Environment-friendly soldering tin wire

Abstract

The utility model discloses an environment-friendly soldering tin wire which comprises an inner core layer, a lead-free tin layer, a soldering aid layer and an anti-oxidation layer, and the lead-free tin layer is arranged on the outer surface of the inner core layer. The soldering-aid layers are arranged between the lead-free tin layer and the inner core layer, and are arranged around the circumferential direction of the inner core layer at intervals, so that a gap is formed between the inner core layer and the lead-free tin layer; and the anti-oxidation layer is coated on the surface of the lead-free tin layer. According to the utility model, the surface of the lead-free tin layer is coated with the anti-oxidation layer, so that the oxidation of the tin wire can be reduced, and heat accumulation can be reduced through a gap formed by the weld-aid layers which are arranged at intervals in the welding and using process of the tin wire, so that the problem of tin explosion can be avoided, and the safety is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of tin wires, in particular to an environmentally friendly soldering tin wire. Background Art

[0002] Lead-free tin wire is a composite material composed of multiple metal elements that can provide good conductivity and plasticity. During electronic soldering, lead-free tin wire is usually used in conjunction with a soldering iron to add molten tin wire as a filler metal to the surface and gaps of electronic components, thereby soldering and fixing the electronic components. In related technologies, existing tin wire is prone to problems such as oxidation during storage, resulting in tin explosion during the soldering process and insufficient safety. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems in the related art to a certain extent. To this end, one purpose of the present invention is to provide an environmentally friendly solder wire, comprising:

[0004] inner core layer;

[0005] a lead-free tin layer, the lead-free tin layer being provided on the outer surface of the inner core layer;

[0006] A soldering layer, the soldering layer being provided between the lead-free tin layer and the inner core layer and being spaced apart in a circumferential direction around the inner core layer to form a gap between the inner core layer and the lead-free tin layer;

[0007] An anti-oxidation layer is coated on the surface of the lead-free tin layer.

[0008] Preferably, the diameter of the inner core layer is 0.11 mm-0.32 mm.

[0009] Preferably, the radial dimension of the lead-free tin layer is 0.2 mm-0.41 mm.

[0010] Preferably, a reinforcing core is provided in the gap, and the reinforcing core is interference fit with the gap.

[0011] Preferably, the diameter of the reinforcing core is larger than the radial dimension of the soldering layer.

[0012] Preferably, the inner core layer, the lead-free tin layer and the reinforcing core are made of the same material.

[0013] Preferably, the thickness of the anti-oxidation layer is 0.02 mm to 0.05 mm.

[0014] Preferably, the anti-oxidation layer is made of copper oxide.

[0015] The above solution of the utility model includes at least the following beneficial effects:

[0016] The environmentally friendly solder wire provided by the utility model can reduce the oxidation of the tin wire by coating an anti-oxidation layer on the surface of the lead-free tin layer. In addition, during the soldering process of the tin wire, the gaps formed by the interval-arranged soldering layers can reduce heat accumulation, thereby avoiding the problem of tin frying and improving safety.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0019] Figure 1 It is a cross-sectional view of the environmentally friendly solder wire provided in an embodiment of the present utility model.

[0020] Figure 2 This is another cross-sectional view of the environmentally friendly solder wire provided in an embodiment of the present invention.

[0021] Description of Figure Numbers:

[0022] 10. Inner core layer; 20. Lead-free tin layer; 30. Soldering layer; 40. Gap; 50. Anti-oxidation layer; 60. Strengthening core.

[0023] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0024] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0027] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integral connection; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0028] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0029] The environmentally friendly solder wire according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0030] Reference Figure 1 and Figure 2As shown, the environmentally friendly solder wire provided in the embodiment of the present invention includes: an inner core layer 10, a lead-free tin layer 20, a soldering layer 30 and an anti-oxidation layer 50. The lead-free tin layer 20 is arranged on the outer surface of the inner core layer 10; the soldering layer 30 is arranged between the lead-free tin layer 20 and the inner core layer 10, and is spaced around the circumferential direction of the inner core layer 10 to form a gap 40 between the inner core layer 10 and the lead-free tin layer 20; the anti-oxidation layer 50 is coated on the surface of the lead-free tin layer 20.

[0031] During the soldering process, the electric soldering iron melts the tin wire and concentrates it on the soldering point. The gap 40 formed between the inner core layer 10 and the lead-free tin layer 20 can reduce the heat on the soldering point, allowing part of the heat to enter the gap 40, thereby avoiding problems such as tin frying caused by heat concentration.

[0032] The environmentally friendly solder wire provided by the present invention can reduce the oxidation of the tin wire by coating the anti-oxidation layer 50 on the surface of the lead-free tin layer 20. During the soldering process of the tin wire, the gaps 40 formed by the spaced-apart soldering layers 30 can reduce heat accumulation, thereby avoiding the problem of tin frying and improving safety.

[0033] Specifically, the diameter of the inner core layer 10 is 0.11mm-0.32mm, and the radial dimension of the lead-free tin layer 20 is 0.2mm-0.41mm. Among them, the soldering layer 30 can be made of materials such as rosin, so that during welding, the inner core layer 10 and the lead-free tin layer 20 can be melted at the same time and assisted by the soldering layer 30 to improve the welding quality. It is understandable that the diameter of the inner core layer 10 and the radial dimension of the lead-free tin layer 20 can be set according to actual needs. For example, the diameter of the inner core layer 10 can be 0.15mm, and the diameter of the lead-free tin layer 20 can be 0.35mm.

[0034] As a preferred embodiment, a reinforcing core 60 is provided in the gap 40 . The reinforcing core 60 is interference fit with the gap 40 , and the diameter of the reinforcing core 60 is larger than the radial dimension of the soldering layer 30 .

[0035] In this embodiment, a reinforcing core 60 is provided in the gap 40, so that the tin wire is not easily broken during use, thereby ensuring higher overall strength. It can be understood that the inner core layer 10, the lead-free tin layer 20 and the reinforcing core 60 are made of the same material, for example, they can be made of tin-copper alloy and other materials. During welding, the inner core layer 10, the lead-free tin layer 20 and the reinforcing core 60 can be melted at the same time to be welded on the circuit board. At the same time, the gap 40 can also be used to reduce heat accumulation, thereby reducing tin frying and improving safety during the welding process.

[0036] Optionally, the thickness of the anti-oxidation layer 50 is 0.02 mm to 0.05 mm, and the anti-oxidation layer 50 is made of copper oxide. The anti-oxidation layer 50 can be made of copper oxide or other materials, thereby improving the oxidation resistance of the tin wire, reducing oxidation of the tin wire, and avoiding oxidation during soldering that affects soldering quality, thereby improving the oxidation resistance of the tin wire.

[0037] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0038] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the utility model concept, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An environmentally friendly solder wire, characterized in that: include: inner core layer; a lead-free tin layer, the lead-free tin layer being provided on the outer surface of the inner core layer; A soldering layer, the soldering layer being provided between the lead-free tin layer and the inner core layer and being spaced apart in a circumferential direction around the inner core layer to form a gap between the inner core layer and the lead-free tin layer; An anti-oxidation layer is coated on the surface of the lead-free tin layer.

2. The environmentally friendly solder wire according to claim 1, characterized in that: The diameter of the inner core layer is 0.11 mm to 0.32 mm.

3. The environmentally friendly solder wire according to claim 1, characterized in that: The radial dimension of the lead-free tin layer is 0.2 mm to 0.41 mm.

4. The environmentally friendly solder wire according to claim 1, characterized in that: A reinforcing core is provided in the gap, and the reinforcing core is interference-fitted with the gap.

5. The environmentally friendly solder wire according to claim 4, characterized in that: The diameter of the reinforcing core is greater than the radial dimension of the soldering layer.

6. The environmentally friendly solder wire according to claim 4, characterized in that: The inner core layer, the lead-free tin layer and the reinforcing core are made of the same material.

7. The environmentally friendly solder wire according to claim 1, characterized in that: The thickness of the anti-oxidation layer is 0.02 mm to 0.05 mm.

8. The environmentally friendly solder wire according to claim 1, characterized in that: The anti-oxidation layer is made of copper oxide.

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