Electronic equipment with waterproof heat dissipation structure

Abstract

The utility model discloses an electronic device with a waterproof heat dissipation structure, which comprises a shell and a sealing heat dissipation assembly, the shell is provided with a front surface and a back surface, the front surface of the shell is provided with a display screen, an accommodating cavity is formed in the shell, a main control circuit board is arranged in the accommodating cavity, and the display screen is electrically connected with the main control circuit board. An opening part is formed in a position, corresponding to the main control circuit board, of the back surface of the shell; the sealing heat dissipation assembly at least comprises a sealing plate and a heat dissipation fan, the sealing plate is tightly connected to the edge of the opening part, a plurality of heat dissipation fins are arranged on the surface of the sealing plate at intervals, part of the heat dissipation fins are sunken downwards to form a mounting part, and the heat dissipation fan is arranged on the mounting part in an attached mode and electrically connected to the main control circuit board. The technical scheme of the utility model aims to ensure the waterproofness and good heat dissipation performance of the equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, in particular to an electronic equipment with a waterproof heat dissipation structure. Background Art

[0002] When considering the waterproof performance of some existing outdoor electronic devices, their casings are often designed to be completely sealed. However, this will cause heat to accumulate inside the device, resulting in poor heat dissipation. This can easily cause the device to malfunction during long-term use or in hot outdoor weather. However, if a cooling device such as a cooling fan is installed inside, holes must be opened in the casing to ensure air circulation, which will cause the device to lose its waterproof performance. How to make the device have both waterproof and heat dissipation functions remains a problem that needs to be solved. Utility Model Content

[0003] The main purpose of the utility model is to provide an electronic device with a waterproof heat dissipation structure, aiming to ensure the waterproofness and good heat dissipation performance of the device.

[0004] To achieve the above-mentioned purpose, the present invention provides an electronic device with a waterproof heat dissipation structure, comprising:

[0005] a housing, the housing having a front and a back, a display screen disposed on the front of the housing, a housing formed inside the housing for accommodating a main control circuit board, the display screen being electrically connected to the main control circuit board, and an opening formed on the back of the housing at a position corresponding to the main control circuit board;

[0006] A sealed heat dissipation component, which includes at least a sealing plate and a heat dissipation fan. The sealing plate is tightly connected to the edge of the open portion. A plurality of heat dissipation fins are arranged at intervals on the surface of the sealing plate, and some of the heat dissipation fins are recessed downward to form a mounting portion. The heat dissipation fan is fitted on the mounting portion and is electrically connected to the main control circuit board.

[0007] In one embodiment of the present invention, a CPU is integrated on the main control circuit board, a thickened portion is formed on the sealing plate at a position corresponding to the CPU, and the mounting portion is disposed in the thickened portion.

[0008] In one embodiment of the present invention, the sealed heat dissipation assembly further includes a protective plate, which covers the sealing plate and the heat dissipation fan, and a plurality of air holes are spaced apart on the surface of the protective plate.

[0009] In one embodiment of the present invention, a plurality of connection holes are circumferentially formed at the edge of the open portion, and a plurality of connection posts are provided at the edge of the sealing plate corresponding to the connection holes, and the connection posts are interference or transitionally fitted in the connection holes.

[0010] In an embodiment of the present invention, the sealing plate is made of copper.

[0011] This innovative solution ensures the device's waterproofness and excellent heat dissipation through a carefully designed housing and heat dissipation structure. The sealed heat dissipation assembly effectively protects the device's internal electronic components, extending their service life. The heat dissipation system also ensures that the device's performance is not affected by overheating during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0013] Figure 1 This is a schematic diagram of the front structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the back structure of the utility model;

[0015] Figure 3 This is an exploded view of the utility model;

[0016] Figure 4 This is a schematic structural diagram of the sealing plate of the present invention.

[0017] Description of Figure Numbers:

[0018] 1. Housing; 2. Display screen; 3. Accommodation cavity; 31. Main control circuit board; 4. Open portion; 41. Connection hole; 5. Sealing plate; 51. Heat dissipation fin; 511. Mounting portion; 52. Thickened portion; 53. Connecting column; 6. Heat dissipation fan; 7. Protective plate; 71. Ventilation hole.

[0019] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0021] Reference Figures 1 to 3The present invention proposes an electronic device with a waterproof heat dissipation structure, including a shell 1 and a sealed heat dissipation component. The shell 1 has a front and a back. A display screen 2 is provided on the front of the shell 1. A accommodating cavity 3 is formed inside the shell 1. A main control circuit board 31 is provided inside the accommodating cavity 3. The display screen 2 is electrically connected to the main control circuit board 31. An open portion 4 is opened at a position corresponding to the main control circuit board 31 on the back of the shell 1; the sealed heat dissipation component includes at least a sealing plate 5 and a heat dissipation fan 6. The sealing plate 5 is tightly connected to the edge of the open portion 4. A plurality of heat dissipation fins 51 are arranged at intervals on the surface of the sealing plate 5, and some of the heat dissipation fins 51 are recessed downward to form a mounting portion 511. The heat dissipation fan 6 is fitted on the mounting portion 511, and the heat dissipation fan 6 is electrically connected to the main control circuit board 31.

[0022] As you can understand, the housing 1 supports and protects the internal components. The display screen 2 is located on the front of the housing 1 and is used to display information or images. The main control circuit board 31 is the core control unit of the device, responsible for processing and controlling the device's functions. It is located in the housing cavity 3 within the housing 1. The display screen 2 is connected to the main control circuit board 31 via electrical wiring, allowing it to display information processed by the main control circuit board 31. The open portion 4 is an opening on the back of the housing 1, corresponding to the location of the main control circuit board 31, and is used to install the sealed heat dissipation assembly.

[0023] The sealed heat dissipation assembly is waterproof and has heat dissipation functions. It consists of two parts: a sealing plate 5 that seals the open portion 4, preventing water and dust from entering the device and damaging the components on the main control circuit board 31. The sealing plate 5 is also made of a material with high thermal conductivity, such as copper or aluminum, to conduct heat generated by the components on the main control circuit board 31 during operation to the sealing plate 5. The main control circuit board 31 and the sealing plate 5 can be connected by a thermally conductive copper tube or a thermally conductive copper plate, which is not further defined herein. The heat dissipation fins 51 are multiple thermally conductive fins disposed on the surface of the sealing plate 5 to increase the heat dissipation area and facilitate heat dissipation. The mounting portion 511 is a recessed space formed by a portion of the heat dissipation fins 51, which is used to secure and mount the heat dissipation fan 6. The heat dissipation fan 6 is used to circulate air, which removes heat from the sealing plate 5 and heat dissipation fins 51, maintaining the normal operating temperature of the device. The mounting portion 511 has a small hole at the bottom for wiring to pass through. The heat dissipation fan 6 is electrically connected to the main control circuit board 31 and can be controlled by the main control circuit board 31 to achieve intelligent heat dissipation.

[0024] This embodiment ensures waterproofing and excellent heat dissipation through the carefully designed housing 1 and heat dissipation structure. The sealed heat dissipation assembly effectively protects the electronic components within the device, extending their service life. The heat dissipation system design ensures that the device's performance will not be affected by overheating during use.

[0025] Reference Figures 3 to 4In one embodiment of the present application, a CPU is integrated on the main control circuit board 31 , a thickened portion 52 is formed on the sealing plate 5 at a position corresponding to the CPU, and the mounting portion 511 is disposed in the thickened portion 52 .

[0026] It is understandable that the main control circuit board 31 is equipped with a CPU (central processing unit), which is the core computing unit of the device and is responsible for executing instructions and processing data. Since its power is relatively high during operation, its heat generation will also be more serious. Therefore, the sealing plate 5 is specially designed with a thickened area at the position corresponding to the CPU. On the one hand, it can shorten the distance between the sealing plate 5 and the CPU, so that heat can be transferred to the sealing plate 5 more quickly. On the other hand, it also increases the height of the heat dissipation fins 51 of this part, so that its surface area increases, which helps to improve the heat exchange efficiency. Since the CPU generates a lot of heat when working, the thickened part 52 can effectively conduct and dissipate this heat, prevent the CPU from overheating, and ensure that the CPU remains within a safe operating temperature range.

[0027] Mounting portion 511 is located within thickened portion 52. Mounting portion 511 secures cooling fan 6, fitting directly within thickened portion 52. This enhances heat dissipation efficiency and prevents fan 6 from shifting or being damaged by vibration during operation. This positioning allows cooling fan 6 to more effectively remove heat from the CPU and dissipate it to the outside environment through airflow.

[0028] Reference Figures 2 to 3 In one embodiment of the present application, the sealed heat dissipation assembly further includes a protective plate 7, which covers the sealing plate 5 and the heat dissipation fan 6, and a plurality of air holes 71 are spaced apart on the surface of the protective plate 7.

[0029] As will be appreciated, protective plate 7 is mounted above sealing plate 5 and cooling fan 6. This covering design provides additional protection for the cooling assembly, preventing external factors from affecting the internal components. A plurality of ventilation holes 71 are provided on the surface of protective plate 7. These holes are designed to ensure air circulation, thereby promoting the normal operation of cooling fan 6 and the dissipation of internal heat.

[0030] Protective plate 7 prevents dust and other foreign matter from invading the area between sealing plate 5 and cooling fan 6, thereby improving the durability and safety of the device. Ventilation holes 71 allow air to circulate within the cooling assembly, helping cooling fan 6 more effectively absorb and dissipate heat, thereby maintaining excellent heat dissipation performance. The design of vents 71 effectively prevents heat accumulation between protective plate 7 and sealing plate 5, reducing the risk of overheating and protecting the normal operation of the CPU and other internal components.

[0031] By covering the sealing plate 5 and the cooling fan 6, the protective plate 7 provides additional protection, while the ventilation holes 71 ensure the flow of cooling air. This structural design not only enhances the device's protective performance but also optimizes heat dissipation, enabling the device to maintain stable and efficient operation in relatively harsh environments.

[0032] Reference Figures 3 to 4 In one embodiment of the present application, a plurality of connecting holes 41 are circumferentially provided at the edge of the open portion 4 , and a plurality of connecting columns 53 are provided at the edge of the sealing plate 5 corresponding to the connecting holes 41 , and the connecting columns 53 are interference or transitionally fitted in the connecting holes 41 .

[0033] As will be appreciated, multiple connection holes 41 are circumferentially defined along the edge of the open portion 4. These holes are provided for connection to the sealing plate 5. The number and distribution of the connection holes 41 can be adjusted according to design requirements to ensure stability and secure assembly. The edge of the sealing plate 5 is provided with multiple connection posts 53, which correspond to the connection holes 41 of the open portion 4. This allows for a mechanical connection between the sealing plate 5 and the open portion 4, ensuring sealing and structural stability.

[0034] Interference fit and transition fit refer to the design of the fitting dimensions of two parts when connected to each other to be slightly larger than or equal to the dimensions of the connecting hole 41. This is generally used to ensure a tight connection and prevent loosening during use. Through this fit, the connecting post 53 is firmly fixed in the connecting hole 41, enhancing the firmness of the connection and improving the overall strength and stability of the assembly. It also allows the connecting post 53 to be easily inserted into the connecting hole 41 during assembly, reducing assembly difficulty while ensuring sufficient connection strength and sealing.

[0035] The mating of connecting posts 53 and connecting holes 41 creates a tight connection between sealing plate 5 and open portion 4, helping to prevent air and moisture from entering the internal space, thereby improving the device's protective performance. The design of connecting posts 53 and connecting holes 41 ensures the stability of the heat dissipation assembly during use, preventing loosening or dislodging due to external forces or vibration.

[0036] Reference Figures 3 to 4 In one embodiment of the present application, the sealing plate 5 is made of copper.

[0037] As you can understand, copper has a very high thermal conductivity of approximately 390 W / m·K, allowing it to conduct heat quickly, reduce temperature gradients, and improve heat exchange efficiency. Copper's excellent mechanical strength and toughness make it stable in high-temperature and high-pressure environments. Its wear resistance also prevents the sealing plate 5 from easily damaging during long-term use. Copper's moderate coefficient of thermal expansion prevents drastic dimensional changes with temperature fluctuations, helping to maintain a tight joint and effective thermal conductivity.

[0038] This innovative solution ensures the device's waterproofness and excellent heat dissipation through a carefully designed housing 1 and heat dissipation structure. The sealed heat dissipation assembly effectively protects the device's internal electronic components, extending their service life. The heat dissipation system ensures that the device's performance is not affected by overheating during use.

[0039] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the drawings. This is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0040] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. An electronic device with a waterproof heat dissipation structure, characterized in that: include: A housing (1), the housing (1) having a front and a back, a display screen (2) being provided on the front of the housing (1), a receiving cavity (3) being formed inside the housing (1), a main control circuit board (31) being provided inside the receiving cavity (3), the display screen (2) being electrically connected to the main control circuit board (31), and an opening (4) being provided at a position on the back of the housing (1) corresponding to the main control circuit board (31); A sealed heat dissipation component comprises at least a sealing plate (5) and a heat dissipation fan (6), wherein the sealing plate (5) is tightly connected to the edge of the open portion (4), a plurality of heat dissipation fins (51) are arranged at intervals on the surface of the sealing plate (5), and a portion of the heat dissipation fins (51) is recessed downward to form a mounting portion (511), the heat dissipation fan (6) is fitted on the mounting portion (511), and the heat dissipation fan (6) is electrically connected to the main control circuit board (31).

2. The electronic device with a waterproof heat dissipation structure according to claim 1, characterized in that: The main control circuit board (31) is integrated with a CPU, the sealing plate (5) is formed with a thickened portion (52) at a position corresponding to the CPU, and the mounting portion (511) is arranged in the thickened portion (52).

3. The electronic device with a waterproof heat dissipation structure according to claim 2, characterized in that: The sealed heat dissipation assembly further comprises a protective plate (7), which covers the sealing plate (5) and the heat dissipation fan (6), and a plurality of air holes (71) are spaced apart on the surface of the protective plate (7).

4. The electronic device with a waterproof heat dissipation structure according to claim 3, characterized in that: The edge of the open portion (4) is circumferentially provided with a plurality of connection holes (41), and the edge of the sealing plate (5) is provided with a plurality of connection columns (53) corresponding to the connection holes (41), and the connection columns (53) are interference-fitted or transition-fitted with the connection holes (41).

5. The electronic device with a waterproof heat dissipation structure according to claim 4, characterized in that: The sealing plate (5) is made of copper.

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