Centralized heat management device and energy storage system

Through the centralized thermal management device, the cooling capacity is provided for the energy storage cabinet, which solves the problem of energy density reduction caused by excessive volume of the heat dissipation system in the energy storage cabinet, realizes the management of efficient cooling and thermal runaway risks, and improves the energy density and safety of the energy storage system.

CN223296917UActive Publication Date: 2025-09-02SUNGROW POWER SUPPLY CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202422716814.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-06
Publication Date
2025-09-02
Estimated Expiration
2034-11-06

AI Technical Summary

Technical Problem

With the increase in the number of battery cells and stored energy in the energy storage system, the demand for heat dissipation increases, resulting in an increase in the volume of the heat dissipation system in the energy storage cabinet and reducing the energy density.

Method used

The centralized thermal management device is adopted, including a thermal management host and multiple cooling branches. The energy storage cabinet is provided with cooling capacity through compression refrigeration circuit, liquid cooling supply circuit, air cooling circuit and air cooling supply circuit, reducing the consumption of the cabin space in the energy storage cabinet.

Benefits of technology

The energy density of the energy storage cabinet is improved, the structure of the heat dissipation system is simplified, the difficulty of maintenance and maintenance is reduced, and further risks are reduced when the heat is out of control.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223296917U_ABST
    Figure CN223296917U_ABST
Patent Text Reader

Abstract

The utility model provides a centralized heat management device and an energy storage system. A centralized heat management device comprises: a heat management host, the heat management host comprising a compression refrigeration loop; and a plurality of cold supply branches. Each cold supply branch is provided with a cold supply outlet and a cold supply return port; a cold supply outlet and a cold supply return port of the cold supply branch are used for being connected with an energy storage cabinet; and the compression refrigeration loop is used for cooling a cooling medium in the cold supply branch. The centralized heat management device is provided with a plurality of cooling branches, so that cooling capacity can be provided for a plurality of energy storage cabinets, occupation of the inner cabin space of the energy storage cabinets is reduced, and the energy density of the energy storage cabinets is improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present application relates to the field of energy storage, and specifically to a centralized thermal management device and an energy storage system. Background Art

[0002] Currently, with the increasing demand for stored energy, energy storage systems often include multiple energy storage cabinets. To meet these heat dissipation requirements, a heat dissipation system is installed in each energy storage cabinet. However, as the demand for energy storage increases, the number of battery cells and / or the maximum storage energy of each battery cell in each energy storage cabinet increases, and the demand for heat dissipation also increases. This results in an increasing size of the heat dissipation system in the energy storage cabinet, which reduces the energy density of the energy storage cabinet. Summary of the Invention

[0003] Multiple embodiments of the present application provide a centralized thermal management device and an energy storage system that can improve the energy density of an energy storage cabinet.

[0004] In one aspect, the present application provides a centralized thermal management device, comprising:

[0005] a thermal management host, the thermal management host comprising a compression refrigeration circuit; and

[0006] Multiple cooling branches, each cooling branch having a cooling outlet and a cooling return; the cooling outlet and cooling return of the cooling branch are used to connect to the energy storage cabinet;

[0007] Wherein, the compression refrigeration circuit is used to cool the cooling medium in the cooling branch.

[0008] In some embodiments, the compression refrigeration circuit is provided with a first evaporation unit and a first condensation unit;

[0009] The thermal management host also includes:

[0010] a liquid cooling supply circuit, wherein the liquid cooling supply circuit is provided with a first heat exchange unit arranged for heat exchange with the first evaporation unit; the plurality of cooling branches are provided on the liquid cooling supply circuit;

[0011] An air cooling circuit is provided with an air cooler and a second heat exchange unit arranged for heat exchange with the first condensing unit.

[0012] In some embodiments, the centralized thermal management device has a first coupling mode and a second coupling mode;

[0013] Wherein, the first coupling mode is configured such that the liquid cooling supply circuit independently forms a closed circuit; and the compression refrigeration circuit provides cooling capacity for the liquid cooling supply circuit;

[0014] The second coupling mode is configured as the air cooling circuit and the liquid cooling supply circuit being connected in series.

[0015] In some embodiments, the plurality of cooling branches are provided on the compression refrigeration circuit.

[0016] In some embodiments, the thermal management host further includes:

[0017] The air-cooling supply circuit is provided with the plurality of cooling branches.

[0018] In some embodiments, the compression refrigeration circuit is provided with a second condensing unit and a second evaporating unit;

[0019] The air-cooled supply circuit is provided with a third heat exchange unit, and the third heat exchange unit has a heat exchange cavity; the second evaporation unit is located in the heat exchange cavity.

[0020] In some embodiments, the air-cooling supply circuit is provided with a plurality of air circulation drive mechanisms; the plurality of air circulation drive mechanisms are arranged in the heat exchange chamber, and each of the cooling branches is correspondingly provided with at least one of the air circulation drive mechanisms.

[0021] In some embodiments, the third heat exchange unit is provided with a condensate drainage structure.

[0022] In some embodiments, the air cooling supply circuit is provided with an air circulation drive mechanism;

[0023] The centralized thermal management device further includes a control unit; the control unit is configured to control and increase the power of the airflow circulation drive mechanism when thermal runaway occurs in the battery cell in the energy storage cabinet.

[0024] On the other hand, the present application also provides an energy storage system, which includes multiple energy storage cabinets and the centralized thermal management device provided by the present application; each of the energy storage cabinets is connected to the centralized thermal management device through at least one of the cooling branches.

[0025] In the multiple embodiments provided in the present application, the centralized thermal management device is provided with multiple cooling branches, thereby providing cooling for multiple energy storage cabinets, reducing the space occupied by the internal cabin of the energy storage cabinets, and improving the energy density of the energy storage cabinets. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic structural diagram of a centralized thermal management device provided in one embodiment of the present application.

[0027] Figure 2 A schematic structural diagram of a centralized thermal management device provided in one embodiment of the present application.

[0028] Figure 3A schematic structural diagram of a centralized thermal management device provided in one embodiment of the present application.

[0029] Figure 4 A schematic structural diagram of a centralized thermal management device provided in one embodiment of the present application.

[0030] Figure 5 A schematic structural diagram of an energy storage system provided for one embodiment of the present application.

[0031] Figure 6 A schematic structural diagram of an energy storage system provided for one embodiment of the present application.

[0032] Figure 7 A schematic structural diagram of an energy storage system provided for one embodiment of the present application.

[0033] Figure 8 A schematic structural diagram of an energy storage system provided for one embodiment of the present application.

[0034] Description of Reference Numerals

[0035] 100 / 200 / 300 / 400, centralized thermal management device; 1000 / 2000 / 3000 / 4000, energy storage system; 110, thermal management host; 111, compression refrigeration circuit; 111a, first evaporation unit; 111b, first condensing unit; 111c, compressor; 111d, second condensing unit; 111e, second evaporation unit; 112, liquid cooling supply circuit; 112a, first heat exchange unit; 112b, power supply device; 113, air cooling circuit; 113a , air cooler; 113b, second heat exchange unit; 114, pipeline coupling mechanism; 114a, first interface; 114b, second interface; 114c, third interface; 114d, fourth interface; 115, air-cooled supply circuit; 115a, third heat exchange unit; 115b, heat exchange chamber; 115c, air circulation drive mechanism; 120, cooling branch; 121, cooling outlet; 122, cooling return; 123, valve; 130, energy storage cabinet; 131, air-cooled inlet; 132, air-cooled outlet. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0037] In this application, the drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show details of the local features.

[0038] Unless otherwise indicated, all technical and scientific terms used in this application have the same meaning as those generally understood by those skilled in the art in the technical field of this application. The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit the scope of this application. The term "and / or" used in this application includes any and all combinations of one or more related listed items. The singular forms "a", "above", and "the" used in this application and the appended claims are also intended to include plural forms, unless the context clearly indicates otherwise.

[0039] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, "plurality" means two or more, unless otherwise clearly and specifically defined. In the description of this application, "several" means one or more, unless otherwise clearly and specifically defined.

[0040] In the description of this application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of a simplified description of this application, and do not indicate that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be understood as a limitation to this application.

[0041] In the description of this application, unless otherwise expressly defined, the terms "installed," "connected," "connect," "fixed," and "disposed" should be understood broadly. For example, "connection" can mean fixed, removable, or integrated; it can mean mechanical or electrical; it can mean direct or indirect connection through an intermediary; it can also mean internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0042] In the description of this application, unless otherwise explicitly defined, a first feature being “on,” “above,” “above,” “above,” “below,” “below,” or “below” a second feature may mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Moreover, a first feature being “on,” “above,” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature. A first feature being “below,” “below,” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than that of the second feature.

[0043] See also Figure 1 A centralized thermal management device 100 provided in one embodiment of the present application includes a thermal management host 110 and multiple cooling branches 120. The thermal management host 110 includes a compression refrigeration circuit 111. Each cooling branch 120 has a cooling outlet 121 and a cooling return 122. The cooling outlets 121 and cooling return 122 of the cooling branches 120 are configured to connect to energy storage cabinets. The compression refrigeration circuit 111 is configured to cool the cooling medium in the cooling branches 120.

[0044] It is understandable that the cooled fluid flows out to the energy storage cabinet through the cooling outlet 121 ; after the fluid is cooled in the inner compartment of the energy storage cabinet, it flows back to the centralized thermal management device 100 through the cooling return port 122 for cooling.

[0045] The centralized thermal management device 100 is provided with a plurality of cooling branches 120, thereby being able to provide cooling for a plurality of energy storage cabinets, thereby reducing the space occupied by the inner cabin of the energy storage cabinets and improving the energy density of the energy storage cabinets.

[0046] It should be understood that, in this application, an energy storage cabinet refers to an enclosed device for storing electrical energy, including a cabinet body and structures such as a battery pack and a power conversion system (PCS) located within the cabinet. Within the energy storage cabinet, structures cooled by the centralized thermal management device 100 may include battery cells and / or the PCS.

[0047] In addition, compared with the traditional method of providing a cooling device for each energy storage cabinet, the fluid is centrally cooled by the centralized thermal management device, and the thermal management host 110 is shared, and the overall volume is smaller.

[0048] In addition, the centralized thermal management device is set up, the thermal management host 110 is shared, and the location is centralized, which reduces the difficulty of inspection and maintenance.

[0049] Furthermore, the installation of a centralized thermal management device reduces the volume of the energy storage cabinet, making it easier to carry and transport.

[0050] In the present application, the number of cooling branches 120 is four. It is understandable that in other embodiments, the number of cooling branches is not limited to four, and may be two, three, or more than four.

[0051] In this embodiment, multiple cooling branches 120 are connected in parallel. It is understood that in other embodiments, multiple cooling branches can also be connected in series, or in parallel and in series at the same time.

[0052] Optionally, the centralized thermal management device 100 further has a shell, and the thermal management host 110 is located in the inner cavity of the shell to prevent external environmental factors, such as dust, moisture, etc., from damaging the thermal management host 110, thereby extending the service life and reliability of the thermal management host 110.

[0053] See also Figure 2 The centralized thermal management device 200 provided in one embodiment of the present application differs from the centralized thermal management device 100 in that, in this embodiment, the thermal management host 110 further includes a liquid cooling supply circuit 112. The compression refrigeration circuit 111 is provided with a first evaporation unit 111a; the liquid cooling supply circuit 112 is provided with a first heat exchange unit 112a arranged to exchange heat with the first evaporation unit 111a; and a plurality of cooling branches 120 are provided on the liquid cooling supply circuit 112. It is understood that the first evaporation unit 111a and the first heat exchange unit 112a exchange heat to cool the liquid in the first heat exchange unit 112a.

[0054] It can be understood that the cooling outlet 121 is located downstream of the first heat exchange unit 112 a , so that the liquid cooled in the first heat exchange unit 112 a flows to the cooling outlet 121 and then flows into the energy storage cabinet.

[0055] In this embodiment, the compression refrigeration circuit 111 is further provided with a first condensing unit 111b. The thermal management host 110 also includes an air cooling circuit 113. This air cooling circuit 113 includes an air cooler 113a and a second heat exchange unit 113b arranged to exchange heat with the first condensing unit 111b. It will be appreciated that the second heat exchange unit 113b can exchange heat with the first condensing unit 111b to cool the refrigerant in the first condensing unit 111b.

[0056] In this embodiment, the centralized thermal management device 200 has a first coupling mode and a second coupling mode. In the first coupling mode, the liquid cooling supply circuit 112 forms an independent closed loop, and the compression refrigeration circuit 111 provides cooling to the liquid cooling supply circuit 112. In the second coupling mode, the air cooling circuit 113 is connected in series with the liquid cooling supply circuit 112, that is, the air cooling circuit 113 provides cooling to the liquid cooling supply circuit 112.

[0057] It will be appreciated that in this embodiment, the fluid in the liquid cooling supply circuit 112 is liquid. In other words, the fluid in the liquid cooling supply circuit 112 is liquid, and the fluid provided to the cooling branch 120 for cooling is also liquid. Accordingly, it will be appreciated that in an energy storage system utilizing the centralized thermal management device 200, a flow channel for the flow of cooling medium is also provided within the energy storage cabinet. Furthermore, when in contact with the structure to be cooled, the sidewalls of the flow channel can conduct heat to achieve a cooling effect.

[0058] Specifically, in this embodiment, the thermal management host 110 includes a pipe coupling mechanism 114. This mechanism adjusts the coupling mode of the centralized thermal management device 200. Specifically, the pipe coupling mechanism 114 has four interfaces, which are designated as a first interface 114a, a second interface 114b, a third interface 114c, and a fourth interface 114d for ease of identification. The liquid cooling supply circuit 112 is connected to the first interface 114a and the second interface 114b; the air cooling circuit 113 is connected to the third interface 114c and the fourth interface 114d.

[0059] In the first coupling mode, the first interface 114a and the second interface 114b are connected, so that the liquid cooling supply circuit 112 forms an independent closed loop. The compression refrigeration circuit 111 provides cooling to the first heat exchange unit 112a of the liquid cooling supply circuit 112 via the first evaporation unit 111a. Furthermore, in this embodiment, in the first coupling mode, the third interface 114c and the fourth interface 114d are connected, so that the air cooling circuit 113 forms an independent closed loop. The air cooling circuit 113 provides cooling to the first condensing unit 111b of the compression refrigeration circuit 111 via the second heat exchange unit 113b.

[0060] In the second coupling mode, the first interface 114a is connected to the third interface 114c, and the second interface 114b is connected to the fourth interface 114d, so that the air cooling circuit 113 and the liquid cooling supply circuit 112 are connected in series, and the air cooling circuit 113 provides cooling for the liquid cooling supply circuit 112.

[0061] Specifically, different coupling modes can be selected based on the usage environment. For example, when the temperature is high, the first coupling mode is selected; when the temperature is low, the second coupling mode is selected. The specific setting can be based on the usage environment and the structure of the air cooler, etc., and is not specifically limited here.

[0062] In this embodiment, the compression refrigeration circuit 111 also includes a compressor 111c. The compressor 111c, the first condensing unit 111b and the first evaporation unit 111a are connected in series in sequence. Among them, the compressor 111c compresses the refrigerant from a low-pressure and low-temperature gas state to a high-pressure and high-temperature gas state. After being compressed, the refrigerant is in a high-pressure state, which provides the necessary pressure conditions for the subsequent condensation process, and provides power for the circulation of the refrigerant in the compression refrigeration circuit 111, thereby achieving a continuous refrigeration effect. When the refrigerant in a high-temperature state passes through the first condensing unit 111b, it exchanges heat with the external cooling medium, cooling the high-pressure and high-temperature gas to a liquid state. In this process, the refrigerant releases a large amount of heat, thereby achieving cooling of the refrigerant. When the cooled refrigerant passes through the first evaporation unit 111a, it exchanges heat with the medium to be cooled, thereby achieving a cooling effect.

[0063] In this embodiment, each cooling branch 120 is equipped with a valve 123. This valve 123 controls whether fluid flows into the corresponding cooling branch 120, or controls the flow rate of the fluid flowing into the corresponding cooling branch 120. This allows for targeted cooling treatment based on the specific conditions of different energy storage cabinets. Furthermore, when the number of cooling branches 120 required by an energy storage cabinet is less than the number of cooling branches 120 in the centralized thermal management device 200, the valve 123 can be used to close the excess cooling branches 120, thereby increasing the applicability of the centralized thermal management device 200.

[0064] Optionally, the valve 123 is a ball valve.

[0065] In this embodiment, a power supply device 112b is further provided in the liquid cooling supply circuit 112, and the power supply device 112b drives the liquid in the liquid cooling supply circuit 112 to circulate. Specifically, the power supply device 112b can be a water pump or the like.

[0066] See also Figure 3 The centralized thermal management device 300 provided in one embodiment of the present application is different from the centralized thermal management device 200 in that a plurality of cooling branches 120 are provided on the compression refrigeration circuit 111 .

[0067] The centralized thermal management device 300 directly delivers refrigerant to the cooling branch 120. In other words, the fluid in the compressed refrigeration circuit 111 is the refrigerant, and the fluid provided for cooling in the cooling branch 120 is the refrigerant. This refrigerant cools the structures within the energy storage cabinet, reducing cooling loss caused by multiple heat exchanges and improving cooling capacity utilization and efficiency.

[0068] In this embodiment, a second condensing unit 111d is further provided on the compression refrigeration circuit 111, and the second condensing unit 111d is located downstream of the compressor 111c. The compressor 111c compresses the refrigerant from a low-pressure and low-temperature gas state into a high-pressure and high-temperature gas state. After being compressed, the refrigerant is in a high-pressure state, which provides the necessary pressure conditions for the subsequent condensation process, and provides power for the circulation of the refrigerant in the compression refrigeration circuit 111, thereby achieving a continuous refrigeration effect. The refrigerant in a high-temperature state is cooled to a liquid state when passing through the second condensing unit 111d. In this process, the refrigerant releases a large amount of heat, which means that the refrigerant is cooled. The cooled refrigerant flows into the cooling branch 120.

[0069] In this embodiment, each cooling branch 120 is also equipped with a valve 123. This valve 123 controls whether fluid flows into the corresponding cooling branch 120, or controls the flow rate of the fluid flowing into the corresponding cooling branch 120. This allows for targeted cooling treatment based on the specific conditions of different energy storage cabinets. Furthermore, when the number of cooling branches 120 required by an energy storage cabinet is less than the number of cooling branches 120 in the centralized thermal management device 200, the valve 123 can be used to close the excess cooling branches 120, thereby increasing the applicability of the centralized thermal management device 200.

[0070] Optionally, the valve 123 is a ball valve.

[0071] See also Figure 4 The centralized thermal management device 400 provided in one embodiment of the present application is different from the centralized thermal management device 200 in that the thermal management host 110 also includes an air-cooling supply circuit 115 , and multiple cooling branches 120 are provided on the air-cooling supply circuit 115 .

[0072] In the centralized thermal management device 400, the fluid in the air cooling supply circuit 115 is gas, and the cooling fluid provided to the cooling branch 120 is also gas. Using the cooled gas to cool the internal structures of the energy storage cabinet can reduce the risk of moisture in the cabinet. Furthermore, this can reduce the need for tight sealing of the cooling fluid channels within the cabinet.

[0073] In some feasible embodiments, airflow can simply pass through gaps between structures within the energy storage cabinet, simplifying the cabinet's structure. In this case, the airflow within the energy storage cabinet can flow through the cooling branch 120 to the air-cooling supply circuit 115. As the airflow is cooled within the air-cooling supply circuit, moisture in the airflow is condensed into liquid, thereby reducing moisture in the airflow. This dehumidifies the airflow flowing into the air-cooling supply circuit and dehumidifies the interior of the energy storage cabinet. Therefore, the centralized thermal management device 400 can simultaneously achieve cooling and dehumidification, eliminating the need for a separate dehumidification device. This simplifies the structure of the centralized thermal management device 400, and thus the energy storage system.

[0074] In addition, when thermal runaway occurs in the energy storage cabinet, such as thermal runaway or even explosion of multiple battery cells, the heat in the energy storage cabinet can be output through the cooling branch 120, thereby reducing further risks caused by thermal runaway.

[0075] In this embodiment, compression refrigeration circuit 111 is provided with a second condensing unit 111d and a second evaporating unit 111e. Air-cooled supply circuit 115 is provided with a third heat exchange unit 115a, which is arranged to exchange heat with second evaporating unit 111e. In other words, in this embodiment, compression refrigeration circuit 111 provides cooling for air-cooled supply circuit 115.

[0076] Specifically, in this embodiment, the third heat exchange unit 115a has a heat exchange chamber 115b; the second evaporation unit 111e is located within the heat exchange chamber 115b. It will be appreciated that the heat exchange chamber 115b is used to allow airflow from the cooling air supply circuit 115 to flow through. The second evaporation unit 111e directly contacts the airflow within the heat exchange chamber 115b, thereby improving cooling capacity utilization and cooling efficiency.

[0077] In this embodiment, the cooling air supply circuit 115 is provided with an air circulation drive mechanism 115c; this drive mechanism 115c is located within the heat exchange chamber 115b. It is understood that the drive mechanism 115c is used to provide power for the circulation of air within the cooling air supply circuit 115. This placement of the drive mechanism 115c within the heat exchange chamber 115b reduces the space occupied by the heat exchange chamber. Furthermore, the power provided is used solely for the circulation of air within the cooling air supply circuit 115, thereby improving drive utilization and efficiency.

[0078] Specifically in this embodiment, the air circulation driving mechanism 115c is a fan. It is understandable that in other embodiments, the air circulation driving mechanism is not limited to a fan, but can also be a blower, an exhaust fan, etc.

[0079] In this embodiment, there are multiple air circulation drive mechanisms 115 c , and each cooling branch 120 is provided with at least one air circulation drive mechanism 115 c to drive air flow into the cooling branch 120 .

[0080] Optionally, the power of the air circulation drive mechanism 115c is adjustable. In other words, the driving capacity of the air circulation drive mechanism 115c is adjustable, so that the speed of the airflow flowing into the cooling branch 120 is adjustable, so as to adaptively cool different energy storage cabinets and meet the cooling needs of different energy storage cabinets.

[0081] In this embodiment, the air circulation driving mechanism 115c is located downstream of the second evaporation unit 111e, so that the airflow is more concentrated around the second evaporation unit 111e, so as to better cool the airflow and improve the cooling efficiency and cooling capacity utilization.

[0082] Optionally, the third heat exchange unit 115a is provided with a condensate drainage structure (not shown) to drain condensed water formed in the third heat exchange unit 115a, preventing the condensed water from evaporating again and increasing in volume. Specifically, for example, the condensate drainage structure includes a condensate collection container located on the bottom wall of the heat exchange chamber 115b and a discharge channel connecting the condensate collection container with the external environment. Thus, the condensate collected by the condensate collection container is discharged through the discharge channel.

[0083] In this embodiment, the centralized thermal management device 400 further includes a control unit; the control unit is configured to, when thermal runaway occurs in a battery cell in the energy storage cabinet, control the increase in the power of the air circulation drive mechanism 115c to help discharge heat from the interior of the energy storage cabinet 130 and reduce further risks caused by thermal runaway, such as thermal runaway of more battery cells or even explosion.

[0084] It is understandable that in other embodiments, even if the air circulation drive mechanism is disposed outside the heat exchange chamber, the heat in the inner compartment of the energy storage cabinet can be discharged by increasing the power of the air circulation drive mechanism.

[0085] It is understandable that in some embodiments, based on the selection of product performance in the centralized thermal management device 400, if the centralized thermal management device 400 is more effective in discharging heat from the inner compartment of the energy storage cabinet 130 under the action of thermal runaway, the provision of a fire-fighting mechanism in the energy storage system can be eliminated, further simplifying the structure of the energy storage system, achieving miniaturization of the energy storage system, and improving the energy density of the energy storage system.

[0086] See also Figure 5 An energy storage system 1000 provided in one embodiment of the present application includes a plurality of energy storage cabinets 130 and a centralized thermal management device 100 ; each energy storage cabinet 130 is connected to the centralized thermal management device 100 via a cooling branch 120 .

[0087] In the above energy storage system 1000 , the centralized thermal management device 100 is provided with a plurality of cooling branches 120 , thereby providing cooling for a plurality of energy storage cabinets 130 , reducing the space occupied by the inner compartment of the energy storage cabinet 130 , and improving the energy density of the energy storage cabinet 130 .

[0088] In some embodiments, when the cooling demand of the energy storage cabinet 130 is high and the cooling efficiency provided by a single cooling branch is difficult to meet the cooling demand of the energy storage cabinet 130, one energy storage cabinet 130 can be connected to multiple cooling branches 120 to meet the cooling demand of the energy storage cabinet 130.

[0089] Optionally, in the energy storage system, the number of cooling branches 120 connected to each energy storage cabinet 130 may be the same or different, and may be set according to specific needs.

[0090] In this embodiment, the centralized thermal management device 100 and the multiple energy storage cabinets 130 are arranged in a straight line, with the centralized thermal management device 100 located in the middle. It is understood that in other embodiments, the arrangement of the centralized thermal management device 100 and the multiple energy storage cabinets 130 is not limited to this arrangement and can be arranged in other arrangements, which is not limited here.

[0091] See also Figure 6 The energy storage system 2000 provided in one embodiment of the present application is different from the energy storage system 1000 in that the energy storage system 2000 uses a centralized thermal management device 200 for cooling.

[0092] See also Figure 7 The energy storage system 3000 provided in one embodiment of the present application is different from the energy storage system 1000 in that the energy storage system 3000 uses a centralized thermal management device 300 for cooling.

[0093] See also Figure 8 The energy storage system 4000 provided in one embodiment of the present application is different from the energy storage system 1000 in that the energy storage system 4000 uses a centralized thermal management device 400 for cooling.

[0094] In this embodiment, the energy storage cabinet 130 has an air cooling inlet 131 connected to the cooling outlet 121, and an air cooling outlet 132 connected to the cooling return port 122; the air cooling inlet 131 and the air cooling outlet 132 are respectively arranged near a set of diagonal positions of the energy storage cabinet 130, so that the airflow provided by the cooling branch 120 has a longer flow path in the energy storage cabinet 130, thereby improving the utilization rate of the cooling capacity.

[0095] It is understandable that Figure 8 The positions of the air cooling inlet 131 and the air cooling outlet 132 are only schematically drawn, and can be specifically set according to the placement position of the energy storage cabinet 130, the specific structure of the energy storage cabinet 130, etc., and are not specifically limited here.

[0096] It can be understood that in the various embodiments of the present application, the size of the serial number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0097] It can be understood that the various implementation methods described in this application can be implemented individually or in combination, and the embodiments of this application are not limited to this.

[0098] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described systems, devices and units can refer to the corresponding processes in the aforementioned method implementation methods and will not be repeated here.

[0099] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A centralized thermal management device, characterized in that: The centralized thermal management device comprises: a thermal management host, the thermal management host comprising a compression refrigeration circuit; and Multiple cooling branches, each cooling branch having a cooling outlet and a cooling return; the cooling outlet and cooling return of the cooling branch are used to connect to the energy storage cabinet; Wherein, the compression refrigeration circuit is used to cool the cooling medium in the cooling branch.

2. The centralized thermal management device according to claim 1, characterized in that The compression refrigeration circuit is provided with a first evaporation unit and a first condensation unit; The thermal management host also includes: a liquid cooling supply circuit, wherein the liquid cooling supply circuit is provided with a first heat exchange unit arranged for heat exchange with the first evaporation unit; the plurality of cooling branches are provided on the liquid cooling supply circuit; An air cooling circuit is provided with an air cooler and a second heat exchange unit arranged for heat exchange with the first condensing unit.

3. The centralized thermal management device according to claim 2, characterized in that The centralized thermal management device has a first coupling mode and a second coupling mode; Wherein, the first coupling mode is configured such that the liquid cooling supply circuit independently forms a closed circuit, and the compression refrigeration circuit provides cooling capacity for the liquid cooling supply circuit; The second coupling mode is configured as the air cooling circuit and the liquid cooling supply circuit being connected in series.

4. The centralized thermal management device according to claim 1, characterized in that The plurality of cooling branches are provided on the compression refrigeration circuit.

5. The centralized thermal management device according to claim 1, characterized in that The thermal management host also includes: The air-cooling supply circuit is provided with the plurality of cooling branches.

6. The centralized heat management device according to claim 5, characterized in that The compression refrigeration circuit is provided with a second condensing unit and a second evaporating unit; The air-cooled supply circuit is provided with a third heat exchange unit, and the third heat exchange unit has a heat exchange cavity; the second evaporation unit is located in the heat exchange cavity.

7. The centralized heat management device according to claim 6, characterized in that The air-cooling supply circuit is provided with a plurality of airflow circulation drive mechanisms; the plurality of airflow circulation drive mechanisms are arranged in the heat exchange cavity, and each of the cooling branches is correspondingly provided with at least one airflow circulation drive mechanism.

8. The centralized heat management device according to claim 6, characterized in that: The third heat exchange unit is provided with a condensed water drainage structure.

9. The centralized heat management device according to claim 6, characterized in that: The air cooling supply circuit is provided with an air flow circulation driving mechanism; The centralized thermal management device further includes a control unit; the control unit is configured to control and increase the power of the air circulation drive mechanism when thermal runaway occurs in the battery cell in the energy storage cabinet.

10. An energy storage system, characterized in that: The energy storage system includes a plurality of energy storage cabinets and the centralized thermal management device according to any one of claims 1 to 9; each of the energy storage cabinets is connected to the centralized thermal management device via at least one of the cooling branches.