Transfer device for semiconductor silicon epitaxial wafer

Abstract

The utility model relates to the technical field of semiconductor material transportation, in particular to a transfer device for semiconductor silicon epitaxial wafers, which comprises a protection box body, the left side and the right side of the protection box body are fixedly provided with buckle plates, the inside of the protection box body is fixedly provided with limiting blocks, and the side end part of the protection box body is rotatably provided with a fixed handrail. A top sealing cover is rotationally installed at the upper end of the protection box body, and a second buffering cushion is installed at the lower end of the top sealing cover. According to the improved transfer device for the semiconductor silicon epitaxial wafer, a material is placed through a placing box and a first buffer pad, limited and blocked through a blocking plate, limited and fixed through an upper protection box body, an extrusion plate and a top sealing cover, and buffered through cooperation of positions such as an upper anti-skid pad, the first buffer pad and a second buffer pad; and when the device is used, materials can be rapidly placed and limited, meanwhile, the materials are protected and fixed, the stability during transportation is improved, and therefore the integrity of the materials is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor material transportation, in particular to a transfer device for semiconductor silicon epitaxial wafers. Background Art

[0002] Epitaxy is a type of semiconductor manufacturing process. During this process, the bottom layer of a silicon wafer consists of a P-type substrate (sometimes with a buried layer). A single-crystalline silicon layer, called the epitaxial layer, is then grown on top of the substrate. Subsequently, base and emitter regions are implanted into the epitaxial layer. This essentially forms a vertical NPN transistor structure: the epitaxial layer serves as the collector region, while the base and emitter regions are located above the epitaxial layer. An epitaxial wafer is a silicon wafer with the epitaxial layer pre-grown on the substrate. Because some manufacturers only perform post-epitaxy processes, they purchase epitaxial wafers already processed by others for subsequent processing.

[0003] At present, existing semiconductor silicon epitaxial wafers need to be transported to the use site for installation and use after production. The existing transportation method mostly stores them in a storage box and stacks them with cushioning materials such as foam. This placement method is prone to collision between the materials stored inside and the storage box due to bumpy roads during transportation, thereby causing damage to the materials and affecting product quality. Utility Model Content

[0004] The purpose of the present invention is to provide a transport device for semiconductor silicon epitaxial wafers to solve the problems raised in the above-mentioned background technology. To achieve the above-mentioned purpose, the present invention provides the following technical solution: a transport device for semiconductor silicon epitaxial wafers, comprising a protective box, wherein snap plates are fixedly installed on the left and right sides of the protective box, a limit block is fixedly installed inside the protective box, an extrusion plate is slidably installed inside the protective box, a placement box is slidably installed inside the protective box, a fixed handrail is rotatably installed on the side end of the protective box, a top cover is rotatably installed on the upper end of the protective box, and a second buffer pad is installed on the lower end of the top cover.

[0005] Further preferably, fixing columns are fixedly installed on both the left and right sides of the protection box body, and bolts are installed on the side ends of each of the fixing columns.

[0006] Further preferably, a bracket is sleeved on the outer surface of each of the fixing columns, a fixed handrail is installed between each of the brackets, and each of the brackets is connected to the fixing column by a bolt.

[0007] Further preferably, a threaded rotating rod is rotatably mounted on the side end portion of the protection box body, an extrusion plate is rotatably mounted on the side end portion of the threaded rotating rod, and a rotating handle is fixedly mounted on the side end portion of the threaded rotating rod.

[0008] Further preferably, a connecting ring is fixedly installed on the upper end of the protective box body, a fixed pull rod is fixedly installed on the upper end of the top cover, fixed blocks are fixedly installed on the left and right sides of the top cover, and a snap support rod is fixedly installed on the lower end of each fixed block.

[0009] Further preferably, an anti-slip pad is fixedly installed on the inner wall of the protection box, and a first buffer pad is fixedly installed inside the placement box.

[0010] Further preferably, the first buffer pad drives the upper end portion to rotate and is installed with two pillars, and the outer surface of each pillar is provided with a blocking plate.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] In the utility model, the material is placed on the blocking plate through the placement box and the first buffer pad, and then the protection box, the extrusion plate and the top cover are used for limiting and fixing. Then, the anti-slip pad, the first buffer pad, the second buffer pad and other positions are used for buffering, so that the device can quickly place and limit the material when in use, and at the same time protect and fix it, thereby improving stability during transportation and ensuring the integrity of the material.

[0013] In the utility model, the protective box, fixed handrail, threaded rotating rod and placement box, first buffer pad, top cover, snap support rod and other parts are designed to cooperate with each other, so that the device can be quickly assembled after ten years of use, thereby facilitating the rapid disassembly and replacement of the device during subsequent maintenance, thereby increasing the service life of the device and improving the use effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the protective box structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the fixed handrail structure of the utility model;

[0016] Figure 3 This is a schematic diagram of the structure of the placement box of the utility model;

[0017] Figure 4 This is a schematic diagram of the top cover structure of the utility model.

[0018] In the figure: 1. Protective box body; 11. Fixed column; 12. Bolt; 13. Snap plate; 14. Bracket; 15. Fixed handrail; 16. Limit block; 17. Connecting ring; 18. Anti-slip pad; 2. Threaded rotating rod; 21. Extrusion plate; 22. Turning handle; 23. Placement box; 24. First buffer pad; 25. Support column; 26. Blocking plate; 3. Top cover; 31. Fixed pull rod; 32. Second buffer pad; 33. Fixed block; 34. Snap support rod. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technical personnel in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0020] See also Figures 1 to 4 The utility model provides a technical solution: a transfer device for semiconductor silicon epitaxial wafers, including a protective box 1, a snap plate 13 fixedly installed on the left and right sides of the protective box 1, a limit block 16 fixedly installed inside the protective box 1, an extrusion plate 21 slidably installed inside the protective box 1, a placement box 23 slidably installed inside the protective box 1, a fixed handrail 15 rotatably installed on the side end of the protective box 1, a top cover 3 rotatably installed on the upper end of the protective box 1, and a second buffer pad 32 installed on the lower end of the top cover 3.

[0021] In this embodiment, Figure 1 and Figure 2 As shown, fixing columns 11 are fixedly installed on both sides of the protective box 1, and bolts 12 are installed on the side ends of each fixing column 11. This structure can quickly install and use parts such as the bracket 14 by limiting the fixing columns 11 installed on both sides of the protective box 1 with the bolts 12.

[0022] In this embodiment, Figure 1 and Figure 2 As shown, the outer surface of each fixed column 11 is provided with a bracket 14, and the same fixed handrail 15 is installed between each bracket 14. Each bracket 14 is connected to the fixed column 11 by a bolt 12. This structure can pull the fixed handrail 15, thereby cooperating with the bracket 14, the fixed column 11 and other parts to drive the protective box 1 to move together.

[0023] In this embodiment, Figure 1 and Figure 2 As shown, a threaded rotating rod 2 is rotatably installed on the side end of the protective box body 1, an extrusion plate 21 is rotatably installed on the side end of the threaded rotating rod 2, and a rotating handle 22 is fixedly installed on the side end of the threaded rotating rod 2. This structure can drive the threaded rotating rod 2 to rotate by rotating the rotating handle 22 and then cooperate with the protective box body 1 to drive the extrusion plate 21 to slide.

[0024] In this embodiment, Figure 1 、 Figure 2 and Figure 4As shown, a connecting ring 17 is fixedly installed on the upper end of the protective box body 1, a fixed pull rod 31 is fixedly installed on the upper end of the top cover 3, and fixed blocks 33 are fixedly installed on the left and right sides of the top cover 3. The lower end of each fixed block 33 is fixedly installed with a snap support rod 34. This structure can cooperate with the side groove of the top cover 3 through the connecting ring 17 installed on the top of the protective box body 1, so that the top cover 3 can be quickly installed and used.

[0025] In this embodiment, Figure 1 、 Figure 2 and Figure 3 As shown, the inner wall of the protective box 1 is fixedly installed with an anti-slip pad 18, and the interior of the placement box 23 is fixedly installed with a first buffer pad 24. This structure can quickly place the material while providing buffer protection through the first buffer pad 24 installed inside the placement box 23.

[0026] In this embodiment, Figure 1 and Figure 3 As shown, the first buffer pad 24 drives the upper end to rotate and is installed with two pillars 25, and the outer surface of each pillar 25 is provided with a blocking plate 26. This structure can limit the material placed inside the first buffer pad 24 by rotating the blocking plate 26 along the pillar 25, thereby facilitating its subsequent placement and fixation.

[0027] The use method and advantages of the utility model: The semiconductor silicon epitaxial wafer transfer device, when in use, works as follows:

[0028] like Figure 1 、 Figure 2 、 Figure 3 and Figure 4As shown, when using, the user first places the device on a horizontal surface, picks up the protective box 1, installs the fixing columns 11 on the left and right sides of the protective box 1, installs the bolts 12 on the side ends of each fixing column 11, installs the brackets 14 on the outer surface of each fixing column 11, installs the fixed handrails 15 between each bracket 14, then installs the snap plates 13 on both sides of the protective box 1, installs the upper limit block 16 inside the protective box 1, installs the connecting ring 17 on the top of the protective box 1, installs the anti-slip pad 18 on the inner wall of the protective box 1, then picks up the threaded rotating rod 2, Install the extrusion plate 21 on the side end of the threaded rotating rod 2, install the rotating handle 22 on the side end of the threaded rotating rod 2, then install the assembled threaded rotating rod 2 inside the protective box 1 along the side end opening of the protective box 1, then pick up the placement box 23, install the first buffer pad 24 inside the placement box 23, install two pillars 25 above the first buffer pad 24, install a blocking plate 26 on the outer surface of each pillar 25, then place the assembled placement box 23 inside the protective box 1, then pick up the top cover 3, install the fixing rod 31 above the top cover 3, and The second buffer pad 32 is installed at the bottom, and the fixing blocks 33 are installed on the left and right sides of the top cover 3. Then, the buckle support rod 34 is installed under each fixing block 33. Then, the assembled top cover 3 is connected to the protective box 1 along the connecting ring 17. When the user needs to use the device, the user places the semiconductor silicon epitaxial wafer to be transported inside the first buffer pad 24 along the inner groove of the first buffer pad 24, and then rotates the blocking plate 26 to block the opening position above the first buffer pad 24. After assembling multiple placement boxes 23, the user places the semiconductor silicon epitaxial wafer to be transported along the protective box 1 along the inner groove of the first buffer pad 24. 1 The limit block 16 installed inside is placed and installed with the groove or protrusion at the side end of the placement box 23. Then, the rotating handle 22 is rotated, and the rotating handle 22 drives the threaded rotating rod 2 to rotate, thereby pushing the extrusion plate 21 to squeeze and fix the placement box 23. Then, the fixing rod 31 is pulled, and the fixing rod 31 drives the top cover 3 to rotate along the connecting ring 17, so that the top cover 3 is rotated to the top of the protective box body 1. Then, the top cover 3 cooperates with the buckle support rods 34 on both sides to connect and fix it with the buckle plate 13. Then, the user picks up the device along the fixed handrail 15 for easy carrying.

[0029] The above shows and describes the basic principles, main features, and advantages of the present invention. Persons skilled in the art should understand that the present invention is not limited to the above-described embodiments. The above-described embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A transport device for semiconductor silicon epitaxial wafers, comprising a protective box (1), characterized in that: The left and right sides of the protection box (1) are fixedly mounted with snap plates (13), the interior of the protection box (1) is fixedly mounted with a limit block (16), the interior of the protection box (1) is slidably mounted with an extrusion plate (21), the interior of the protection box (1) is slidably mounted with a placement box (23), the side ends of the protection box (1) are rotatably mounted with a fixed handrail (15), the upper end of the protection box (1) is rotatably mounted with a top cover (3), and the lower end of the top cover (3) is mounted with a second buffer pad (32).

2. The semiconductor silicon epitaxial wafer transfer device according to claim 1, wherein: The left and right sides of the protection box (1) are fixedly mounted with fixing columns (11), and the side end of each fixing column (11) is mounted with a bolt (12).

3. The semiconductor silicon epitaxial wafer transfer device according to claim 2, wherein: The outer surface of each fixing column (11) is sleeved with a bracket (14), a fixed handrail (15) is installed between each bracket (14), and each bracket (14) is connected to the fixing column (11) through a bolt (12).

4. The semiconductor silicon epitaxial wafer transfer device according to claim 1, wherein: A threaded rotating rod (2) is rotatably mounted on the side end of the protection box body (1), an extrusion plate (21) is rotatably mounted on the side end of the threaded rotating rod (2), and a rotating handle (22) is fixedly mounted on the side end of the threaded rotating rod (2).

5. The semiconductor silicon epitaxial wafer transfer device according to claim 1, wherein: A connecting ring (17) is fixedly mounted on the upper end of the protection box body (1), a fixed pull rod (31) is fixedly mounted on the upper end of the top cover (3), fixed blocks (33) are fixedly mounted on both the left and right sides of the top cover (3), and a buckle support rod (34) is fixedly mounted on the lower end of each fixed block (33).

6. The semiconductor silicon epitaxial wafer transfer device according to claim 1, wherein: An anti-slip pad (18) is fixedly installed on the inner wall of the protection box (1), and a first buffer pad (24) is fixedly installed inside the placement box (23).

7. The semiconductor silicon epitaxial wafer transfer device according to claim 6, wherein: The first buffer pad (24) drives the upper end portion to rotate and is provided with two pillars (25), and the outer surface of each pillar (25) is sleeved with a blocking plate (26).

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