Charging pile power module

Abstract

The utility model provides a charging pile power module, which is characterized in that an input filter and a power factor correction circuit are arranged on an AC-DC circuit board, and a DC conversion circuit and an output filter are arranged on a DC-DC circuit board; an AC-DC circuit auxiliary board is further arranged below the AC-DC circuit board, magnetic devices in the input filter and the power factor correction circuit are welded on the AC-DC circuit auxiliary board, and the magnetic devices are connected with corresponding positions of the AC-DC circuit board through first connecting conductors; a DC-DC circuit auxiliary board is further arranged below the DC-DC circuit board, magnetic devices in the DC conversion circuit and the output filter are welded on the DC-DC circuit auxiliary board, and the magnetic devices are connected with the corresponding positions of the DC-DC circuit board through second connecting conductors. According to the utility model, the AC-DC module and the DC-DC module in the power module are respectively arranged on different PCBs, and meanwhile, the heating devices are additionally arranged, so that the maintenance is convenient.

Description

Technical Field

[0001] The utility model relates to an electric pile power module. Background Art

[0002] The charging pile power module is the charging module of the charging pile, also known as the charging pile power module. It is used in the DC charging pile to convert the AC power in the AC power grid into DC power that can charge the power battery. It is the core component of the DC charging pile to charge the power battery. The core component of the charging pile module is the power converter, which converts AC power (mains power) into DC power to charge the car's power battery. The traditional charging pile module mainly includes four parts: input filter, power factor correction circuit, DC conversion circuit and output filter. Figure 1 As shown, AC power is generally three-phase industrial power, and sometimes 220VAC mains power is used. After passing through the input filter, AC power enters the PFC circuit and is converted into DC power. Therefore, the input filter and PFC are sometimes collectively called an AC-DC circuit, while the DC conversion circuit and output filter combination is called a DC-DC circuit.

[0003] At present, charging pile power modules are generally integrated on a PCB. The advantage of this is that all components and the lines connecting these components are on the same PCB board. The disadvantage is that maintenance is inconvenient. If a component burns out, it is necessary to test the entire PCB, which is very large and time-consuming. Utility Model Content

[0004] In order to solve the problem that the current charging pile power modules are all integrated on a single PCB and are inconvenient to maintain, the utility model provides a charging pile power module in which the input filter and power factor correction circuit are arranged on an AC-DC circuit board, and the DC conversion circuit and output filter are arranged on a DC-DC circuit board.

[0005] The technical solution adopted by the present invention to achieve its technical purpose is: a charging pile power module, including an input filter, a power factor correction circuit, a DC conversion circuit and an output filter; the input filter and the power factor correction circuit are arranged on an AC-DC circuit board, and the DC conversion circuit and the output filter are arranged on a DC-DC circuit board;

[0006] The AC-DC circuit board and the DC-DC circuit board are arranged side by side on the radiator;

[0007] An AC-DC circuit sub-board is provided below the AC-DC circuit board, magnetic components in the input filter and power factor correction circuit are soldered to the AC-DC circuit sub-board, and a first connecting conductor is used to connect the magnetic components to corresponding positions of the AC-DC circuit board;

[0008] There is also a DC-DC circuit sub-board under the DC-DC circuit board, the magnetic components in the DC conversion circuit and the output filter are welded to the DC-DC circuit sub-board, and the magnetic components are connected to the corresponding positions of the DC-DC circuit board using a second connecting conductor;

[0009] The heat absorbing surface of the radiator is provided with a heat conducting groove for accommodating the AC-DC circuit sub-board and the magnetic components welded on the DC-DC circuit sub-board.

[0010] Furthermore, in the above-mentioned charging pile power module: the heat conduction groove is filled with heat conduction liquid, the AC-DC circuit sub-board and the DC-DC circuit sub-board are respectively sealed and covered on the heat conduction groove, and the magnetic device is immersed in the heat conduction liquid.

[0011] Furthermore, in the above-mentioned charging pile power module: the heat-conducting surfaces of the high-power semiconductor devices on the AC-DC circuit board and the DC-DC circuit board are fixed on the heat-absorbing surface of the radiator.

[0012] Furthermore, in the above-mentioned charging pile power module: in the radiator, the back side of the heat absorption surface (31) is a heat dissipation surface with evenly distributed heat dissipation teeth.

[0013] In the utility model, the AC-DC module and the DC-DC module in the power module are respectively arranged on different PCBs, and the heating device is arranged separately, which is convenient for maintenance.

[0014] In addition, in the present invention, the heating coils such as inductors and transformers are heat-conducted by filling the surrounding thermal conductive fluid, while high-power semiconductor devices such as MOS tubes are heat-conducted by contact with high thermal conductivity materials, so as to achieve better heat dissipation effect.

[0015] Furthermore, in the present invention, the transformer and the inductor are integrated onto the transformer circuit board and the inductor circuit board, which are then connected to corresponding positions on the main circuit board with wires. At the same time, the pins of the MOS tube are soldered to the main PCB, and the heat dissipation surface on the package body of the packaged MOS tube is closely attached to the heat dissipation plane of the radiator. Targeted heat dissipation structures are adopted for different heating devices, resulting in better heat dissipation effect.

[0016] The present invention will be described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Attachment Figure 1 This is the principle block diagram of the charging pile power module;

[0018] Attachment Figure 2 This is a three-dimensional diagram of the power module of the charging pile according to the embodiment of the utility model;

[0019] Attachment Figure 3 This is a partial cross-sectional view of the charging pile power module according to an embodiment of the present utility model. DETAILED DESCRIPTION

[0020] Example 1, as Figure 2 、 3 As shown, this embodiment is a charging pile power module, which is consistent with the current mainstream charging pile. The charging pile power module includes an input filter, a power factor correction circuit, a DC conversion circuit and an output filter. In this embodiment, in order to make the charging pile power module more convenient to maintain, two PCB boards are used. The input filter and the power factor correction circuit are arranged on an AC-DC circuit board 1, and the DC conversion circuit and the output filter are arranged on a DC-DC circuit board 2. In fact, the AC-DC circuit board 1 is the DC power supply part, and the DC-DC circuit board 2 is the DC-DC part. The DC power supply part rectifies and filters the AC power (including three-phase industrial frequency power supply and two-phase mains power). When using 220VAC mains power, the PFC (power factor correction circuit) outputs two sets of DC power supplies of +400VDC and -400VDC, which are connected to the DC conversion circuit on the DC-DC circuit board 2 through a wire (copper wire or other metal wire with low resistivity). The DC signal is inverted to form DC, and then coupled to the output filter by an isolation transformer to form DC to charge the power battery.

[0021] In this embodiment, the AC-DC circuit board 1 and the DC-DC circuit board 2 are arranged side by side on the radiator 3; since there are many high-power devices on the AC-DC circuit board 1 and the DC-DC circuit board 2, which generate heat during operation and increase the temperature, a radiator is necessary. The radiator in this embodiment is designed for the charging pile power module and can effectively reduce the temperature of the charging pile power module, especially for the high-power devices in the charging pile power module, such as high-power semiconductor devices, inductors or transformers and other devices with coil windings.

[0022] There is also an AC-DC circuit sub-board 4 under the AC-DC circuit board 1. The magnetic components 10 in the input filter and power factor correction circuit are welded on the AC-DC circuit sub-board 4. The first connecting conductor 41 is used to connect the magnetic components 10 to the corresponding position of the AC-DC circuit board 1.

[0023] There is also a DC-DC circuit sub-board 5 under the DC-DC circuit board 2. The magnetic components 10 in the DC conversion circuit and the output filter are welded on the DC-DC circuit sub-board 5. The second connecting conductor 51 is used to connect the magnetic components 10 to the corresponding position of the DC-DC circuit board 2.

[0024] In this embodiment, the magnetic device 10 mainly refers to the inductor and transformer in the charging pile power module. They all have coil windings. Since the cross-sectional area of ​​the wire wound around these coil windings is relatively small, whether it is copper wire or other wires with low resistivity, there will be a certain resistance. Since the current added to it is large, more heat is generated and special heat dissipation is required. In this embodiment, these inductors or transformers are separately arranged on a sub-board to create conditions for their heat dissipation. In this embodiment, the specific circuitry of the charging pile power module is not modified. Magnetic components such as the inductor and transformer are simply moved from the AC-DC circuit board 1 and DC-DC circuit board 2 to the sub-board. Conductors are used to connect these coil windings to their original locations. The first connecting conductor 41 and second connecting conductor 51 used here are actually copper pillars and copper particles, connecting the PIN pins of the inductor or transformer to their original locations. Since the AC-DC circuit board 1 and the AC-DC circuit sub-board 4 are located in an upper and lower position, the AC-DC circuit board 1 is also supported on the heat absorbing surface 31 of the heat sink 3 by a metal pillar, while the AC-DC circuit sub-board 4 rests on the heat absorbing surface 31 of the heat sink 3. The distance between the two is relatively short, making jumper wires inconvenient. Therefore, copper pillars and copper particles are used here. The same is true between the DC-DC circuit board 2 and the DC-DC circuit sub-board 5.

[0025] The heat absorbing surface 31 of the heat sink 3 is provided with a heat conducting groove 32 for accommodating the magnetic components soldered onto the AC-DC circuit sub-board 4 and the DC-DC circuit sub-board 5. The heat conducting groove 32 is filled with a heat conducting fluid. The AC-DC circuit sub-board 4 and the DC-DC circuit sub-board 5 are sealed and covered in the heat conducting groove 32, and the magnetic components 10 are immersed in the heat conducting fluid. In this embodiment, two heat conducting grooves 32 are provided on the heat absorbing surface 31 of the heat sink 3, corresponding to the two sub-boards.

[0026] The heat conducting surfaces of the high-power semiconductor devices 20 on the AC-DC circuit board 1 and the DC-DC circuit board 2 are fixed to the heat absorbing surface 31 of the heat sink 3. In the heat sink 3, the back of the heat absorbing surface 31 is a heat dissipation surface 33 with evenly distributed heat dissipation teeth 34.

[0027] This embodiment is a natural heat dissipation charging pile power module, including an input filter, a power factor correction circuit, a DC conversion circuit and an output filter arranged on a printed circuit board 1; the input filter and the power factor correction circuit, as well as the DC conversion circuit and the output filter are respectively arranged on two printed circuit boards, AC-DC circuit board 1 and DC-DC circuit board 2.

[0028] To convert AC power to DC power for charging the power battery, the charging pile power module in this embodiment consists of an input filter, a power factor correction circuit, a DC conversion circuit, and an output filter. The input filter filters the input mains power and removes any noise. The PFC circuit, also known as the power factor correction circuit, then converts the 220VAC mains power to a 400VDC output, improving the power factor while also rectifying it. Compared to a simple rectifier circuit, this circuit improves the power factor. These two components are commonly used in power supply circuits and are very mature technologies. These two components primarily include capacitors and rectifiers. The DC conversion circuit primarily consists of an inverter bridge circuit, including switching transistors and a transformer. The output filter, like the input filter, also filters out noise to make the output DC power more stable. It primarily consists of components such as inductors, transformers, and diodes. The input filter, power factor correction circuit, DC conversion circuit, and output filter are all very mature technologies in power supply circuits and are commonly found in various power supply modules. This embodiment classifies the specific devices used in these circuit modules, mainly dividing these devices into semiconductor devices with high heat generation, such as MOS tubes (used as switching tubes, rectifier tubes, etc.). Some diodes can also be replaced by these MOS tubes. Another device with high heat generation is the coil. The wire used in the coil itself has a certain resistivity. If the wire of the coil winding is long enough, its resistance will also be large enough. Due to the large current flowing through, the heat generation is very considerable. Therefore, it is also the focus of attention when doing heat dissipation. There are two main components in the coil winding, one is the inductor, and the other is the transformer. Both are devices with high heat generation, especially in high-power power supplies such as charging piles. Therefore, the heat dissipation of transformers and inductors is the focus of attention.

[0029] In this embodiment, in order to achieve heat dissipation of the charging pile power module, a special radiator 3 is designed, such as Figure 2 The heat sink 3 shown is stamped from a single piece of aluminum alloy and includes a heat-absorbing surface 31 that contacts the AC-DC circuit board 1 and the DC-DC circuit board 2. Behind the heat-absorbing surface 31 is a heat-dissipating surface 33 provided with heat-dissipating teeth 34. Heat generated by the power devices on the AC-DC circuit board 1 and the DC-DC circuit board 2 is absorbed by the heat-absorbing surface 31 and then conducted to the heat-dissipating surface 33 on the opposite side by the high thermal conductivity of the aluminum alloy. Heat-dissipating teeth 34 are used to increase the heat dissipation area on the heat-dissipating surface 33, allowing the heat to be quickly dissipated into the air.

[0030] In this embodiment, a heat absorbing surface 31 is provided with a heat absorbing surface connected to the heat dissipation surface of the high-power semiconductor device and a heat dissipation groove 32 filled with heat-conducting liquid. Winding coil devices such as inductor transformers are immersed in the heat-conducting liquid.

[0031] In this embodiment, AC-DC circuit board 1 and DC-DC circuit board 2 are further provided with an AC-DC circuit sub-board 4 and a DC-DC circuit sub-board 5, each containing a soldered inductor or transformer. In this embodiment, magnetic components such as the transformer and inductor on the PCB are collectively immersed in a thermal conductive fluid. Thermal conductive fluid, also known as thermal oil or thermal adhesive, is a commercially available product and can be used by those skilled in the art. The thermal conductive fluid is filled around the coil windings to promptly dissipate heat generated by the coil windings. This provides a better heat dissipation effect than exposing the coil windings to air. Compared to air, thermal conductive fluid is a good conductor of heat and can more quickly absorb heat generated by the coil windings. High-power semiconductor devices are packaged and have a metal surface for heat dissipation. For example, some MOS transistors have a metal housing and a heat dissipation surface in addition to their three pins.

[0032] In this embodiment, the heat conduction groove 32 includes two grooves corresponding to the AC-DC circuit sub-board 4 and the DC-DC circuit sub-board 5, respectively. The AC-DC circuit sub-board 4 and the DC-DC circuit sub-board 5 are sealed over the notches of the heat conduction groove 32. The AC-DC circuit board 1 and the DC-DC circuit board 2 are supported on the heat absorption surface 31 using metal rods. The MOS transistor is fixed to the heat absorption surface 31 with bolts. The heat dissipation surface of the MOS transistor is in close contact with the heat absorption surface of the heat absorption surface 31. The pins of the MOS transistor are soldered to the main AC-DC circuit board 1 and the DC-DC circuit board 2. In this embodiment, the heat absorbing surface 31 of the heat sink 3 has two heat absorbing structures. One is a heat dissipation plane, which is mainly used to dissipate heat from high-power semiconductor devices such as MOS tubes. As we know, high-power devices such as MOS tubes generally require packaging. For example, general integrated circuits and MOS tubes have a heat dissipation plane on the package. This heat dissipation plane is basically a metal surface that dissipates heat within the package. Therefore, the heat dissipation surface on the device is closely attached to the heat absorbing plane 33 on the heat absorbing surface 31 allocated for dissipating heat from the MOS tube using bolts. The heat absorbing plane 31 quickly absorbs heat from the heat dissipation surface of the MOS tube and conducts it to the heat dissipation teeth 34 on the opposite heat dissipation surface 33 to dissipate it into the air.

[0033] In this embodiment, the heat dissipation characteristics of coil windings and high-power semiconductor devices such as MOS tubes are combined. Winding-type devices such as inductors and transformers are cooled by filling the surrounding heat-conducting liquid, while high-power semiconductor devices such as MOS tubes are cooled by closely contacting the heat dissipation surface with the heat absorption surface. The advantages of each are fully utilized to increase the heat dissipation. At the same time, natural heat dissipation is achieved by means of natural air flow, resulting in good heat dissipation effect.

Claims

1. A charging pile power module, comprising an input filter, a power factor correction circuit, a DC conversion circuit, and an output filter; characterized in that: The input filter and the power factor correction circuit are arranged on an AC-DC circuit board (1), and the DC conversion circuit and the output filter are arranged on a DC-DC circuit board (2); The AC-DC circuit board (1) and the DC-DC circuit board (2) are arranged side by side on the heat sink (3); An AC-DC circuit sub-board (4) is provided below the AC-DC circuit board (1); the magnetic device (10) in the input filter and power factor correction circuit is welded to the AC-DC circuit sub-board (4); and a first connecting conductor (41) is used to connect the magnetic device (10) to a corresponding position of the AC-DC circuit board (1); A DC-DC circuit sub-board (5) is provided below the DC-DC circuit board (2); the magnetic device (10) in the DC conversion circuit and the output filter is welded to the DC-DC circuit sub-board (5); and a second connecting conductor (51) is used to connect the magnetic device (10) to the corresponding position of the DC-DC circuit board (2); A heat-conducting groove (32) is provided on the heat-absorbing surface (31) of the radiator (3) for accommodating magnetic components welded on the AC-DC circuit sub-board (4) and the DC-DC circuit sub-board (5).

2. The charging pile power module according to claim 1, characterized in that: The heat-conducting groove (32) is filled with heat-conducting liquid, the AC-DC circuit sub-board (4) and the DC-DC circuit sub-board (5) are respectively sealed and covered on the heat-conducting groove (32), and the magnetic device (10) is immersed in the heat-conducting liquid.

3. The charging pile power module according to claim 1, characterized in that: The heat-conducting surfaces of the high-power semiconductor devices (20) on the AC-DC circuit board (1) and the DC-DC circuit board (2) are fixed on the heat-absorbing surface (31) of the heat sink (3).

4. The charging pile power module according to claim 1, 2 or 3, characterized in that: In the radiator (3), the back side of the heat absorbing surface (31) is a heat dissipation surface (33) with evenly distributed heat dissipation teeth (34).

Images