Support plate frame

Abstract

The utility model relates to a support plate frame, belongs to the technical field of photovoltaic manufacturing, particularly provides a support plate frame, and aims to solve the problem that a support plate in the prior art is prone to inaccurate placement of battery pieces when the battery pieces are taken and placed due to temperature rise deformation. In order to achieve the purpose, the carrier plate frame comprises a frame assembly and a carrier plate, the carrier plate is arranged on the frame assembly, the carrier plate is configured to be provided with a plurality of bearing frames used for bearing silicon wafers, the bearing frames are provided with bearing portions and positioning portions, the bearing portions are configured to be planes used for bearing the silicon wafers, and the positioning portions are configured to be planes used for positioning the silicon wafers. And one side, close to the bearing part, of the positioning part is configured to be a continuous inclined surface and is connected with the plane of the bearing part. By adopting the structure, even if the carrier plate is slightly deformed, the silicon wafer can slide to a more stable position under the action of gravity when the silicon wafer is placed in the bearing frame of the carrier plate.

Description

Technical Field

[0001] The utility model relates to a board carrier frame, belongs to the technical field of photovoltaic manufacturing, and specifically provides a board carrier frame. Background Art

[0002] The carrier used in the existing heterojunction cell PVD (physical vapor deposition) process consists of a frame, carrier plate, and ribbed plates. Adjustable sub-carrier slots allow for wafer size adjustments. Due to the high temperatures in the main equipment's heating chamber, the carrier plate undergoes some deformation, significantly impacting wafer placement and retrieval in automated loading and unloading equipment.

[0003] Existing technical solutions to carrier deformation include changing the carrier material (based on actual usage, stainless steel is the most cost-effective material), splitting the carrier into multiple sub-carrier frames, and adding auxiliary frames to reduce carrier deformation. Due to the influence of material price factors, existing technical solutions often use multi-segment segmentation to control deformation. The silicon wafer slot frame in the middle of the carrier is trapezoidal in shape, and the automated placement of wafers requires precise positioning. Carrier deformation can easily cause the battery cells to overlap or fall out during placement, which can easily lead to risks such as overlapping, fragmentation, and color difference of the battery cells.

[0004] Accordingly, the art requires a new carrier frame to solve the above problems. Utility Model Content

[0005] The utility model aims to solve the above technical problem, that is, to solve the problem in the prior art that the carrier plate is deformed due to temperature increase, which causes the battery cells to be placed inaccurately when the battery cells are taken out and placed.

[0006] In a first aspect, the utility model provides a carrier frame, which comprises: a frame assembly and a carrier, wherein the carrier is arranged on the frame assembly, the carrier is configured to have multiple carrying frames for carrying silicon wafers, the carrying frames are provided with a carrying portion and a positioning portion, the carrying portion is configured to be a plane for carrying silicon wafers, the side of the positioning portion close to the carrying portion is configured to be a continuous inclined surface and connected to the plane of the carrying portion, the top end of the positioning portion is configured to be a line structure so that the positioning portion can be in line contact with the silicon wafer, and the angle between the continuous inclined surface of the positioning portion and the carrying portion is suitable for allowing the silicon wafer to slide along the continuous inclined surface to the plane of the carrying portion.

[0007] In a specific embodiment of the above-mentioned carrier frame, the continuous inclined surface configured as a linear inclined surface is formed on a side of the positioning portion close to the carrying portion.

[0008] In a specific embodiment of the above-mentioned carrier frame, the cross section of the positioning portion shared by adjacent carrier frames and perpendicular to the length direction of the positioning portion is triangular.

[0009] In a specific embodiment having the above-mentioned carrier frame, a chamfer is provided on the inner side of the carrier portion facing away from the silicon wafer.

[0010] In a specific embodiment having the above-mentioned carrier frame, the frame assembly includes:

[0011] The main frame has an inner area configured as a plurality of sub-frame areas, and the carrier plates are provided in a plurality and correspond one to one with the sub-frame areas.

[0012] In a specific embodiment of the carrier frame, the main frame includes an outer frame and a load-bearing beam. The load-bearing beam is provided in plurality and is arranged inside the outer frame to configure the outer frame into a plurality of sub-frame areas.

[0013] In a specific embodiment having the above-mentioned carrier frame, the outer frame and the load-bearing beam are both detachably connected to the carrier.

[0014] In a specific embodiment of the carrier frame, the frame assembly further comprises a pressure strip connected to the outer frame and / or the load-bearing beam to abut against an edge of the carrier.

[0015] In a specific embodiment of the above-mentioned carrier frame, the continuous inclined surface configured as a curved inclined surface is formed on a side of the positioning portion close to the carrying portion.

[0016] In a specific embodiment having the above-mentioned carrier frame, the curved inclined surface is a convex surface close to the silicon wafer; or

[0017] The inclined surface of the curve is a concave surface close to the silicon wafer.

[0018] Under the condition of adopting the above-mentioned technical solution, the carrier frame disclosed in the present invention optimizes the original structure of transition from a plane to an inclined plane and then to a plane into a continuous inclined plane directly connected to the plane to solve the problem caused by the thermal deformation of the carrier. With the above-mentioned structure, even if the carrier is slightly deformed, when the silicon wafer is placed in the carrier frame of the carrier, the silicon wafer will slide to the flat bearing position under the action of gravity, so that the silicon wafer is in a more stable bearing state, avoiding the trapezoidal cross-section structure, which is prone to inaccurate placement of the battery cell position and even the possibility of overlapping or falling off due to the existence of the trapezoidal top plane. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The preferred embodiments of the present invention are described below with reference to the accompanying drawings, in which:

[0020] Figure 1 It is a schematic diagram of the cross-sectional structure of a load-bearing frame in the prior art;

[0021] Figure 2 This is a schematic diagram of the overall structure of the carrier plate frame in the utility model;

[0022] Figure 3 This is a schematic cross-sectional view of one embodiment of the carrier frame of the present invention;

[0023] Figure 4 This is a schematic cross-sectional view of another embodiment of the carrier frame of the present invention;

[0024] Figure 5 It is a schematic cross-sectional structure diagram of another embodiment of the carrying frame in the present utility model.

[0025] Among them, 1. frame assembly, 2. carrier plate, 3. load-bearing frame, 4. load-bearing part, 5. positioning part, 6. chamfer, 7. main frame, 8. outer frame, 9. load-bearing beam, 10. pressure strip. DETAILED DESCRIPTION

[0026] The following describes preferred embodiments of the present invention with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are intended only to illustrate the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. Those skilled in the art may adjust these embodiments as needed to suit specific applications.

[0027] It should be noted that in the description of this utility model, terms such as "upper," "lower," "left," "right," "inner," and "outer" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is for ease of description only and does not indicate or imply that the relevant devices or components must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, ordinal numbers such as "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0028] Furthermore, it should be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "installation" and "connection" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integral connection; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0029] like Figure 1As shown in the figure, the carrier for placing solar cells in the existing HJT PVD process is composed of a frame, a carrier, and a ribbed plate. The carrier is a hollow structure, and the cross-section of the carrier frame is a flat structure similar to a trapezoid. Because the carrier is used to place many silicon wafers at a time during the coating process, the carrier frame will eventually form a flat, long strip. Therefore, when passing through the heating chamber process, the sub-frame is easily deformed due to high temperature factors, which affects the position of the silicon wafers during automated placement and creates the risk of wafer drop and overlap. After the overlap, the coating in the process chamber will cause color difference, diffraction, and other adverse process effects.

[0030] Based on the above problems, the cross-section of the carrier frame is optimized in combination with the positioning method when placing the silicon wafer to avoid deformation of the carrier frame. The automated placement equipment will overlap the silicon wafer at the top flat position of the trapezoidal cross-section of the carrier frame, making it difficult for the silicon wafer to achieve automatic positioning based on the inclined positioning structure.

[0031] like Figure 2-5 As shown, the utility model proposes a PVD carrier frame, the PVD carrier 2 frame includes: a frame assembly 1 and a carrier 2, wherein the carrier 2 is arranged on the frame assembly 1, the carrier 2 is configured to have multiple carrier frames 3 for carrying silicon wafers, the carrier frame 3 is provided with a carrying part 4 and a positioning part 5, the carrying part 4 is configured as a plane for carrying silicon wafers, the side of the positioning part 5 close to the carrying part 4 is configured as a continuous inclined surface and connected to the plane of the carrying part 4, the top of the positioning part 5 is configured as a line structure, and the angle between the continuous inclined surface of the positioning part 5 and the carrying part 4 is suitable for making the silicon wafer slide along the continuous inclined surface to the plane of the carrying part 4.

[0032] In this embodiment, the PVD carrier 2 frame is based on the frame assembly 1, and the carrier 2 is installed on the frame assembly 1. The carrier 2 is used to carry silicon wafers. There are generally multiple silicon wafers and their sizes are smaller than those of the carrier 2. Therefore, multiple hollow structures are set on the carrier 2 to form a carrying frame 3 for carrying silicon wafers. The silicon wafers are placed in the carrying frame 3 under the transportation of automated placement equipment. The carrying frame 3 can enable the silicon wafers to accurately slide into the center of the carrying frame 3 under the action of their own gravity to achieve accurate positioning.

[0033] Specifically, taking the frame cross-section of one side of the supporting frame 3 as an example, the structure of the supporting frame 3 is a combination of a supporting part 4 and a positioning part 5, wherein the supporting part 4 is configured as a plane, which is used to support the silicon wafer, so that the silicon wafer maintains a horizontal placement state, thereby making the film deposited on the surface of the silicon wafer more uniform; the positioning part 5 is on the outside of the supporting part 4, and the positioning part 5 is configured as a continuous inclined surface, and the inclined surface of the positioning part 5 extends to the plane of the supporting part 4 and connects. When the automated placement equipment takes the silicon wafer and places it in the supporting frame 3, even if the supporting frame 3 is deformed due to temperature rise, since the positioning part 5 of the supporting frame 3 is a continuous inclined surface instead of a trapezoidal surface, the top of the positioning part 5 is a line structure, that is, the contact point between the top of the positioning part 5 and the silicon wafer is a line contact, and the side edge of the silicon wafer abuts on the continuous side surface of the positioning part 5. The top of the positioning part 5 is a line structure compared to the positioning part 5 with a trapezoidal surface, which will reduce the support for the silicon wafer, so that it will slide into the supporting frame 3 under the action of its own gravity to achieve accurate positioning.

[0034] In some possible embodiments, the carrier frame 3 is a rectangular frame, and the continuous inclined surfaces on the positioning portions 5 on all four sides tend to expand away from the plane of the carrier portion 4, forming a bell-shaped shape. That is, the angle between the continuous inclined surfaces and the plane of the carrier portion 4 is an obtuse angle greater than 90°. The above embodiments are merely illustrative, and the specific structure can be selected based on actual production to best improve production efficiency.

[0035] It should be noted that the positioning portion 5 mentioned in this embodiment is a continuous inclined surface and its specific inclined surface type is not limited, as long as it is a continuous inclined surface. The difference is the trapezoidal cross-section, which is a plane transition to an inclined surface. Therefore, the continuous inclined surface in this embodiment is not specifically limited, as long as the silicon wafer can slide into the accurate supporting portion 4 by its own gravity.

[0036] See Figure 3 On the basis of the above embodiment, in some possible implementation processes, the continuous inclined surface configured on the side of the positioning portion 5 close to the bearing portion 4 is a straight inclined surface.

[0037] Specifically, the continuous inclined surface of the positioning portion 5 is configured as a linear inclined surface. When the automated placement equipment places the silicon wafer within the carrier frame 3, the edge of the silicon wafer abuts the linear inclined surface of the positioning portion 5. Due to gravity, the silicon wafer slides along the linear inclined surface until the bottom of the silicon wafer abuts the carrier portion 4. The sliding trend of the linear inclined surface is relatively smooth, and the sliding and positioning of the silicon wafer is more stable. It should be noted that the inclination angle and length of the linear inclined surface are determined by the size of the silicon wafer and the number of carrier frames 3 designed on the carrier board 2. The specific selection should be based on a comprehensive consideration of multiple factors such as the actual application scenario, load requirements, installation convenience, and cost budget, and no specific restrictions are imposed here.

[0038] Based on the above embodiment, the positioning portion 5 is a straight inclined surface. Furthermore, the cross-section of the positioning portion 5 shared by adjacent carrier frames 3 perpendicular to the length direction of the positioning portion 5 is triangular. When two adjacent carrier frames 3 share a positioning portion 5, both sides of the positioning portion 5 are straight inclined surfaces. The positioning portion 5 is designed as a triangular structure. On the one hand, the structure of the carrier frame 3 is more stable, and the triangular positioning portion 5 is less prone to deformation than the trapezoidal structure. On the other hand, the triangular positioning portion 5 structure has a larger size than the trapezoidal structure, allowing for a larger range of silicon wafer placement and greater tolerance for sliding the silicon wafer into the silicon wafer slot, reducing the risk of wafer overlap and falling due to thermal deformation of the carrier plate 2, and improving various quality indicators.

[0039] It should be noted that the cross-section of the positioning portion 5 is a triangle. The angle and height of the specific triangle are not limited here. The specific selection needs to be comprehensively considered based on multiple factors such as actual application scenarios, load requirements, installation convenience, cost budget, etc.

[0040] Furthermore, a chamfer 6 is provided on the inner side of the carrier 4 facing away from the silicon wafer. The carrier 4 is formed into a hollow structure, and the silicon wafer is placed on the flat side of the carrier 4. On the side facing away from the silicon wafer, the carrier 4 is designed with a chamfer 6. This reduces the overall weight of the carrier 2 and allows for uniform heating of the silicon wafer. Finally, the chamfer 6 also enhances the overall stability of the carrier 4, preventing excessive deformation due to heat.

[0041] On the basis of the above embodiment, the frame assembly 1 further includes a main frame 7, the main frame 7 is configured into a plurality of sub-frame areas, and the carrier plates 2 are provided in plurality and correspond one-to-one to the sub-frame areas.

[0042] Specifically, the main body of the frame assembly 1 adopts a main frame 7, and partitions are set in the main frame 7, and multiple sub-frame areas are set. Considering the production efficiency issue, the frame needs to carry as many silicon wafers as possible. At the same time, the problem of frame deformation must also be considered. The larger the frame, the easier it is to deform. Therefore, the main frame 7 is designed into multiple sub-frame areas, and multi-segment division is used to control the deformation amount, which is conducive to reducing deformation as much as possible while improving efficiency. There are multiple sub-frame areas, and multiple carriers 2 can be designed for the corresponding sub-frame areas to be used in combination, thereby improving production efficiency.

[0043] Furthermore, the main frame 7 is designed to be a plurality of sub-frame areas. In some feasible methods, the main frame 7 is divided into an outer frame 8 and a load-bearing beam 9. The outer frame 8 can be a rectangular frame structure. Both ends of the load-bearing beam 9 are connected to the inner side of the outer frame 8. The load-bearing beams 9 are designed to be multiple and arranged in parallel, dividing the inner side of the outer frame 8 into a plurality of areas to form sub-frame areas.

[0044] Furthermore, the carrier plate 2 is installed in the sub-frame area. The positions of the connection points of the carrier plate 2 installed in different sub-frame areas are different. When the carrier plate 2 is installed in the sub-frame area close to the outer frame 8, the carrier plate 2 is connected to the outer frame 8 on three sides, and the other side is connected to the load-bearing beam 9; when the carrier plate 2 is installed in the sub-frame area in the middle area, the two sides of the carrier plate 2 are connected to the outer frame 8, and the other two sides are connected to the load-bearing beam 9. Considering the flexibility of the carrier plate 2 during use, the carrier plate 2 can be designed as a detachable connection.

[0045] The carrier plate 2 is detachably connected to the outer frame 8 and the load-bearing beam 9, which embodies a high degree of flexibility and maintainability. This design allows users or maintenance personnel to quickly and conveniently assemble, disassemble or replace components according to actual needs. The specific connection method is not specifically limited here. There are many different detachable connection methods between the carrier plate 2 and the outer frame 8 and the load-bearing beam 9. The specific selection needs to be comprehensively considered based on multiple factors such as actual application scenarios, load requirements, installation convenience, cost budget, etc.

[0046] In an optional embodiment, the carrier plate 2 can be fixed by bolts in combination with a pressure strip 10. The bolts are arranged at intervals and pass through the pressure strip 10 to connect with the outer frame 8 or the load-bearing beam 9. The pressure strip 10 is used to press the edge of the carrier plate 2 to fix the carrier plate 2 in the load-bearing frame 3.

[0047] See Figure 4 and Figure 5 In some other possible embodiments, the continuous inclined surface of the positioning portion 5 near the supporting portion 4 is a curved inclined surface. Similar to the linear inclined surface positioning portion 5, the curved inclined surface positioning portion 5 and the linear inclined surface positioning portion 5 are both continuous inclined surfaces, except that the inclined surface is curved. This is also one of the ways to achieve silicon wafer positioning.

[0048] Based on the above embodiments, the curved slope is divided into two cases. One of them is that the curved slope is a convex surface close to the direction of the silicon wafer. The upper surface of this convex inclined surface is relatively flat, which can provide better support for the silicon wafer when the silicon wafer is placed; the other is that the curved slope is a concave surface close to the direction of the silicon wafer. The transition between the bottom of the curved slope of the concave surface and the planar connection part of the supporting part 4 is smoother, and the silicon wafer slides more smoothly.

[0049] It should be further explained that the continuous inclined surface on the side of the positioning portion 5 can not only be set as a single straight inclined surface or a curved inclined surface, but can also be a combination of straight lines and curves, so that the silicon wafer can have stable support when placed, have a smooth sliding track when sliding, and have a smooth transition when sliding to a plane. Therefore, the continuous inclined surface on the side of the positioning portion 5 should be the main technical improvement of the present invention, and its specific shape can be adaptively selected according to actual applications.

[0050] Thus far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present invention.

Claims

1. A carrier frame, characterized in that: The carrier frame comprises: A frame assembly (1) and a carrier (2), wherein the carrier (2) is arranged on the frame assembly (1), the carrier (2) is configured to have a plurality of carrier frames (3) for carrying silicon wafers, the carrier frames (3) are provided with a carrier portion (4) and a positioning portion (5), the carrier portion (4) is configured to be a plane for carrying the silicon wafers, the side of the positioning portion (5) close to the carrier portion (4) is configured to be a continuous inclined surface and connected to the plane of the carrier portion (4), the top end of the positioning portion (5) is configured to be a linear structure so that the positioning portion (5) can be in linear contact with the silicon wafer, and the angle between the continuous inclined surface of the positioning portion (5) and the carrier portion (4) is suitable for allowing the silicon wafer to slide along the continuous inclined surface to the plane of the carrier portion (4).

2. The carrier frame according to claim 1, characterized in that: The continuous inclined surface configured on one side of the positioning portion (5) close to the bearing portion (4) is a straight inclined surface.

3. The carrier frame according to claim 2, characterized in that: The cross section of the positioning portion (5) shared by adjacent supporting frames (3) and perpendicular to the length direction of the positioning portion (5) is triangular.

4. The carrier frame according to claim 1, characterized in that: A chamfer (6) is provided on the inner side of the supporting portion (4) facing away from the silicon wafer.

5. The carrier frame according to claim 1, characterized in that: The frame assembly (1) comprises: A main frame (7), wherein the inner area of ​​the main frame (7) is configured into a plurality of sub-frame areas, and the carrier plates (2) are provided in a plurality and correspond one to one with the sub-frame areas.

6. The carrier frame according to claim 5, characterized in that: The main frame (7) comprises an outer frame (8) and a load-bearing beam (9); the load-bearing beam (9) is provided in plurality and is arranged inside the outer frame (8) to configure the outer frame (8) into a plurality of sub-frame areas.

7. The carrier frame according to claim 6, characterized in that: The outer frame (8) and the load-bearing beam (9) are both detachably connected to the carrier plate (2).

8. The carrier frame according to claim 6, characterized in that: The frame assembly (1) further comprises a pressure strip (10), wherein the pressure strip (10) is connected to the outer frame (8) and / or the load-bearing beam (9) to abut against the edge of the carrier plate (2).

9. The carrier frame according to claim 1, characterized in that: The continuous inclined surface configured on one side of the positioning portion (5) close to the bearing portion (4) is a curved inclined surface.

10. The carrier frame according to claim 9, characterized in that: The inclined surface of the curve is a convex surface close to the silicon wafer; or The inclined surface of the curve is a concave surface close to the silicon wafer.

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