Camera module

Abstract

The utility model provides a camera module, which is applied to a driving monitoring system and comprises a shell, an LED (light-emitting diode) plate, a semiconductor chilling plate and a radiating fin, the shell comprises a first cover body and a second cover body, and the first cover body and the second cover body are mutually buckled to form an inner cavity; the LED plate, the semiconductor chilling plate and the cooling fin are arranged in the inner cavity, the semiconductor chilling plate comprises a refrigeration surface and a cooling surface which are opposite to each other, and the refrigeration surface is attached to one surface, facing the first cover body, of the LED plate; the cooling fin is attached to the heat dissipation face, and the face, away from the heat dissipation face, of the cooling fin is further in direct contact with the first cover body so that heat generated by the LED plate can be conducted to the cooling fin through the semiconductor chilling plate and then directly conducted to the shell. According to the technical scheme, heat dissipation can be achieved only through the semiconductor chilling plate and the cooling fins, the heat dissipation cost is reduced, and meanwhile damage to the PCB caused by heat dissipation is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of cameras, and in particular to a camera module. Background Art

[0002] With the rapid advancement of technology, intelligent driving in vehicles is developing rapidly, and people's requirements for in-vehicle cameras are becoming increasingly demanding. Among them, the Driver Monitoring System (DMS) is used to identify and monitor the driver's identity. Because the DMS is installed in the cab, the light is significantly affected by the external environment. Therefore, the DMS camera requires infrared LEDs to provide supplemental lighting during operation. Infrared LEDs consume a lot of power during operation and generate a lot of heat. Combined with the power consumption of the camera's imaging unit, the combined heat will cause the module to operate in a high-temperature environment for a long time, affecting product reliability and safety. Currently, automotive DMS cameras in the industry typically use the copper foil of the PCB to dissipate heat from the infrared LED. As the infrared LED operates for a long time, heat accumulates in the copper foil of the substrate. Coupled with the poor heat dissipation performance of the substrate, the heat from the infrared LED cannot be effectively distributed, which can easily burn out the infrared LED and ultimately cause product failure. Utility Model Content

[0003] In view of this, it is necessary to propose a camera module.

[0004] In the first aspect, an embodiment of the utility model provides a camera module, which is applied to a driving monitoring system, wherein the camera module includes an outer shell, an LED board, a semiconductor refrigeration sheet and a heat sink, and the outer shell includes a first cover body and a second cover body, and the first cover body and the second cover body are interlocked to form an inner cavity; the LED board, the semiconductor refrigeration sheet and the heat sink are arranged in the inner cavity, and the semiconductor refrigeration sheet includes a cooling surface and a heat dissipation surface opposite to each other, and the cooling surface is attached to the side of the LED board facing the first cover body; the heat sink is attached to the heat dissipation surface, and the side of the heat sink facing away from the heat dissipation surface is also in direct contact with the first cover body, so as to conduct the heat generated by the LED board to the heat sink through the semiconductor refrigeration sheet, and then directly conduct it to the outer shell.

[0005] Optionally, from the second cover body to the first cover body, the LED board, the semiconductor cooling plate and the heat sink are sequentially fastened to the first cover body by a plurality of screws.

[0006] Optionally, a side of the LED board facing the first cover body is provided with a plurality of LED lights; the camera module further comprises a PCB board, the PCB board is arranged in the inner cavity, and is connected to a side of the LED board facing away from the plurality of LED lights through a pin header.

[0007] Optionally, corresponding first through holes are respectively opened on the semiconductor refrigeration fin and the heat sink at positions corresponding to the plurality of LED lamps, so that each LED lamp passes through the corresponding first through hole in sequence on the semiconductor refrigeration fin and the heat sink.

[0008] Optionally, the camera module also includes a lens; the LED board, the semiconductor refrigeration plate and the heat sink are respectively provided with a second through hole different from the first through hole, so that the lens passes through the second through hole in sequence through the LED board, the semiconductor refrigeration plate and the heat sink.

[0009] Optionally, the semiconductor refrigeration plate is provided with a wiring harness, and the LED board is provided with an opening for the wiring harness to pass through, so that the wiring harness is connected to the PCB board through the opening.

[0010] Optionally, the camera module further includes an IR sheet, and the IR sheet is arranged on a side of the first cover body facing away from the heat sink.

[0011] Optionally, a surface of the first cover body facing away from the heat sink is further provided with a plurality of heat dissipation ribs, and each heat dissipation rib has a concave-convex structure.

[0012] Optionally, a sealing ring is provided on one side of the first cover body and the second cover body that are buckled with each other.

[0013] Optionally, the camera module further includes a connector, which is arranged on a side of the second cover body facing away from the first cover body, so that an external device can be connected to the camera module through the connector.

[0014] Optionally, the heat sink is provided with a plurality of buckles, and the heat sink is fastened to the semiconductor refrigeration sheet through the plurality of buckles and is attached to the heat dissipation surface.

[0015] The above-mentioned camera module transfers the heat generated on the LED board to the heat sink through the semiconductor cooling plate, and then directly transfers it to the housing of the camera module. Heat dissipation can be achieved only through the semiconductor cooling plate and the heat sink, which reduces the heat dissipation cost while avoiding damage to the PCB board due to heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0017] Figure 1A schematic structural diagram of a camera module provided in accordance with an embodiment of the utility model.

[0018] Figure 2 A schematic structural diagram of a semiconductor refrigeration plate provided in an embodiment of the utility model.

[0019] Figure 3 A schematic structural diagram of a heat sink provided in an embodiment of the utility model.

[0020] Figure 4 This is a schematic structural diagram of an LED board provided in an embodiment of the utility model.

[0021] Component numbers

[0022] Camera module 100 screws 11

[0023] Connector 1 Opening 501

[0024] Second cover 2 Second through holes 502, 602, 702

[0025] PCB board 3 LED lights 503

[0026] Lens 4 First through holes 601, 701

[0027] LED board 5 wiring harness 603

[0028] Semiconductor cooling plate 6 heat dissipation surface 604

[0029] Heat sink 7 cooling surface 605

[0030] First cover 8 buckle 703

[0031] IR chip 9 heat sink 801

[0032] Sealing ring 10

[0033] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0034] In the description of the present invention, it is necessary to understand that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or the number of technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0036] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0037] To provide a clearer and more accurate understanding of the present invention, the following detailed description is provided with reference to the accompanying drawings. The accompanying drawings illustrate exemplary embodiments of the present invention, with like reference numerals representing like elements. It should be understood that the scales shown in the accompanying drawings are not those of the actual implementation of the present invention. These scales are for illustrative purposes only and are not drawn to scale.

[0038] Please see Figure 1 , which is a structural diagram of the camera module provided by an embodiment of the utility model. The present application provides a camera module 100. The camera module 100 is applied to a driving monitoring system. The camera module 100 can achieve heat dissipation of the internal components of the camera module 100 by conducting the heat generated by the internal components of the camera module 100 when the driving monitoring system is working to the outside of the camera module 100, thereby avoiding damage caused by excessive heat, and also avoiding the heat generated by the internal components when working from being stored inside the camera module 100 and causing damage to the camera module 100. The specific features of each component in the camera module 100 will be specifically described below to explain how the camera module 100 achieves heat dissipation.

[0039] like Figure 1As shown, the camera module 100 includes an outer shell, an LED board 5, a semiconductor refrigeration sheet 6 and a heat sink 7. The outer shell includes a first cover 8 and a second cover 2. The first cover 8 and the second cover 2 are interlocked to form an inner cavity. In the present application, the inner cavity is used to accommodate components in the camera module 100 that are prone to generate heat when the driving monitoring system is working, such as the LED lamp 503 used for fill light on the LED board 5. The present application conducts the heat generated by the components in the inner cavity that are prone to generate heat to the outside of the camera module 100 through the semiconductor refrigeration sheet 6 and the heat sink 7, thereby achieving heat dissipation of the components. Specifically, the LED board 5, the semiconductor refrigeration sheet 6 and the heat sink 7 are arranged in the inner cavity. The semiconductor refrigeration sheet 6 includes a cooling surface 605 and a heat dissipation surface 604 that are opposite to each other. The cooling surface 605 is attached to the side of the LED board 5 facing the first cover 8. The heat sink 7 is attached to the heat dissipation surface 604. The side of the heat sink 7 facing away from the heat dissipation surface 604 is also in direct contact with the first cover 8, thereby transferring heat generated by the LED board 5 to the heat sink 7 via the semiconductor cooling sheet 6, and then directly to the housing. The specific structures of the LED board 5, the semiconductor cooling sheet 6, and the heat sink 7 will be described below to further illustrate the coordination between these components.

[0040] Please see Figure 2-Figure 4 , Figure 2 This is a schematic diagram of the structure of the semiconductor refrigeration plate provided in the embodiment of the utility model. Figure 3 A schematic diagram of the structure of the heat sink provided by the utility model embodiment, Figure 4 This is a schematic structural diagram of an LED board provided in an embodiment of the utility model.

[0041] In this embodiment, the heat sink 7 can be attached to the heat dissipation surface 604 by providing a certain number of fixing components. Optionally, the heat sink 7 is provided with a plurality of clips 703. The heat sink 7 is attached to the heat dissipation surface 604 by snapping the clips 703 onto the semiconductor cooling fin 6. Specifically, the clips 703 are provided on the heat sink 7 along the edge of the heat sink 7 facing the semiconductor cooling fin 6, so that the clips 703 cooperate with the edge of the semiconductor cooling fin 6 and snap onto the semiconductor cooling fin 6, thereby attaching the heat sink 7 to the heat dissipation surface 604.

[0042] In this embodiment, a sealing ring 10 is provided on one side of the first cover body 8 and the second cover body 2 where they are fastened to each other, so that the first cover body 8 and the second cover body 2 are firmly fastened together. From the second cover body 2 to the first cover body 8, the LED board 5, the semiconductor refrigeration sheet 6 and the heat sink 7 are sequentially locked to the first cover body 8 by a number of screws 11. Optionally, the LED board 5, the semiconductor refrigeration sheet 6 and the heat sink 7 are sequentially locked to the first cover body 8 by the same screws 11, so that the LED board 5, the semiconductor refrigeration sheet 6, the heat sink 7 and the outer shell are stably attached to each other, thereby improving the heat dissipation efficiency. The heat sink 7 is made of a metal material with good thermal conductivity, such as silver, copper, aluminum, etc. Optionally, the heat sink 7 is made of copper.

[0043] In this embodiment, a plurality of LED lamps 503 are provided on a side of the LED board 5 facing the first cover body 8. The camera module 100 also includes a PCB board 3. The PCB board 3 is arranged in the inner cavity and is connected to the side of the LED board 5 facing away from the plurality of LED lamps 503 through a pin header. A plurality of sensors (not shown) are provided on the PCB board 3. The plurality of sensors are also prone to generate heat when the driving monitoring system is working. The heat generated by the plurality of sensors can be conducted through the PCB board 3 to the side of the LED board 5 facing away from the LED lamps 503, and then conducted to the semiconductor refrigeration plate 6 and the heat sink 7, and finally conducted to the outer casing to achieve heat dissipation.

[0044] In this embodiment, the semiconductor refrigeration plate 6 and the heat sink 7 are respectively provided with corresponding first through holes 601 and 701 at positions corresponding to the plurality of LED lamps 503, that is, the semiconductor refrigeration plate 6 is provided with corresponding first through holes 601 at positions corresponding to the plurality of LED lamps 503, and the heat sink 7 is provided with corresponding first through holes 701 at positions corresponding to the plurality of LED lamps 503, so that each LED lamp 503 is sequentially passed through the corresponding first through holes 601 and 701 in the semiconductor refrigeration plate 6 and the heat sink 7.

[0045] Furthermore, the camera module 100 also includes a lens. The LED board 5, the semiconductor cooling plate 6, and the heat sink 7 are respectively provided with second through holes 502, 602, and 702 different from the first through holes 601 and 701. That is, the LED board 5 is provided with a second through hole 502, the semiconductor cooling plate 6 is provided with a second through hole 602 different from the first through hole 601, and the heat sink 7 is provided with a second through hole 702 different from the first through hole 701, so that the lens is sequentially provided through the second through holes 502, 602, and 702 to penetrate the LED board 5, the semiconductor cooling plate 6, and the heat sink 7.

[0046] In this embodiment, the semiconductor cooling plate 6 is provided with a wiring harness 603. The LED board 5 has an opening 501 for the wiring harness to pass through, allowing the wiring harness 603 to connect to the PCB board 3 through the opening 501. The camera module 100 also includes an IR plate 9. The IR plate 9 is located on the side of the first cover 8 facing away from the heat sink 7. It blocks visible light and transmits infrared light, allowing it to enter and exit the camera module 100.

[0047] Furthermore, the first cover 8 is provided with a plurality of heat dissipation ribs 801 on the side facing away from the heat sink 7. Each heat dissipation rib 801 has a concave-convex structure to increase the heat dissipation area of ​​the first cover 8 and achieve rapid heat dissipation. Optionally, the second cover 2 is also provided with a plurality of heat dissipation ribs 801 on the side facing away from the first cover 8.

[0048] In this embodiment, the camera module 100 can also be connected to other components via a connector 1. Specifically, the connector 1 is disposed on the side of the second cover 2 facing away from the first cover 8, allowing an external device (not shown) to connect to the camera module 100 via the connector 1. The external device may be other components of the driving monitoring system.

[0049] In the above embodiment, the heat generated on the LED board is conducted to the heat sink through the semiconductor refrigeration sheet, and then directly conducted to the housing of the camera module. Heat dissipation can be achieved only through the semiconductor refrigeration sheet and the heat sink, which reduces the heat dissipation cost and avoids damage to the PCB board due to heat dissipation.

[0050] Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present application. Thus, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include such modifications and variations.

[0051] The above examples are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention still fall within the scope of the present invention.

Claims

1. A camera module, applied to a driving monitoring system, characterized in that: The camera module includes: The housing comprises a first cover and a second cover, wherein the first cover and the second cover are buckled together to form an inner cavity; and An LED board, a semiconductor refrigeration sheet and a heat sink are arranged in the inner cavity. The semiconductor refrigeration sheet includes a cooling surface and a heat sink surface facing each other. The cooling surface is attached to the side of the LED board facing the first cover body; the heat sink is attached to the heat sink surface, and the side of the heat sink facing away from the heat sink surface is also in direct contact with the first cover body, so as to conduct the heat generated by the LED board to the heat sink through the semiconductor refrigeration sheet, and then directly conduct it to the outer shell.

2. The camera module according to claim 1, wherein: From the second cover body to the first cover body, the LED board, the semiconductor cooling plate and the heat sink are sequentially fastened to the first cover body by a plurality of screws.

3. The camera module according to claim 1, wherein: The LED board is provided with a plurality of LED lights on a side facing the first cover body; the camera module further comprises a PCB board, which is arranged in the inner cavity and is connected to a side of the LED board away from the plurality of LED lights through a pin header.

4. The camera module according to claim 3, wherein: The semiconductor refrigeration plate and the heat sink are respectively provided with corresponding first through holes at positions corresponding to the plurality of LED lamps, so that each LED lamp is sequentially arranged on the semiconductor refrigeration plate and the heat sink through the corresponding first through holes.

5. The camera module according to claim 4, wherein: The camera module also includes a lens; the LED board, the semiconductor refrigeration plate and the heat sink are respectively provided with a second through hole different from the first through hole, so that the lens passes through the second through hole in sequence through the LED board, the semiconductor refrigeration plate and the heat sink.

6. The camera module according to claim 3, wherein: The semiconductor refrigeration plate is provided with a wiring harness, and the LED board is provided with an opening for the wiring harness to pass through, so that the wiring harness is connected to the PCB board through the opening.

7. The camera module according to claim 1, wherein: The camera module further includes an IR sheet, and the IR sheet is arranged on a side of the first cover body facing away from the heat sink.

8. The camera module according to claim 1, wherein: A plurality of heat dissipation ribs are provided on a side of the first cover body facing away from the heat dissipation fins, and each heat dissipation rib has a concave-convex structure.

9. The camera module according to claim 1, wherein: A sealing ring is provided on one side where the first cover body and the second cover body are buckled with each other.

10. The camera module according to claim 1, wherein: The heat sink is provided with a plurality of buckles, and the heat sink is fastened to the semiconductor refrigeration sheet through the plurality of buckles and is attached to the heat dissipation surface.

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