High-condensation LED light source

Abstract

The utility model relates to the technical field of LED (light-emitting diode) light sources, and discloses a high-condensation LED light source, which comprises a substrate, the substrate is provided with a concave light-emitting area, the bottom of the light-emitting area is provided with a light-emitting chip, the light-emitting chip is covered with a fluorescent glue layer, and the fluorescent glue layer covers the light-emitting chip. A light-transmitting glue layer is arranged on the substrate, the lower portion of the light-transmitting glue layer is filled in the light-emitting area and covers the fluorescent glue layer, and the upper portion of the light-transmitting glue layer extends above the substrate. The fluorescent glue layer covers the light-emitting chip, and light emitted by the light-emitting chip irradiates outwards through the fluorescent glue layer and the light-transmitting glue layer so as to meet the required illumination requirement. And secondly, the lower part of the light-transmitting glue layer is embedded in the light-emitting area, so that the light-transmitting glue layer and the substrate can form a more stable integral structure, the lower part of the light-transmitting glue layer is limited by the circumferential direction of the light-emitting area, the light-transmitting glue layer is prevented from flowing towards the outer circumference excessively, and the light-transmitting glue layer can be kept to form a higher arched shape, so that the light irradiation range is limited, and the high-condensation irradiation effect is realized.

Description

Technical Field

[0001] This utility model patent relates to the technical field of LED light sources, specifically, to a high-concentration LED light source. Background Art

[0002] With the development of LED technology, LED light sources are now increasingly used in daily life and in various industries. With advantages such as small size, long life, and high efficiency, LED light sources can be used continuously for up to 100,000 hours, making them the mainstream light source in the lighting field.

[0003] In the prior art, an LED light source includes a substrate having a recessed light-emitting area, a light-emitting chip disposed on the light-emitting area, and a fluorescent adhesive layer covering the light-emitting area. Light emitted by the light-emitting chip passes through the fluorescent adhesive layer and irradiates outward. However, current LED light sources have the defect of insufficient concentration, making it difficult to meet the needs of high-concentration lighting. Utility Model Content

[0004] The purpose of the utility model is to provide a high-concentration LED light source, aiming to solve the problem of insufficient light concentration of LED light sources in the prior art.

[0005] The present utility model is implemented as follows: a high-concentration LED light source is characterized in that it includes a substrate, the substrate has a recessed light-emitting area, a light-emitting chip is provided at the bottom of the light-emitting area, the light-emitting chip is covered with a fluorescent glue layer, and the fluorescent glue layer covers the light-emitting chip; a light-transmitting glue layer is provided on the substrate, the lower part of the light-transmitting glue layer is filled in the light-emitting area and covered with the fluorescent glue layer, and the upper part of the light-transmitting glue layer extends above the substrate.

[0006] Furthermore, an inner dam is arranged around the periphery of the light emitting chip, the inner dam forms an inner enclosed area, the light emitting chip is located in the inner enclosed area, and the fluorescent glue layer is filled in the inner enclosed area.

[0007] Furthermore, the top of the fluorescent glue layer has an inner top surface, and the inner top surface is arched upward to form an arc shape.

[0008] Furthermore, a peripheral dam is provided on the substrate, the peripheral dam surrounds the periphery of the light emitting area, the upper portion of the light-transmitting adhesive layer has an upper portion extending above the substrate, and the peripheral dam abuts against the periphery of the upper portion.

[0009] Furthermore, the top of the upper portion has an external top surface, and the external top surface is in the shape of an upwardly arched arc surface.

[0010] Furthermore, the inner side of the inner dam has an inner reflective side wall facing the light emitting chip, and along the inner dam from bottom to top, the inner reflective side wall is arranged to be tilted outward away from the light emitting chip.

[0011] Furthermore, the fluorescent adhesive layer covers the inner reflective side wall.

[0012] Furthermore, the inner side of the light emitting area has an outer reflective side wall facing the light emitting chip, and along the bottom-up direction of the substrate, the outer reflective side wall is arranged to be tilted outward away from the light emitting chip.

[0013] Furthermore, the outer periphery of the inner dam and the outer periphery of the light emitting area are spaced apart to form a surrounding annular area, and the lower portion of the light-transmitting adhesive layer is embedded in the annular area.

[0014] Furthermore, the outer periphery of the inner dam extends to the outer periphery of the light-emitting area, and the lower portion of the light-transmitting adhesive layer covers the inner dam.

[0015] Compared with the prior art, the high-concentration LED light source provided by the present invention has a fluorescent adhesive layer covering the light-emitting chip. The light emitted by the light-emitting chip is irradiated outward through the fluorescent adhesive layer and the translucent adhesive layer to achieve the required lighting requirements; secondly, the lower part of the translucent adhesive layer is embedded in the light-emitting area, which can form a more stable overall structure with the substrate. The lower part of the translucent adhesive layer is circumferentially restricted by the light-emitting area, which limits the excessive flow of the translucent adhesive layer toward the periphery, and can maintain the translucent adhesive layer in a higher arch shape to limit the light irradiation range and achieve the effect of high-concentration irradiation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a three-dimensional schematic diagram of the high-concentration LED light source provided by the utility model;

[0017] Figure 2 It is a three-dimensional schematic diagram of the high-concentration LED light source provided by the utility model. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0019] The implementation of the present invention is described in detail below with reference to specific embodiments.

[0020] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this utility model, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating directions or positional relationships, they are based on the directions or positional relationships shown in the drawings. This is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0021] Reference Figure 1-2 The figure shows a preferred embodiment of the present invention.

[0022] A high-concentration LED light source includes a substrate 100, which has a recessed light-emitting area. A light-emitting chip 300 is provided at the bottom of the light-emitting area. The light-emitting chip 300 is covered with a fluorescent adhesive layer 500, which covers the light-emitting chip 300. A light-transmitting adhesive layer 200 is provided on the substrate 100, the lower part of the light-transmitting adhesive layer 200 fills the light-emitting area and covers the fluorescent adhesive layer 500, and the upper part of the light-transmitting adhesive layer 200 extends above the substrate 100.

[0023] In the high-concentration LED light source provided above, the fluorescent glue layer 500 covers the light-emitting chip 300. The light emitted by the light-emitting chip 300 is irradiated outward through the fluorescent glue layer 500 and the translucent glue layer 200 to achieve the required lighting requirements; secondly, the lower part of the translucent glue layer 200 is embedded in the light-emitting area, and can form a more stable overall structure with the substrate 100. The lower part of the translucent glue layer 200 is subject to the circumferential restriction of the light-emitting area, which limits the excessive flow of the translucent glue layer 200 toward the periphery, and can keep the translucent glue layer 200 in a higher arch shape to limit the light irradiation range and achieve the effect of high-concentration irradiation.

[0024] In this embodiment, an inner dam 400 is arranged around the periphery of the light-emitting chip 300. The inner dam 400 encloses an inner enclosed area, in which the light-emitting chip 300 is located, and the fluorescent adhesive layer 500 is filled. The inner dam 400 forms an inner enclosed area, which facilitates the filling of the fluorescent adhesive layer 500 within the inner enclosed area, and the fluorescent adhesive layer 500 covers the light-emitting chip 300.

[0025] In this embodiment, the top of the fluorescent adhesive layer 500 has an inner top surface 501 , which is arched upward to form an arc shape. This can further improve the concentration of light from the translucent fluorescent adhesive layer 500 to achieve more concentrated illumination.

[0026] In this embodiment, a peripheral dam 600 is provided on the substrate 100, enclosing the periphery of the light-emitting area. The upper portion of the light-transmitting adhesive layer 200 includes an upper portion extending above the substrate 100, and the peripheral dam 600 abuts the periphery of the upper portion. The provision of the peripheral dam 600, abutting the periphery of the upper portion, restricts the flow of light from the upper portion toward the periphery, thereby limiting the arching of the light-transmitting adhesive layer 200 to a set height and maintaining a set degree of arching to ensure the concentration of the LED light source.

[0027] In this embodiment, the top of the upper portion has an external top surface 201, and the external top surface 201 is in the shape of an upwardly arched arc surface, so that the high-concentration irradiation advantage of the LED light source can be achieved.

[0028] In this embodiment, the inner side of the inner dam 400 has an inner reflective sidewall 401 facing the light emitting chip 300 . From bottom to top along the inner dam 400 , the inner reflective sidewall 401 is tilted outward away from the light emitting chip 300 .

[0029] The periphery of the light-emitting chip 300 has a peripheral light-emitting surface, and the top of the light-emitting chip 300 has a top light-emitting surface. In this way, the light emitted by the peripheral light-emitting surface is irradiated toward the inner reflective side wall 401 of the inner dam 400, which can reflect the light, improve the light efficiency of the LED light source, and reduce the heat generated by the LED light source.

[0030] The fluorescent adhesive layer 500 covers the inner reflective side wall 401 , so that the light emitted from the peripheral luminous surface passes through the fluorescent adhesive layer 500 and then shines on the inner reflective side wall 401 and is reflected.

[0031] In this embodiment, the inner side of the light-emitting area has an outer reflective sidewall 102 facing the light-emitting chip 300. From bottom to top along the substrate 100, the outer reflective sidewall 102 is arranged outwardly and away from the light-emitting chip 300. This allows light emitted from the peripheral light-emitting surface to partially illuminate the outer reflective sidewall 102, which, through reflection from the outer reflective sidewall 102, can improve the light efficiency of the LED light source.

[0032] In this embodiment, the outer periphery of the inner dam 400 is spaced apart from the outer periphery of the light-emitting area, forming a surrounding annular region 101. The lower portion of the light-transmitting adhesive layer 200 is embedded in the annular region 101. Thus, the inner dam 400 is arranged in a ring shape, disposed between the light-emitting chip 300 and the outer periphery of the light-emitting area, and the lower portion of the light-transmitting adhesive layer 200 is embedded in the annular region 101. This allows the light-transmitting adhesive layer 200, the fluorescent adhesive layer 500, and the substrate 100 to form a more stable structure.

[0033] Alternatively, as another embodiment, the outer periphery of the inner dam 400 extends to the outer periphery of the light-emitting area, and the lower part of the light-transmitting adhesive layer 200 covers the inner dam 400. In this way, the outer periphery of the inner dam 400 directly extends to the outer periphery of the light-emitting area, which facilitates the molding of the inner dam 400.

[0034] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. High-concentration LED light source, characterized in that: The invention comprises a substrate having a recessed light-emitting area, a light-emitting chip being provided at the bottom of the light-emitting area, the light-emitting chip being covered with a fluorescent adhesive layer, and the fluorescent adhesive layer covering the light-emitting chip; a light-transmitting adhesive layer being provided on the substrate, the lower part of the light-transmitting adhesive layer filling the light-emitting area and covering the fluorescent adhesive layer, and the upper part of the light-transmitting adhesive layer extending above the substrate.

2. The high-concentration LED light source according to claim 1, wherein: An inner dam is arranged around the outer periphery of the light emitting chip, the inner dam encloses an inner enclosed area, the light emitting chip is located in the inner enclosed area, and the fluorescent glue layer is filled in the inner enclosed area.

3. The high-concentration LED light source according to claim 2, wherein: The top of the fluorescent glue layer has an inner top surface, and the inner top surface is arched upward to form an arc shape.

4. The high-concentration LED light source according to claim 2, wherein: The substrate is provided with a peripheral dam, which surrounds the periphery of the light-emitting area. The upper portion of the light-transmitting adhesive layer has an upper portion extending above the substrate, and the peripheral dam abuts against the periphery of the upper portion.

5. The high-concentration LED light source according to claim 4, characterized in that: The top of the upper portion has an outer top surface, and the outer top surface is in an upwardly arched arc shape.

6. The high-concentration LED light source according to claim 2, wherein: The inner side of the inner dam has an inner reflective side wall facing the light emitting chip. From bottom to top along the inner dam, the inner reflective side wall is arranged to be tilted outward away from the light emitting chip.

7. The high-concentration LED light source according to claim 6, characterized in that: The fluorescent adhesive layer covers the inner reflective side wall.

8. The high-concentration LED light source according to claim 2, wherein: The inner side of the light emitting area has an outer light reflecting side wall facing the light emitting chip. From bottom to top along the substrate, the outer light reflecting side wall is arranged to be tilted outward away from the light emitting chip.

9. The high-concentration LED light source according to any one of claims 2 to 8, characterized in that: The outer periphery of the inner dam is spaced apart from the outer periphery of the light emitting area to form a surrounding annular area, and the lower portion of the light-transmitting adhesive layer is embedded in the annular area.

10. The high-concentration LED light source according to any one of claims 2 to 8, characterized in that: The outer periphery of the inner dam extends to the outer periphery of the light emitting area, and the lower part of the light-transmitting adhesive layer covers the inner dam.

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