Optical module capable of improving heat dissipation efficiency

Abstract

The utility model discloses an optical module capable of improving heat dissipation efficiency. The optical module comprises a PCBA board, a transmitting end assembly and a receiving end assembly. The PCBA board comprises a PCBA board transmitting surface and a PCBA board receiving surface; the transmitting end assembly comprises a transmitting end laser chip, a first lens, an optical transmission assembly, a second lens, an optical fiber assembly and an optical transmitting interface; the receiving end assembly comprises an optical receiving interface, an optical fiber, an optical receiving device, a photoelectric detecting device and a TIA device; the transmitting end laser chip transmits an optical signal, and the optical signal is transmitted to the optical transmission assembly through the first lens and then reaches the optical transmitting interface to be output through the second lens and the optical fiber assembly. An optical signal is input into the optical receiving interface, transmitted to the optical receiving device through the optical fiber and then converted into an electric signal through the photoelectric detecting device, and the electric signal is output from the photoelectric detecting device and reaches the TIA device to be amplified and received. According to the utility model, the transmitting end assembly and the receiving end assembly are arranged at the two sides of the PCBA board, so that heat is dissipated from the upper cover and the lower cover of the optical module respectively, and the heat dissipation efficiency of the optical module is improved.

Description

Technical Field

[0001] The utility model relates to the field of optical signal transmission, and in particular to an optical module with improved heat dissipation efficiency. Background Art

[0002] In the prior art, the transmitter chip and receiver chip of an optical module are usually placed on the same side of the PCBA board. Therefore, the heat generated by the transmitter chip and the receiver chip accumulate on the same side of the optical module, which is usually the closed side in the optical module application scenario. As a result, the heat on one side of the optical module is very high, affecting heat dissipation.

[0003] Therefore, the problem in the existing technology is that the transmitter chip and the receiver chip of the optical module are placed on the same side of the PCBA board, which causes high heat on one side of the optical module and low heat dissipation efficiency, resulting in unstable product performance and shortened service life.

[0004] Therefore, there is an urgent need for an optical module structure that improves the internal heat dissipation structure and enhances the heat dissipation efficiency. Utility Model Content

[0005] In order to improve the heat dissipation efficiency of the optical module, the utility model proposes an optical module with improved heat dissipation efficiency, comprising a PCBA board, a transmitting end assembly, and a receiving end assembly; the PCBA board comprises a PCBA board transmitting surface and a PCBA board receiving surface; the transmitting end assembly is placed on the PCBA board transmitting surface, and the receiving end assembly is placed on the PCBA board receiving surface; the transmitting end assembly comprises a transmitting end laser chip, a first lens, an optical transmission assembly, a second lens, an optical fiber assembly, and an optical transmitting interface; the receiving end assembly comprises an optical receiving interface, an optical fiber, an optical receiving device, a photoelectric detection device, and a TIA device;

[0006] The transmitting end laser chip transmits an optical signal, which is transmitted to the optical transmission component through the first lens, and then reaches the optical transmission interface through the second lens and the optical fiber component for output;

[0007] The optical receiving interface inputs an optical signal, which is transmitted to the optical receiving device through the optical fiber and then converted into an electrical signal by the photoelectric detection device. The electrical signal is output from the photoelectric detection device and reaches the TIA device to be amplified and received.

[0008] Furthermore, the transmitting end component also includes a substrate, which is placed on the transmitting surface of the PCBA board, and the transmitting end laser chip is placed on the substrate.

[0009] Furthermore, the optical module further comprises an optical module upper cover and an upper cover side heat conduction device, and the heat generated by the transmitting end component reaches the optical module upper cover through the upper cover side heat conduction device and is dissipated.

[0010] Furthermore, the optical module further comprises an optical module lower cover and a lower cover side heat conduction device, and the heat generated by the receiving end component reaches the optical module lower cover through the lower cover side heat conduction device and is dissipated.

[0011] Furthermore, the first lens is coupled and aligned with the transmitting end laser chip, and the second lens is coupled and aligned with the optical transmission component.

[0012] Furthermore, the upper cover side heat conduction component and the lower cover side heat conduction component are heat pipes or heat conduction gels or condensation materials.

[0013] Furthermore, the optical transmitting interface and the optical receiving interface are specifically LC interfaces.

[0014] Furthermore, the TIA device is fixed on the receiving surface of the PCBA board by welding and gold wire bonding.

[0015] Furthermore, the substrate, the transmitting end laser chip, the first lens, the optical transmission component, the second lens, and the optical fiber component are fixed on the emitting surface of the PCBA board by gluing; the light receiving device and the photoelectric detection device are fixed on the receiving surface of the PCBA board by gluing.

[0016] Furthermore, the upper cover side heat conduction device is placed directly above the optical transmission component or the emitting end laser chip, and the upper cover side heat conduction device is in direct contact with the optical transmission component or the emitting end laser chip; the lower cover side heat conduction device is placed directly below the optical receiving device or the TIA device, and the lower cover side heat conduction device is in direct contact with the optical receiving device or the TIA device.

[0017] The beneficial effect of the present invention is that by placing the transmitting end component and the receiving end component on both sides of the PCBA board, heat is dissipated from the upper cover and the lower cover of the optical module respectively, thereby improving the heat dissipation efficiency of the optical module, avoiding heat accumulation on one side, and improving the working performance and service life of the optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of the transmitter component of an embodiment of the utility model;

[0019] Figure 2 This is a schematic diagram of the receiving end component structure of an embodiment of the utility model;

[0020] Figure 3 This is a schematic diagram showing that the transmitter and receiver components are respectively placed on the upper and lower cover sides of the optical module according to an embodiment of the present utility model.

[0021] In the figure: 1-PCBA board emitting surface, 2-substrate, 3-emitting end laser chip, 4-first lens, 5-optical transmission component, 6-second lens, 7-optical fiber component, 8-optical transmitting interface, 9-optical receiving interface, 10-optical fiber, 11-optical receiving device, 12-photoelectric detection device, 13-TIA device, 14-PCBA board receiving surface, 15-optical module upper cover, 16-optical module lower cover, 17-upper cover side heat conduction device, 18-lower cover side heat conduction device. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0023] In the following embodiments, TIA, or trans-impedance amplifier, is used to amplify current signals.

[0024] Example 1

[0025] An optical module for improving heat dissipation efficiency includes a PCBA board, a transmitting end component, and a receiving end component; the PCBA board includes a PCBA board transmitting surface 1 and a PCBA board receiving surface 14; the transmitting end component is placed on the PCBA board transmitting surface 1, and the receiving end component is placed on the PCBA board receiving surface 14; the transmitting end component includes a transmitting end laser chip 3, a first lens 4, an optical transmission component 5, a second lens 6, an optical fiber component 7, and an optical transmitting interface 8; the receiving end component includes an optical receiving interface 9, an optical fiber 10, an optical receiving device 11, a photoelectric detection device 12, and a TIA device 13.

[0026] The first lens 4 is coupled and aligned with the transmitting end laser chip 3. The optical signal is emitted from the transmitting end laser chip 3 and transmitted to the optical transmission component 5 after coupling and collimation. The second lens 6 is coupled and aligned with the optical transmission component 5, coupling the emitted light to the optical fiber component 7, and transmitting it to the optical transmission interface 8 through the optical fiber. The optical transmission interface 8 is the interface between the transmitting end of the optical module and the external communication connection jumper, which transmits the light out, thereby realizing the optical signal sending process of the optical module.

[0027] The optical receiving interface 9 is the interface between the receiving end of the optical module and the external communication connection jumper. The optical signal is input from the optical receiving interface 9 and transmitted to the optical receiving device 11 inside the optical module through the optical fiber 10. The optical signal received by the optical receiving device 11 is coupled to the photoelectric detection device 12 and converted into an electrical signal. The electrical signal output from the photoelectric detection device 12 is then amplified by the TIA device 13 placed on the receiving surface 14 of the PCBA board. After this process, the received optical signal is converted into a readable electrical signal, thereby realizing the optical signal reception process of the optical module.

[0028] There are covers on both sides of the optical module, and heat conduction devices are placed on the covers. When the optical module is working, the heat generated by the transmitting and receiving components can be dissipated from the covers through the heat conduction devices on both sides to avoid heat accumulation.

[0029] Example 2

[0030] An optical module for improving heat dissipation efficiency includes a PCBA board emitting surface 1, a substrate 2, a transmitting-end laser chip 3, a first lens 4, an optical transmission component 5, a second lens 6, an optical fiber component 7, an optical transmitting interface 8, an optical receiving interface 9, an optical fiber 10, an optical receiving device 11, a photoelectric detection device 12, a TIA device 13, a PCBA board receiving surface 14, an optical module upper cover 15, an optical module lower cover 16, an upper cover-side heat conduction device 17, and a lower cover-side heat conduction device 18.

[0031] like Figure 1 As shown, the PCBA board emission surface 1, substrate 2, emission end laser chip 3, first lens 4, optical transmission component 5, second lens 6, optical fiber component 7, and optical emission interface 8 constitute the emission end component. The substrate 2, first lens 4, optical transmission component 5, second lens 6, and optical fiber component 7 are placed on the PCBA board emission surface 1, and the emission end laser chip 3 is placed on the substrate 2; the first lens 4 is coupled and aligned with the emission end laser chip 3, and the optical signal is emitted from the emission end laser chip 3, and is transmitted to the optical transmission component 5 after coupling and collimation. The second lens 6 is coupled and aligned with the optical transmission component 5, and the emitted light is coupled to the optical fiber component 7, which is transmitted to the optical emission interface 8 through the optical fiber. The optical emission interface 8 is the interface between the optical module emission end and the external communication connection jumper, which transmits the light out, thereby realizing the optical signal sending process of the optical module.

[0032] like Figure 2As shown, the optical receiving interface 9, optical fiber 10, optical receiving device 11, photoelectric detection device 12, TIA device 13, and PCBA board receiving surface 14 constitute a receiving end component. The optical receiving interface 9, optical fiber 10, optical receiving device 11, photoelectric detection device 12, and TIA device 13 are placed on the PCBA board receiving surface 14; the optical receiving interface 9 is the interface between the receiving end of the optical module and the external communication connection jumper. The optical signal is input from the optical receiving interface 9 and transmitted to the optical receiving device 11 inside the optical module through the optical fiber 10. The optical signal received by the optical receiving device 11 is coupled to the photoelectric detection device 12 and converted into an electrical signal. The electrical signal output from the photoelectric detection device 12 is then amplified by the TIA device 13 placed on the PCBA board receiving surface 14. After this process, the received optical signal is converted into a readable electrical signal, thereby realizing the optical signal receiving process of the optical module.

[0033] like Figure 3 As shown, the transmitting end component is placed on the upper cover side of the optical module, and the receiving end component is placed on the lower cover side of the optical module. The upper cover 15 of the optical module is provided with an upper cover side heat conduction device 17, and the lower cover 16 of the optical module is provided with a lower cover side heat conduction device 18. The heat generated by the transmitting end component can be thermally conducted to the upper cover 15 of the optical module through the upper cover side heat conduction device 17 and dissipated; the heat generated by the receiving end component can be thermally conducted to the lower cover 16 of the optical module through the lower cover side heat conduction device 18 and dissipated.

[0034] In this embodiment, the upper cover side heat conduction device 17 and the lower cover side heat conduction device 18 can be elements with high heat conduction efficiency, such as heat pipes, heat conduction gels, or condensation materials.

[0035] In this embodiment, the optical transmitting interface 8 and the optical receiving interface 9 are specifically LC interfaces.

[0036] In this embodiment, the TIA device 13 is fixed to the receiving surface 14 of the PCBA board by welding and gold wire bonding; the substrate 2, the transmitting end laser chip 3, the first lens 4, the optical transmission component 5, the second lens 6, and the optical fiber component 7 are fixed to the transmitting surface 1 of the PCBA board by gluing; the optical receiving device 11 and the photodetector device 12 are fixed to the receiving surface 14 of the PCBA board by gluing.

[0037] The contact surface between the components inside the optical module and the upper and lower covers of the optical module is uneven, with air in between. The thermal conductivity of air is 0.026, which is more than ten times lower than that of heat conduction devices. Therefore, it is necessary to bond the heat conduction device directly above or below the components in the optical module that generate the most heat, and ensure direct contact to improve heat dissipation efficiency.

[0038] In this embodiment, the upper cover side heat conduction device 17 is placed directly above the optical transmission component 5 or the emitting end laser chip 3, and the upper cover side heat conduction device 17 is in direct contact with the optical transmission component 5 or the emitting end laser chip 3; the lower cover side heat conduction device 18 is placed directly below the optical receiving device 11 or the TIA device 13, and the lower cover side heat conduction device 18 is in direct contact with the optical receiving device 11 or the TIA device 13.

[0039] In another embodiment of the present invention, the transmitting end component may be placed on the lower cover side of the optical module, and the receiving end component may be placed on the upper cover side of the optical module.

[0040] In the above embodiment, by placing the transmitter component and the receiver component on both sides of the PCBA board, heat is dissipated from the upper cover and the lower cover of the optical module respectively, thereby improving the heat dissipation efficiency of the optical module, avoiding heat accumulation on one side, and improving the working performance and service life of the optical module.

[0041] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to this utility model.

Claims

1. An optical module for improving heat dissipation efficiency, characterized in that: The invention comprises a PCBA board, a transmitting end component and a receiving end component; the PCBA board comprises a PCBA board transmitting surface (1) and a PCBA board receiving surface (14); the transmitting end component is placed on the PCBA board transmitting surface (1), and the receiving end component is placed on the PCBA board receiving surface (14); the transmitting end component comprises a transmitting end laser chip (3), a first lens (4), an optical transmission component (5), a second lens (6), an optical fiber component (7) and an optical transmitting interface (8); the receiving end component comprises an optical receiving interface (9), an optical fiber (10), an optical receiving device (11), a photoelectric detection device (12) and a TIA device (13); The transmitting end laser chip (3) transmits an optical signal, and the optical signal is transmitted to the optical transmission component (5) via the first lens (4), and then reaches the optical transmission interface (8) for output via the second lens (6) and the optical fiber component (7); The optical receiving interface (9) inputs an optical signal, the optical signal is transmitted to the optical receiving device (11) through the optical fiber (10), and then converted into an electrical signal by the photoelectric detection device (12). The electrical signal is output from the photoelectric detection device (12) and reaches the TIA device (13) to be amplified and received.

2. The optical module for improving heat dissipation efficiency according to claim 1, characterized in that: The transmitting end component further comprises a substrate (2), the substrate (2) being placed on the transmitting surface (1) of the PCBA board, and the transmitting end laser chip (3) being placed on the substrate (2).

3. The optical module for improving heat dissipation efficiency according to claim 1, characterized in that: The optical module further comprises an optical module upper cover (15) and an upper cover side heat conduction device (17), and the heat generated by the transmitting end component reaches the optical module upper cover (15) through the upper cover side heat conduction device (17) and is dissipated.

4. The optical module for improving heat dissipation efficiency according to claim 3, characterized in that: The optical module further comprises an optical module lower cover (16) and a lower cover side heat conduction device (18), and the heat generated by the receiving end component reaches the optical module lower cover (16) through the lower cover side heat conduction device (18) and is dissipated.

5. The optical module for improving heat dissipation efficiency according to claim 1, characterized in that: The first lens (4) is coupled and aligned with the transmitting end laser chip (3), and the second lens (6) is coupled and aligned with the optical transmission component (5).

6. The optical module for improving heat dissipation efficiency according to claim 4, characterized in that: The upper cover side heat conduction device (17) and the lower cover side heat conduction device (18) are heat conduction pipes or heat conduction gel or condensation materials.

7. The optical module for improving heat dissipation efficiency according to claim 1, characterized in that: The optical transmission interface (8) and the optical reception interface (9) are specifically LC interfaces.

8. The optical module for improving heat dissipation efficiency according to claim 1, characterized in that: The TIA device (13) is fixed on the PCBA board receiving surface (14) by welding and gold wire bonding.

9. The optical module for improving heat dissipation efficiency according to claim 2, characterized in that: The substrate (2), the transmitting end laser chip (3), the first lens (4), the optical transmission component (5), the second lens (6), and the optical fiber component (7) are fixed on the transmitting surface (1) of the PCBA board by gluing; and the optical receiving device (11) and the photoelectric detection device (12) are fixed on the receiving surface (14) of the PCBA board by gluing.

10. The optical module for improving heat dissipation efficiency according to claim 4, characterized in that: The upper cover side heat conduction device (17) is placed directly above the optical transmission component (5) or the transmitting end laser chip (3), and the upper cover side heat conduction device (17) is in direct contact with the surface of the optical transmission component (5) or the transmitting end laser chip (3); the lower cover side heat conduction device (18) is placed directly below the optical receiving device (11) or the TIA device (13), and the lower cover side heat conduction device (18) is in direct contact with the surface of the optical receiving device (11) or the TIA device (13).

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