 31 is equal to the spacing between two adjacent first carriers 21. Because the driving mechanism 4 can drive the second carrier assembly 3 to perform lifting movements, the spacing between the first carrier 21 and the second carrier 31 can be adjusted, which means that by adjusting the spacing between the first carrier 21 and the second carrier 31, another wafer having a second aspect ratio structure can be carried. Among them, the aspect ratios of the first aspect ratio structure and the second aspect ratio structure are different. For example, when the second carrier 31 is raised so that the height of each second carrier 31 is located between two adjacent first carriers 21, the distance between the adjacent first carriers 21 and the second carrier 31 is reduced by half compared to the distance between the two adjacent first carriers 21. Therefore, by using the first carrier 21 and the second carrier 31 in combination, a wafer with a relatively small aspect ratio structure can be carried on the first carrier 21 and the second carrier 31 in turn.

[0048] Continue to refer Figure 1 and Figure 2 As shown, in some embodiments, the first supporting assembly 2 includes a bottom plate 22, a top plate 23 and a plurality of first connecting rods 24. The bottom plate 22 and the top plate 23 are both hollow disc-shaped structures, and the bottom plate 22 is detachably connected to the base 1. A plurality of first connecting rods 24 are distributed in a ring-shaped and spaced relationship between the bottom plate 22 and the top plate 23, and one end of the first connecting rod 24 is fixedly connected to the bottom plate 22, and the other end of the first connecting rod 24 is fixedly connected to the top plate 23. A plurality of first supporting members 21 are arranged on the first connecting rod 24 at intervals along the axial direction of the first connecting rod 24, and a plurality of first supporting members 21 at the same height form a first supporting area for supporting wafers.

[0049] In this embodiment, the number of the first connecting rods 24 is three, and the three first connecting rods 24 are arranged in a ring and at equal intervals between the bottom plate 22 and the top plate 23 to form a cylindrical frame structure. A plurality of first carriers 21 are arranged at equal intervals on each of the first connecting rods 24, so that the three first carriers 21 located at the same height cooperate with each other to form a first carrier area for carrying a wafer with a first aspect ratio structure, and the wafer with the first aspect ratio structure can be transferred to the vertical furnace tube for processing.

[0050] Furthermore, the second supporting assembly 3 includes a plurality of second connecting rods 32, the number of which is the same as the number of the first connecting rods 24. The plurality of second connecting rods 32 are arranged in a circular and spaced arrangement between the bottom plate 22 and the top plate 23, with each second connecting rod 32 adjacent to and arranged side by side with a corresponding first connecting rod 24. One end of the second connecting rod 32 is connected to the driving mechanism 4. A plurality of second supporting members 31 are arranged on the second connecting rod 32 at intervals along the axial direction of the second connecting rod 32, and the plurality of second supporting members 31 located at the same height form a second supporting area, which cooperates with the first supporting area to support wafers having a second aspect ratio structure.

[0051] In this embodiment, the number of the second connecting rods 32 is also set to three, each of the second connecting rods 32 is close to a corresponding one of the first connecting rods 24, and a number of second supporting members 31 are evenly spaced on each of the second connecting rods 32, so that the three second supporting members 31 located at the same height cooperate with each other to form a second supporting area. When the driving mechanism 4 drives the second connecting rods 32 to move up and down, the position of the second supporting member 31 can be adjusted, thereby adjusting the distance between the first supporting member 21 and the second supporting member 31, that is, the distance between the second supporting area and the first supporting area is adjustable, so that it can be suitable for carrying and processing another type of wafer with a different second aspect ratio structure. In this embodiment, the aspect ratio of the second aspect ratio structure is smaller than the aspect ratio of the first aspect ratio structure. For example, in this embodiment, the driving mechanism 4 drives the second connecting rod 32 to rise so that the height of each second carrier 31 is located between the two adjacent first carriers 21. Then, in a part of the wafer boat, only one type of wafer with a first aspect ratio structure can be carried in the first carrying area, and no wafer is carried in the second carrying area in this area. In another part of the wafer boat, another type of wafer with a second aspect ratio structure is carried on both the first carrying area and the second carrying area, thereby achieving the ability to process two wafers each having an aspect ratio structure at one time, thereby improving the utilization and compatibility of the equipment.

[0052] refer to Figure 3 and Figure 4 As shown, in some embodiments, a sliding groove 241 is opened on the side wall of the first connecting rod 24 along its axial direction, and a sliding portion 321 is opened on the side wall of the second connecting rod 32 along its axial direction, and the sliding portion 321 is slidably arranged in the sliding groove 241.

[0053] In this embodiment, the sliding groove 241 is opened on the side wall of the first connecting rod 24, and the sliding portion 321 corresponding to the sliding groove 241 is set on the side wall of the second connecting rod 32 to ensure that the second connecting rod 32 remains stable during the up and down movement to avoid shaking.

[0054] refer to Figure 1 、 Figure 2 and Figure 5 As shown, in some embodiments, a plurality of first through holes 221 are annularly and spaced apart on the bottom plate 22 , and each second connecting rod 32 passes through a corresponding first through hole 221 and is disposed close to the first connecting rod 24 .

[0055] In this embodiment, the first through hole 221 is arranged corresponding to the second connecting rod 32, and the inner diameter of the first through hole 221 is larger than the diameter of the second connecting rod 32. By setting a plurality of first through holes 221 on the bottom plate 22, the second connecting rod 32 can be connected to the driving mechanism 4 located under the base 1.

[0056] In some embodiments, the driving mechanism 4 includes a driver 41 and a driving platform 42. The driver 41 is connected to the driving platform 42 and is used to drive the driving platform 42 to rise and fall. The driving platform 42 is arranged between the base 1 and the bottom plate 22. One end of the second connecting rod 32 passes through the first through hole 221 and is connected to the driving platform 42.

[0057] In this embodiment, the driver 41 may be a telescopic cylinder.

[0058] refer to Figure 1 and Figure 6 As shown, in some embodiments, a support member 11 is provided on the base 1, and the driving platform 42 is provided with a second through hole 421 corresponding to the support member 11, one end of the support member 11 is connected to the base 1, and the other end passes through the second through hole 421 and is connected to the bottom plate 22.

[0059] In this embodiment, the base 1 is connected to the bottom plate 22 by using the support member 11 , so that there is a space between the base 1 and the bottom plate 22 for the driving platform 42 to move.

[0060] In some embodiments, the top plate 23 is provided with a plurality of third through holes corresponding to the plurality of second connecting rods 32 .

[0061] It can be understood that by providing a plurality of third through holes on the top plate 23 corresponding to the plurality of second connecting rods 32, when the driving mechanism 4 drives the second connecting rod 32 to move toward the top plate 23, the other end of the second connecting rod 32 can pass through the third through hole, thereby avoiding interference of the top plate 23 with the second connecting rod 32.

[0062] In some embodiments, a plurality of weight-reducing holes 422 are opened on the driving platform 42 , and the plurality of weight-reducing holes 422 are evenly distributed on the driving platform 42 .

[0063] In this embodiment, the weight-reducing holes 422 are provided on the driving platform 42 to reduce the weight of the driving platform 42 , thereby ensuring the reliability of the driving mechanism 4 in driving the second bearing assembly 3 to move up and down.

[0064] In another embodiment provided by the present invention, a vertical furnace tube is provided, referring to Figure 7 As shown, the vertical furnace tube includes a tube body 20 and the wafer boat 10, and the wafer boat 10 is arranged in the tube body 20. The wafer boat 10 includes a first carrying component and a second carrying component. The first carrying component and the second carrying component have different heights. A part of the first carrying member in the first carrying component is used to carry one type of wafer, and another part of the first carrying member in the first carrying component and a part of the second carrying member in the second carrying component are used to carry another type of wafer.

[0065] In this embodiment, by arranging the wafer boat 10 in this embodiment in the tube body 20, two wafers with different aspect ratio structures can be processed at one time, thereby improving the utilization rate and compatibility of the equipment.

[0066] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A wafer boat, characterized in that: include: base; A first carrying assembly is provided on the base, wherein the first carrying assembly is provided with a plurality of first carrying members spaced apart along its axial direction, and the first carrying members are used to carry a wafer having a first aspect ratio structure; a second carrying assembly, movably disposed on the base and close to the first carrying assembly, wherein the second carrying assembly is provided with second carrying members spaced apart along its axial direction, and the second carrying member cooperates with the first carrying member to carry another type of carrying wafer having a second aspect ratio structure; The driving mechanism is connected to the second bearing assembly and is used to drive the second bearing assembly to rise and fall.

2. The wafer boat according to claim 1, wherein: The first bearing assembly includes a bottom plate, a top plate and a plurality of first connecting rods; The bottom plate is connected to the base; A plurality of first connecting rods are distributed between the bottom plate and the top plate in an annular manner and at intervals, one end of the first connecting rod is connected to the bottom plate, and the other end is connected to the top plate; A plurality of first carriers are arranged on the first connecting rod at intervals along the axial direction of the first connecting rod, and the plurality of first carriers located at the same height form a first carrying area for carrying a wafer with a first aspect ratio structure.

3. The wafer boat according to claim 2, wherein: The second bearing assembly includes a plurality of second connecting rods; A plurality of second connecting rods are arranged in an annular and spaced arrangement, and each second connecting rod is close to a corresponding first connecting rod, and one end of the second connecting rod is connected to the driving mechanism; Several second carriers are arranged on the second connecting rod at intervals along the axial direction of the second connecting rod, and several second carriers located at the same height form a second carrier area, which cooperates with the first carrier area to carry wafers with a second aspect ratio structure.

4. The wafer boat according to claim 3, characterized in that: A sliding groove is formed on the side wall of the first connecting rod along its axial direction; A sliding portion is provided on the side wall of the second connecting rod along its axial direction, and the sliding portion is slidably arranged in the sliding groove.

5. The wafer boat according to claim 3, wherein: The bottom plate is provided with a plurality of first through holes in an annular shape and at intervals; Each second connecting rod passes through the corresponding first through hole and is arranged close to the first connecting rod.

6. The wafer boat according to claim 5, characterized in that: The driving mechanism includes a driver and a driving platform; The driver is connected to the driving platform and is used to drive the driving platform to move up and down; The driving platform is arranged between the base and the bottom plate; One end of the second connecting rod is connected to the driving platform.

7. The wafer boat according to claim 6, characterized in that: A support member is provided on the base; The driving platform is provided with a second through hole corresponding to the supporting member; One end of the support member is connected to the base, and the other end passes through the second through hole and is connected to the bottom plate.

8. The wafer boat according to claim 7, wherein: The top plate is provided with a plurality of third through holes corresponding to the plurality of second connecting rods; When the driving mechanism drives the second connecting rod to move toward the top plate, the other end of the second connecting rod can pass through the third through hole.

9. The wafer boat according to claim 6, wherein: A plurality of weight-reducing holes are provided on the driving platform, and the plurality of weight-reducing holes are evenly distributed on the driving platform.

10. A vertical furnace tube, characterized in that: comprising a tube body and the wafer boat according to any one of claims 1 to 9; The wafer boat is arranged in the tube body, and the wafer boat includes a first carrying component and a second carrying component. The first carrying component and the second carrying component have different heights. A part of the first carrying member in the first carrying component is used to carry a wafer with a first aspect ratio structure, and another part of the first carrying member in the first carrying component and a part of the second carrying member in the second carrying component are used to carry another wafer with a second aspect ratio structure.

Images