High-temperature-resistant probe assembly and probe seat

Abstract

The utility model provides a high-temperature-resistant probe assembly and a probe seat. The probe assembly comprises a probe, a wire, a clamp, a first heat insulation piece, a first temperature-resistant fastener and a second temperature-resistant fastener. The probe is provided with a detection part and a fixing part which are arranged back to back, and the detection part is used for testing a tested sample; the wire comprises a first connecting part, and the first connecting part is connected with the fixing part; the clamp is used for accommodating the fixing part and the first connecting part; the first heat insulation piece wraps the clamp and is arranged corresponding to the fixing part and the first connecting part; the first temperature-resistant fastener is used for pressing and fixing the fixing part to the clamp; and the second temperature-resistant fastening piece is used for pressing and fixing the clamp to the first heat insulation piece. According to the probe assembly provided by the invention, the first heat insulation piece, the first temperature-resistant fastener and the second temperature-resistant fastener enable the probe assembly to be more stable and not easy to damage when the probe assembly is applied to a test in a high-temperature environment.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a high-temperature resistant probe assembly and a probe seat. Background Art

[0002] The integrated circuit elements on semiconductor devices need to be electrically characterized and measured before the packaging process to determine whether the integrated circuit elements meet the standards. Due to the advantages of probe seat test equipment such as low cost, wide application, easy operation, stable and objective test results, it is widely used in the field of semiconductor testing technology. In some cases, it is necessary to test the performance of the sample under test in a high temperature environment to further understand the performance of the sample under test. However, when the probe seat test equipment is actually used for high temperature environment testing, it is necessary to move the probe and make it contact with the high-temperature component under test, transmit signals to the component under test or receive signals from the component under test through the wire, which can easily cause the wire temperature to be too high during the test process, thereby causing damage to the wire, interfering with the test results, and affecting the life of the probe seat test equipment. Utility Model Content

[0003] The technical problem to be solved by the embodiments of the present application is that the existing probe assembly is prone to cause the wire temperature to be too high when used to test the sample under test in a high temperature environment. A high-temperature resistant probe assembly and probe seat are provided to realize the testing of the sample under test in a high temperature environment.

[0004] In a first aspect, the present application provides a high-temperature resistant probe assembly, the probe assembly comprising:

[0005] A probe having a detection portion and a fixing portion disposed opposite to each other, wherein the detection portion is used to test a sample;

[0006] A wire, the wire comprising a first connecting portion connected to the fixing portion;

[0007] a clamp, the clamp being used to accommodate the fixing portion and the first connecting portion;

[0008] a first heat insulating member, the first heat insulating member wrapping the clamp and being arranged corresponding to the fixing portion and the first connecting portion;

[0009] a first temperature-resistant fastener, the first temperature-resistant fastener being used for crimping and fixing the fixing portion to the clamp; and

[0010] A second temperature-resistant fastener is used for crimping and fixing the clamp to the first thermal insulation member.

[0011] Embodiments of the present application provide a high-temperature-resistant probe assembly, comprising a probe having a detection portion and a fixing portion disposed opposite each other, the detection portion being used to test a sample. The probe assembly includes a wire, a first connection portion of the wire being connected to the fixing portion to enable electrical signal exchange between the probe and the wire. The probe assembly includes a clamp that receives the fixing portion to secure the probe, and the clamp receives the first connection portion to secure the first connection portion. The probe assembly includes a first thermal insulator that wraps around the clamp and is disposed corresponding to the fixing portion and the first connection portion to reduce heat transfer between the first connection portion and the test environment, thereby preventing damage to the first connection portion from overheating. The probe assembly includes a first heat-resistant fastener and a second heat-resistant fastener. The first heat-resistant fastener is used to crimp the fixing portion to the clamp, and the second heat-resistant fastener is used to crimp the clamp to the first heat-resistant fastener. The combination of the first and second heat-resistant fasteners and the crimping method makes the probe assembly more stable and less susceptible to damage when used in high-temperature test environments.

[0012] In some embodiments, the clamp comprises:

[0013] a first clamp portion, the first clamp portion having a first through hole, the first temperature-resistant fastener being disposed corresponding to the first through hole to fix the fixing portion to the clamp, and;

[0014] The second clamp portion has a second through hole, and the second temperature-resistant fastener is arranged corresponding to the second through hole to fix the clamp to the first thermal insulation component.

[0015] The embodiment of the present application provides a high-temperature resistant probe assembly, wherein the clamp includes a first clamp portion having a first through hole and a second clamp portion having a second through hole. The first through hole cooperates with the first heat-resistant fastener to fix the probe to the clamp; the second through hole cooperates with the second heat-resistant fastener to fix the clamp to the thermal insulation member. The first through hole and the first heat-resistant fastener realize a press-fit fixation between the clamp and the probe, and the second through hole and the second heat-resistant fastener realize a press-fit fixation between the clamp and the thermal insulation member. The first through hole and the second through hole in the embodiment of the present application cooperate with the first heat-resistant fastener and the second heat-resistant fastener, so that the probe assembly is more stable and less prone to damage when used in tests under high-temperature test environments.

[0016] In some embodiments, the first clamp portion has:

[0017] A first peripheral side surface and a limiting surface, wherein the limiting surface is connected to the first peripheral side surface by bending, and the limiting surface faces away from the probe; the fixture further comprises:

[0018] A clamp body connected between the first clamp portion and the second clamp portion, the clamp body having a second peripheral side surface, the second peripheral side surface being bent and connected to the limiting surface; the first thermal insulation member having:

[0019] A third peripheral side surface and an end surface, wherein the third peripheral side surface and the end surface are connected to the bend, wherein the end surface abuts against the limiting surface.

[0020] The high-temperature resistant probe assembly provided in an embodiment of the present application comprises the first clamp portion having a first circumferential side surface and a limiting surface that is bent and connected to the first circumferential side surface and faces away from the probe. The clamp further comprises a clamp body connected between the first clamp portion and the second clamp portion. The clamp body has a second circumferential side surface that is bent and connected to the limiting surface. The first thermal insulation member has a third circumferential side surface and an end surface that is bent and connected to the third circumferential side surface. When the probe assembly is assembled and installed, the second clamp portion extends into the interior of the first thermal insulation member facing one end of the probe until the limiting surface abuts the end surface. The assembled installation of the first thermal insulation member and the clamp is achieved. The end surface abuts the limiting surface, so that when the probe assembly is assembled and installed, the position of the thermal insulation member in the direction of the line connecting the geometric centers of the first clamp portion and the second clamp portion can be quickly and accurately determined.

[0021] In some embodiments, the clamp body further comprises:

[0022] A first body sub-part, the first body sub-part having a first sub-circumferential side surface, the first sub-circumferential side surface being connected to the limiting surface by a bending motion; and

[0023] The second body sub-section has a second sub-circumferential side surface and a first side surface, the second sub-circumferential side surface is connected to the first side surface by a bending, the first side surface is connected to the first sub-circumferential side surface by a bending, and the first side surface and the limiting surface are located on the same side of the second sub-circumferential side surface; the first thermal insulation component has:

[0024] A first inner wall surface is in contact with the second sub-peripheral side surface.

[0025] The high-temperature resistant probe assembly provided in an embodiment of the present application, the clamp body also includes a first body sub-section and a second body sub-section. The first body sub-section has a first sub-circumferential side surface that is bent and connected to the limiting surface. The second body sub-section has a second sub-circumferential side surface, and a first side surface that is bent and connected to the second sub-circumferential side surface and the first sub-circumferential side surface; the first side surface and the limiting surface are located on the same side of the second sub-circumferential side surface. The first thermal insulation member has a first inner wall surface. The first inner wall surface abuts the second sub-circumferential side surface, so that when the probe assembly is assembled and installed, the first thermal insulation member and the clamp are fixed under the abutment of the first inner wall surface and the second sub-circumferential side surface, so that the combined installation of the clamp and the first thermal insulation member can be achieved quickly and accurately.

[0026] In some embodiments, the probe assembly further comprises a cannula, wherein the cannula comprises:

[0027] a first sleeve portion, the first sleeve portion being provided on an outer peripheral side of an end of the first heat insulating member away from the probe and accommodating the first connecting portion; and

[0028] The second sleeve portion is used to connect with the displacement stage to drive the probe to move under the action of the displacement stage.

[0029] The high-temperature resistant probe assembly provided in an embodiment of the present application further comprises a sleeve, and the sleeve comprises a first sleeve portion and a second sleeve portion. The first sleeve portion accommodates the first connecting portion and connects the sleeve and the first thermal insulation member. The second sleeve portion connects the sleeve to the displacement stage when the probe assembly is applied to test the sample under test. The sleeve connects the first thermal insulation member to the displacement stage when the probe assembly is applied to test the sample under test, thereby enabling the position of the probe to be moved in all directions when the probe assembly is applied to test the sample under test.

[0030] In some embodiments, the wire further comprises:

[0031] a wire body, one end of which is connected to the first connecting portion; and

[0032] a second connecting portion, the second connecting portion being connected to the other end of the wire body and being used to electrically connect to the measurement interface; the probe assembly further comprising:

[0033] a second heat insulating member, the second heat insulating member being sleeved on the outer circumference of the portion of the wire body connected to the first connecting portion, and the second heat insulating member being further accommodated in the sleeve; and

[0034] A third heat insulating member is sleeved on the outer circumference of a portion of the wire body close to the second connecting portion.

[0035] The high-temperature resistant probe assembly provided in the embodiment of the present application also has a wire body and a second connecting part, and the two ends of the wire body are respectively connected to the first connecting part and the second connecting part. When the probe assembly is used to test the sample to be tested, the second connecting part can realize the electrical connection between the probe assembly and the measurement interface. The probe assembly also includes a second thermal insulation member and a third thermal insulation member. The second thermal insulation member is sleeved on the outer peripheral side of the part of the wire body connected to the first connecting part. When the probe assembly is used to test the sample to be tested in a high-temperature test environment, the second thermal insulation member can reduce the heat exchange between the first connecting part and the test environment, and avoid the heat of the test environment from being conducted to the first connecting part during use, causing the first connecting part to be overheated and damaged. The third thermal insulation member is sleeved on the outer peripheral side of the part of the wire body close to the second connecting part. When the probe assembly is used to test the sample to be tested in a high-temperature test environment, the third thermal insulation member can reduce the heat exchange between the second connecting part and the test environment, and avoid the heat of the test environment from being conducted to the second connecting part during use, causing the second connecting part to be overheated and damaged.

[0036] In some embodiments, the probe assembly further comprises:

[0037] a support member, wherein one end of the support member accommodates a portion of the wire body close to the second connecting portion and a portion of the third thermal insulation member close to the second connecting portion, and the other end of the support member is used to connect to the translation stage; and

[0038] A transition piece is used to fix the support piece to the sleeve.

[0039] The high-temperature resistant probe assembly provided in the embodiment of the present application further includes a support member and a transition member. The support member accommodates the portion of the wire body close to the second connection portion and the third thermal insulation member. And when the probe assembly is applied to the test sample, the support member connects the sleeve to the displacement table. The transition member connects and fixes the support member and the sleeve. Furthermore, when the probe assembly is applied to the test sample under high-temperature test conditions, the transition member can assist in weakening the heat conduction from the sleeve to the support member, thereby avoiding overheating and damage to the portion of the wire body close to the second connection portion.

[0040] In some embodiments, the probe assembly further comprises:

[0041] A locking member is located on the outer peripheral side of the first sleeve portion, wraps the sleeve, and locks the sleeve and the first thermal insulation member.

[0042] The high-temperature-resistant probe assembly provided in an embodiment of the present application further includes a locking member. The locking member is located on the outer periphery of the first sleeve portion and wraps around the sleeve to achieve locking and fixation of the sleeve and the first thermal insulation member. The locking member locks the portion of the first thermal insulation member facing away from the probe and the first sleeve portion, thereby tightly connecting the sleeve and the first thermal insulation member, further ensuring that the sleeve and the first thermal insulation member are not easily separated when the probe assembly is in use.

[0043] In some embodiments, the sleeve further comprises:

[0044] a sleeve body, one end of which is connected to the first sleeve part and the other end of which is connected to the second sleeve part; the probe assembly further comprises:

[0045] A heat sink is connected to a portion of the outer surface of the sleeve body close to the first sleeve portion, and is used to transfer the heat of the clamp to the outside.

[0046] In the high-temperature resistant probe assembly provided in an embodiment of the present application, the sleeve further includes a sleeve body connected to the first sleeve portion and the second sleeve portion. The probe assembly further includes a heat sink. The heat sink is connected to a portion of the outer surface of the sleeve body near the first sleeve portion to enable the sleeve to dissipate heat to the outside, thereby reducing heat conduction from the fixture wrapped by the sleeve to the second connecting portion, which may cause overheating and damage to the second connecting portion. Furthermore, the heat sink increases the maximum temperature of the application environment of the probe assembly.

[0047] In a second aspect, the present application provides a probe base, the probe base comprising:

[0048] At least one probe assembly, wherein the probe in the probe assembly is used to test the working status of the sample under test in a test environment;

[0049] A testing platform, the testing platform is used to carry the sample to be tested, and the testing platform provides the testing environment for the sample to be tested;

[0050] a translation stage connected to a side of the probe assembly facing away from the detection stage; the translation stage is used to move in different directions to adjust the position of the probe; and

[0051] An electrode device is electrically connected to the wire of the wire and is used to exchange electrical signals with the probe.

[0052] The embodiment of the present application provides a high-temperature resistant probe seat, which includes at least one probe assembly, a detection platform, a displacement platform and an electrode device. The probe seat realizes the testing of the sample to be tested under the test environment. The probe in the probe assembly is used to test the working status of the sample to be tested under the test environment. The components in the probe assembly are crimped and fixedly connected by heat-resistant fasteners, so that the probe assembly is more stable and not easy to damage when used for testing in a high-temperature test environment. The detection platform provides the test environment for the sample to be tested and carries the sample to be tested during testing. The displacement platform is connected to the side of the probe assembly away from the detection platform to realize the displacement of the probe in the probe assembly. The electrode device is electrically connected to the wire to realize the supply of current to the probe in the probe assembly, or to receive electrical signals from the probe in the probe assembly; thereby further realizing the exchange of electrical signals with the sample to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the implementation methods or the description of the prior art. Obviously, the drawings described below are only some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0054] Figure 1 This is a schematic diagram of a top view of a probe base according to an embodiment of the present application;

[0055] Figure 2 1 is a schematic diagram of a three-dimensional structure of a probe assembly and a translation stage in an assembled state according to an embodiment of the present application;

[0056] Figure 3 yes Figure 1 The schematic diagram of the cross-sectional structure of the probe base along line AA is shown;

[0057] Figure 4 1 is a schematic diagram of the three-dimensional structure of a probe assembly according to an embodiment of the present application;

[0058] Figure 5 yes Figure 4 A schematic cross-sectional view of the probe assembly along line BB is shown;

[0059] Figure 6 yes Figure 5 A partial enlarged schematic diagram of the probe assembly II shown;

[0060] Figure 7 yes Figure 4 A schematic cross-sectional view of the fixture in the probe assembly along line BB is shown;

[0061] Figure 8 This is a schematic diagram of a separated three-dimensional structure of a probe assembly according to one embodiment of the present application;

[0062] Figure 9 yes Figure 5 Another partial enlarged schematic diagram of the probe assembly II is shown;

[0063] Figure 10 yes Figure 4 Another schematic cross-sectional view of the fixture in the probe assembly along line BB is shown;

[0064] Figure 11 This is another schematic diagram of a separated three-dimensional structure of a probe assembly according to an embodiment of the present application;

[0065] Figure 12 yes Figure 4 Another cross-sectional structural diagram of the probe assembly along line BB is shown;

[0066] Figure 13 yes Figure 5 A partial enlarged schematic diagram of part III of the probe assembly is shown;

[0067] Figure 14 yes Figure 4 A partial enlarged schematic diagram of part I of the probe assembly is shown.

[0068] Description of reference numerals:

[0069] Probe base 1, probe assembly 10, detection platform 20, translation stage 30, electrode device 40, first temperature-resistant fastener 101, second temperature-resistant fastener 102, second thermal insulation member 103, third thermal insulation member 104, support member 105, transition member 106, locking member 107, heat dissipation member 108, probe 110, wire 120, clamp 130, first thermal insulation member 140, sleeve 150, detection part 111, fixing part 112, first connecting part 121, second connecting part 122, wire body 123, first clamp The clamp part 131, the second clamp part 132, the clamp body 133, the third circumferential side surface 141, the end face 142, the first inner wall surface 143, the first sleeve part 151, the second sleeve part 152, the sleeve main part 153, the first body sub-part 1331, the second body sub-part 1332, the first through hole 131a, the first circumferential side surface 131b, the limiting surface 131c, the second through hole 132a, the second circumferential side surface 133a, the first sub-circumferential side surface 1331a, the second sub-circumferential side surface 1332a, and the first side surface 1332b. DETAILED DESCRIPTION

[0070] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0071] The terms "first," "second," and the like in the specification, claims, and drawings of this application are used to distinguish between different objects rather than to describe a specific order. In addition, the terms "include," "include," and "have," and any variations thereof, are intended to cover non-exclusive inclusions.

[0072] References herein to "embodiments" or "implementations" mean that a particular feature, structure, or characteristic described in connection with the embodiment or implementation may be included in at least one implementation of the present application. The appearance of such phrases in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0073] See also Figure 1 、 Figure 2 and Figure 3 , Figure 1 This is a schematic diagram of a top view of the probe base according to one embodiment of the present application; Figure 2 1 is a schematic diagram of a three-dimensional structure of a probe assembly and a translation stage in an assembled state according to an embodiment of the present application; Figure 3 yes Figure 1 The schematic diagram of the cross-sectional structure of the probe seat along the AA line is shown. One embodiment of the present application provides a probe seat 1, which includes at least one probe assembly 10, a detection platform 20, a displacement platform 30 and an electrode device 40. Among them, the probe 110 in the high-temperature resistant probe assembly 10 is used to test the working state of the sample under test under the test environment. The detection platform 20 is used to carry the sample under test, and the detection platform 20 provides the test environment for the sample under test. The displacement platform 30 is connected to the side of the probe assembly 10 away from the detection platform 20, and the displacement platform 30 is used to move in different directions to adjust the position of the probe 110. The electrode device 40 is electrically connected to the wire 120, and is used to exchange electrical signals with the probe 110.

[0074] The probe holder 1 provided in the embodiment of the present application is a process test instrument for the field of information science and system science, and the probe holder 1 is used to test the performance parameters of the sample under test environment. Wherein, the sample under test can be but is not limited to wafers, light emitting diodes, power devices, circuit boards, liquid crystal panels and solar cells, etc. Wherein, the test environment can be but is not limited to temperature environment, pressure environment, current environment and light environment, etc. It can be understood that the probe holder 1 can be used for radio frequency testing of wafers, high temperature environment testing of light emitting diodes, low current testing of power devices, high voltage and high current testing of circuit boards, radiation environment testing of solar cells, and can also be used for resistivity testing of material surfaces, etc. The above are examples of application scenarios of the probe holder 1 provided in the present application, and should not be understood as limitations on the application scenarios of the probe holder 1 provided in the embodiment of the present application.

[0075] The probe seat 1 includes at least one probe assembly 10 and a detection platform 20. Optionally, the at least one probe assembly 10 is located around the detection platform 20, and the probe 110 in the probe assembly 10 is arranged toward the detection platform 20. When the probe seat 1 tests the sample to be tested, the detection portion 111 of the probe 110 contacts the sample to be tested to test the sample to be tested. The probe seat 1 includes a displacement stage 30 and an electrode device 40. Optionally, the displacement stage 30 is arranged corresponding to the probe assembly 10, and the displacement stage 30 is located at one end of the probe assembly 10 away from the probe 110, and the displacement stage 30 is connected to one end of the probe assembly 10 away from the probe 110. It can be understood that the electrode device 40 is arranged corresponding to the probe assembly 10 and is electrically connected to the wire 120 in the probe assembly 10 to realize the exchange of electrical signals between the probe seat 1 and the sample to be tested.

[0076] The probe 110 in the probe assembly 10 is used to test the working state of the sample under test in the test environment. The detection platform 20 carries the sample under test and provides a test environment for the sample under test. The detection platform 20 may have a test cavity. When the probe seat 1 is used to test the sample under test, the detection portion 111 of the probe 110 in the probe assembly 10 extends into the test cavity, contacts the sample under test, and thus tests the sample under test. The detection platform 20 may include a sample table, which is accommodated in the test cavity. When the probe seat 1 is used to test the sample under test, the sample table is used to carry the sample under test. The detection platform 20 may, but is not limited to, also include a cooling component, a heating component, a pressure component, an electromagnetic component, and a light simulation component. It is understood that the cooling component and the heating component can regulate the temperature of the test environment in the test cavity; the pressure component can regulate the pressure of the test environment in the test cavity; the electromagnetic component can regulate the magnetic field of the test environment in the test cavity; and the light simulation component can regulate the light environment of the test environment in the test cavity.

[0077] The displacement stage 30 is connected to the side of the probe assembly 10 away from the detection platform 20, and the displacement stage 30 is used to move in different directions to adjust the position of the probe 110. The displacement stage 30 may include, but is not limited to, a first mechanism, a second mechanism, and a third mechanism. The first mechanism is used to achieve translation of the probe assembly 10 in a first direction, the second mechanism is used to achieve translation of the probe assembly 10 in a second direction, and the third mechanism is used to achieve translation of the probe assembly 10 in a third direction. The first direction is perpendicular to the second direction, the first direction is perpendicular to the third direction, and the second direction is perpendicular to the third direction. The first mechanism, the second mechanism, and the third mechanism enable the displacement stage 30 to move in different directions, thereby further achieving adjustment of the position of the probe 110. Optionally, the displacement stage 30 also includes a displacement connection portion, which is connected to the side of the probe assembly 10 away from the detection platform 20 to achieve connection between the displacement stage 30 and the probe assembly 10, thereby further achieving adjustment of the position of the probe 110 through the displacement stage 30. It is understandable that the displacement stage 30 may also be a displacement device including a translation stage and a rotation stage. The above is an example of the structure of the displacement stage 30 provided in the present application and should not be understood as limiting the structure of the displacement stage 30 provided in the embodiments of the present application.

[0078] The electrode device 40 is electrically connected to the wire of the probe assembly 10 for exchanging electrical signals with the probe 110. It is understood that the electrode device 40 can conduct current to the probe 110 of the probe assembly 10 through the wire 120 of the probe assembly 10. This enables the probe base 1 to provide current to the sample under test during testing to test the parameters of the sample under test when the current passes through it. It is understood that the electrode device 40 can receive electrical signals from the probe 110 of the probe assembly 10 through the wire 120 of the probe assembly 10. When the probe base 1 is testing, the probe 110 contacts the sample under test to receive the electrical signals of the sample under test, and transmits the electrical signals to the electrode device 40 for analysis of the electrical signals, thereby testing the parameters of the sample under test. The electrode device 40 can be, but is not limited to, connected to the translation stage 30 and move in different directions with the translation stage 30 during testing.

[0079] In summary, the probe seat 1 provided in the embodiment of the present application comprises at least one probe assembly 10, a detection platform 20, a displacement platform 30 and an electrode device 40. The probe seat 1 is used to test the parameters of the sample under test in a test environment. When the probe seat 1 is used to test the sample under test, the probe assembly 10 contacts the sample under test to realize the exchange of electrical signals between the sample under test and the probe seat 1. The detection platform 20 realizes the support of the sample under test and provides a corresponding test environment for the sample under test. The displacement platform 30 is connected to the end of the probe assembly 10 away from the detection platform 20 to realize the displacement of the probe 110 in the probe assembly 10. The electrode device 40 is electrically connected to the wire 120 to realize the supply of current to the probe 110 in the probe assembly 10; or to receive the electrical signal from the probe 110 in the probe assembly 10, thereby further realizing the exchange of electrical signals with the sample under test.

[0080] See also Figure 4 、 Figure 5 and Figure 6 , Figure 4 1 is a schematic diagram of the three-dimensional structure of a probe assembly according to an embodiment of the present application; Figure 5 yes Figure 4 A schematic cross-sectional view of the probe assembly along line BB is shown; Figure 6 yes Figure 5A partially enlarged schematic diagram of part of the probe assembly II is shown. One embodiment of the present application provides a probe assembly 10, which includes a probe 110, a wire 120, a clamp 130, a first heat-insulating member 140, a first heat-resistant fastener 101, and a second heat-resistant fastener 102. The probe 110 has a detection portion 111 and a fixing portion 112 disposed opposite to each other, and the detection portion 111 is used to test the sample under test. The wire 120 includes a first connecting portion 121, which is connected to the fixing portion 112. The clamp 130 is used to accommodate the fixing portion 112 and the first connecting portion 121. The first heat-insulating member 140 wraps around the clamp 130 and is disposed corresponding to the fixing portion 112 and the first connecting portion 121. The first heat-resistant fastener 101 is used to crimp and fix the fixing portion 112 to the clamp 130. The second heat-resistant fastener 102 is used to crimp and fix the clamp 130 to the first heat-insulating member 140.

[0081] The high temperature resistant probe assembly 10 provided in the embodiment of the present application can be applied to the probe seat 1 provided in the embodiment of the present application. The high temperature resistant probe assembly 10 provided in the embodiment of the present application is a process test equipment used in the field of information science and system science, and the probe assembly 10 is used to test the performance parameters of the sample under test under a test environment. Wherein, the sample under test can be but is not limited to wafers, light emitting diodes, power devices, circuit boards, liquid crystal panels and solar cells, etc. Wherein, the test environment can be but is not limited to temperature environment, pressure environment, current environment and light environment, etc. It can be understood that the probe assembly 10 can be used to perform radio frequency testing on wafers, high temperature environment testing on light emitting diodes, low current testing on power devices, high voltage and high current testing on circuit boards, radiation environment testing on solar cells, and can also be used to perform resistivity testing on material surfaces, etc. The above are examples of application scenarios of the probe assembly 10 provided in the present application, and should not be understood as limiting the application scenarios of the high temperature resistant probe assembly 10 provided in the embodiment of the present application.

[0082] The probe 110 includes a detection portion 111 and a fixing portion 112 disposed opposite each other. The detection portion 111 and the fixing portion 112 may be integrally formed to reduce production costs. The detection portion 111 and the fixing portion 112 may be connected by a bend, so that when the probe assembly 10 is used to test a sample, the detection portion 111 can more accurately contact the test position of the sample.

[0083] The detection portion 111 is used to test the sample under test. When the probe assembly 10 is used to test the parameters of the sample under test, the detection portion 111 of the probe 110 contacts the sample under test to test the sample under test. It is understood that the detection portion 111 can transmit the electrical signal from the sample under test to the electrode device 40, thereby collecting and analyzing the electrical signal to test the parameters of the sample under test. It is understood that the detection portion 111 can conduct the current from the electrode device 40 to the sample under test to test the parameters of the sample under test when receiving the current. The detection portion 111 can be an oxidation-resistant detection portion; optionally, the oxidation-resistant detection portion is a tungsten detection portion. When the probe assembly 10 is used to test the parameters of the sample under test in a high-temperature test environment, the detection portion 111 needs to be located in the high-temperature test environment. The oxidation-resistant detection portion can prevent the detection portion 111 from oxidizing and failing in the high-temperature test environment, thereby increasing the service life of the probe 110.

[0084] The probe assembly 10 also includes a wire 120. When the probe assembly 10 is applied to the probe seat 1 to test the parameters of the sample under test, the probe 110 is electrically connected to the electrode device 40 on the probe seat 1 through the wire 120 to achieve the exchange of electrical signals between the probe 110 and the electrode device 40. It can be understood that the detection part 111 conducts current to the sample under test through the wire 120 to test the parameters of the sample under test when receiving the current. It can be understood that the sample under test conducts electrical signals to the electrode device 40 through the wire 120 to achieve the collection and analysis of the electrical signals from the sample under test. Among them, the wire 120 includes a first connecting part 121, and the first connecting part 121 is electrically connected to the fixing part 112 to achieve the electrical connection between the wire 120 and the probe 110.

[0085] The probe assembly 10 also includes a clamp 130, which is used to accommodate and fix the probe 110, and to accommodate and fix the first connecting portion 121. The clamp 130 may, but is not limited to, have a clamp cavity, which accommodates the fixing portion 112 and the first connecting portion 121. The clamp 130 may, but is not limited to, include a clamp inner wall surface, which defines the clamp cavity. In one possible embodiment, part of the outer surface of the fixing portion 112 abuts against the clamp inner wall surface, the detection portion 111 passes through the clamp cavity, and the portion of the wire 120 other than the first connecting portion 121 passes through the clamp cavity.

[0086] The first thermal insulation member 140 wraps the clamp 130 and is arranged corresponding to the fixing portion 112 and the first connecting portion 121. It can be understood that the first thermal insulation member 140 can be, but is not limited to, a tubular structure, which is sleeved on the outer peripheral side of the portion of the clamp 130. The portion of the clamp 130 is the portion of the clamp 130 that accommodates the fixing portion 112 and the first connecting portion 121. When the probe assembly 10 is used to test the parameters of the sample under test in a high-temperature test environment, the first thermal insulation member 140 can achieve thermal isolation between the first connecting portion 121 and the high-temperature test environment, thereby avoiding overheating and damage to the first connecting portion 121, and increasing the service life of the wire 120. The first thermal insulation member 140 can be an insulating first thermal insulation member; optionally, the insulating first thermal insulation member is a ceramic first thermal insulation member.

[0087] In order to clearly illustrate the beneficial effects of the technical solution of the present application, the relevant technology is introduced here. In the relevant technology, a solder fixing process is usually adopted in the manufacture of the probe assembly 10 to realize the electrical connection between the components of the probe assembly. The solder in the solder fixing process has the characteristic of being easy to melt at high temperatures. When the temperature of the test environment in which the probe assembly 10 is applied is close to 500°C, the solder in the solder fixing process in the relevant technology will melt and cause the probe assembly to be damaged. The temperature of the test environment in which the probe assembly in the relevant technology is applied is between -269°C and 200°C. The first temperature-resistant fastener and the second temperature-resistant fastener in the high-temperature resistant probe assembly 10 provided in the embodiment of the present application have the characteristic of not being easy to melt at high temperatures, so that the probe assembly 10 can be used to test the parameters of the sample under test in a test environment between -269°C and 500°C.

[0088] The first temperature-resistant fastener 101 is used to crimp and fix the fixing portion 112 to the clamp 130. As can be understood, the first temperature-resistant fastener 101 can be, but is not limited to, a temperature-resistant screw, a temperature-resistant bolt, a combination of a temperature-resistant screw and a temperature-resistant nut, or a combination of a temperature-resistant bolt and a temperature-resistant nut. Optionally, the first temperature-resistant fastener 101 is arranged corresponding to the portion of the clamp 130 close to the fixing portion 112, and passes through the clamp 130 to achieve crimping and fixing of the clamp 130 and the fixing portion 112. The electrical connection method of the first temperature-resistant fastener 101 and the crimping fixation can avoid the melting of the solder in the solder fixing process used in the related art, thereby making the probe assembly 10 more stable and less prone to damage when used in a high-temperature test environment.

[0089] The second temperature-resistant fastener 102 is used to crimp and fix the clamp 130 to the first thermal insulation member 140. It can be understood that the second temperature-resistant fastener 102 can be, but is not limited to, a temperature-resistant screw, a temperature-resistant bolt, a combination of a temperature-resistant screw and a temperature-resistant nut, or a combination of a temperature-resistant bolt and a temperature-resistant nut. Optionally, the second temperature-resistant fastener 102 is arranged corresponding to the portion of the clamp 130 that is away from the fixing portion 112, and passes through the clamp 130 to achieve crimping and fixing of the clamp 130 and the first thermal insulation member 140. The electrical connection method of the second temperature-resistant fastener 102 and the crimping fixation can avoid the melting of the solder in the solder fixing process used in the related art, thereby making the probe assembly 10 more stable and less prone to damage when used in a high-temperature test environment.

[0090] In summary, the high-temperature resistant probe assembly 10 provided in the embodiment of the present application includes a probe 110, wherein the probe 110 has a detection portion 111 and a fixing portion 112 arranged in opposite directions, and the detection portion 111 is used to test the sample to be tested. The probe assembly 10 includes a wire 120, and the first connection portion 121 of the wire 120 is connected to the fixing portion 112 to achieve electrical signal exchange between the probe 110 and the wire 120. The probe assembly 10 includes a clamp 130, wherein the clamp 130 accommodates the fixing portion 112 to achieve fixation of the probe 110, and the clamp 130 accommodates the first connection portion 121 to achieve fixation of the first connection portion 121. The probe assembly 10 includes a first thermal insulation member 140, which wraps the clamp 130 and is arranged corresponding to the fixing portion 112 and the first connection portion 121 to weaken the heat transfer between the first connection portion 121 and the test environment, thereby avoiding overheating and damage to the first connection portion 121. The probe assembly 10 includes a first heat-resistant fastener 101 and a second heat-resistant fastener 102. The first heat-resistant fastener 101 is used to crimp the fixing portion 112 to the clamp 130, and the second heat-resistant fastener 102 is used to crimp the clamp 130 to the first thermal insulation member 140. The first heat-resistant fastener 101 achieves crimping between the fixing portion 112 and the clamp 130, while the second heat-resistant fastener 102 achieves crimping between the clamp 130 and the first thermal insulation member 140. The combination of the first and second heat-resistant fasteners 101, 102, and the crimping method makes the probe assembly more stable and less susceptible to damage when used in high-temperature testing environments.

[0091] Please refer again Figure 6 Also see Figure 7 , Figure 7 yes Figure 4A schematic cross-sectional view of the clamp in the probe assembly along line BB is shown. Furthermore, in one embodiment, the clamp 130 includes a first clamp portion 131 and a second clamp portion 132. The first clamp portion 131 has a first through hole 131a, and the first heat-resistant fastener 101 is disposed corresponding to the first through hole 131a to secure the fixing portion 112 to the clamp 130. The second clamp portion 132 has a second through hole 132a, and the second heat-resistant fastener 102 is disposed corresponding to the second through hole 132a to secure the clamp 130 to the first thermal insulation member 140.

[0092] The first clamp portion 131 is the portion of the clamp 130 that is close to the detection portion 111 and accommodates the fixing portion 112. The second clamp portion 132 is the portion of the clamp 130 that is away from the detection portion 111 and is accommodated in the first thermal insulation member 140. The first through hole 131a and the second through hole 132a may be through holes perpendicular to the line connecting the geometric centers of the first clamp portion 131 and the second clamp portion 132. The first through hole 131a is located in the first clamp portion 131, and the second through hole 132a is located in the second clamp portion 132.

[0093] The first clamp portion 131 also has a first wall surface corresponding to the first through hole 131a, and the first wall surface defines the first through hole 131a. It is understandable that the first wall surface may, but is not limited to, have a first internal thread, and the first heat-resistant fastener 101 may, but is not limited to, have a first external thread. When the clamp 130 and the probe 110 in the probe assembly 10 are assembled and installed, the first clamp portion 131 can be fixed to the first heat-resistant fastener 101 through the first internal thread and the first external thread, and at the same time, the fixing portion 112 is electrically connected to the first clamp portion 131 through the first heat-resistant fastener 101 in a crimping fixing manner. It is understandable that the first wall surface may also be a smooth inner wall, and the outer peripheral side of the first heat-resistant fastener 101 abuts against the first wall surface. When the clamp 130 and the probe 110 in the probe assembly 10 are assembled and installed, the first clamp portion 131 can be squeezed and fixed to the first temperature-resistant fastener 101 through the first temperature-resistant fastener 101 and the first wall surface, and at the same time, the fixing portion 112 is electrically connected to the first clamp portion 131 through the first temperature-resistant fastener 101 in a crimping manner.

[0094] The second clamp portion 132 also has a second wall surface corresponding to the second through hole 132a, and the second wall surface defines the second through hole 132a. It is understandable that the second wall surface may, but is not limited to, have a second internal thread, and the second heat-resistant fastener 102 may, but is not limited to, have a second external thread. When the clamp 130 and the first heat-insulating member 140 in the probe assembly 10 are assembled and installed, the second clamp portion 132 can be fixed to the second heat-resistant fastener 102 through the second internal thread and the second external thread, while the first clamp portion 131 and the first heat-insulating member 140 are electrically connected to the second heat-resistant fastener 102 in a crimping manner. It is understandable that the second wall surface may also be a smooth inner wall, and the outer peripheral side of the second heat-resistant fastener 102 abuts against the second wall surface. When the clamp 130 and the first thermal insulation member 140 in the probe assembly 10 are assembled and installed, the second clamp portion 132 can be squeezed and fixed to the second temperature-resistant fastener 102 through the second temperature-resistant fastener 102 and the second wall surface, and at the same time, the first clamp portion 131 and the first thermal insulation member 140 are electrically connected to each other by crimping through the second temperature-resistant fastener 102.

[0095] In summary, the high-temperature resistant probe assembly 10 provided in an embodiment of the present application comprises a clamp 130 including a first clamp portion 131 having a first through hole 131a and a second clamp portion 132 having a second through hole 132a. The first through hole 131a cooperates with the first heat-resistant fastener 101 to fix the probe 110 to the clamp 130; the second through hole 132a cooperates with the second heat-resistant fastener 102 to fix the clamp 130 to the thermal insulation member. The first through hole 131a and the first heat-resistant fastener 101 achieve a press-fit fixation between the clamp 130 and the probe 110, while the second through hole 132a and the second heat-resistant fastener 102 achieve a press-fit fixation between the clamp 130 and the thermal insulation member. In the embodiment of the present application, the first through hole 131a and the second through hole 132a cooperate with the first heat-resistant fastener 101 and the second heat-resistant fastener 102, making the probe assembly 10 more stable and less susceptible to damage when used for testing in a high-temperature test environment.

[0096] Please refer again Figure 5 and Figure 7 Also see Figure 8 、 Figure 9 and Figure 10 , Figure 8 This is a schematic diagram of a separated three-dimensional structure of a probe assembly according to one embodiment of the present application; Figure 9 yes Figure 5 Another partial enlarged schematic diagram of the probe assembly II is shown; Figure 10 yes Figure 4Another cross-sectional structural diagram of the clamp in the probe assembly shown along line BB. Furthermore, in one embodiment, the first clamp portion 131 has a first circumferential side surface 131b and a limiting surface 131c. The limiting surface 131c is bent and connected to the first circumferential side surface 131b, and the limiting surface 131c faces away from the probe 110. The clamp 130 also includes a clamp body 133, which is connected between the first clamp portion 131 and the second clamp portion 132. The clamp body 133 has a second circumferential side surface 133a, and the second circumferential side surface 133a is bent and connected to the limiting surface 131c. The first thermal insulation component 140 has a third circumferential side surface 141 and an end face 142, and the end face 142 is bent and connected to the third circumferential side surface 141. Wherein, the end face 142 abuts the limiting surface 131c.

[0097] It is understandable that the clamp 130 can be, but is not limited to, a cylindrical, prism-shaped or irregularly structured clamp 130, and the clamp 130 has a clamp cavity for accommodating the fixing portion 112 and the first connecting portion 121. The first clamp portion 131 has a first circumferential side surface 131b and a limiting surface 131c, and the clamp body 133 located between the first clamp portion 131 and the second clamp portion 132 has a second circumferential side surface 133a; the limiting surface 131c is connected to the first circumferential side surface 131b by bending, and the second circumferential side surface 133a is connected to the limiting surface 131c by bending. In one embodiment, the clamp 130 is a cylindrical structure, and the first clamp portion 131 and the clamp body 133 can be connected cylindrical structures with different bottom diameters. The side surface of the first clamp portion 131 is the first circumferential side surface 131b, and the side surface of the clamp body 133 is the second circumferential side surface 133a. Optionally, the bottom surface of the first clamp portion 131 has a first diameter, the bottom surface of the clamp body 133 has a second diameter, the first diameter is greater than the second diameter, and the limiting surface 131c is an annular shape with an outer diameter of the first diameter and an inner diameter of the second diameter. It is understood that the clamp 130 may also have a prismatic structure having the first circumferential side surface 131b, the second circumferential side surface 133a, and the limiting surface 131c, or an irregular structure. The above is an example of the structure of the clamp 130 provided in the present application and should not be understood as limiting the structure of the clamp 130 provided in the embodiments of the present application.

[0098] The first thermal insulation member 140 has a third circumferential side surface 141 and an end surface 142, the end surface 142 is bent and connected to the third circumferential side surface 141, and the end surface 142 abuts the limiting surface 131c. It can be understood that the first thermal insulation member 140 can be, but is not limited to, an annular columnar structure or an irregular structure having a cavity that can accommodate the clamp 130. The first thermal insulation member 140 is sleeved on the clamp 130, and the limiting surface 131c and the end surface 142 abut to achieve the position fixation of the first thermal insulation member 140 and the clamp 130 in the direction of the geometric center line connecting the first clamp part 131 and the second clamp part 132. The first thermal insulation member 140 can have a first inner wall surface 143, the first inner wall surface 143 defines the cavity that accommodates the clamp 130, and the first thermal insulation inner wall is bent and connected to the end surface 142. When the probe assembly 10 is assembled, the second clamp portion 132 extends into the interior of the first thermal insulation member 140 toward one end of the probe 110 until the limiting surface 131 c abuts the end surface 142 , thereby achieving the assembled installation of the first thermal insulation member 140 and the clamp 130 .

[0099] In summary, the high-temperature resistant probe assembly 10 provided in the embodiment of the present application comprises the first clamp portion 131 having a first circumferential side surface 131b and a limiting surface 131c that is bent and connected to the first circumferential side surface 131b and faces away from the probe 110. The clamp 130 also includes a clamp body 133 connected between the first clamp portion 131 and the second clamp portion 132. The clamp body 133 has a second circumferential side surface 133a that is bent and connected to the limiting surface 131c. The first thermal insulation member 140 has a third circumferential side surface 141 and an end surface 142 that is bent and connected to the third circumferential side surface 141. When the probe assembly 10 is assembled and installed, the second clamp portion 132 extends into the interior of the first thermal insulation member 140 facing one end of the probe 110 until the limiting surface 131c abuts the end surface 142. The assembled installation of the first thermal insulation member 140 and the clamp 130 is achieved. The end surface 142 abuts against the limiting surface 131 c , so that when the probe assembly 10 is assembled and installed, the position of the thermal insulation component in the direction of the line connecting the geometric centers of the first clamp part 131 and the second clamp part 132 can be quickly and accurately determined.

[0100] Please refer again Figure 5 、 Figure 7 、 Figure 8 、 Figure 9 and Figure 10. Further, in one embodiment, the clamp body 133 also includes a first body sub-portion 1331 and a second body sub-portion 1332. The first body sub-portion 1331 has a first sub-circumferential side surface 1331a, and the first sub-circumferential side surface 1331a is bent and connected to the limiting surface 131c. The second body sub-portion 1332 has a second sub-circumferential side surface 1332a and a first side surface 1332b that is bent and connected to the second sub-circumferential side surface 1332a. The first side surface 1332b is bent and connected to the first sub-circumferential side surface 1331a, and the first side surface 1332b and the limiting surface 131c are located on the same side of the second sub-circumferential side surface 1332a. The first thermal insulation component 140 also has a first inner wall surface 143, and the first inner wall surface 143 abuts the second sub-circumferential side surface 1332a.

[0101] It can be understood that the clamp body 133 can be, but is not limited to, a cylindrical, prism-shaped, or irregularly structured clamp body 133. In one embodiment, the clamp body 133 is a cylindrical structure, and the first body sub-section 1331 and the second body sub-section 1332 can be cylindrical structures with two bottom surfaces connected and having different bottom surface diameters. The side surface of the first body sub-section 1331 is the first sub-circumferential side surface 1331a, and the side surface of the second body sub-section 1332 is the second sub-circumferential side surface 1332a. The bottom surface of the first body sub-section 1331 has a third diameter, and the bottom surface of the second body sub-section 1332 has a fourth diameter, and the third diameter can be smaller than the fourth diameter, and the first side surface 1332b is a ring with an outer diameter of the fourth diameter and an inner diameter of the third diameter. It is understood that the clamp body 133 may also be a prismatic structure having the first sub-peripheral side surface 1331a, the second sub-peripheral side surface 1332a, and the first side surface 1332b, or a clamp body 133 having an irregular structure. The above is an example of the structure of the clamp body 133 provided in the present application and should not be understood as limiting the structure of the clamp body 133 provided in the embodiments of the present application.

[0102] The first thermal insulation member 140 also has a first inner wall surface 143, and the first inner wall surface 143 abuts the second sub-circumferential side surface 1332a. It can be understood that when the first thermal insulation member 140 and the clamp 130 are assembled, the second clamp portion 132 extends from the side of the first thermal insulation member 140 close to the end surface 142 into the cavity that accommodates the clamp 130, so that the first thermal insulation member 140 can accommodate the clamp 130. The second sub-circumferential side surface 1332a abuts the first inner wall surface 143 to accurately determine the connection position of the first thermal insulation member 140 and the clamp 130. Furthermore, when the probe assembly 10 is assembled and installed, the first thermal insulation member 140 and the clamp 130 are fixed under the abutment of the first inner wall surface 143 and the second sub-circumferential side surface 1332a, so that the combined installation of the clamp 130 and the first thermal insulation member 140 can be achieved quickly and accurately.

[0103] In summary, the high-temperature resistant probe assembly 10 provided in the embodiment of the present application, the clamp body 133 also includes a first body sub-portion 1331 and a second body sub-portion 1332. The first body sub-portion 1331 has a first sub-circumferential side surface 1331a that is bent and connected to the limiting surface 131c. The second body sub-portion 1332 has a second sub-circumferential side surface 1332a, and a first side surface 1332b that is bent and connected to the second sub-circumferential side surface 1332a and the first sub-circumferential side surface 1331a. The first side surface 1332b and the limiting surface 131c are located on the same side of the second sub-circumferential side surface 1332a. The first thermal insulation member 140 has a first inner wall surface 143. The first inner wall surface 143 abuts against the second sub-circumferential side surface 1332a, so that when the probe assembly 10 is assembled and installed, the first thermal insulation member 140 and the clamp 130 are fixed under the abutment of the first inner wall surface 143 and the second sub-circumferential side surface 1332a, thereby enabling the combined installation of the clamp 130 and the first thermal insulation member 140 to be achieved quickly and accurately.

[0104] Please refer again Figure 4 Also see Figure 11 and Figure 12 , Figure 11 This is another schematic diagram of a separated three-dimensional structure of a probe assembly according to an embodiment of the present application; Figure 12 yes Figure 4Another cross-sectional structural schematic diagram of the probe assembly along line BB is shown. Furthermore, in one embodiment, the probe assembly 10 further includes a sleeve 150, and the sleeve 150 includes a first sleeve portion 151 and a second sleeve portion 152. The first sleeve portion 151 is disposed on the outer peripheral side of the end of the first thermal insulation member 140 facing away from the probe 110, and accommodates the first connecting portion 121. The second sleeve portion 152 is used to connect to the displacement stage 30, so as to drive the probe 110 to move under the action of the displacement stage 30.

[0105] The probe assembly 10 further includes a sleeve 150, wherein the sleeve 150 accommodates and supports a portion of the wire 120. When the probe assembly 10 is used in the probe base 1 to test a sample, the sleeve 150 is used to connect the probe 110 and the translation stage 30 in the probe base 1 to achieve displacement of the probe assembly 10.

[0106] The sleeve 150 includes a first sleeve portion 151, which is disposed on the outer circumference of the first thermal insulator 140 at an end facing away from the probe 110 and accommodates the first connecting portion 121. The first sleeve portion 151 accommodates the first connecting portion 121 and connects the sleeve 150 to the first thermal insulator 140.

[0107] The second sleeve portion 152 is used to connect to the translation stage 30. When the probe assembly 10 is applied to the probe holder 1 to test a sample, the second sleeve portion 152 moves in different directions along with the translation stage 30, thereby driving the probe 110 to move in different directions to achieve position adjustment of the probe 110.

[0108] In summary, the high-temperature resistant probe assembly 10 provided in the embodiment of the present application further comprises a sleeve 150, and the sleeve 150 comprises a first sleeve portion 151 and a second sleeve portion 152. The first sleeve portion 151 accommodates the first connecting portion 121 and connects the sleeve 150 and the first thermal insulation member 140. The second sleeve portion 152 connects the sleeve 150 to the displacement stage 30 when the probe assembly 10 is testing the sample under test. The sleeve 150 connects the first thermal insulation member 140 to the displacement stage 30 when the probe assembly 10 is testing the sample under test, thereby enabling the position of the probe 110 to move in various directions when the probe assembly 10 is testing the sample under test.

[0109] Please refer again Figure 11 and Figure 12. Furthermore, in one embodiment, the wire 120 also has a wire body 123 and a second connecting portion 122. One end of the wire body 123 is connected to the first connecting portion 121. The second connecting portion 122 is connected to the other end of the wire body 123, and the second connecting portion 122 is used to be electrically connected to the measurement interface. The probe assembly 10 also includes a second thermal insulation member 103 and a third thermal insulation member 104. The second thermal insulation member 103 is sleeved on the outer peripheral side of the portion of the wire body 123 connected to the first connecting portion 121, and the second thermal insulation member 103 is also accommodated in the sleeve 150. The third thermal insulation member 104 is sleeved on the outer peripheral side of the portion of the wire body 123 close to the second connecting portion 122.

[0110] The wire 120 also includes a wire body 123. One end of the wire body 123 is connected to the first connecting portion 121. When the probe assembly 10 is used in the probe holder 1 to test a sample, the conductive body acts as an electrical signal transmission medium and can be used to transmit current from the detection portion 111 to the sample to test parameters of the sample when receiving the current. Alternatively, the conductive body can be used to transmit electrical signals from the sample to the electrode assembly 40 to collect and analyze the electrical signals to test the sample.

[0111] The wire 120 also has a second connecting portion 122, which connects the end of the wire body 123 that is not connected to the first conductive portion, and the second connecting portion 122 is used to be electrically connected to the measurement interface. When the probe assembly 10 is applied to the probe seat 1 to test the sample to be tested, the wire 120 can receive the current emitted by the electrode device 40 in the probe seat 1 and conduct the current to the probe 110, thereby transmitting the current to the sample to be tested to test the parameters of the sample to be tested when receiving the current. The wire 120 can also receive the electrical signal emitted by the sample to be tested, and conduct the electrical signal from the measurement interface to the electrode device 40 to collect and analyze the electrical signal to achieve the test of the sample to be tested.

[0112] The probe assembly 10 further includes a second thermal insulator 103, which is sleeved around the outer circumference of the portion of the wire body 123 connected to the first connecting portion 121, and is further housed within the sleeve 150. When the probe assembly 10 is testing parameters of a sample under a high-temperature test environment, the second thermal insulator 103 can reduce heat exchange between the first connecting portion 121 and the high-temperature test environment, thereby preventing heat from the test environment from being transferred to the first connecting portion 121 during use, causing overheating and damage to the first connecting portion 121.

[0113] The probe assembly 10 further includes a third thermal insulator 104, which is disposed around the outer periphery of the portion of the lead body 123 adjacent to the second connecting portion 122. When the probe assembly 10 is used to test parameters of a sample under high temperature, the third thermal insulator 104 can reduce heat exchange between the second connecting portion 122 and the test environment, thereby preventing heat from the test environment from being transferred to the second connecting portion 122 during use, which could cause overheating and damage to the second connecting portion 122.

[0114] In summary, the high-temperature resistant probe assembly 10 provided in the embodiment of the present application also has a wire body 123 and a second connecting part 122, and the two ends of the wire body 123 are respectively connected to the first connecting part 121 and the second connecting part 122. When the probe assembly 10 is used to test the sample to be tested, the second connecting part 122 can realize the electrical connection between the probe assembly 10 and the measurement interface. The probe assembly 10 also includes a second thermal insulation member 103 and a third thermal insulation member 104. The second thermal insulation member 103 is sleeved on the outer peripheral side of the part of the wire body 123 connected to the first connecting part 121. When the probe assembly 10 tests the parameters of the sample to be tested in a high-temperature test environment, the second thermal insulation member 103 can reduce the heat exchange between the first connecting part 121 and the test environment, thereby avoiding the heat of the test environment from being conducted to the first connecting part 121 during use, causing the first connecting part 121 to be overheated and damaged. The third thermal insulation member 104 is sleeved on the outer peripheral side of the part of the wire body 123 close to the second connection part 122. When the probe assembly 10 tests the parameters of the sample under test in a high-temperature test environment, the third thermal insulation member 104 can reduce the heat exchange between the second connection part 122 and the test environment, thereby avoiding the heat of the test environment from being conducted to the second connection part 122 during use, causing the second connection part 122 to be overheated and damaged.

[0115] Please refer again Figure 5 、 Figure 11 and Figure 12 Also see Figure 13 , Figure 13 yes Figure 5 A partial enlarged schematic diagram of probe assembly III is shown. Furthermore, in one embodiment, the probe assembly 10 further includes a support member 105 and a transition member 106. One end of the support member 105 accommodates the portion of the wire body 123 near the second connection portion 122 and the portion of the third thermal insulation member 104 near the second connection portion 122, and the other end is used to connect to the translation stage 30. The transition member 106 is used to secure the support member 105 to the sleeve 150.

[0116] The probe assembly 10 also includes a support member 105, one end of which accommodates the portion of the wire body 123 near the second connection portion 122 and the portion of the third thermal insulation member 104 near the second connection portion 122. The support member 105 can accommodate the portion of the wire body 123 near the second connection portion 122 and the portion of the third thermal insulation member 104 near the second connection portion 122. The other end of the support member 105 is used to be connected to the displacement stage 30 in the probe assembly 10. When the probe assembly 10 is applied to the probe seat 1 to test the parameters of the sample under test, the support member 105 is used to connect the probe assembly 10 and the displacement stage 30 in the probe seat 1 to achieve the displacement of the probe assembly 10. In one embodiment, the support member 105 includes a support seat and a support rod, the support seat is used to be connected to the displacement stage 30, the support rod is fixedly connected to the support seat, and the support rod realizes the portion of the second connection portion 122 and the portion of the third thermal insulation member 104 near the second connection portion 122.

[0117] The probe assembly 10 also includes a transition piece 106, which is used to fix the support member 105 to the sleeve 150. It can be understood that the transition piece 106 simultaneously accommodates the portion of the wire 120 that is not accommodated by the sleeve 150 and the support member 105, and the transition piece 106 accommodates the portion of the third thermal insulation member 104 that is not accommodated by the support member 105. Optionally, the transition piece 106 includes a first transition portion and a second transition portion. The first transition portion is fixedly connected to the second sleeve portion 152, and the second transition portion is fixedly connected to one end of the support member 105 facing the second sleeve portion 152, so as to achieve a fixed connection between the support member 105 and the sleeve 150. Furthermore, the transition piece 106 prevents the sleeve 150 and the support portion from being directly connected. When the probe assembly 10 is used to test parameters of a sample under a high-temperature test environment, the transition piece 106 can prevent the heat of the sleeve 150 from being transferred to the support piece 105, thereby preventing the portion of the wire 120 accommodated in the support piece 105 from being overheated and damaged.

[0118] In one embodiment, the transition piece 106 is a tubular structure. The first transition portion is sleeved on the outer peripheral side of the second sleeve portion 152 and fixedly connected to the second sleeve portion 152; the second transition portion is sleeved on the outer peripheral side of the first support portion and fixedly connected to the first support portion. The first transition portion and the second transition portion may have through holes. The first transition portion and the second sleeve portion 152 may be fixedly connected by a heat-resistant fastener and a through hole on the first transition portion, and the second transition portion and the first support portion may be fixedly connected by a heat-resistant fastener and a through hole on the second transition portion. It can be understood that the clamp 130 may also be other structures that can accommodate the wire 120 and connect the sleeve 150 and the support member 105. The above is an example of the connection method between the components of the probe assembly 10 provided in the present application, and should not be understood as a limitation on the connection method between the components of the high-temperature resistant probe assembly 10 provided in the embodiments of the present application.

[0119] In summary, the high-temperature resistant probe assembly 10 provided in the embodiment of the present application further comprises a support member 105 and a transition member 106. The support member 105 accommodates the portion of the wire body 123 close to the second connection portion 122 and the third thermal insulation member 104. When the probe assembly 10 is used to test the sample under test, the support member 105 connects the sleeve 150 with the displacement stage 30. The transition member 106 connects and fixes the support member 105 and the sleeve 150. Furthermore, when the probe assembly 10 is applied to the probe seat 1 to test the parameters of the sample under test in a high-temperature test environment, the transition member 106 can assist in weakening the heat conduction from the sleeve 150 to the support member 105, thereby avoiding overheating and damage to the portion of the wire body 123 close to the second connection portion 122.

[0120] Please refer again Figure 4 Also see Figure 14 , Figure 14 yes Figure 4 FIG2 is a partial enlarged schematic diagram of the probe assembly I. Furthermore, in one embodiment, the probe assembly 10 further includes a locking member 107. The locking member 107 is located on the outer periphery of the first sleeve portion 151, wraps around the sleeve 150, and locks the sleeve 150 and the first thermal insulation member 140.

[0121] The probe assembly 10 further includes a locking member 107 located on the outer periphery of the first sleeve portion 151. The locking member 107 wraps around the sleeve 150 and locks the sleeve 150 and the clamp 130. It is understood that the first sleeve portion may be loosely fitted around the outer periphery of the first thermal insulation member 140. It is understood that the first sleeve portion 151 may be tightly fitted around the outer periphery of the first thermal insulation member 140 under the action of the locking member 107. When the probe assembly 10 is assembled, the side of the first thermal insulation member 140 facing away from the probe 110 extends from the first sleeve portion 151 toward one end of the probe 110 into the sleeve 150, so that the first sleeve portion 151 accommodates the outer periphery of the first thermal insulation member 140 facing away from the probe 110. The locking member 107 is fitted around the outer periphery of the first sleeve portion 151 and abuts against the outer periphery of the first sleeve portion 151. The locking member 107 causes the first sleeve portion 151 to elastically deform toward the outer periphery of the end of the first thermal insulation member 140 facing away from the probe 110, so that the inner surface of the first sleeve portion 151 and the outer periphery of the end of the first thermal insulation member 140 facing away from the probe 110 are pressed and fixed. Thus, the sleeve 150 and the first thermal insulation member 140 are further locked and fixed by the locking member 107.

[0122] In summary, the high-temperature-resistant probe assembly 10 provided in the embodiments of the present application further includes a locking member 107. The locking member 107 is located on the outer periphery of the first sleeve portion 151 and wraps around the sleeve 150 to achieve locking and fixing of the sleeve 150 and the first thermal insulation member 140. The locking member 107 locks the portion of the first thermal insulation member 140 that is away from the probe 110 and the first sleeve portion 151, thereby tightly connecting the sleeve 150 and the first thermal insulation member 140, further ensuring that the sleeve 150 and the first thermal insulation member 140 are not easily separated when the probe assembly 10 is in use.

[0123] Please refer again Figure 4 and Figure 14 Furthermore, in one embodiment, the sleeve 150 further includes a sleeve body 153, one end of which is connected to the first sleeve portion 151 and the other end of which is connected to the second sleeve portion 152. The probe assembly 10 further includes a heat sink 108, which is connected to a portion of the outer surface of the sleeve body 153 adjacent to the first sleeve portion 151. The heat sink 108 is used to transfer heat from the fixture 130 to the outside.

[0124] The sleeve 150 also includes a sleeve body 153 connected to the first sleeve portion 151 at one end and to the second sleeve portion 152 at the other end. The sleeve body 153 accommodates the second thermal insulation member 103 and the portion of the wire body 123 accommodated in the second thermal insulation member 103. The probe assembly 10 also includes a heat sink 108. The heat sink 108 can be a metal heat sink wire woven together, and the heat sink 108 is connected to the outer surface of the sleeve body 153 close to the first sleeve portion 151, and is used to transfer the heat of the fixture 130 to the outside. When the probe assembly 10 is applied to the probe seat 1 to test the parameters of the sample under test in a high-temperature test environment, the heat sink 108 can realize the heat dissipation of the sleeve 150 to the outside, thereby reducing the heat conduction of the fixture 130 wrapped by the sleeve 150 to the first connecting portion 121, causing the first connecting portion 121 to be overheated and damaged. Furthermore, the heat sink 108 increases the maximum temperature of the test environment in which the probe assembly 10 is used.

[0125] In an optional embodiment, the probe assembly 10 further includes a heat dissipation fixture, which accommodates the heat dissipation element 108 and is fixedly connected to the sleeve body 153 to fix the heat dissipation element 108 to the sleeve body 153. The heat dissipation fixture can be fixedly connected to the sleeve body 153 by a temperature-resistant fastener. The portion of the sleeve body 153 connected to the heat dissipation fixture can have a heat dissipation through-hole, and the sleeve body 153 and the heat dissipation fixture are fixedly connected by the heat dissipation through-hole and the temperature-resistant fastener to fix the heat dissipation element 108 to the outer surface of the sleeve body 153 close to the first sleeve part 151.

[0126] In summary, the high-temperature resistant probe assembly 10 provided in the embodiment of the present application, the sleeve 150 also includes a sleeve body 153 connected to the first sleeve part 151 and the second sleeve part 152. The probe assembly 10 also includes a heat sink 108. The heat sink 108 is connected to a portion of the outer surface of the sleeve body 153 close to the first sleeve part 151 to achieve heat dissipation of the sleeve 150 to the outside, thereby reducing heat conduction from the clamp 130 wrapped by the sleeve 150 to the second connecting part 122, causing overheating and damage to the second connecting part 122. Furthermore, the heat sink 108 increases the maximum temperature of the application environment of the probe assembly 10.

[0127] Mentioning "embodiments" and "implementation methods" in this application means that the specific features, structures or characteristics described in conjunction with the implementation methods may be included in at least one embodiment of the present application. The appearance of the phrases in various places in the specification does not necessarily refer to the same implementation method, nor is it an independent or alternative implementation method that is mutually exclusive with other implementation methods. It is understood explicitly and implicitly by those skilled in the art that the implementation methods described in the present invention can be combined with other implementation methods. In addition, it should also be understood that the features, structures or characteristics described in the various implementation methods of the present application can be arbitrarily combined to form another implementation method that does not deviate from the spirit and scope of the technical solution of the present invention, provided that there is no contradiction between them.

[0128] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model and are not limiting. Although the utility model has been described in detail with reference to the above preferred embodiments, ordinary technicians in this field should understand that the technical solution of this application can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model.

Claims

1. A high temperature resistant probe assembly, characterized in that: The probe assembly comprises: A probe having a detection portion and a fixing portion disposed opposite to each other, wherein the detection portion is used to test a sample; A wire, the wire comprising a first connecting portion connected to the fixing portion; a clamp, the clamp being used to accommodate the fixing portion and the first connecting portion; a first heat insulating member, the first heat insulating member wrapping the clamp and being arranged corresponding to the fixing portion and the first connecting portion; a first temperature-resistant fastener, the first temperature-resistant fastener being used for crimping and fixing the fixing portion to the clamp; and A second temperature-resistant fastener is used for crimping and fixing the clamp to the first thermal insulation member.

2. The probe assembly according to claim 1, wherein The fixture comprises: a first clamp portion, the first clamp portion having a first through hole, the first temperature-resistant fastener being disposed corresponding to the first through hole to fix the fixing portion to the clamp, and; The second clamp portion has a second through hole, and the second temperature-resistant fastener is arranged corresponding to the second through hole to fix the clamp to the first thermal insulation component.

3. The probe assembly according to claim 2, wherein: The first clamp portion has: A first peripheral side surface and a limiting surface, wherein the limiting surface is connected to the first peripheral side surface by bending, and the limiting surface faces away from the probe; the fixture further comprises: A clamp body connected between the first clamp portion and the second clamp portion, the clamp body having a second peripheral side surface, the second peripheral side surface being bent and connected to the limiting surface; the first thermal insulation member having: A third peripheral side surface and an end surface, wherein the third peripheral side surface and the end surface are connected to the bend, wherein the end surface abuts against the limiting surface.

4. The probe assembly according to claim 3, wherein: The fixture body also includes: A first body sub-part, the first body sub-part having a first sub-circumferential side surface, the first sub-circumferential side surface being connected to the limiting surface by a bending motion; and The second body sub-part has a second sub-circumferential side surface and a first side surface, the second sub-circumferential side surface is connected to the first side surface by a bending, the first side surface is connected to the first sub-circumferential side surface by a bending, and the first side surface and the limiting surface are located on the same side of the second sub-circumferential side surface; the first thermal insulation component has: A first inner wall surface is in contact with the second sub-peripheral side surface.

5. The probe assembly according to any one of claims 1 to 4, characterized in that: The probe assembly further includes a cannula, the cannula comprising: a first sleeve portion, the first sleeve portion being provided on an outer peripheral side of an end of the first heat insulating member away from the probe and accommodating the first connecting portion; and The second sleeve portion is used to connect with the displacement stage to drive the probe to move under the action of the displacement stage.

6. The probe assembly according to claim 5, wherein: The wire also has: a wire body, one end of which is connected to the first connecting portion; and a second connecting portion, the second connecting portion being connected to the other end of the wire body and being used to electrically connect to the measurement interface; the probe assembly further comprising: a second heat insulating member, the second heat insulating member being sleeved on the outer circumference of the portion of the wire body connected to the first connecting portion, and the second heat insulating member being further accommodated in the sleeve; and A third heat insulating member is sleeved on the outer circumference of a portion of the wire body close to the second connecting portion.

7. The probe assembly according to claim 6, wherein: The probe assembly further comprises: a support member, wherein one end of the support member accommodates a portion of the wire body close to the second connecting portion and a portion of the third thermal insulation member close to the second connecting portion, and the other end of the support member is used to connect to the translation stage; and A transition piece is used to fix the support piece to the sleeve.

8. The probe assembly according to claim 5, wherein: The probe assembly further comprises: A locking member is located on the outer peripheral side of the first sleeve portion, wraps the sleeve, and locks the sleeve and the first thermal insulation member.

9. The probe assembly according to claim 8, wherein: The sleeve further comprises: a sleeve body, one end of which is connected to the first sleeve part and the other end of which is connected to the second sleeve part; the probe assembly further comprises: A heat sink is connected to a portion of the outer surface of the sleeve body close to the first sleeve portion, and is used to transfer the heat of the clamp to the outside.

10. A probe seat, characterized in that: The probe seat comprises: At least one probe assembly according to any one of claims 1 to 9, wherein the probe in the probe assembly is used to test the working status of the sample under test in a test environment; A testing platform, the testing platform is used to carry the sample to be tested, and the testing platform provides the testing environment for the sample to be tested; a translation stage connected to a side of the probe assembly facing away from the detection stage; the translation stage is used to move in different directions to adjust the position of the probe; and An electrode device is electrically connected to the wire of the wire and is used to exchange electrical signals with the probe.

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