Combined hot pressboard for semiconductor bonding wire

Abstract

The utility model belongs to the technical field of bonding wire hot pressboards, in particular to a combined hot pressboard for semiconductor bonding wires, which comprises a mounting base and a fixing component arranged on the outer side of the end of the mounting base. The fixing assembly comprises a sliding plate, a containing groove and a clamping plate. The sliding plate is slidably connected to the inner side of the top end of the mounting base. A rapid material fixing and releasing mechanism achieved through the fixing assembly remarkably shortens the operation period, time efficiency is crucial in the semiconductor manufacturing process, the combined hot pressing plate design can greatly reduce material loading and unloading time, and therefore the efficiency of the whole production line is improved, and compared with a traditional complex fixing and releasing mode, the working efficiency is greatly improved. According to the design, the operation process is simplified, an operator can fix and take out the materials only by executing simple pressing and lifting actions, and the operation difficulty and the skill requirement are reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of wire bonding hot pressing plates, and in particular relates to a combined hot pressing plate for semiconductor wire bonding. Background Art

[0002] The modular hot press plate for semiconductor wire bonding is a hot pressing device that integrates multiple functions. It is designed to achieve precise bonding between semiconductor chips and lead frames or other packaging substrates. The hot press plate ensures the quality and reliability of the bond wire by providing stable and uniform temperature and pressure. Its modular design enables the hot press plate to adapt to different specifications and types of semiconductor products, improving production efficiency and flexibility.

[0003] However, traditional devices lack a quick fixing and releasing mechanism, and the material fixing and removal process may require more manual operation and time, thereby reducing the overall production or operation efficiency. Traditional devices often rely on complex mechanical structures or manual operations to fix and release materials, which not only increases the complexity of the operation, but also increases the skill requirements for the operator. Due to the lack of a special fixing mechanism, traditional devices may have insufficient stability in material fixation, increasing the risk of material movement or falling off during processing or use.

[0004] Therefore, a combined hot pressing plate for semiconductor bonding wires is designed to solve the above problems. Utility Model Content

[0005] To solve the problems raised in the above background technology. The utility model provides a combined hot press plate for semiconductor welding wires. The rapid material fixing and releasing mechanism achieved by the fixing components significantly shortens the operation cycle. In the semiconductor manufacturing process, time efficiency is very important. This combined hot press plate design can greatly reduce the time for material loading and unloading, thereby improving the efficiency of the overall production line. Compared with the traditional complex fixing and releasing methods, this design simplifies the operation process. The operator only needs to perform simple pressing and lifting actions to complete the fixing and removal of the material, which reduces the difficulty of operation and skill requirements, and also reduces the error rate caused by complex operations. In the precision manufacturing process of semiconductor welding wires, it is very important to prevent the material from moving or falling off during the operation. This combined hot press plate design effectively prevents the accidental movement of the material during the processing process through the reliable fixing mechanism of the splint and the placement of the baffle, thereby improving the safety of production.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a combined hot pressing plate for semiconductor wire bonding, comprising a mounting base and a fixing assembly disposed outside an end portion of the mounting base;

[0007] The fixing assembly includes a sliding plate, a placement groove and a clamping plate. The sliding plate is slidably connected to the inner side of the top end of the mounting base. Several placement grooves are evenly opened on the inner side of the sliding plate. Four clamping plates are arranged inside the placement groove. The outer sides of both ends of the spring are fixedly connected to the inner wall surface of the placement groove and one side of the clamping plate respectively. The two sides of the mounting base are fixedly connected to the mounting frame, and a pressing plate is installed on the inner side of the top end of the mounting frame.

[0008] As a further optimization, a placement baffle is fixedly connected to one side of the splint, and the material of the placement baffle is rubber.

[0009] As a further optimization, the inner side of the sliding plate is slidably connected to a push plate, and the upper surface of the push plate is fixedly connected to a plurality of top blocks.

[0010] As a further optimization, a buffer pad is fixedly connected to the upper surface of the top block, and the buffer pad is made of sponge.

[0011] As a further optimization, handles are fixedly connected to the outer sides of both ends of the push plate.

[0012] As a further optimization, the top block is arranged on the inner side of the four clamping plates.

[0013] As a further optimization, an indicator light is installed on the upper surface of the mounting frame, and a plurality of suction cups are fixedly connected to the lower surface of the mounting base.

[0014] Compared with the prior art, the beneficial effects of the present invention are: a fixing component is added to the present application, and the rapid material fixing and release mechanism achieved by the fixing component significantly shortens the operation cycle. In the semiconductor manufacturing process, time efficiency is crucial. This combined hot press plate design can greatly reduce the time for material loading and unloading, thereby improving the efficiency of the overall production line. Compared with the traditional complex fixing and release methods, this design simplifies the operation process. The operator only needs to perform simple pressing and lifting actions to complete the fixing and removal of the material, which reduces the operation difficulty and skill requirements, and also reduces the error rate caused by complex operations. In precision manufacturing processes such as semiconductor welding wires, it is crucial to prevent materials from moving or falling off during operation. This combined hot press plate design effectively prevents accidental movement of materials during processing through a reliable fixing mechanism of splints and baffles, thereby improving production safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0016] Figure 1It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic structural diagram of the mounting frame and the pressing plate in the present invention;

[0018] Figure 3 This is a schematic structural diagram of the sliding plate and the clamping plate in the present invention;

[0019] Figure 4 This is a schematic diagram of the structure of the splint and spring in the utility model;

[0020] Figure 5 This is a schematic structural diagram of the top block and the buffer pad in the utility model;

[0021] Figure 6 It is a structural schematic diagram of the pressing plate in the utility model.

[0022] In the picture:

[0023] 1. Install the base;

[0024] 2. Fixing assembly; 21. Sliding plate; 22. Placement slot; 23. Clamp; 24. Spring; 25. Mounting frame; 26. Pressing plate; 27. Placement baffle; 28. Push plate; 29. ​​Top block; 210. Buffer pad; 211. Handle; 212. Indicator light; 213. Suction cup. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] like Figure 1 As shown;

[0027] A modular hot press plate for semiconductor wire bonding includes a mounting base 1. However, conventional devices lack a quick fixing and release mechanism, and the material fixing and removal process may require more manual operation and time, thereby reducing overall production or operational efficiency. Conventional devices often rely on complex mechanical structures or manual operations to fix and release materials, which not only increases operational complexity but also increases the skill requirements of the operator. Due to the lack of a specialized fixing mechanism, conventional devices may have insufficient stability in material fixation, increasing the risk of material movement or falling off during processing or use. To address this technical problem, a fixing component 2 is added to this basis.

[0028] Further, if Figures 1 to 6 As shown: the fixing assembly 2 includes a sliding plate 21, a placement groove 22 and a splint 23. The sliding plate 21 is slidably connected to the inner side of the top end of the mounting base 1. Several placement grooves 22 are evenly opened on the inner side of the sliding plate 21. Four splints 23 are arranged inside the placement groove 22. The outer sides of both ends of the spring 24 are respectively fixedly connected to the inner wall surface of the placement groove 22 and one side of the splint 23. The two sides of the mounting base 1 are fixedly connected with the mounting frame 25. A pressing plate 26 is installed on the inner side of the top end of the mounting frame 25. A placement baffle 27 is fixedly connected to one side of the splint 23. The placement baffle 27 is made of rubber. The inner side of the sliding plate 21 is slidably connected with a push plate 28. The upper surface of the push plate 28 is fixedly connected with several top blocks 29. The outer sides of both ends of the push plate 28 are fixedly connected with pull handles 211. The top blocks 29 are arranged on the inner sides of the four splints 23.

[0029] In this embodiment: when the user uses the device, he can move the device to a specified position. At this time, the user can place the material between the four clamping plates 23. At this time, the user only needs to press the material inside and compress the spring 24 at the same time to fix the material. When pressed to the bottom, the material will resist the upper surface of the baffle 27, thereby blocking and fixing the material. At this time, the user can move the sliding plate 21 to the bottom of the pressing plate 26, start the pressing plate 26 to operate the material. After the operation is completed, the user only needs to push the sliding plate 21 out. At this time, the user lifts the push plate 28 upward through the pull handle 211. The push plate 28 will lift the material through the top block 29, thereby quickly taking multiple materials out of the inside of the sliding plate 21. The suction cup 213 can assist in the fixation of the device. By fixing the assembly 2. The rapid material fixing and releasing mechanism achieved by the invention significantly shortens the operation cycle. In the semiconductor manufacturing process, time efficiency is of vital importance. This combined hot press plate design can greatly reduce the time for loading and unloading materials, thereby improving the efficiency of the overall production line. Compared with the traditional complex fixing and releasing methods, this design simplifies the operation process. The operator only needs to perform simple pressing and lifting actions to complete the fixing and removal of materials, which reduces the difficulty of operation and skill requirements, and also reduces the error rate caused by complex operations. In the precision manufacturing process of semiconductor wire bonding, it is crucial to prevent the material from moving or falling off during the operation. This combined hot press plate design effectively prevents the accidental movement of materials during the processing process through the reliable fixing mechanism of the clamping plate 23 and the placement baffle 27, thereby improving the safety of production.

[0030] Furthermore, in an optional embodiment, a buffer pad 210 is fixedly connected to the upper surface of the top block 29 , and the buffer pad 210 is made of sponge.

[0031] In this embodiment, the installation of an indicator light 212 on the combined hot press plate for semiconductor wire bonding can significantly improve the intuitiveness and convenience of operation. As an intuitive tool for status feedback, the indicator light 212 can instantly convey the working status of the hot press plate to the operator, such as whether the material has been correctly pressed and fixed, whether it is currently in the heating or cooling stage, etc. This not only helps to reduce production delays caused by operational errors or misunderstandings, but also ensures that every step in the production process is executed accurately. In addition, the bright color and conspicuous position design of the indicator light 212 can provide clear visual guidance in complex or low-light working environments, thereby improving the safety and operational efficiency of the overall working environment. At the same time, through the intelligent control system, the indicator light 212 can also be linked with the alarm system. Once an abnormal situation is detected, such as excessive temperature or incorrect material fixation, a warning signal will be immediately issued to quickly remind the operator to take measures to ensure production safety and equipment stability. Therefore, the installation of the indicator light 212 is an important highlight in the design of the combined hot press plate, which significantly improves the intelligence level of the equipment and user experience.

[0032] Furthermore, in an optional embodiment, an indicator light 212 is installed on the upper surface of the mounting frame 25 , and a plurality of suction cups 213 are fixedly connected to the lower surface of the mounting base 1 .

[0033] In this embodiment: the buffer pad 210 is fixedly connected to the part in contact with the material in the combined hot pressing plate for semiconductor wire bonding, which brings many significant benefits. First, the buffer pad 210 has excellent shock absorption and cushioning properties, which can effectively reduce the impact and vibration of the material during the fixing process and protect the surface of the material from damage. This is especially important when performing wire bonding operations on precision semiconductor components. Secondly, the porous structure of the buffer pad 210 can absorb and disperse the excess heat generated during the welding process, which helps to maintain the temperature uniformity of the material surface and avoid welding defects or material damage caused by local overheating. In addition, the buffer pad 210 can also effectively absorb spatter and impurities that may be generated during the welding process, keep the working environment clean, and reduce the burden of subsequent cleaning work. For operators, the soft touch of the buffer pad 210 can also improve the comfort of operation and reduce fatigue on the hands caused by long-term operation.

[0034] Working principle: When the user uses the device, he can move the device to a designated position. At this time, the user can place the material between the four clamping plates 23. At this time, the user only needs to press the material inside and compress the spring 24 at the same time to fix the material. When pressed to the bottom, the material will press against the upper surface of the baffle 27, thereby shielding and fixing the material. At this time, the user can move the sliding plate 21 to the bottom of the pressing plate 26 and start the pressing plate 26 to operate the material. After the operation is completed, the user only needs to push the sliding plate 21 out. At this time, the user lifts the push plate 28 upward through the pull handle 211. The push plate 28 will lift the material through the top block 29, thereby quickly taking multiple materials out of the inside of the sliding plate 21, and the suction cup 21 3 can assist in the fixation of the device. The rapid material fixation and release mechanism achieved by the fixing component 2 significantly shortens the operation cycle. In the semiconductor manufacturing process, time efficiency is crucial. This combined hot press plate design can significantly reduce the time for material loading and unloading, thereby improving the efficiency of the entire production line. Compared with the traditional complex fixation and release method, this design simplifies the operation process. The operator only needs to perform simple pressing and lifting actions to complete the fixation and removal of the material, which reduces the difficulty and skill requirements of the operation and reduces the error rate caused by complex operations. In the precision manufacturing process of semiconductor wire bonding, it is crucial to prevent the material from moving or falling off during the operation. This combined hot press plate design is designed by placing the clamp 23 and the baffle 2 7. A reliable fixing mechanism effectively prevents accidental movement of materials during processing, thereby improving production safety. Installing an indicator light 212 on the combined hot press plate for semiconductor wire bonding can significantly improve the intuitiveness and convenience of operation. As an intuitive tool for status feedback, the indicator light 212 can instantly convey the working status of the hot press plate to the operator, such as whether the material has been correctly pressed and fixed, whether it is currently in the heating or cooling stage, etc. This not only helps to reduce production delays caused by operational errors or misunderstandings, but also ensures that every step in the production process is executed accurately. In addition, the bright color and conspicuous position design of the indicator light 212 can provide clear visual guidance in complex or low-light working environments, thereby improving the overall working environment. Safety and operational efficiency. At the same time, through the intelligent control system, the indicator light 212 can also be linked with the alarm system. Once an abnormal situation is detected, such as excessive temperature or incorrect fixation of materials, a warning signal is immediately issued to quickly remind the operator to take measures to ensure production safety and equipment stability. Therefore, the installation of the indicator light 212 is an important highlight in the design of the combined hot pressing plate. It significantly improves the intelligence level of the equipment and user experience. The part of the combined hot pressing plate for semiconductor bonding wires that contacts the material is fixedly connected to the buffer pad 210, which brings many significant benefits. First, the buffer pad 210 has excellent shock absorption and cushioning properties, which can effectively reduce the impact and vibration of the material during the fixing process and protect the material surface from damage.This is particularly important when wire bonding precision semiconductor components. Furthermore, the porous structure of cushion pad 210 absorbs and disperses excess heat generated during the welding process, helping to maintain temperature uniformity across the material surface and preventing welding defects or material damage caused by localized overheating. Furthermore, cushion pad 210 effectively absorbs spatter and impurities that may be generated during welding, maintaining a clean working environment and reducing the burden of subsequent cleanup. For operators, the soft touch of cushion pad 210 enhances operating comfort and reduces hand fatigue from prolonged work.

[0035] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A combined hot pressing plate for semiconductor wire bonding, comprising a mounting base (1), characterized in that: It also includes a fixing assembly (2) arranged on the outside of the end of the mounting base (1); The fixing assembly (2) comprises a sliding plate (21), a placement groove (22) and a clamping plate (23); the sliding plate (21) is slidably connected to the inner side of the top end of the mounting base (1); a plurality of placement grooves (22) are evenly provided on the inner side of the sliding plate (21); four clamping plates (23) are provided inside the placement groove (22); the outer sides of both ends of the spring (24) are fixedly connected to the inner wall surface of the placement groove (22) and one side of the clamping plate (23); the two sides of the mounting base (1) are fixedly connected to the mounting frame (25); and a pressing plate (26) is installed on the inner side of the top end of the mounting frame (25).

2. The combined hot pressing plate for semiconductor wire bonding according to claim 1, wherein: A placement baffle (27) is fixedly connected to one side of the clamping plate (23), and the material of the placement baffle (27) is rubber.

3. The combined hot pressing plate for semiconductor wire bonding according to claim 2, wherein: The inner side of the sliding plate (21) is slidably connected to a push plate (28), and the upper surface of the push plate (28) is fixedly connected to a plurality of top blocks (29).

4. The combined hot pressing plate for semiconductor wire bonding according to claim 3, wherein: A buffer pad (210) is fixedly connected to the upper surface of the top block (29), and the buffer pad (210) is made of sponge.

5. The combined hot pressing plate for semiconductor wire bonding according to claim 3, wherein: Pull handles (211) are fixedly connected to the outer sides of both ends of the push plate (28).

6. The combined hot pressing plate for semiconductor wire bonding according to claim 3, wherein: The top block (29) is arranged on the inner side of the four clamping plates (23).

7. The combined hot pressing plate for semiconductor wire bonding according to claim 1, wherein: An indicator light (212) is installed on the upper surface of the mounting frame (25), and a plurality of suction cups (213) are fixedly connected to the lower surface of the mounting base (1).

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