Thin integrally-formed double inductor
By optimizing the combined structure and packaging process of chip cores and coils, the problems of dual-inductor devices independently operate and electromagnetic compatibility in high-density assembly and miniaturized electronic products are solved, and space saving and performance improvement are achieved. It is suitable for scenarios such as artificial intelligence AI servers, data centers and autonomous driving.
Patent Information
- Application Number
- CN202422560777.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-23
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2034-10-23
AI Technical Summary
Existing dual-inductor devices are difficult to operate independently in high-density assembly and miniaturized electronic products, and have a great mutual interference impact, which cannot meet the needs of electromagnetic compatibility and space occupation.
Design a thin integrated double inductor, using a preformed sheet core and coil combination, adopts a vertical accommodating groove and notch groove structure, the coil is embedded and hot-pressed to optimize the core and coil shape to reduce space occupation and interference effects, and add heat dissipation clips during the packaging process to improve performance.
It realizes reducing space occupation and interference effects in high-density PCBs, improving the performance of inductor devices, and mutual coupling coefficient k < 0.1, which is suitable for scenarios such as artificial intelligence AI servers, data centers and autonomous driving.
Smart Images
Figure CN223296649U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an inductor device, in particular to a dual inductor device with a vertical ultra-thin appearance and suitable for high-density assembly, belonging to the technical field of basic electronic components. Background Art
[0002] Inductors are one of the most commonly used components in electronic devices, widely used in various circuits to achieve filtering, energy storage, matching, and resonance. With the increasing miniaturization and portability of electronic products and the high-density assembly of components, the use of inductors has rapidly developed. Furthermore, due to electromagnetic compatibility considerations, the ability of electronic products to resist electromagnetic interference has become a fundamental design requirement, thus increasing the demand for and application of inductors.
[0003] Inductors are widely used in DC-DC converter buck (Buck) circuits and have a crucial impact on their conversion efficiency, constraining the development of big data processing hardware to a certain extent. Currently, designs and products integrating dual inductors into a single component are widely available. However, due to the variability of various application circuit designs, it is often desirable for each integrated inductor to operate independently to achieve the required function with minimal cross-interference. Furthermore, with the demand for miniaturization of electronic products, the form factor and footprint of dual inductors, as essential components for the power supply, have become key considerations for circuit designers. Inductor products require breakthroughs in all aspects, including stable performance parameters, durability, and installation compatibility. Summary of the Invention
[0004] The purpose of this utility model is to provide a thin, one-piece molded dual inductor, which is dedicated to improving the performance of inductor devices and their adaptability to various application scenarios.
[0005] The technical solution for achieving the above-mentioned purpose in the present invention is: a thin, one-piece dual inductor, which is formed by combining two preformed and identical chip magnetic cores and two coils. One side surface of any of the chip magnetic cores is flat, and the other side surface is provided with two parallel vertical accommodating grooves spaced a certain distance apart, and the bottom of the chip magnetic core is provided with notches corresponding to each vertical accommodating groove. Each coil is a pre-bent Z-shaped copper sheet. The two chip magnetic cores are assembled with the vertical accommodating grooves closed into holes and the notches facing different directions. The coils are embedded in the vertical accommodating grooves one-to-one, and the folded edges at both ends of the coils overlap the notches. The two chip magnetic cores are seamlessly spliced and hot-pressed into one, and the exposed parts corresponding to the two ends of the coils are set as electrode pads.
[0006] Furthermore, the vertical receiving groove has a groove depth that satisfies the requirement that the middle section of the coil is clamped and fixed therein by two sides in a closed hole state.
[0007] Furthermore, the sheet magnetic cores are all cold-pressed bodies made of powder material based on customized molds.
[0008] Furthermore, the folded edge width of the coil is greater than the middle section width of the coil, the width of the notch groove is greater than the width of the vertical accommodating groove, and the coil is limitedly clamped between the two grooves.
[0009] Furthermore, the chip magnetic core is provided with an insert groove on both sides of the side opposite to the notch groove. When the chip magnetic core is assembled and hot-pressed, the insert groove is filled with a heat dissipation clip.
[0010] Furthermore, a spray paint layer is provided on the surface of the semi-finished product of the hot pressing package, and an electrode pad obtained by paint stripping and electroplating is provided at the end position corresponding to the U-shaped coil.
[0011] Compared with existing technologies, the advantages of this dual inductor are as follows: by optimizing the shape of the prefabricated magnetic core and supporting coil, it helps reduce the space occupied by the inductor components in high-density PCBs and the interference it causes to the surrounding environment. It also improves the performance of the inductor device, achieving an internal mutual coupling coefficient k less than 0.1. This further improves the circuit operating environment and promotes hardware performance development in application scenarios such as artificial intelligence (AI) servers, data centers, autonomous driving, and smart city transportation. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 This is a close-up structural diagram of a chip core in the one-piece molded dual inductor of the utility model.
[0013] Figure 2 This is a close-up structural diagram of one coil in the one-piece dual inductor of the utility model.
[0014] Figure 3 It is a schematic diagram of the appearance evolution of the assembly and manufacturing of the utility model. DETAILED DESCRIPTION
[0015] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.
[0016] The utility model proposes a thin one-piece dual inductor. Figures 1 to 3As shown, the basic structure of the dual inductor is formed by combining two preformed and identical chip cores 1 and two coils 2. When the functional components are unfolded, any chip core 1 has a smooth flat surface 11 on one side and an uneven surface 12 processed on the other side, wherein the uneven surface is provided with two parallel vertical receiving grooves 13 spaced a distance apart, and the bottom of the chip core 1 is provided with notch grooves 14 corresponding to each vertical receiving groove. It should be noted that the notch grooves are only provided on one of the top or bottom sides of the chip core, while the opposite side of the notch groove is a straight side. Any coil 2 is a pre-bent Z-shaped copper sheet, and its main body shape is adapted to be compatible with the vertical receiving groove. When assembling a group of two chip cores and coils, the two chip cores are assembled with the vertical accommodating grooves closed into holes and the notch grooves facing different directions (i.e., one notch groove faces upward and the other notch groove faces downward), and before the chip cores are spliced together, the coils are embedded one-to-one in the vertical accommodating grooves of one chip core; when the chip cores are seamlessly spliced together, the folded edges at both ends of the coils are overlapped in the notch grooves and hot-pressed to be packaged into one, and the exposed parts at both ends of the corresponding coils are often sprayed with paint, stripped, electroplated, or other conventional processes to set as electrode pads 4.
[0017] Based on this technical solution overview, the detailed features of each functional component include: Figure 1 As shown, the slot depths of the two vertical receiving grooves 13 in the chip magnetic core 1 meet the requirement that in the closed hole state, the middle section of the coil 2 is clamped and fixed in it by the two sides. It can also be understood as clamping the coil to stabilize its position and prevent it from loosening and displacement. Moreover, since the chip magnetic core is completely symmetrically arranged on both sides of the center line between the two vertical receiving grooves, the notch groove only needs to be set at one of the top or bottom, which can not only meet the needs of mass customization of chip magnetic cores, but also provide the convenience of rotating one of them 180° to make the notch grooves face different directions during assembly. In particular, the depth of the notch groove meets the requirement that the folded edge of the coil falls into it flush or slightly higher than the surface of the core, which is conducive to the production of electrode pads.
[0018] The coil 2 is cut from a copper sheet and pre-bent into a Z-shape. Figure 2 As shown, it has an upright middle section 21 and folded edges 22 formed in opposite directions at the top and bottom ends. In addition, the width of the folded edge of the coil is greater than the width of the middle section of the coil. Correspondingly, the width of the above-mentioned notch groove is greater than the width of the vertical accommodating groove. The coil is then clamped in the two grooves through width compatibility limit clamping, that is, the middle section is limited to the vertical accommodating groove, and the folded edge is limited to the notch groove. On the top and bottom surfaces of the two chip cores after hot pressing and packaging, each folded edge can occupy an appropriate area to facilitate the production of electrode pads.
[0019] As a further optimization, Figure 1 and Figure 2The chip core 1 shown has an insert slot 15 on either side of the edge opposite the notch 14. When the chip core is assembled and hot-pressed, these insert slots can be fitted with heat-dissipating clips 3 (preferably copper sheets), allowing the dual inductor to quickly dissipate heat during operation.
[0020] like Figure 1 The complete manufacturing process for this dual inductor is shown below. First, the chip core, coil, and heat sink clip are prefabricated, with two of each being taken. Coils 2a and 2b are then individually placed into the vertical slots of one chip core 1b, with the folded edges of each coil nestling into the notched slots for initial positioning. The other chip core 1a is then rotated so that the notches face opposite directions and the vertical slots face each other, completely clamping the two coils. At this point, the folded edges of the other coils nestle into the notched slots of the chip core 1a. After being transferred to the encapsulation mold, the components are encapsulated together under a heat and pressure environment at temperatures between 100°C and 200°C and pressures between 4 and 10 tons / cm². The molding time typically ranges from 30 to 180 seconds, but this time can be adjusted based on actual needs. After demolding, the product is then baked at 100-180°C for a period of time to fully cure and set. The semi-finished inductor is then fully spray-painted. The coil's folded edges are then laser-stripped. The exposed copper edges are then electroplated to create the clearly spaced electrode pads 4 on the bottom of the device. During the paint drying and stripping process, the heat sink clips 3a and 3b can be inserted into the insert slots one-to-one. The preferred approach is to ensure that the heat sink clips, after assembly, conform to the core surface without protruding portions.
[0021] The aforementioned chip cores are assembled from powder materials and custom molds using a cold-pressing process. The powder material used can be one of Fe-based, FeSi, FeSiCr, FeSiAl, FeNi, amorphous, or nanocrystalline, or a mixture of two or more. Epoxy, silicone, or acrylic resins are added, mixed, and then injected into a prefabricated mold designed to fit the device's shape. The molding pressure range is 6-10 tons / cm².
[0022] The above detailed description of the preferred embodiment of this thin, one-piece dual inductor demonstrates substantial advantages and advancements over existing technologies. Its technical benefits include: by optimizing the shape of the prefabricated magnetic core and accompanying coil, it helps reduce the space occupied by inductors in high-density PCBs and their impact on surrounding components. It also enhances inductor performance, achieving an internal coupling coefficient k < 0.1. This further improves the circuit's operating environment and promotes hardware performance advancements in application scenarios such as AI servers, data centers, autonomous driving, and smart city transportation.
[0023] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. made within the principles of the present application shall be included within the scope of protection of the present application.
Claims
1. A thin, one-piece dual inductor, characterized by: The inductor is formed by combining two preformed and identical chip magnetic cores and two coils. One side surface of any of the chip magnetic cores is flat, and the other side surface is provided with two parallel vertical accommodating grooves spaced a certain distance apart, and the bottom of the chip magnetic core is provided with notches corresponding to each vertical accommodating groove. Each coil is a pre-bent Z-shaped copper sheet. The two chip magnetic cores are assembled with the vertical accommodating grooves closed into holes and the notches facing different directions. The coils are embedded in the vertical accommodating grooves one-to-one, and the folded edges at both ends of the coils overlap the notches. The two chip magnetic cores are seamlessly spliced and hot-pressed into one, and the exposed parts corresponding to the two ends of the coils are set as electrode pads.
2. The thin, integrally molded dual inductor according to claim 1, characterized in that: The vertical receiving groove has a groove depth that satisfies the requirement that the middle section of the coil is clamped and fixed therein by two sides when the hole is closed.
3. The thin, integrally molded dual inductor according to claim 1, characterized in that: The sheet magnetic cores are all cold-pressed bodies made of powder material based on customized molds.
4. The thin, integrally molded dual inductor according to claim 1, characterized in that: The folded edge width of the coil is greater than the middle section width of the coil, the width of the notch groove is greater than the width of the vertical accommodating groove, and the coil is limitedly clamped between the two grooves.
5. The thin, integrally molded dual inductor according to claim 1, characterized in that: The chip magnetic core is provided with an insert groove on both sides of the side opposite to the notch groove. When the chip magnetic core is assembled and hot-pressed, the insert groove is filled with a heat dissipation clip.
6. The thin, integrally molded dual inductor according to claim 1, characterized in that: The surface of the semi-finished product of the hot pressing package is provided with a spray paint layer, and an electrode pad obtained by paint stripping and electroplating is provided at the end position corresponding to the U-shaped coil.