Wafer conveying mechanism and semiconductor processing equipment

Abstract

The utility model relates to the technical field of semiconductor processing equipment, in particular to a wafer conveying mechanism and semiconductor processing equipment, and the wafer conveying mechanism comprises a ceramic manipulator which comprises a bearing part and a mounting part which are connected with each other; the first fixing block comprises a first connecting part and a second connecting part, the first connecting part is connected with the second connecting part, and the first connecting part and the mounting part are detachably fixed together; the second fixing block comprises a third connecting part extending in the second direction and a fourth connecting part extending in the first direction, the third connecting part is connected with the fourth connecting part, and the third connecting part and the second connecting part are detachably fixed together; the connecting plate is connected with the driving assembly, the driving assembly is used for driving the connecting plate to move in the third direction, and the connecting plate and the fourth connecting part are detachably fixed together. The ceramic manipulator is at least beneficial to reducing the dismounting difficulty of the ceramic manipulator.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor processing equipment, and in particular relates to a wafer conveying mechanism and semiconductor processing equipment. Background Art

[0002] A wafer is a chip used to make silicon semiconductor circuits. The starting material can be silicon. The main wafer processing methods are sheet processing and batch processing, which involves processing a single wafer or multiple wafers simultaneously.

[0003] During the wafer processing process, if manual handling of the wafers is used, not only will the processing efficiency be low, but the accuracy of the wafer reaching the designated processing position cannot be guaranteed, and the negative impact on the particle size in the environment is relatively large. Therefore, robots with a high degree of automation are often used to transport the wafers. However, the robots in the existing technology have defects such as complex structure, high cost, low strength, and difficult maintenance. Therefore, there is an urgent need to improve the robots. Utility Model Content

[0004] In view of this, the present invention aims to provide a battery pack shell frame structure, which is at least conducive to reducing the difficulty of disassembly of the ceramic robot.

[0005] In order to achieve the above-mentioned purpose, the technical solution of the utility model is achieved as follows:

[0006] On the one hand, the utility model provides a wafer conveying mechanism, including: a ceramic manipulator, the ceramic manipulator includes a supporting part and a mounting part connected to each other, the supporting part has a supporting surface for supporting the wafer; a first fixed block, the first fixed block includes a first connecting part extending along a first direction and a second connecting part extending along a second direction, the first connecting part is connected to the second connecting part, and the first connecting part and the mounting part are detachably fixed together; a second fixed block, the second fixed block includes a third connecting part extending along the second direction and a fourth connecting part extending along the first direction, the third connecting part is connected to the fourth connecting part, and the third connecting part and the second connecting part are detachably fixed together; a driving assembly and a connecting plate, the connecting plate is connected to the driving assembly, the driving assembly is used to drive the connecting plate to move along a third direction, and the connecting plate and the fourth connecting part are detachably fixed together.

[0007] Furthermore, any two directions among the first direction, the second direction and the third direction are perpendicular to each other.

[0008] Furthermore, the first fixed block also includes a first reinforcement portion, which is located in the corner area formed by the first connecting portion and the second connecting portion. Along the direction perpendicular to the thickness direction of the first reinforcement portion, the cross-sectional shape of the first reinforcement portion is a triangle. The first reinforcement portion has a first side surface and a second side surface connected to each other, the first side surface is fixed to the first connecting portion, and the second side surface is fixed to the second connecting portion.

[0009] Furthermore, the second fixed block also includes a second reinforcement portion, which is located in the corner area formed by the third connecting portion and the fourth connecting portion. Along the direction perpendicular to the thickness direction of the second reinforcement portion, the cross-sectional shape of the second reinforcement portion is a triangle, and the second reinforcement portion has a third side surface and a fourth side surface connected to each other. The third side surface is fixed to the third connecting portion, and the fourth side surface is fixed to the fourth connecting portion.

[0010] Furthermore, the carrying surface of the carrying part has a plurality of vacuum adsorption holes, and a vacuum pump is used to connect the vacuum adsorption holes through quick plugs to vacuum adsorb the wafer through the vacuum adsorption holes.

[0011] Furthermore, the mounting portion has a first mounting hole that passes through the mounting portion along the thickness direction of the mounting portion, and the first connecting portion has a second mounting hole at one end away from the second connecting portion. The second mounting hole passes through the first connecting portion along the thickness direction of the first connecting portion, and the first connecting member is matched with the corresponding first mounting hole and second mounting hole to fix the mounting portion to the first connecting portion.

[0012] Furthermore, the second connecting part has a third mounting hole that passes through the second connecting part along the thickness direction of the second connecting part, and the third connecting part has a fourth mounting hole that passes through the third connecting part along the thickness direction of the third connecting part. The second connecting part is matched with the corresponding third mounting hole and fourth mounting hole to fix the second connecting part to the third connecting part.

[0013] Furthermore, the wafer transport mechanism also includes: a connecting block, a slider and a guide rail, one end of the connecting plate is connected to the driving assembly, the end of the connecting plate away from the driving assembly is connected to the fourth connecting part, the middle area of ​​the connecting plate is connected to the slider through the connecting block, the slider is set on the guide rail, and the slider is movable along the third direction relative to the guide rail.

[0014] Furthermore, the connecting plate extends along the first direction, and the end of the connecting plate away from the driving assembly has a fifth mounting hole, the fifth mounting hole penetrates the connecting plate along the thickness direction of the connecting plate, and the fourth connecting part has a sixth mounting hole that penetrates the fourth connecting part along the thickness direction of the fourth connecting part, and the third connecting member is used to cooperate with the corresponding fifth mounting hole and sixth mounting hole to fix the fourth connecting part to the connecting plate.

[0015] On the other hand, the present invention further provides a semiconductor processing device, which includes: the above-mentioned wafer transport mechanism.

[0016] Compared with the prior art, the present invention can achieve the following beneficial effects: when the transport height of the wafer is different from the height of the connecting plate, if the height difference is small, the height of the entire wafer transport mechanism can be directly adjusted, but if the height difference is large, other mechanisms are likely to restrict the adjustment of the connecting plate and the drive assembly. Therefore, it is impossible to position the ceramic manipulator to the required height by simply adjusting the overall position, but the height adjustment must be achieved by bending. If a special ceramic manipulator with a bending structure is designed, the cost is high and it needs to be specially customized, which makes the procedure for obtaining parts complicated. The present invention utilizes a conventional sheet-type ceramic manipulator and adopts a first fixed The block and the second fixed block detachably fix the ceramic manipulator on the connecting plate, and make the height of the ceramic manipulator different from the height of the connecting plate. The driving component drives the connecting plate, and the connecting plate can drive the ceramic manipulator to move, thereby realizing the use of the ceramic manipulator to transport wafers at different horizontal heights from the connecting plate, which is conducive to reducing the installation difficulty of the ceramic manipulator in different scenarios, and the first fixed block and the ceramic manipulator, the first fixed block and the second fixed block, and the second fixed block and the connecting plate are all detachable fixing methods, so that the ceramic manipulator is easy to disassemble and replace or disassemble for maintenance. When other components are damaged, it is also easy to disassemble and maintain or disassemble and replace other components.

[0017] In addition, the wafer transport mechanism provided by the present invention has a simple structure, low cost, and high structural strength, and can perform stable wafer transport operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which constitute part of the present invention, are intended to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0019] Figure 1 This is a schematic structural diagram of a wafer transport mechanism according to an embodiment of the present invention;

[0020] Figure 2 A side view of a partial structure of a wafer transport mechanism according to an embodiment of the present invention;

[0021] Figure 3 This is an exploded view of the wafer transport mechanism described in an embodiment of the present invention.

[0022] Explanation of the accompanying drawings: 10, ceramic manipulator; 11, bearing part; 12, mounting part; 20, first fixed block; X, first direction; 21, first connecting part; Y, second direction; 22, second connecting part; 30, second fixed block; 31, third connecting part; 32, fourth connecting part; 50, driving assembly; Z, third direction; 23, first reinforcement part; 33, second reinforcement part; 40, connecting plate; 42, connecting block; 43, slider; 44, guide rail. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and do not constitute a limitation of the present invention.

[0024] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein can be combined with each other.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0026] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0027] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0028] refer to Figures 1 to 3 On the one hand, the utility model provides a wafer conveying mechanism, including: a ceramic manipulator 10, the ceramic manipulator 10 includes a carrying part 11 and a mounting part 12 connected to each other, the carrying part 11 having a carrying surface for carrying a wafer; a first fixed block 20, the first fixed block 20 includes a first connecting part 21 extending along a first direction X and a second connecting part 22 extending along a second direction Y, the first connecting part 21 is connected to the second connecting part 22, and the first connecting part 21 and the mounting part 12 are detachably fixed together; a second fixed block 30, the second fixed block 30 includes a third connecting part 31 extending along the second direction Y and a fourth connecting part 32 extending along the first direction X, the third connecting part 31 is connected to the fourth connecting part 32, and the third connecting part 31 and the second connecting part 22 are detachably fixed together; a driving assembly 50 and a connecting plate 40, the connecting plate 40 is connected to the driving assembly 50, the driving assembly 50 is used to drive the connecting plate 40 to move along a third direction Z, and the connecting plate 40 and the fourth connecting part 32 are detachably fixed together.

[0029] The ceramic manipulator 10 is detachably fixed to the connecting plate 40 by using the first fixing block 20 and the second fixing block 30, and the height of the ceramic manipulator 10 is different from the height of the connecting plate 40. The driving component 50 drives the connecting plate 40, and the connecting plate 40 can drive the ceramic manipulator 10 to move, thereby realizing the use of the ceramic manipulator 10 to transport wafers at different horizontal heights from the connecting plate 40, which is beneficial to reducing the installation difficulty of the ceramic manipulator 10 in different scenarios. The first fixing block 20 and the ceramic manipulator 10, the first fixing block 20 and the second fixing block 30, and the second fixing block 20 and the connecting plate 40 are all detachably fixed. In this way, it is not only convenient to disassemble the ceramic manipulator 20 for replacement or maintenance of the ceramic manipulator 10, but also convenient to disassemble and maintain other components when other components are damaged.

[0030] Furthermore, any two directions among the first direction X, the second direction Y and the third direction Z are perpendicular to each other.

[0031] In some embodiments of the present invention, the first direction X is a horizontal direction, the second direction Y is a vertical direction, the bearing surface is the upper surface of the bearing portion 11, the lower surface of the mounting portion 12 is in contact with and fixed to a portion of the inner surface of the first connecting portion 21, the outer surface of the second connecting portion 22 is in contact with and fixed to an outer surface of the third connecting portion 31, and the outer surface of the fourth connecting portion 32 is in contact with and fixed to a lower surface of the end of the connecting plate 40 away from the driving assembly 50. That is to say, the contact between the mounting portion 12 and the first fixed block 20, the contact between the first fixed block 20 and the second fixed block 30, and the contact between the second fixed block 30 and the connecting plate 40 are all surface-to-surface contacts, which is beneficial to improving the stability of the wafer transport mechanism.

[0032] In some embodiments of the present invention, the supporting portion 12 of the ceramic manipulator 10 includes a main plate extending along a first direction X and two supporting plates extending along a third direction Z. The main plate and the two supporting plates are connected. Specifically, the two supporting plates extend from the same side of the main plate in a direction away from the main plate, and the two supporting plates are arranged at intervals along the first direction X on the side of the main plate.

[0033] In some embodiments of the present invention, the carrying plate and the main body plate are an integrally formed structure.

[0034] Furthermore, the carrying surface of the carrying portion 11 has a plurality of vacuum adsorption holes, and a vacuum pump is used to connect the vacuum adsorption holes through quick plugs to vacuum adsorb the wafer through the vacuum adsorption holes.

[0035] In some embodiments of the present invention, the carrying surface of the carrying portion 11 has 8 vacuum adsorption holes, and each carrying plate is provided with 4 vacuum adsorption holes.

[0036] Furthermore, the first fixing block 20 also includes a first reinforcement portion 23. The first reinforcement portion 23 is located in the corner region formed by the first connecting portion 21 and the second connecting portion 22. The cross-section of the first reinforcement portion 23 is triangular in a direction perpendicular to the thickness of the first reinforcement portion 23. The first reinforcement portion 23 has a first side surface and a second side surface connected to each other. The first side surface is fixed to the first connecting portion 21, and the second side surface is fixed to the second connecting portion 22. The first reinforcement portion 23 is equivalent to adding a reinforcing rib between the first connecting portion 21 and the second connecting portion 22, which helps to improve the structural stability of the first fixing block 20.

[0037] In some embodiments of the present invention, the first connecting portion 21, the second connecting portion 22, and the first reinforcing portion 23 may be an integrally formed structure, which helps ensure greater structural stability of the first fixing block 20. In other embodiments of the present invention, the first connecting portion 21, the second connecting portion 22, and the first reinforcing portion 23 may also be connected by screwing, riveting, welding, snap-fit ​​connection, or other connection methods.

[0038] Furthermore, the second fixing block 30 includes a second reinforcement portion 33, which is located in the corner region formed by the third connecting portion 31 and the fourth connecting portion 32. The cross-section of the second reinforcement portion 33, perpendicular to the thickness of the second reinforcement portion 33, is triangular. The second reinforcement portion 33 has a third side surface and a fourth side surface connected to each other. The third side surface is fixed to the third connecting portion 31, and the fourth side surface is fixed to the fourth connecting portion 32. The second reinforcement portion 33 is equivalent to adding a reinforcing rib between the third connecting portion 31 and the fourth connecting portion 32, which helps to improve the structural stability of the second fixing block 30.

[0039] In some embodiments of the present invention, the third connecting portion 31, the fourth connecting portion 32, and the second reinforcing portion 33 are integrally formed, which helps ensure greater structural stability of the second fixing block 30. In other embodiments of the present invention, the third connecting portion 31, the fourth connecting portion 32, and the second reinforcing portion 33 can also be connected by screwing, riveting, welding, snap-fit ​​connection, or other connection methods.

[0040] Furthermore, the mounting portion 12 has a first mounting hole (not marked) that passes through the mounting portion 12 along the thickness direction of the mounting portion 12, and the first connecting portion 21 has a second mounting hole (not marked) at one end away from the second connecting portion 22. The second mounting hole passes through the first connecting portion 21 along the thickness direction of the first connecting portion 21, and a first connecting member (not shown) is used to cooperate with the corresponding first mounting hole and second mounting hole to fix the mounting portion 12 to the first connecting portion 21.

[0041] In some embodiments of the present invention, there are multiple corresponding first mounting holes and second mounting holes.

[0042] In some embodiments of the present invention, the first connecting member may be a screw or a bolt.

[0043] Furthermore, the second connection part 22 has a third mounting hole (not marked) that passes through the second connection part 22 along the thickness direction of the second connection part 22, and the third connection part 31 has a fourth mounting hole (not marked) that passes through the third connection part 31 along the thickness direction of the three connection parts. The second connection part 22 and the third connection part 31 are fixed by cooperating with the corresponding third mounting hole and fourth mounting hole using a second connecting member (not shown).

[0044] In some embodiments of the present invention, there are multiple corresponding third mounting holes and fourth mounting holes.

[0045] In some embodiments of the present invention, the second connecting member may be a screw or a bolt.

[0046] Furthermore, the wafer transport mechanism also includes a connecting block 42, a slider 43, and a guide rail 44. One end of the connecting plate 40 is connected to the drive assembly 50, and the end of the connecting plate 40 away from the drive assembly 50 is connected to the fourth connecting portion 32. The middle area of ​​the connecting plate 40 is connected to the slider 43 via the connecting block 42. The slider 43 is disposed on the guide rail 44 and is movable relative to the guide rail 44 along the third direction Z. This helps reduce the vibration of the ceramic robot 10. The connecting block 42, slider 43, and guide rail 44 make the movement of the ceramic robot 10 driven by the connecting plate 40 more stable, thereby facilitating stable wafer handling.

[0047] Furthermore, the connecting plate 40 extends along the first direction X, and the end of the connecting plate 40 away from the driving assembly 50 has a fifth mounting hole (not marked), and the fifth mounting hole penetrates the connecting plate 40 along the thickness direction of the connecting plate 40. The fourth connecting part 32 has a sixth mounting hole (not marked) that penetrates the fourth connecting part 32 along the thickness direction of the fourth connecting part 32. The third connecting member (not shown) is used to cooperate with the corresponding fifth mounting hole and sixth mounting hole to fix the fourth connecting part 32 to the connecting plate 40.

[0048] In some embodiments of the present invention, there are multiple corresponding fifth mounting holes and sixth mounting holes.

[0049] In some embodiments of the present invention, the third connecting member may be a screw or a bolt.

[0050] In some embodiments of the present invention, the driving assembly 50 may be a screw module for driving the ceramic robot 10 to move.

[0051] The utility model has the following advantages: it is conducive to reducing the installation difficulty of the ceramic manipulator in different scenarios; it is convenient for disassembling the ceramic manipulator; it utilizes a first fixed block with a first reinforcement part and a second fixed block with a second reinforcement part to realize the connection between the ceramic manipulator and the connecting plate, which is conducive to improving the structural stability of the wafer conveying mechanism, and is conducive to alleviating the shaking phenomenon during the wafer conveying process.

[0052] On the other hand, the present invention further provides a semiconductor processing device, which includes: the above-mentioned wafer transport mechanism.

[0053] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this disclosure can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution disclosed in this disclosure can be achieved. This is not a limitation herein.

[0054] The above specific embodiments do not limit the scope of protection of this utility model. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model shall be included within the scope of protection of this utility model.

Claims

1. A wafer transport mechanism, characterized in that: include: A ceramic manipulator (10), comprising a supporting portion (11) and a mounting portion (12) connected to each other, wherein the supporting portion (11) has a supporting surface for supporting a wafer; a first fixing block (20), the first fixing block (20) comprising a first connecting portion (21) extending along a first direction (X) and a second connecting portion (22) extending along a second direction (Y), the first connecting portion (21) being connected to the second connecting portion (22), and the first connecting portion (21) being detachably fixed to the mounting portion (12); a second fixing block (30), the second fixing block (30) comprising a third connecting portion (31) extending along the second direction (Y) and a fourth connecting portion (32) extending along the first direction (X), the third connecting portion (31) being connected to the fourth connecting portion (32), and the third connecting portion (31) being detachably fixed to the second connecting portion (22); A driving assembly (50) and a connecting plate (40), wherein the connecting plate (40) is connected to the driving assembly (50), the driving assembly (50) is used to drive the connecting plate (40) to move along a third direction (Z), and the connecting plate (40) is detachably fixed to the fourth connecting portion (32).

2. The wafer transport mechanism according to claim 1, wherein: Any two of the first direction (X), the second direction (Y) and the third direction (Z) are perpendicular to each other.

3. The wafer transport mechanism according to claim 1, wherein: The first fixing block (20) further includes a first reinforcing portion (23), the first reinforcing portion (23) being located in a corner region formed by the first connecting portion (21) and the second connecting portion (22), the cross-sectional shape of the first reinforcing portion (23) being triangular in a direction perpendicular to the thickness direction of the first reinforcing portion (23), the first reinforcing portion (23) having a first side surface and a second side surface connected to each other, the first side surface being fixed to the first connecting portion (21), and the second side surface being fixed to the second connecting portion (22).

4. The wafer transport mechanism according to claim 1 or 3, wherein: The second fixing block (30) further includes a second reinforcing portion (33), the second reinforcing portion (33) being located in a corner region formed by the third connecting portion (31) and the fourth connecting portion (32), the cross-sectional shape of the second reinforcing portion (33) being triangular in a direction perpendicular to the thickness direction of the second reinforcing portion (33), the second reinforcing portion (33) having a third side surface and a fourth side surface connected to each other, the third side surface being fixed to the third connecting portion (31), and the fourth side surface being fixed to the fourth connecting portion (32).

5. The wafer transport mechanism according to claim 1, wherein: The carrying surface of the carrying part (11) has a plurality of vacuum adsorption holes, and a vacuum pump is used to connect the vacuum adsorption holes through a quick plug, so as to vacuum adsorb the wafer through the vacuum adsorption holes.

6. The wafer transport mechanism according to claim 1, wherein: The mounting portion (12) has a first mounting hole that passes through the mounting portion (12) along the thickness direction of the mounting portion (12); the first connecting portion (21) has a second mounting hole at one end away from the second connecting portion (22); the second mounting hole passes through the first connecting portion (21) along the thickness direction of the first connecting portion (21); and a first connecting member is used to cooperate with the corresponding first mounting hole and second mounting hole to fix the mounting portion (12) and the first connecting portion (21).

7. The wafer transport mechanism according to claim 1, wherein: The second connecting portion (22) has a third mounting hole that passes through the second connecting portion (22) along the thickness direction of the second connecting portion (22), and the third connecting portion (31) has a fourth mounting hole that passes through the third connecting portion (31) along the thickness direction of the three connecting portions. The second connecting member is matched with the corresponding third mounting hole and the fourth mounting hole to fix the second connecting portion (22) and the third connecting portion (31).

8. The wafer transport mechanism according to claim 1, wherein: The wafer transport mechanism also includes: a connecting block (42), a slider (43) and a guide rail (44), one end of the connecting plate (40) is connected to the driving component (50), the end of the connecting plate (40) away from the driving component (50) is connected to the fourth connecting portion (32), the middle area of ​​the connecting plate (40) is connected to the slider (43) through the connecting block (42), the slider (43) is arranged on the guide rail (44), and the slider (43) is movable relative to the guide rail (44) along the third direction (Z).

9. The wafer transport mechanism according to claim 1, wherein: The connecting plate (40) extends along the first direction (X), and the end of the connecting plate (40) away from the driving assembly (50) has a fifth mounting hole, and the fifth mounting hole passes through the connecting plate (40) along the thickness direction of the connecting plate (40), and the fourth connecting portion (32) has a sixth mounting hole passing through the fourth connecting portion (32) along the thickness direction of the fourth connecting portion (32), and a third connecting member is used to cooperate with the corresponding fifth mounting hole and the sixth mounting hole to fix the fourth connecting portion (32) to the connecting plate (40).

10. A semiconductor processing equipment, characterized in that: include: The wafer transport mechanism according to any one of claims 1 to 9.

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