Uniform heating device and heterojunction battery coating equipment

Abstract

The utility model provides a uniform heating device and heterojunction cell coating equipment, and relates to the technical field of solar cells, the uniform heating device comprises a reaction chamber, at least one heating plate and two heating wire members, the reaction chamber is internally provided with a carrier plate placing area, and the carrier plate placing area is used for placing a carrier plate loaded with a silicon wafer; the heating plate is arranged on the top wall and / or the bottom wall of the reaction chamber; the two heating wire components are arranged on two opposite side walls of the reaction chamber, are positioned on two sides of the carrier plate placing area and are used for heating the carrier plate in the carrier plate placing area. Compared with the prior art, by additionally arranging the heating wire component, the original single heating mode of utilizing a heating plate is changed into a multi-point flexible heating mechanism, so that the temperature difference is effectively improved, the temperature uniformity of the carrier plate during film coating is improved, and more thoughts can be provided for future machine table transformation and process development.

Description

Technical Field

[0001] The utility model relates to the technical field of solar cells, in particular to a uniform heating device and heterojunction cell coating equipment. Background Art

[0002] During the preparation of heterojunction batteries, coating is required. However, in order to pursue equipment integration, the current CVD chamber for preparing heterojunction batteries concentrates the conditions required for the reaction process in one reaction cavity.

[0003] The common reaction chamber currently consists of an upper heating plate, a discharge plate, a ceramic plate, a carrier plate placement area, and a lower heating plate. During the reaction, the upper and lower heating plates provide the same heating temperature. This single heating and temperature control design will have obvious problems:

[0004] 1. The carrier is heated unevenly in the reaction chamber, causing the temperature in the middle of the carrier to be higher than that in the four corners. This is because the edges and corners are mainly heated by radiation rather than direct heating wires, which directly leads to poor uniformity of the coating.

[0005] 2. The temperature controllability is poor, and subsequent process adjustments are limited. Many ideas involving temperature changes cannot be effectively implemented, which hinders the improvement of subsequent research efficiency. Utility Model Content

[0006] The purpose of the present utility model is to provide a uniform heating device and heterojunction battery coating equipment, which can realize flexible heating, improve heating uniformity, improve temperature differences on the carrier, improve temperature controllability, facilitate subsequent process adjustments, and provide more ideas for subsequent machine modification and process development.

[0007] The embodiment of the present utility model is achieved as follows:

[0008] In a first aspect, the present invention provides a uniform heating device, comprising:

[0009] A reaction chamber, wherein the reaction chamber has a carrier placement area, and the carrier placement area is used to place a carrier loaded with silicon wafers;

[0010] at least one heating plate, the heating plate being arranged on the top wall and / or the bottom wall of the reaction chamber;

[0011] Two heating wire components are arranged on two opposite side walls of the reaction chamber and located on both sides of the carrier placement area, and are used to heat the carrier in the carrier placement area.

[0012] In an optional embodiment, the heating wire component includes a heat-conductive carrier, a heating wire body, a positive electrode connecting wire and a negative electrode connecting wire. The heat-conductive carrier is arranged on the side wall of the reaction chamber, and the heating wire body is ringed on the heat-conductive carrier. The positive electrode connecting wire and the negative electrode connecting wire are both connected to the heating wire body and extend out of the reaction chamber for connection to an external electrode.

[0013] In an optional embodiment, the heating wire body includes a first straight line segment, a second straight line segment, a first spiral segment and a second spiral segment, the first straight line segment and the second straight line segment are arranged relatively parallel in the horizontal direction, the first spiral segment and the second spiral segment are relatively arranged at the two ends of the second straight line segment, and the two ends of the first spiral segment are respectively connected to the first straight line segment and the second straight line segment, one end of the second spiral segment is connected to the second straight line segment, and the other end is connected to the positive electrode connecting wire, and the end of the first straight line segment away from the first spiral segment is separated from the second spiral segment and connected to the negative electrode connecting wire.

[0014] In an optional embodiment, the heating wire component also includes a temperature-sensing wire and a temperature measuring component. The temperature measuring component is arranged on the heat-conducting carrier and extends to the heating wire body for detecting the heating temperature of the heating wire body. The temperature-sensing wire is connected to the temperature measuring component and extends out of the reaction chamber for connection to an external temperature measuring device.

[0015] In an optional embodiment, a fixed joint is further provided on the reaction chamber, and the fixed joint has a first closed hole and a second closed hole. The connecting wire is sealed and assembled in the first closed hole, and the temperature sensing wire is sealed and assembled in the second closed hole.

[0016] In an optional embodiment, the first sealed hole and the second sealed hole are spaced apart, and both the first sealed hole and the second sealed hole are provided with sealing rings, which are used to seal against the circumference of the connecting wire or the temperature sensing wire.

[0017] In an optional embodiment, there are two heating plates, which are respectively laid on the top wall and the bottom wall of the reaction chamber. Each heating plate is provided with a heating wire, and the heating wires are evenly distributed inside the heating plates.

[0018] In an optional embodiment, the heating wires are distributed in an S-shape within the heating plate.

[0019] In an optional embodiment, the reaction chamber is rectangular, and a carrier inlet for the carrier to enter and a carrier outlet for the carrier to be taken out are respectively provided on opposite side walls in the reaction chamber, the carrier inlet and the heating wire component are provided on adjacent side walls in the reaction chamber, and the carrier outlet and the heating wire component are provided on adjacent side walls in the reaction chamber.

[0020] In the second aspect, the utility model provides a heterojunction battery coating device, comprising a first power supply control device and a second power supply control device and a uniform heating device as described in any one of the aforementioned embodiments, the first power supply control device is electrically connected to the heating plate, and is used to supply power to the heating plate and control the heating temperature of the heating plate, and the second power supply control device is connected to the heating wire component, and is used to supply power to the heating wire component but cannot control the heating temperature of the heating wire component.

[0021] The beneficial effects of the embodiments of the present utility model include:

[0022] The embodiment of the present invention provides a uniform heating device and heterojunction battery coating equipment, which sets a heating plate on the top wall and / or bottom wall of the reaction chamber to achieve main heating, and then sets two heating wire components on the opposite side walls of the reaction chamber. The two heating wire components are located on both sides of the carrier placement area and are used to heat the carrier in the carrier placement area. Compared with the existing technology, the present invention changes the original single heating method using the heating plate into a multi-point flexible heating mechanism by adding a heating wire component. In the future, it can also be used to match the enlarged cavity, which can not only increase production capacity but also reduce costs. Because the original reaction chamber only has the heating plate for uniform heating, it will cause the temperature of the four corners and the edge of the carrier to differ from the temperature of the center of the carrier. Therefore, the current cavity size is relatively small. As the cavity increases, this phenomenon will be amplified, which can easily cause poor overall uniformity. Embedding heating wires on both sides of the inner cavity as auxiliary heating will effectively improve the temperature difference and improve the temperature uniformity of the carrier during coating. It can also provide more ideas for future machine modification and process development. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 A cross-sectional view of the overall structure of the uniform heating device provided by an embodiment of the utility model;

[0025] Figure 2A sectional view of the assembly structure of the uniform heating device provided by an embodiment of the utility model from a side perspective;

[0026] Figure 3 A cross-sectional view from the front perspective of a uniform heating device provided by an embodiment of the present invention;

[0027] Figure 4 for Figure 3 Schematic diagram of the connection structure of the heating wire body;

[0028] Figure 5 for Figure 4 Schematic diagram of the fixed joint;

[0029] Figure 6 for Figure 1 Schematic diagram of the structure of the heating plate.

[0030] icon:

[0031] 100-uniform heating device; 110-reaction chamber; 111-carrier inlet; 113-carrier outlet; 130-heating plate; 131-heating wire; 150-heating wire component; 151-heat-conducting carrier; 153-heating wire body; 1531-first straight segment; 1533-second straight segment; 1535-first spiral segment; 1537-second spiral segment; 155-positive electrode connecting wire; 157-negative electrode connecting wire; 158-temperature sensing wire; 159-temperature measuring element; 170-fixed joint; 171-first closed hole; 173-second closed hole; 175-sealing ring; 200-carrier. DETAILED DESCRIPTION

[0032] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0035] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is typically placed when in use. These terms are intended solely to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0036] Furthermore, terms such as "horizontal" and "vertical" do not necessarily mean that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0037] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0038] Please refer to Figures 1 to 3 This embodiment provides a uniform heating device 100, which can achieve flexible heating, improve heating uniformity, improve temperature differences on the carrier 200, and improve temperature controllability, which is beneficial to subsequent process adjustments and provides more ideas for subsequent machine modification and process development.

[0039] The uniform heating device 100 provided in an embodiment of the present invention includes a reaction chamber 110, at least one heating plate 130 and two heating wire components 150. The reaction chamber 110 has a carrier 200 placement area, which is used to place the carrier 200 loaded with silicon wafers; the heating plate 130 is arranged on the top wall and / or bottom wall of the reaction chamber 110; the two heating wire components 150 are arranged on two opposite side walls of the reaction chamber 110 and are located on both sides of the carrier 200 placement area to heat the carrier 200 in the carrier 200 placement area.

[0040] The uniform heating device 100 provided in this embodiment employs a heating plate 130 disposed on the top and / or bottom wall of the reaction chamber 110 for primary heating. Two heating wire members 150 are then disposed on opposing side walls of the reaction chamber 110. These two heating wire members 150 are located on either side of the area where the carrier 200 is placed, providing auxiliary heating for the carrier 200. The addition of the heating wire members 150 transforms the previous single heating method using the heating plate 130 into a flexible multi-point heating mechanism. This allows for future expansion of the chamber, increasing production capacity while reducing costs. Because the original reaction chamber only has the heating plate 130 for uniform heating, the temperature of the four corners and the edge of the carrier 200 will be different from the temperature of the center of the carrier 200. Therefore, the current chamber size is relatively small. As the chamber size increases, this phenomenon will be amplified, which can easily lead to poor overall uniformity. Embedding heating wires 131 on both sides of the inner cavity for auxiliary heating will effectively improve the temperature difference and enhance the temperature uniformity of the carrier 200 during coating. It can also provide more ideas for future machine modification and process development.

[0041] It should be noted that the uniform heating device 100 in this embodiment is used to prepare heterojunction batteries and to coat silicon wafers of heterojunction batteries. Multiple silicon wafers can be placed on the carrier 200 at the same time, and coating is completed under heating conditions. Due to the additional design of the heating wire component 150, the single heating method in the cavity is changed to a multi-point flexible heating method, so that the heating uniformity of the silicon wafers on the carrier 200 is improved, and the film uniformity of the silicon wafers during the coating process is improved.

[0042] Each heating wire component 150 includes a heat-conducting carrier 151, a heating wire body 153, a positive electrode connecting wire 155 and a negative electrode connecting wire 157. The heat-conducting carrier 151 is arranged on the side wall of the reaction chamber 110, and the heating wire body 153 is arranged around the heat-conducting carrier 151. The positive electrode connecting wire 155 and the negative electrode connecting wire 157 are both connected to the heating wire body 153 and extend out of the reaction chamber 110 for connection to the external electrode. Specifically, the heat-conducting carrier 151 can be a shell structure, and the heating wire body 153 is arranged inside the heat-conducting carrier 151 and has an opening facing the carrier 200, so that the heating wire body 153 can transfer heat to the two side edges of the carrier 200 by radiation heat conduction, thereby achieving temperature compensation, and covering the phenomenon that the difference between the middle temperature and the edge temperature of the carrier 200 is too large when the inner cavity reacts.

[0043] Of course, in other preferred embodiments of the present invention, the heating wire body 153 may also be directly embedded in the side wall of the reaction chamber 110 , which can also achieve a good heating effect.

[0044] It should be noted that in this embodiment, the primary heating is achieved through the heating plate 130, which can heat the large surface of the carrier 200. However, since the edges and four corners of the carrier 200 are mainly heated by radiation rather than directly by the heating wire 131, the center temperature of the carrier 200 is high and the surrounding temperature is relatively low. Here, the heating wire body 153 is used to heat the two sides of the carrier 200, which can improve the phenomenon of excessive temperature difference between the center and edge temperatures of the carrier 200 during the internal cavity reaction, especially the low temperature at the four corners, ultimately reducing the impact of uneven cavity temperature on coating uniformity. The added side heating wire 131 body and the original heating plate 130 are independently controlled, detected, and heated, forming a new temperature control system. The temperature and operating time of the side heating wire 131 body can be individually set according to the coating process requirements.

[0045] See also Figure 4 In some embodiments, the heating wire body 153 includes a first straight segment 1531, a second straight segment 1533, a first spiral segment 1535 and a second spiral segment 1537. The first straight segment 1531 and the second straight segment 1533 are arranged relatively parallel to each other in the horizontal direction. The first spiral segment 1535 and the second spiral segment 1537 are relatively arranged at the two ends of the second straight segment 1533, and the two ends of the first spiral segment 1535 are respectively connected to the first straight segment 1531 and the second straight segment 1533. One end of the second spiral segment 1537 is connected to the second straight segment 1533, and the other end is connected to the positive electrode connecting wire 155. The end of the first straight segment 1531 away from the first spiral segment 1535 is spaced from the second spiral segment 1537 and connected to the negative electrode connecting wire 157. Specifically, the first straight segment 1531, the first Luxuan segment, the second straight segment 1533 and the second spiral segment 1537 are connected in sequence to form a roughly rectangular frame structure, and the heating wire 131 of the first spiral segment 1535 and the second spiral segment 1537 is spiral, and the first spiral segment 1535 and the second spiral segment 1537 correspond to the corners of the carrier 200, which can increase the heating area and make the temperature compensation effect of the four corners of the carrier 200 better.

[0046] Furthermore, the heating wire assembly 150 also includes a temperature-sensing wire 158 and a temperature-measuring element 159. The temperature-measuring element 159 is disposed on the heat-conducting bearing member 151 and extends to the heating wire body 153 for detecting the heating temperature of the heating wire body 153. The temperature-sensing wire 158 is connected to the temperature-measuring element 159 and extends out of the reaction chamber 110 for connection to an external temperature-measuring device. Specifically, the temperature-measuring element 159 can be a temperature-measuring sensor rod. The temperature-measuring sensor plate extends into the reaction chamber 110 and monitors the measured temperature, thereby facilitating feedback to an external control device for adjustment.

[0047] See also Figure 4 and Figure 5 In some embodiments, the reaction chamber 110 is further provided with a fixed joint 170, which has a first sealed hole 171 and a second sealed hole 173. The connecting wire is sealed and assembled in the first sealed hole 171, and the temperature sensing wire 158 is sealed and assembled in the second sealed hole 173. Specifically, the fixed joint 170 can be disc-shaped and embedded in the reaction chamber 110. The holes in the fixed joint 170 can realize sealed wire passage. At the same time, the fixed joint 170 can be made of heat-resistant material to effectively isolate the internal and external temperatures and prevent heat dissipation to the external space. Moreover, by providing the fixed joint 170, the wiring harness can be fixed, avoiding disorderly wiring of the wiring harness.

[0048] In some embodiments, the first sealed hole 171 and the second sealed hole 173 are spaced apart, and each of the first sealed hole 171 and the second sealed hole 173 is provided with a sealing ring 175, which is used to seal against the circumference of the connecting wire or the temperature sensing wire 158. Specifically, the sealing ring 175 can be made of elastic material and elastically press against the edge of the wire. There can be two first sealed holes, each corresponding to two connecting wires. There is one second sealed hole, so that the temperature sensing wire 158 can be installed. The two first sealed holes and the second sealed hole are distributed in a triangular pattern to minimize interference.

[0049] Please continue to see Figure 1 、 Figure 3 and Figure 6 Furthermore, there are two heating plates 130, which are respectively laid on the top and bottom walls of the reaction chamber 110. Each heating plate 130 is provided with a heating wire, and the heating wires are evenly distributed within the heating plates 130. Of course, in other preferred embodiments of the present invention, the heating plates 130 can also be provided only on the top or bottom wall. In this embodiment, the heating plates 130 are laid on both the top and bottom walls of the reaction chamber 110. On the one hand, top-down heating can be achieved, making heating more uniform and efficient. On the other hand, the heating plates 130 are installed in a laid manner, which can expand the heating range and ensure the heating effect.

[0050] In some embodiments, the heating wires 131 are distributed in an S-shape within the heating plate 130. Specifically, the heating wires 131 are distributed in a continuous S-shape within the heating plate 130, thereby achieving uniform distribution and uniform heating. In addition, the heating wires 131 are also connected to an external power supply control device via a wire. The specific heating structure and principle thereof can refer to the structure of the heating plate 130 in the prior art.

[0051] In some embodiments, the reaction chamber 110 is rectangular, and a carrier inlet 111 for the carrier 200 to enter and a carrier outlet 113 for the carrier 200 to be removed are respectively provided on opposite side walls within the reaction chamber 110. The carrier inlet 111 and the heating wire component 150 are provided on adjacent side walls within the reaction chamber, and the carrier outlet 113 and the heating wire component 150 are provided on adjacent side walls within the reaction chamber. Specifically, the reaction chamber 110 has four side walls, front, back, left, and right. The carrier inlet 111 and the carrier outlet 113 can be respectively provided on the left and right side walls of the reaction chamber 110 and pass through to the external space, and the two heating wire components 150 can be respectively provided on the front and back side walls of the reaction chamber 110.

[0052] The uniform heating device 100 provided in this embodiment transforms the original single heating method into a flexible multi-point heating mechanism. In the future, it can also be used with larger chambers, which can not only increase production capacity but also reduce costs. Because conventional reaction chambers only have two upper and lower heating plates 130 for unified heating, the temperature of the four corners and the edge of the carrier 200 will differ from the temperature of the center of the carrier 200. Therefore, the current chamber size is relatively small. As the chamber size increases, this phenomenon will be amplified, which can easily lead to poor overall uniformity. Embedding heating wires 131 on both sides of the inner chamber for auxiliary heating will effectively improve the temperature difference and provide more ideas for future machine modification and process development.

[0053] The present invention also provides a heterojunction cell coating apparatus, comprising a first power supply control device, a second power supply control device, and the aforementioned uniform heating device 100. The uniform heating device 100 includes a reaction chamber 110, at least one heating plate 130, and two heating wire members 150. The reaction chamber 110 includes a carrier plate 200 placement area for placing the carrier plate 200 loaded with silicon wafers. The heating plate 130 is disposed on the top and / or bottom wall of the reaction chamber 110. The two heating wire members 150 are disposed on two opposing side walls of the reaction chamber 110, located on either side of the carrier plate 200 placement area, for heating the carrier plate 200 in the carrier plate 200 placement area. The first power supply control device is electrically connected to the heating plate 130, for supplying power to the heating plate 130 and controlling the heating temperature of the heating plate 130. The second power supply control device is connected to the heating wire members 150, for supplying power to the heating wire members 150 but not controlling the heating temperature of the heating wire members 150.

[0054] It should be noted that the first power supply control device and the second power supply control device are controlled independently of each other, and can independently supply power to and control the heating plate 130 and the heating wire component 150 .

[0055] In summary, the uniform heating device 100 and heterojunction cell coating equipment provided by the present embodiment of the present invention employs heating plates 130 disposed on the top and / or bottom walls of the reaction chamber 110 for primary heating. Two heating wire members 150 are then disposed on opposing side walls of the reaction chamber 110. These two heating wire members 150 are located on either side of the carrier 200 placement area and are used to heat the carrier 200 within the placement area. Compared to the prior art, the present invention, by adding heating wire members 150, transforms the single heating method previously utilizing heating plates 130 into a flexible multi-point heating mechanism. This allows for future use with larger chambers, increasing production capacity while also reducing costs. Because the original reaction chamber only has the heating plate 130 for uniform heating, the temperature of the four corners and the edge of the carrier 200 will be different from the temperature of the center of the carrier 200. Therefore, the current chamber size is relatively small. As the chamber size increases, this phenomenon will be amplified, which can easily lead to poor overall uniformity. Embedding heating wires 131 on both sides of the inner cavity for auxiliary heating will effectively improve the temperature difference and enhance the temperature uniformity of the carrier 200 during coating. It can also provide more ideas for future machine modification and process development.

[0056] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A uniform heating device, characterized in that: include: A reaction chamber (110), wherein the reaction chamber (110) has a carrier plate (200) placement area, and the carrier plate (200) placement area is used to place the carrier plate (200) loaded with silicon wafers; at least one heating plate (130), the heating plate (130) being arranged on the top wall and / or the bottom wall of the reaction chamber (110); Two heating wire components (150) are arranged on two opposite side walls of the reaction chamber (110) and located on both sides of the carrier (200) placement area, and are used to heat the carrier (200) in the carrier (200) placement area.

2. The uniform heating device according to claim 1, characterized in that: The heating wire component (150) includes a heat-conducting bearing member (151), a heating wire body (153), a positive electrode connecting wire (155) and a negative electrode connecting wire (157). The heat-conducting bearing member (151) is arranged on the side wall of the reaction chamber (110), and the heating wire body (153) is arranged around the heat-conducting bearing member (151). The positive electrode connecting wire (155) and the negative electrode connecting wire (157) are both connected to the heating wire body (153) and extend out of the reaction chamber (110) for connection with external electrodes.

3. The uniform heating device according to claim 2, characterized in that: The heating wire body (153) includes a first straight segment (1531), a second straight segment (1533), a first spiral segment (1535) and a second spiral segment (1537), wherein the first straight segment (1531) and the second straight segment (1533) are arranged relatively parallel to each other in the horizontal direction, the first spiral segment (1535) and the second spiral segment (1537) are relatively arranged at the two ends of the second straight segment (1533), and the two ends of the first spiral segment (1535) are respectively connected to the first straight segment (1531) and the second straight segment (1533), one end of the second spiral segment (1537) is connected to the second straight segment (1533), and the other end is connected to the positive electrode connecting wire (155), and the end of the first straight segment (1531) away from the first spiral segment (1535) is spaced from the second spiral segment (1537) and connected to the negative electrode connecting wire (157).

4. The uniform heating device according to claim 2, characterized in that: The heating wire component (150) further includes a temperature-sensing wire (158) and a temperature-measuring element (159). The temperature-measuring element (159) is arranged on the heat-conducting bearing element (151) and extends to the heating wire body (153) for detecting the heating temperature of the heating wire body (153). The temperature-sensing wire (158) is connected to the temperature-measuring element (159) and extends out of the reaction chamber (110) for connection with an external temperature-measuring device.

5. The uniform heating device according to claim 4, characterized in that: The reaction chamber (110) is further provided with a fixed joint (170), the fixed joint (170) is provided with a first closed hole (171) and a second closed hole (173), the connecting wire is sealed and assembled in the first closed hole (171), and the temperature sensing wire (158) is sealed and assembled in the second closed hole (173).

6. The uniform heating device according to claim 5, characterized in that: The first sealed hole (171) and the second sealed hole (173) are spaced apart, and both the first sealed hole (171) and the second sealed hole (173) are provided with a sealing ring (175), and the sealing ring (175) is used to seal against the circumference of the connecting wire or the temperature sensing wire (158).

7. The uniform heating device according to claim 1, characterized in that: There are two heating plates (130), and the two heating plates (130) are laid on the top wall and the bottom wall of the reaction chamber (110) respectively. A heating wire is provided in each heating plate (130), and the heating wires are evenly distributed in the heating plates (130).

8. The uniform heating device according to claim 7, characterized in that: The heating wire (131) is distributed in an S-shape within the heating plate (130).

9. The uniform heating device according to claim 1, characterized in that: The reaction chamber (110) is in the shape of a rectangle, and a carrier plate inlet (111) for the carrier plate (200) to enter and a carrier plate outlet (113) for the carrier plate (200) to be taken out are respectively provided on opposite side walls in the reaction chamber (110), the carrier plate inlet (111) and the heating wire component (150) are provided on adjacent side walls in the reaction chamber (110), and the carrier plate outlet (113) and the heating wire component (150) are provided on adjacent side walls in the reaction chamber (110).

10. A heterojunction battery coating device, characterized in that: The uniform heating device comprises a first power supply control device and a second power supply control device and the uniform heating device according to any one of claims 1 to 9, wherein the first power supply control device is electrically connected to the heating plate (130) and is used to supply power to the heating plate (130) and control the heating temperature of the heating plate (130), and the second power supply control device is connected to the heating wire component (150) and is used to supply power to the heating wire component (150) but cannot control the heating temperature of the heating wire component (150).

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