Sealed wafer carrying device

Abstract

The utility model discloses a sealed wafer carrying device, which comprises a transmission structure, a driving structure and a sealing structure, and is characterized in that the transmission structure comprises a rotating rod, and a clamping arm is mounted on the rotating rod; the driving structure comprises a shell and a driving assembly, a containing space is formed in the shell, the driving assembly is installed in the containing space, and the rotating rod penetrates through the shell to be connected with the driving assembly; the driving structure drives the rotating rod to rotate so as to drive the clamping arm to rotate to clamp the wafer; the sealing structure comprises a first sealing piece, and the first sealing piece is arranged at the connecting position of the rotating rod and the shell so as to seal the containing space. Wherein the containing space is filled with a gas medium, and the pressure intensity of first gas in the containing space is larger than that of second gas outside the shell, so that external gas is prevented from entering the containing space. Positive pressure is formed in the containing space of the structure, so that acid gas is prevented from entering the containing space, and corrosion of internal components is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing technology, in particular to a sealed wafer transport device. Background Art

[0002] With the increasing localization of semiconductors, there is an increasing demand for chip production process research and development and testing. Wafer cassettes are devices that store semiconductor wafers. In actual production, wafers cannot be touched directly by hand, as this will cause irreparable static damage to the wafers and will be directly scrapped. Anti-static equipment is needed for material transfer to minimize manual material transfer. Currently, the market uses mass production models / semi-automatic equipment to meet this demand. These are expensive and occupy a large space, resulting in an increasing demand for modular equipment.

[0003] Existing wafer processing typically occurs in an environment saturated with acidic gases. When the robotic arm that grips the wafer cassette operates in this environment for extended periods, the acidic gases can corrode the surfaces of the robotic components. While the robotic surface exposed to air can be easily wiped and maintained, the acidic gases can penetrate gaps within the drive cassette and other internal components, damaging them. Furthermore, disassembly of these areas is difficult, making them difficult to maintain. Utility Model Content

[0004] Therefore, the technical problem addressed by this utility model is to overcome the problem that conventional wafer processing generally takes place in an environment filled with acidic gases. When the robotic arm device that grips the wafer cassette operates in this environment for a long time, the acidic gases can corrode the surface of the robotic arm components. While the robotic arm surface exposed to air can be easily wiped and maintained, the acidic gases can enter the interior of the drive cassette and other components through gaps, causing damage and defects to the surface of internal components.

[0005] To this end, the present invention provides a sealed wafer handling device, comprising:

[0006] A transmission structure, the transmission structure comprising a rotating rod, on which a clamping arm is mounted;

[0007] The drive structure includes a housing and a drive assembly. The housing defines a housing space, the drive assembly is mounted in the housing space, and the rotating rod passes through the housing and is connected to the drive assembly. The drive structure drives the rotating rod to rotate, thereby driving the clamping arm to rotate and clamp the wafer.

[0008] a sealing structure, the sealing structure comprising a first sealing member, the first sealing member being disposed at a connection position between the rotating rod and the housing to seal the accommodating space;

[0009] The accommodating space is filled with a gas medium, and a first gas pressure in the accommodating space is greater than a second gas pressure outside the shell so that the accommodating space is isolated from external gas.

[0010] Beneficial Effect: The sealed structure seals the housing. An external inflator is used to fill the interior of the housing with an inert gas medium, such as helium. The pressure of the first gas inside the housing is greater than the pressure of the second gas outside the housing, isolating the housing from external air. This creates a positive pressure inside the housing, preventing acidic gases from entering and potentially corroding internal components.

[0011] Optionally, two of the above-mentioned transmission structures are provided, and the two transmission structures are symmetrically arranged;

[0012] The driving structure is suitable for driving the two rotating rods to rotate and drive the clamping ends of the two clamping arms to approach each other so as to clamp the wafer.

[0013] Beneficial effect: Through the above structure, one driving structure is used to drive the two rotating rods to rotate simultaneously, thereby improving the synchronization of the two rotating rods.

[0014] Optionally, the sealed wafer handling device further includes a mounting frame;

[0015] The drive assembly includes:

[0016] a driving member, the driving member being mounted on the mounting frame;

[0017] An eccentric wheel, the eccentric wheel being mounted on the output shaft of the driving member, and the eccentric wheel being further mounted with a connecting shaft;

[0018] a connecting rod, one end of which is connected to the connecting shaft, and the other end of which is connected to the rotating rod;

[0019] Wherein, the driving member drives the eccentric wheel to rotate so as to drive the connecting rod to drive the rotating rod to rotate.

[0020] Optionally, two connecting rods are provided, one end of the two connecting rods is connected to the two rotating rods respectively, and the other end is installed on the connecting shaft.

[0021] Optionally, the sealed wafer transport device further comprises a support plate, support holes are respectively provided on both sides of the support plate, and ends of the two rotating rods away from the accommodating space are respectively inserted into the two support holes.

[0022] Beneficial effect: The support plate and the support hole cooperate with the shell to limit the rotating rod and ensure its parallelism.

[0023] Optionally, the transmission structure further includes:

[0024] A first bearing is connected to the end of the rotating rod located in the accommodating space, an inner ring of the first bearing is connected to the rotating rod, and an outer ring of the first bearing is connected to the inner wall of the shell.

[0025] Beneficial effects: It plays a role in supporting and reducing resistance, and prolongs the service life of the entire device.

[0026] Optionally, the sealed wafer handling device further includes a first sensor, which is disposed on one side of the transmission structure;

[0027] Wherein, a blocking piece is installed on at least one of the rotating rods, and the first sensor is suitable for sensing the position of the blocking piece to determine whether the clamping arm is in the clamping position.

[0028] Optionally, the sealed wafer transport device further includes a second sensor, and the second sensor is used to determine whether a wafer is clamped between the two clamping arms.

[0029] Beneficial effects: This structure is provided with a first sensor, a baffle and a second sensor, ensuring that the entire sealed wafer handling device is automatically controlled, with a high degree of automation, easy use and strong applicability.

[0030] Optionally, the sealed wafer transport device further comprises a moving structure, the shell is mounted at the output end of the moving structure; and a second sealing member is provided at the connection between the shell and the output end of the moving structure.

[0031] Beneficial effects: The use of a six-axis robot with a clamping mechanism can meet the current research and development needs of cleaning equipment, with a smaller footprint and a more flexible motion trajectory, making the equipment layout more compact. Compared with the robot arm of traditional trough-type cleaning equipment, there is no need to replace the robot arm for changes in the cleaning module, which reduces the customer's operating costs and thus achieves better economic benefits.

[0032] Optionally, the first sealing member is an oil seal, and the second sealing member is a sealing ring.

[0033] Beneficial effect: ensuring the sealing between the mobile structure and the shell, preventing external acidic gas from entering the accommodating space.

[0034] The technical solution provided by the utility model has the following advantages:

[0035] 1. The sealed wafer handling device provided by the present invention includes: a transmission structure, a driving structure and a sealing structure, the transmission structure includes a rotating rod, and a clamping arm is installed on the rotating rod; the driving structure includes a shell and a driving assembly, a accommodating space is opened in the shell, a mounting hole is opened on the shell, the driving assembly is installed in the accommodating space, and the rotating rod passes through the mounting hole and is connected to the driving assembly; the driving structure drives the rotating rod to rotate to drive the clamping arm to rotate and clamp the wafer; the sealing structure includes a first sealing member, which is arranged at the connection position between the rotating rod and the shell to seal the accommodating space; wherein, the accommodating space is filled with a gas medium, and the first gas pressure in the accommodating space is greater than the second gas pressure outside the shell to prevent external gas from entering the accommodating space.

[0036] The first seal of this structure seals the housing space. An external inflator is used to fill the interior of the housing with an inert gas medium, such as helium or nitrogen. The pressure of the first gas within the housing space is greater than the pressure of the second gas outside the housing, preventing external gas from entering the housing space. This creates a positive pressure within the housing space, preventing acidic gases from entering and potentially corroding internal components.

[0037] 2. The sealed wafer handling device provided by the present invention also includes a moving structure, the output end of which is connected to the driving structure; the driving member in the driving assembly is installed on the mounting frame; the eccentric wheel is fixed on the output shaft of the driving member, and a connecting shaft is also installed on the eccentric wheel; one end of the connecting rod is connected to the connecting shaft, and the other end is connected to the rotating rod; wherein the driving member drives the eccentric wheel to rotate to drive the connecting rod to drive the rotating rod to rotate.

[0038] This structure, through the aforementioned drive assembly configuration and the coordination of the drive assembly and the rotating rod, enables a single motor to simultaneously drive the two rotating rods for synchronous rotation, resulting in a high degree of automation, ease of use, and strong applicability. Furthermore, the use of a six-axis manipulator with a clamping mechanism offers a smaller footprint and more flexible motion paths compared to existing cleaning process manipulators, resulting in a more compact equipment layout. Compared to the manipulator arms of traditional tank-type cleaning equipment, there's no need to replace the manipulator for every cleaning module change, reducing operating costs for customers and achieving better economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0040] Figure 1This is a schematic diagram of the overall structure of the sealed wafer handling device provided in the present invention;

[0041] Figure 2 This is a schematic diagram of the assembly of the clamping arm, transmission structure and drive structure provided in the present utility model;

[0042] Figure 3 This is a side internal schematic diagram of the clamping arm, transmission structure and drive structure provided in the present invention;

[0043] Figure 4 A side sectional view of the driving structure provided in the present utility model;

[0044] Figure 5 This is a schematic diagram of the structure of the drive assembly provided in the present utility model;

[0045] Figure 6 This is a schematic diagram of the installation of the first sensor and the second sensor provided in the present utility model;

[0046] Description of reference numerals:

[0047] 1-Clamping arm;

[0048] 2 - transmission structure; 21 - rotating rod; 211 - blocking piece; 22 - first bearing;

[0049] 3-Support plate;

[0050] 4-Mounting frame;

[0051] 5-driving structure; 51-housing; 511-inflating hole; 52-driving assembly; 521-driving member; 522-eccentric wheel; 523-connecting rod;

[0052] 61 - first sensor; 62 - second sensor;

[0053] 7-mobile structure;

[0054] 81 - first seal; 82 - second seal. DETAILED DESCRIPTION

[0055] The following is a clear and complete description of the technical solution of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0056] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0057] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0058] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0059] Example

[0060] This embodiment provides a sealed wafer handling device, such as Figures 1 to 6 As shown, it includes: a transmission structure 2, a drive structure 5 and a sealing structure. The drive structure 5 includes a housing 51 and a drive assembly 52. ​​The housing 51 is a hollow structure with a built-in accommodating space, and the drive assembly 52 is fixed in the accommodating space. The housing 51 also has two mounting holes for mounting the transmission structure 2.

[0061] like Figure 2 and Figure 5 As shown, there are two transmission structures 2, which are symmetrically arranged on both sides of the housing 51, and the axes of the two transmission structures 2 are parallel. Each transmission structure 2 includes: a rotating rod 21, a first bearing 22, a second bearing and a third bearing. The rotating rod 21 is inserted into the mounting hole, with a portion located in the accommodating space and the other portion located outside the housing 51. The two clamping arms 1 are symmetrical and respectively mounted on the portions of the two rotating rods 21 outside the housing 51. The ends of the two rotating rods 21 outside the housing 51 are supported by a support plate 3. The support plate 3 has two support holes corresponding to the two mounting holes. The ends of the two rotating rods 21 away from the housing 51 are inserted into the corresponding support holes, and cooperate with the mounting holes to ensure the parallelism of the two rotating rods 21.

[0062] The first bearing 22 is fixed at one end of the rotating rod 21 located in the accommodating space at both ends. The inner ring of the first bearing 22 is fixedly connected to the rotating rod 21, and the outer ring of the first bearing 22 is fixedly connected to the inner wall of the housing 51; the second bearing is arranged in the mounting hole, the inner ring of the second bearing is fixedly connected to the rotating rod 21, and the outer ring of the second bearing is fixedly connected to the inner wall of the mounting hole; the third bearing is arranged in the supporting hole, the inner ring of the third bearing is fixedly connected to the rotating rod 21, and the outer ring of the third bearing is fixedly connected to the inner wall of the supporting hole.

[0063] like Figure 4 and Figure 5 As shown, a mounting bracket 4 is fixed to the inner wall of the housing 51. The drive assembly 52 includes a drive member 521, an eccentric wheel 522, a connecting shaft, and a connecting rod 523. The drive member 521 is fixed to the mounting bracket 4. The output shaft of the drive member 521 passes through the mounting bracket and extends toward the clamping arm 1. The eccentric wheel 522 is fixed to the output shaft of the drive member 521. The outer ring of the eccentric wheel 522 is rotatably connected to a connecting shaft. Two connecting rods 523 are provided corresponding to the two rotating rods 21. The ends of the two connecting rods 523 that are close to each other are rotatably mounted on the connecting shaft, and the other ends of the two connecting rods 523 are rotatably fixed to the rotating rod 21.

[0064] like Figure 6 As shown, a metal baffle 211 is fixedly mounted on the portion of one of the rotating rods 21 located within the accommodation space. A first sensor 61 is mounted on the outer side of the rotating rod 21 on which the baffle 211 is mounted. The baffle 211 is L-shaped. The sealed wafer handling device also includes a second sensor 62.

[0065] Before clamping the wafer, the baffle 211 is separated from the first sensor 61, and the clamping arm 1 is in an open state. When the wafer needs to be clamped, the driving member 521 is started, the driving member 521 drives the eccentric wheel 522 to rotate, and the eccentric wheel 522 drives the connecting shaft to rotate, such as Figure 5 As shown, the connecting shaft moves in an arc shape from bottom to top as the eccentric wheel 522 rotates, thereby driving the ends of the two connecting rods 523 close to the connecting shaft to move upward, thereby driving the rotating rods 21 on both sides to rotate in opposite directions, for example: Figure 2 As shown, in the direction of the wafer toward the shell, the rotating rod 21 on the right rotates clockwise, and the rotating rod 21 on the left rotates counterclockwise, and the two clamping arms 1 rotate following the corresponding rotating rod 21, and the clamping ends below the clamping arms 1 gradually approach until the protruding part of the baffle 211 rotates to the position of the first sensor 61. When the first sensor 61 senses the baffle 211, the control driving member 521 stops rotating. At this time, the clamping ends below the two clamping arms 1 are respectively clamped on both sides of the wafer, and the clamping arms 1 are in the clamping position.

[0066] The second sensor 62 is a laser sensor. During the clamping process, the second sensor 62 can be used to illuminate the wafer and determine whether there is a wafer in the two clamping ends based on whether the second sensor 62 receives light reflected from the wafer surface.

[0067] When the wafer needs to be put down, the driving member 521 is started in the opposite direction, and the driving member 521 drives the eccentric wheel 522 to rotate in the opposite direction. The eccentric wheel 522 drives the connecting shaft to move in an arc from top to bottom, thereby driving the ends of the two connecting rods 523 close to the connecting shaft to move downward, thereby driving the rotating rods 21 on both sides to rotate in the opposite direction of the rotation during the clamping process, for example: Figure 2 As shown, in the direction of the wafer toward the shell, the rotating rod 21 on the right rotates counterclockwise, and the rotating rod 21 on the left rotates clockwise, and the two clamping arms 1 rotate following the corresponding rotating rod 21, and the clamping end below the clamping arm 1 gradually moves away, the wafer moves out from the clamping end, and the driving member 521 stops rotating. At this time, the two clamping arms 1 are in an open state.

[0068] By setting the driving assembly 52 and cooperating with the driving assembly 52 and the rotating rod 21 , one motor can simultaneously drive the two rotating rods 21 to rotate synchronously, which has a high degree of automation, is easy to use, and has strong applicability.

[0069] During the rotation of the rotating rod 21, the inner rings of the first bearing 22, the second bearing and the third bearing also rotate accordingly. The first bearing 22, the second bearing and the third bearing play a role in supporting and reducing resistance, thereby increasing the service life of the entire device.

[0070] Specifically, a waist-shaped hole is provided at the connection position between the connecting rod 523 and the connecting shaft, and the connecting shaft is inserted into the waist-shaped hole. By providing the waist-shaped hole, the connecting shaft can simultaneously drive the two connecting rods 523 to move to prevent interference.

[0071] In this embodiment, if Figure 1 As shown, the sealed wafer handling device also includes a mobile structure 7, which is a six-axis robot. The output end of mobile structure 7 is connected to the housing 51 of the drive structure 5. Mobile structure 7 can drive the entire drive structure 5 and clamping arm 1 to move flexibly. The use of a six-axis robot in combination with a clamping mechanism can meet the current needs of cleaning equipment research and development. It has a smaller footprint and a more flexible motion trajectory, making the equipment layout more compact. Compared with the robot arm of traditional tank-type cleaning equipment, there is no need to replace the robot arm for changes in cleaning modules, reducing customers' operating costs and achieving better economic benefits.

[0072] A first seal 81 is installed at the connection between the rotating rod 21 and the housing 51, i.e., at the mounting hole. This first seal 81 is a combination of an oil seal and a sealing ring. The oil seal is installed on the side of the mounting hole near the accommodating space, isolating the accommodating space from the outer wall through the oil seal. A sealing ring is installed along the outer side of the mounting hole, along the circumference of the rotating rod 21, to prevent oil film overflow and sealing defects. A second seal 82 is installed at the connection between the movable structure 7 and the housing 51. This second seal 82 is also a sealing ring, such as an O-ring or a PTFE mounting seat. The first and second seals 81 and 82 seal the accommodating space. A gas filling hole 511 is provided at the top of the housing 51. An inert gas medium, such as helium or nitrogen, is introduced into the interior of the housing 51 through the gas filling hole 511 by an external gas filling device. The first gas pressure within the accommodating space is greater than the second gas pressure outside the housing 51. This creates a positive pressure within the accommodating space, preventing acid gas from entering and corroding internal components. After the inflation is completed, the inflation hole 511 is blocked with a blocking piece to prevent gas leakage.

[0073] In other feasible methods, the entire surface of the sealed wafer handling device is coated with Teflon, which can effectively prevent the corrosion of the shell by acid gas. If it is an organic process area, the entire shell will be electrolytically polished to reduce pollution.

[0074] The specific steps for using the sealed wafer handling device provided in this embodiment are as follows:

[0075] Before clamping the wafer, the baffle 211 is separated from the first sensor 61, and the clamping arm 1 is in the open state. When the wafer needs to be clamped, the movable structure 7 drives the remaining clamping structures to move to the position where the clamping is required, and the driving member 521 is started. The driving member 521 drives the eccentric wheel 522 to rotate, and the eccentric wheel 522 drives the connecting shaft to rotate. The connecting shaft moves in an arc from bottom to top, thereby driving the ends of the two connecting rods 523 close to the connecting shaft to move upward, thereby driving the rotating rods 21 on both sides to rotate in opposite directions. The two clamping arms 1 rotate following the corresponding rotating rods 21, and the clamping ends below the clamping arms 1 gradually approach until the protruding part of the baffle 211 rotates to the position of the first sensor 61. When the first sensor 61 senses the baffle 211, the driving member 521 is controlled to stop rotating. At this time, the clamping ends below the two clamping arms 1 are respectively clamped on both sides of the wafer, and the clamping arms 1 are in the clamping position. The second sensor 62 illuminates the wafer and determines whether there is a wafer in the two clamping ends by receiving light reflected from the wafer surface. When it is determined that there is a wafer in the clamping end, the operation continues. When it is determined that there is no wafer in the clamping end, the alarm device is activated to alarm.

[0076] When the wafer needs to be put down, the moving structure 7 drives the rest of the clamping structure to move to the position to be placed, and the driving member 521 is started in the opposite direction. The driving member 521 drives the eccentric wheel 522 to rotate in the opposite direction, and the eccentric wheel 522 drives the connecting shaft to move in an arc from top to bottom, thereby driving the two connecting rods 523 close to the end of the connecting shaft to move downward, thereby driving the rotating rods 21 on both sides to rotate in the opposite direction of rotation to the clamping process, and the two clamping arms 1 rotate following the corresponding rotating rods 21, and the clamping end below the clamping arm 1 gradually moves away, the wafer moves out from the clamping end, and the driving member 521 stops rotating.

[0077] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will readily appreciate that other variations or modifications based on the above descriptions are possible. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A sealed wafer handling device, characterized in that: include: A transmission structure (2), the transmission structure (2) comprising a rotating rod (21), a clamping arm (1) being mounted on the rotating rod (21); A driving structure (5), the driving structure (5) comprising a housing (51) and a driving assembly (52), the housing (51) having an accommodating space, the driving assembly (52) being installed in the accommodating space, the rotating rod (21) passing through the housing and being connected to the driving assembly (52); the driving structure (5) driving the rotating rod (21) to rotate so as to drive the clamping arm (1) to rotate and clamp the wafer; A sealing structure, comprising a first sealing member (81), the first sealing member (81) being arranged at a connection position between the rotating rod (21) and the housing (51) to seal the accommodating space; The accommodating space is filled with a gas medium, and a first gas pressure in the accommodating space is greater than a second gas pressure outside the shell (51) to prevent external gas from entering the accommodating space.

2. The sealed wafer transport device according to claim 1, wherein: There are two transmission structures (2), and the two transmission structures (2) are symmetrically arranged; The driving structure (5) is suitable for driving the two rotating rods (21) to rotate and drive the clamping ends of the two clamping arms (1) to approach each other so as to be suitable for clamping the wafer.

3. The sealed wafer transport device according to claim 1, wherein: The sealed wafer handling device further includes a mounting frame (4); The drive assembly (52) comprises: A driving member (521), the driving member (521) being mounted on the mounting frame (4); an eccentric wheel (522), the eccentric wheel (522) being mounted on the output shaft of the driving member (521), and a connecting shaft being further mounted on the eccentric wheel (522); a connecting rod (523), one end of the connecting rod (523) being connected to the connecting shaft, and the other end being connected to the rotating rod (21); The driving member (521) drives the eccentric wheel (522) to rotate, thereby driving the connecting rod (523) to drive the rotating rod (21) to rotate.

4. The sealed wafer transport device according to claim 3, wherein: Two connecting rods (523) are provided, one end of each of the two connecting rods (523) is connected to the two rotating rods (21) respectively, and the other end is mounted on the connecting shaft.

5. The sealed wafer transport device according to claim 2, wherein: The sealed wafer handling device further comprises a support plate (3), support holes are respectively provided on both sides of the support plate (3), and ends of the two rotating rods (21) away from the accommodating space are respectively inserted into the two support holes.

6. The sealed wafer transport device according to claim 1, wherein: The transmission structure (2) further comprises: A first bearing (22), wherein the first bearing (22) is connected to the end of the rotating rod (21) located in the accommodating space, the inner ring of the first bearing (22) is connected to the rotating rod (21), and the outer ring of the first bearing (22) is connected to the inner wall of the housing (51).

7. The sealed wafer transport device according to claim 1, wherein: The sealed wafer handling device further comprises a first sensor (61), wherein the first sensor (61) is arranged on one side of the transmission structure (2); A baffle (211) is mounted on at least one of the rotating rods (21), and the first sensor (61) is adapted to sense the position of the baffle (211) to determine whether the clamping arm (1) is in a clamping position.

8. The sealed wafer transport device according to claim 1, wherein: The sealed wafer transport device further comprises a second sensor (62), and the second sensor (62) is used to determine whether a wafer is clamped between the two clamping arms (1).

9. The sealed wafer transport device according to any one of claims 1 to 8, characterized in that: The sealed wafer handling device further comprises a moving structure (7), the housing (51) being mounted on the output end of the moving structure (7); and a second sealing member (82) is provided at the connection between the housing (51) and the output end of the moving structure (7).

10. The sealed wafer transport device according to claim 9, wherein: The first sealing member (81) is an oil seal, and the second sealing member (82) is a sealing ring.

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