Scanner

Abstract

The scanner comprises a shell, a mainboard structure, a first heat dissipation structure and a fan assembly, the mainboard structure is arranged in the shell, a chip of the mainboard structure is correspondingly provided with the first heat dissipation structure, the shell is provided with an air inlet and an air outlet, the direction of the air inlet facing the air outlet is a heat dissipation air flow direction, and the fan assembly is arranged in the shell. In the heat dissipation air flow direction, an area formed by connecting lines of the edges of the air inlet and the air outlet is located in the shell, and at least part of the first heat dissipation structure is located in the largest area formed by connecting lines of the edges of the air inlet and the air outlet. Through the technical scheme provided by the utility model, the heat dissipation effect on the chip position of the mainboard structure can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of detection equipment, in particular to a scanner. Background Art

[0002] For scanner-type detection equipment in the existing technology, natural heat dissipation is usually adopted. For example, the chip of the mainboard structure is attached to the main beam through a thermal pad, and the heat is directly dissipated through the main beam, or a fixed fan is used to blow directly at the chip of the mainboard structure. However, this heat dissipation effect is limited and the air outlet on the shell cannot be utilized. Utility Model Content

[0003] The utility model provides a scanner to improve the heat dissipation effect of the chip position of the mainboard structure.

[0004] In order to solve the above problems, the utility model provides a scanner, which includes a shell, a mainboard structure, a first heat dissipation structure and a fan assembly. The mainboard structure is arranged in the shell, and the first heat dissipation structure is correspondingly arranged at the chip of the mainboard structure. The shell has an air inlet and an air outlet. The direction of the air inlet toward the air outlet is the heat dissipation airflow direction. In the heat dissipation airflow direction, the area formed by the edge connection line of the air inlet and the air outlet is in the shell, and the first heat dissipation structure is at least partially located in the maximum area formed by the edge connection line of the air inlet and the air outlet.

[0005] Furthermore, the mainboard structure has multiple chips, there is at least one first heat dissipation structure, and any one first heat dissipation structure is provided corresponding to at least one chip.

[0006] Furthermore, the first heat dissipation structure includes a plurality of heat dissipation fins, the length directions of the plurality of heat dissipation fins are parallel to the heat dissipation airflow direction, a heat dissipation gap is formed between any two adjacent heat dissipation fins, and the first heat dissipation structure is distributed in the heat dissipation airflow direction and the distance between two adjacent first heat dissipation structures is greater than 0. In the heat dissipation airflow direction, the projection of the heat dissipation fins of the latter first heat dissipation structure on the plane perpendicular to the heat dissipation airflow direction at least partially overlaps with the projection of the heat dissipation gap of the previous first heat dissipation structure on the same plane perpendicular to the heat dissipation airflow direction.

[0007] Furthermore, the first heat dissipation structure also includes a first thermal seat, one side of the first thermal seat is in contact with the corresponding chip, and multiple heat dissipation fins are arranged on the other side of the first thermal seat. The mainboard structure also includes a mainboard body on which the chip is installed. The first thermal seat is connected to the mainboard body through a bolt assembly and covers the corresponding chip.

[0008] Furthermore, the air inlet and / or the air outlet are not perpendicular to the heat dissipation airflow direction.

[0009] Furthermore, the shell has a symmetrical plane that divides it into two symmetrical parts. The direction of the heat dissipation airflow is perpendicular to the symmetrical plane. Fan assemblies are provided at the air inlet and the air outlet. The air inlet and the air outlet are symmetrically arranged on both sides of the symmetrical plane, and the projections of the two on the symmetrical plane overlap to form a first projection plane. The two fan assemblies are symmetrically arranged in the shell, and the projections of the two on the symmetrical plane overlap to form a second projection plane. The projection of the first heat dissipation structure on the symmetrical plane is a third projection plane. Among the first projection plane, the second projection plane and the third projection plane, the overlapping area of ​​any two is not 0.

[0010] Furthermore, the fan assembly is arranged at the air inlet and / or air outlet and has an air induced air channel. There is an air guide channel between the fan assembly and the corresponding air inlet or air outlet to avoid airflow dispersion, and the air induced air channel is connected to the air inlet or air outlet through the air guide channel.

[0011] Furthermore, the scanner also includes a lap joint, which is arranged between the fan assembly and the air inlet or air outlet corresponding to the fan assembly. The lap joint is a ring-shaped piece and has a relatively arranged lap side and an installation side. The lap side is adapted to and abuts against the shape of the shell where the air inlet or air outlet is located, and the installation side is adapted to and connected to the outer peripheral shape of the fan assembly, and an air guide channel is formed inside the lap joint.

[0012] Furthermore, the connecting piece is made of silicone material.

[0013] Furthermore, the fan assembly includes a fan fixing base and an axial fan fixedly mounted on the fan fixing base, the axial direction of the axial fan is parallel to the direction of the heat dissipation airflow, the air duct is located in the fan fixing base and extends along the direction of the heat dissipation airflow and passes through the fan fixing base, the fan fixing base is fixedly mounted in the shell, and the air guide channel is located between the fan fixing base and the air inlet or air outlet corresponding to the fan fixing base.

[0014] Furthermore, the scanner also includes a second heat dissipation structure and a main beam structure provided with at least one optical device, the main beam structure is arranged in the shell, and the second heat dissipation structure is installed at at least one optical device of the main beam structure and is located below the area between the air inlet and the air outlet.

[0015] Furthermore, the second heat dissipation structure includes a second heat-conducting seat and a plurality of strip-shaped protrusions arranged in parallel on the same side of the second heat-conducting seat, and a heat dissipation gap is formed between any two strip-shaped protrusions.

[0016] Furthermore, the shell includes a top shell, a base, a rear shell, a front side screen and two side shells. The air inlet and the air outlet are respectively arranged on the two side shells. The top shell, the rear shell and the front side screen are respectively used to block the multiple openings after the two side shells are connected to form a shell cavity for installing the mainboard structure, the first heat dissipation structure and the fan assembly.

[0017] By applying the technical solution of the present utility model, a scanner is provided, which includes a shell, a mainboard structure, a first heat dissipation structure and a fan assembly. The mainboard structure is arranged in the shell, and the first heat dissipation structure is correspondingly arranged at the chip of the mainboard structure. The shell has an air inlet and an air outlet, and the direction of the air inlet toward the air outlet is the heat dissipation airflow direction. In the heat dissipation airflow direction, the area formed by the edge connection line of the air inlet and the air outlet is in the shell, and the first heat dissipation structure is at least partially located in the maximum area formed by the edge connection line of the air inlet and the air outlet.

[0018] With this solution, the heat generated at the chip of the mainboard structure will first be transferred from the chip to the first heat dissipation structure, and then the heat dissipation of the first heat dissipation structure will be achieved through the heat dissipation airflow. The dual heat dissipation of the chip is achieved through the heat dissipation airflow and the first heat dissipation structure, thereby improving the heat dissipation effect on the chip of the mainboard structure. Furthermore, a heat dissipation airflow is formed by the fan assembly to enter from the air inlet and / or exit from the air outlet, thereby promoting the flow of fluid in the shell and ensuring the reliability and continuity of heat dissipation. On the other hand, by limiting the position of the first heat dissipation structure, the heat dissipation airflow between the air inlet and the air outlet must flow through the first heat dissipation structure, thereby improving the heat dissipation effect on the first heat dissipation structure and the mainboard structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings constituting part of this application are provided to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are provided to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0020] Figure 1 A schematic structural diagram of a scanner provided in an embodiment of the present utility model is shown;

[0021] Figure 2 Shown Figure 1 A front view of the scanner;

[0022] Figure 3 Shown Figure 1 A cross-sectional view of a scanner;

[0023] Figure 4 Shown Figure 1 Schematic diagram of the internal structure of the scanner in a rear-view perspective;

[0024] Figure 5 Shown Figure 1 A schematic diagram of another internal structure of the scanner from a rear-view perspective;

[0025] Figure 6 Shown Figure 1 An assembly diagram of a first heat dissipation structure, a mainboard structure, and a fan assembly of a scanner;

[0026] Figure 7 Shown Figure 6 A top view of

[0027] Figure 8 Shown Figure 6 Side view of;

[0028] Figure 9 Shown Figure 6 A structural schematic diagram of one of the first heat dissipation structures;

[0029] Figure 10 Shown Figure 6 A structural schematic diagram of another first heat dissipation structure;

[0030] Figure 11 Shown Figure 1 Schematic diagram of the assembly of the main beam structure and the second heat dissipation structure in the scanner.

[0031] The above drawings include the following reference numerals:

[0032] 10. First heat dissipation structure; 11. Heat dissipation fins; 12. First heat conducting seat;

[0033] 20. Housing; 201. Air inlet; 202. Air outlet; 203. Housing cavity; 21. Side housing; 22. Top housing; 23. Base; 24. Front and side screens; 25. Rear housing;

[0034] 30. Mainboard structure; 31. Chip; 32. Mainboard body;

[0035] 40. Fan assembly; 401. Air duct; 41. Fan fixing base; 42. Axial flow fan;

[0036] 50, overlapping piece; 501, air guide channel; 502, overlapping side; 503, installation side;

[0037] 60. Symmetry plane;

[0038] 70. Second heat dissipation structure; 71. Second heat conducting seat; 72. Strip-shaped protrusion;

[0039] 80. Main beam structure. DETAILED DESCRIPTION

[0040] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some of the embodiments of the present invention, rather than all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and in no way serves as any limitation on the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of the present invention.

[0041] like Figures 1 to 11 As shown, an embodiment of the present invention provides a scanner including a shell 20, a mainboard structure 30, a first heat dissipation structure 10 and a fan assembly 40. The mainboard structure 30 is arranged in the shell 20, and the first heat dissipation structure 10 is correspondingly arranged at the chip 31 of the mainboard structure 30. The shell 20 has an air inlet 201 and an air outlet 202. The direction of the air inlet 201 toward the air outlet 202 is the heat dissipation airflow direction. In the heat dissipation airflow direction, the area formed by the edge connection line of the air inlet 201 and the air outlet 202 is in the shell 20, and the first heat dissipation structure 10 is at least partially located in the maximum area formed by the edge connection line of the air inlet 201 and the air outlet 202.

[0042] In this embodiment, the heat generated at the chip 31 of the mainboard structure 30 will first be transferred from the chip 31 to the first heat dissipation structure 10, and then the heat dissipation of the first heat dissipation structure 10 will be achieved through the heat dissipation airflow. The heat dissipation of the chip 31 is achieved by the heat dissipation airflow and the first heat dissipation structure 10, thereby improving the heat dissipation effect on the chip 31 of the mainboard structure 30. Furthermore, the fan assembly 40 forms a heat dissipation airflow that enters from the air inlet 201 and / or exits from the air outlet 202, thereby promoting the flow of fluid in the housing 20 and ensuring the reliability and continuity of heat dissipation. On the other hand, by limiting the position of the first heat dissipation structure 10, the heat dissipation airflow between the air inlet 201 and the air outlet 202 must flow through the first heat dissipation structure 10, thereby improving the heat dissipation effect on the first heat dissipation structure 10 and the mainboard structure 30.

[0043] Preferably, if Figure 1 and Figure 2 As shown, the air inlet 201 and the air outlet 202 are both grille openings to prevent large solid particles from entering the housing 20, thereby protecting the interior of the scanner while ensuring the circulation of heat dissipation airflow.

[0044] like Figures 4 to 6 As shown, the mainboard structure 30 has a plurality of chips 31 , and there is at least one first heat dissipation structure 10 , and any one first heat dissipation structure 10 is provided corresponding to at least one chip 31 .

[0045] In this embodiment, the mainboard structure 30 has two chips 31 and is correspondingly provided with two first heat dissipation structures 10. The two chips 31 are arranged at intervals along the direction of the heat dissipation airflow. The two first heat dissipation structures 10 are respectively arranged at the two chips 31. Any one of the first heat dissipation structures 10 is at least partially located within the maximum area formed by the edge connection line of the air inlet 201 and the air outlet 202. This arrangement is conducive to ensuring reliable heat dissipation of each chip 31 and improving the heat dissipation effect.

[0046] It can be understood that the number, size, setting position, etc. of the chips 31 and the number, size, corresponding number of chips 31, etc. of the first heat dissipation structures 10 can be adjusted according to actual conditions to ensure the reliability of the heat dissipation of each group of first heat dissipation structures 10 and chips 31 by the heat dissipation airflow and the reliability and stability of the heat dissipation of the chips 31 covered by each first heat dissipation structure 10. For example, in other embodiments not shown in the figure, a first heat dissipation structure 10 can be set up to correspond to at least two chips 31, that is, heat dissipation of multiple chips 31 can be achieved through a first heat dissipation structure 10.

[0047] like Figures 3 to 10 As shown, the first heat dissipation structure 10 includes a plurality of heat dissipation fins 11, the length directions of the plurality of heat dissipation fins 11 are parallel to the heat dissipation airflow direction, a heat dissipation gap is formed between any two adjacent heat dissipation fins 11, and the first heat dissipation structure 10 is distributed in the heat dissipation airflow direction and the distance between two adjacent first heat dissipation structures 10 is greater than 0.

[0048] In this embodiment, the two chips 31 are arranged at intervals and front to back in the direction of the heat dissipation airflow, and the two first heat dissipation structures 10 are arranged corresponding to the two chips 31 and are also arranged at intervals and front to back in the direction of the heat dissipation airflow. The heat dissipation fins 11 are sheet structures whose surfaces are parallel to the direction of the heat dissipation airflow. The multiple heat dissipation fins 11 of the same first heat dissipation structure 10 are distributed at intervals along the vertical direction perpendicular to the direction of the heat dissipation airflow and form multiple spaced heat dissipation gaps. At least part of the heat dissipation fins 11 extend into the maximum area formed by the edge connection line of the air inlet 201 and the air outlet 202 at one end away from the chip 31. The heat exchange area between the heat dissipation airflow and the first heat dissipation structure 10 is increased through the multiple heat dissipation gaps. When the heat dissipation airflow flows through the multiple heat dissipation gaps, it will be diverted and exchange heat with the inner wall of each heat dissipation gap it flows through, which is beneficial to improving the heat exchange effect and heat exchange efficiency.

[0049] It is understood that the arrangement, number, and shape of the heat dissipation fins 11 can be adjusted according to actual conditions. For example, in other embodiments not shown in the figures, the heat dissipation fins 11 can be a serpentine sheet structure extending along the direction of the heat dissipation airflow. In other embodiments not shown in the figures, multiple heat dissipation fins 11 of the same heat dissipation structure can be arranged in multiple rows and columns.

[0050] Preferably, in the direction of the heat dissipation airflow, the projection of the heat dissipation fins 11 of the latter first heat dissipation structure 10 on the plane perpendicular to the heat dissipation airflow direction at least partially overlaps with the projection of the heat dissipation gap of the former first heat dissipation structure 10 on the same plane perpendicular to the heat dissipation airflow direction.

[0051] This arrangement can further divert the heat dissipation airflow and improve the heat dissipation effect. Specifically, the airflow entering from the air inlet 201 will first pass through the first first heat dissipation structure 10 and be diverted into multiple airflows by the heat dissipation gap. Each diverted airflow continues to flow and pass through the next first heat dissipation structure 10. Each airflow will be stopped by the multiple heat dissipation fins 11 of the next first heat dissipation structure 10 and diverted again, slowing down the airflow rate, allowing the gas to diffuse and decelerate, allowing it to fully contact and absorb heat, fully carry out heat exchange, and indirectly increase the heat dissipation area of ​​the heat dissipation airflow and the two first heat dissipation structures 10, thereby improving the heat dissipation effect.

[0052] Specifically, the first heat dissipation structure 10 also includes a first thermal seat 12, one side of the first thermal seat 12 is in contact with the corresponding chip 31, and multiple heat dissipation fins 11 are arranged on the other side of the first thermal seat 12. The mainboard structure 30 also includes a mainboard body 32 on which the chip 31 is installed. The first thermal seat 12 is connected to the mainboard body 32 through a bolt assembly and covers the corresponding chip 31.

[0053] In this embodiment, the heat generated by the chip 31 is transferred to the first thermally conductive base 12 covering it, and then transferred to the multiple heat sinks 11 through the first thermally conductive base 12. The heat dissipating airflow exchanges heat with the heat sink 11 as it flows through the heat dissipation gaps, thereby achieving heat exchange and cooling of the first heat dissipation structure 10. Furthermore, the first thermally conductive base 12 is connected to the mainboard 32 via a bolt assembly, ensuring reliable and stable installation of the first thermally conductive base 12.

[0054] The mounting method of the chip 31 can be adjusted according to actual conditions. In this embodiment, the main body 32 includes a circuit board and an adapter plate for connecting to the first heat dissipation structure 10. The adapter plate is mounted on the circuit board via an adapter, etc., and is parallel to and spaced apart from the circuit board. In the direction of the heat dissipation airflow, the chip 31 located in the front is fixedly mounted on the circuit board, and the chip 31 located in the back is fixedly mounted on the adapter plate.

[0055] Specifically, if Figure 9 and Figure 10 As shown, Figure 9 The figure shows the first heat dissipation structure 10 located at the rear side in the heat dissipation airflow direction. Figure 10The figure shows the first heat dissipation structure 10 located at the front side in the direction of heat dissipation airflow. The front-facing first heat dissipation structure 10 is provided with two diagonally spaced adapter lugs. Bolts pass through the adapter lugs and threadably connect with corresponding nuts embedded in the circuit board. The rear-facing first heat dissipation structure 10 has multiple threaded adapter holes on the side of its first thermally conductive base 12 facing the mainboard 32. The adapter board has multiple corresponding adapter protrusions and through-holes extending through the adapter board and the adapter protrusions. Bolts pass through these through-holes and threadably connect with the corresponding threaded adapter holes.

[0056] Preferably, the air inlet 201 and / or the air outlet 202 are not perpendicular to the heat dissipation airflow direction.

[0057] In this embodiment, the air inlet 201 and the air outlet 202 are symmetrically arranged on both sides of the housing 20 and are both inclined relative to the heat dissipation airflow direction. Compared to the case where the air inlet 201 and the air outlet 202 are both perpendicular to the heat dissipation airflow direction, this arrangement of this embodiment allows for a larger area for airflow, which is beneficial for improving heat dissipation.

[0058] like Figures 3 to 8 As shown, the shell 20 has a symmetry plane 60 that divides it into two symmetrical parts. The direction of the heat dissipation airflow is perpendicular to the symmetry plane 60. Fan assemblies 40 are provided at the air inlet 201 and the air outlet 202. The air inlet 201 and the air outlet 202 are symmetrically arranged on both sides of the symmetry plane 60, and the projections of the two on the symmetry plane 60 overlap and form a first projection plane. The two fan assemblies 40 are symmetrically arranged in the shell 20, and the projections on the symmetry plane 60 overlap and form a second projection plane. The projection of the first heat dissipation structure 10 on the symmetry plane 60 is a third projection plane. Among the first projection plane, the second projection plane and the third projection plane, the overlapping area of ​​any two is not 0.

[0059] This arrangement ensures that the fan assembly 40 can form a stable airflow and that the airflow can stably flow through the first heat dissipation structure 10, thereby ensuring the heat dissipation effect. In this embodiment, the first projection surface and the second projection surface are almost completely overlapped to ensure the airflow effect of the fan assembly 40. The maximum area formed by the edge connection line of the air inlet 201 and the air outlet 202 is as shown in FIG. Figure 4 As shown in the dotted line range, the lower half of any first heat dissipation structure 10 is located in this area, that is, the lower half of the third projection surface overlaps with most or all of the first projection surface or the second projection surface to ensure the heat dissipation effect of the heat dissipation airflow on the first heat dissipation structure 10.

[0060] Specifically, the fan assembly 40 is arranged at the air inlet 201 and / or the air outlet 202 and has an air induced passage 401. An air guide passage 501 is provided between the fan assembly 40 and the corresponding air inlet 201 or air outlet 202 to avoid airflow dispersion. The air induced passage 401 is connected to the air inlet 201 or air outlet 202 through the air guide passage 501.

[0061] With this arrangement, the heat dissipation airflow is rectified through the air guide channel 501 and the air induction channel 401, ensuring the reliability of the heat dissipation airflow flowing through the first heat dissipation structure 10 and further improving the heat dissipation effect of the first heat dissipation structure 10 and the mainboard structure 30.

[0062] like Figures 4 to 8 As shown, the scanner also includes a lap joint 50, which is arranged between the fan assembly 40 and the air inlet 201 or the air outlet 202 corresponding to the fan assembly 40. The lap joint 50 is a ring-shaped member and has a lap side 502 and an installation side 503 that are relatively arranged. The lap side 502 is adapted to and abuts the shape of the shell 20 where the air inlet 201 or the air outlet 202 is located, and the installation side 503 is adapted to and connected to the outer peripheral shape of the fan assembly 40, and an air guide channel 501 is formed inside the lap joint 50.

[0063] This arrangement can ensure the reliability of the air guide channel 501 formed by the lap joint 50 in guiding the heat dissipation airflow, and avoid the situation where a large gap between it and the fan assembly 40 or the air outlet causes the heat dissipation airflow to be diverted, thereby affecting the heat dissipation effect.

[0064] In this embodiment, the lap joint 50 is made of silicone material. This configuration facilitates processing of the lap joint 50 due to the good plasticity of the silicone material. Furthermore, the silicone material also has good wear resistance, softness and resistance to compression deformation, which is conducive to improving the reliability and stability of the installation of the lap joint 50.

[0065] Furthermore, the fan assembly 40 includes a fan mounting base 41 and an axial fan 42 fixedly mounted on the fan mounting base 41. The axial direction of the axial fan 42 is parallel to the direction of the heat dissipation airflow. The air induction channel 401 is located within the fan mounting base 41 and extends along the direction of the heat dissipation airflow and passes through the fan mounting base 41. The fan mounting base 41 is fixedly mounted within the housing 20. The air guide channel 501 is located between the fan mounting base 41 and the air inlet 201 or air outlet 202 corresponding to the fan mounting base 41. This arrangement facilitates the formation of the air induction channel 401 and can ensure the fan assembly 40's ability to guide the heat dissipation airflow, thereby improving the reliability and stability of heat dissipation of the first heat dissipation structure 10.

[0066] The scanner also includes a second heat dissipation structure 70 and a main beam structure 80 provided with at least one optical device. The main beam structure 80 is arranged in the shell 20, and the second heat dissipation structure 70 is installed at at least one optical device of the main beam structure 80 and is located below the area between the air inlet 201 and the air outlet 202.

[0067] like Figure 3 and Figure 11 As shown, in this embodiment, the second heat dissipation structure 70 is provided for each optical device. It is understood that the heat dissipation airflow flowing from the air inlet 201 to the air outlet 202 not only flows along the heat dissipation airflow direction, but also diverges after being output from the air guide channel 501 on the side of the air inlet 201 to achieve heat dissipation at various locations within the housing 20. The heat dissipation airflow discharged from the air outlet 202 also first passes through the air guide channel 501 and the air induction channel 401 on the side of the air outlet 202 before being discharged. By providing the second heat dissipation structure 70, heat dissipation of the optical device can be achieved. Combined with the heat exchange between the heat dissipation airflow and the second heat dissipation structure 70 and the optical device, the heat dissipation effect of the optical device can be further improved.

[0068] It is understandable that the number and arrangement of the second heat dissipation structures 70 can be adaptively adjusted according to actual conditions (the number of optical devices, the arrangement position, the degree of heat generation, etc.), and no examples are given here one by one.

[0069] like Figure 11 As shown, the second heat dissipation structure 70 includes a second heat-conducting base 71 and multiple strip-shaped protrusions 72 arranged parallel to the same side of the second heat-conducting base 71. A heat dissipation gap is formed between any two strip-shaped protrusions 72. This arrangement increases the heat exchange area between the heat dissipation airflow and the second heat dissipation structure 70 through the multiple heat dissipation gaps. When the heat dissipation airflow flows through the multiple heat dissipation gaps, it will be divided and heat exchanged with the inner wall of each heat dissipation gap it flows through, which is beneficial to improving the heat exchange effect and heat exchange efficiency.

[0070] In this embodiment, the shell 20 includes a top shell 22, a base 23, a rear shell 25, a front side screen 24 and two side shells 21. The air inlet 201 and the air outlet 202 are respectively arranged on the two side shells 21. The top shell 22, the rear shell 25 and the front side screen 24 are respectively used to block the multiple openings after the two side shells 21 are connected to form a shell cavity 203 for installing the mainboard structure 30, the first heat dissipation structure 10 and the fan assembly 40.

[0071] This arrangement facilitates the formation of a shell cavity 203 that is a quasi-enclosed environment inside the shell 20, ensuring the circulation and heat exchange effect of the heat dissipation airflow inside the shell cavity 203, and ensuring the reliability and stability of the heat dissipation of various structures inside the shell cavity 203 by the heat dissipation airflow.

[0072] It is understandable that multiple sub-outlets for heat dissipation airflow can be provided on the two side shells 21 to improve the fluidity of the heat dissipation airflow inside the shell cavity 203 and avoid the heat dissipation airflow accumulating inside the shell cavity 203, resulting in a deterioration of the heat exchange effect.

[0073] In summary, the present invention provides a scanner that achieves enhanced heat dissipation of the chip 31 inside the scanner through the cooperation of the fan assembly 40 and the first heat dissipation structure 10, and achieves enhanced heat dissipation of the optical components inside the scanner through the cooperation of the fan assembly 40 and the second heat dissipation structure 70.

[0074] When auxiliary heat dissipation is needed, the operator starts the two axial flow fans 42, and the two axial flow fans 42 rotate and generate a heat dissipation airflow from the air inlet 201 to the air outlet 202. For the air inlet 201, the heat dissipation airflow will be introduced from the air inlet 201 into the air induction channel 401 and the air guide channel 501 on the same side. After the heat dissipation airflow is discharged from the air guide channel 501 on the side of the air inlet 201, most of it will move along the heat dissipation airflow direction, and the other part will diverge and flow to different positions in the shell cavity 203. Most of the heat dissipation airflow moving along the heat dissipation airflow will flow through the two first heat dissipation structures 10 in sequence and be divided It is a plurality of airflows to achieve heat dissipation of the first heat dissipation structure 10 and auxiliary heat dissipation of the chip 31. In this process, some heat dissipation airflows will also diverge. The divergent heat dissipation airflows will flow in the shell cavity 203 and dissipate heat to other structures including the second heat dissipation structure 70 and multiple optical devices, so as to improve the heat dissipation effect of other structures inside the shell cavity 203. Under the action of the two axial flow fans 42, the heat dissipation airflows in the shell cavity 203 will converge in the air guide channel 501 on one side of the air outlet 202 and be discharged from the air outlet 202 along the air guide channel 401.

[0075] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0076] Unless otherwise specifically stated, the relative arrangement of the parts and steps, the numerical expressions and the numerical values ​​set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values ​​should be interpreted as being merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0077] In the description of the present invention, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0078] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0079] In addition, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of this utility model.

[0080] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A scanner, characterized in that: The scanner comprises a housing (20), a mainboard structure (30), a first heat dissipation structure (10) and a fan assembly (40); the mainboard structure (30) is arranged in the housing (20); the first heat dissipation structure (10) is correspondingly arranged at the chip (31) of the mainboard structure (30); the housing (20) has an air inlet (201) and an air outlet (202); the direction from the air inlet (201) toward the air outlet (202) is a heat dissipation airflow direction; in the heat dissipation airflow direction, an area formed by a line connecting the edges of the air inlet (201) and the air outlet (202) is located in the housing (20); and the first heat dissipation structure (10) is at least partially located in a maximum area formed by a line connecting the edges of the air inlet (201) and the air outlet (202).

2. The scanner according to claim 1, wherein The mainboard structure (30) has a plurality of chips (31), there is at least one first heat dissipation structure (10), and any one of the first heat dissipation structures (10) is provided corresponding to at least one of the chips (31).

3. The scanner according to claim 2, wherein: The first heat dissipation structure (10) includes a plurality of heat dissipation fins (11), the length directions of the plurality of heat dissipation fins (11) are parallel to the heat dissipation airflow direction, a heat dissipation gap is formed between any two adjacent heat dissipation fins (11), a plurality of the first heat dissipation structures (10) are distributed in the heat dissipation airflow direction, and the distance between two adjacent first heat dissipation structures (10) is greater than 0, and in the heat dissipation airflow direction, the projection of the heat dissipation fins (11) of the latter first heat dissipation structure (10) on the plane perpendicular to the heat dissipation airflow direction at least partially overlaps with the projection of the heat dissipation gap of the former first heat dissipation structure (10) on the same plane perpendicular to the heat dissipation airflow direction.

4. The scanner according to claim 3, wherein: The first heat dissipation structure (10) further comprises a first heat-conducting seat (12), one side of the first heat-conducting seat (12) is in contact with the corresponding chip (31), and a plurality of heat dissipation fins (11) are arranged on the other side of the first heat-conducting seat (12). The mainboard structure (30) further comprises a mainboard body (32) on which the chip (31) is mounted, and the first heat-conducting seat (12) is connected to the mainboard body (32) via a bolt assembly and covers the corresponding chip (31).

5. The scanner according to claim 1, wherein The air inlet (201) and / or the air outlet (202) are not perpendicular to the heat dissipation airflow direction.

6. The scanner according to claim 5, wherein: The housing (20) has a symmetry plane (60) that divides it into two symmetrical parts, the heat dissipation airflow direction is perpendicular to the symmetry plane (60), the fan assembly (40) is provided at both the air inlet (201) and the air outlet (202), the air inlet (201) and the air outlet (202) are symmetrically arranged on both sides of the symmetry plane (60), and the projections of the two on the symmetry plane (60) overlap and form a first projection plane, the two fan assemblies (40) are symmetrically arranged in the housing (20), and the projections of the two on the symmetry plane (60) overlap and form a second projection plane, the projection of the first heat dissipation structure (10) on the symmetry plane (60) is a third projection plane, and the overlapping area of ​​any two of the first projection plane, the second projection plane and the third projection plane is not zero.

7. The scanner according to claim 1, wherein The fan assembly (40) is arranged at the air inlet (201) and / or the air outlet (202) and has an air induction channel (401); an air guide channel (501) for preventing airflow dispersion is provided between the fan assembly (40) and the corresponding air inlet (201) or the air outlet (202); the air induction channel (401) is communicated with the air inlet (201) or the air outlet (202) through the air guide channel (501).

8. The scanner according to claim 7, wherein: The scanner further comprises a lap joint (50), wherein the lap joint (50) is arranged between the fan assembly (40) and the air inlet (201) or the air outlet (202) corresponding to the fan assembly (40), the lap joint (50) being an annular member and having a lap joint side (502) and an installation side (503) arranged opposite to each other, the lap joint side (502) being adapted to and abutting against the shape of the housing (20) where the air inlet (201) or the air outlet (202) is located, the installation side (503) being adapted to and connected to the outer peripheral shape of the fan assembly (40), and the air guide channel (501) being formed inside the lap joint (50).

9. The scanner according to claim 8, wherein The connecting piece (50) is made of silicone material.

10. The scanner according to claim 7, wherein: The fan assembly (40) comprises a fan fixing seat (41) and an axial fan (42) fixedly mounted on the fan fixing seat (41); the axial direction of the axial fan (42) is parallel to the heat dissipation airflow direction; the air induction channel (401) is located in the fan fixing seat (41) and extends along the heat dissipation airflow direction and passes through the fan fixing seat (41); the fan fixing seat (41) is fixedly mounted in the housing (20); and the air guide channel (501) is located between the fan fixing seat (41) and the air inlet (201) or the air outlet (202) corresponding to the fan fixing seat (41).

11. The scanner according to claim 1, wherein The scanner further comprises a second heat dissipation structure (70) and a main beam structure (80) provided with at least one optical device, wherein the main beam structure (80) is arranged in the housing (20), and the second heat dissipation structure (70) is installed at the at least one optical device of the main beam structure (80) and is located below the area between the air inlet (201) and the air outlet (202).

12. The scanner according to claim 11, wherein The second heat dissipation structure (70) comprises a second heat-conducting seat (71) and a plurality of strip-shaped protrusions (72) arranged in parallel on the same side of the second heat-conducting seat (71), and a heat dissipation gap is formed between any two of the strip-shaped protrusions (72).

13. The scanner according to claim 1, wherein The housing (20) comprises a top housing (22), a base (23), a rear housing (25), a front side screen (24) and two side housings (21); the air inlet (201) and the air outlet (202) are respectively arranged on the two side housings (21); the top housing (22), the rear housing (25) and the front side screen (24) are respectively used to block a plurality of openings after the two side housings (21) are connected, so as to form a housing cavity (203) for installing the mainboard structure (30), the first heat dissipation structure (10) and the fan assembly (40).

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